DE3564636D1 - Copper-type conductive coating composition - Google Patents

Copper-type conductive coating composition

Info

Publication number
DE3564636D1
DE3564636D1 DE8585108001T DE3564636T DE3564636D1 DE 3564636 D1 DE3564636 D1 DE 3564636D1 DE 8585108001 T DE8585108001 T DE 8585108001T DE 3564636 T DE3564636 T DE 3564636T DE 3564636 D1 DE3564636 D1 DE 3564636D1
Authority
DE
Germany
Prior art keywords
copper
coating composition
conductive coating
type conductive
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585108001T
Other languages
English (en)
Inventor
Shoji Mitsubishi Pet Yamaguchi
Kimiko Mitsubishi Petro Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16089384A external-priority patent/JPS6140383A/ja
Priority claimed from JP19973884A external-priority patent/JPS6178869A/ja
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Application granted granted Critical
Publication of DE3564636D1 publication Critical patent/DE3564636D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5398—Phosphorus bound to sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
DE8585108001T 1984-07-31 1985-06-27 Copper-type conductive coating composition Expired DE3564636D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16089384A JPS6140383A (ja) 1984-07-31 1984-07-31 銅系導電性塗料組成物
JP19973884A JPS6178869A (ja) 1984-09-25 1984-09-25 銅系導電性塗料組成物

Publications (1)

Publication Number Publication Date
DE3564636D1 true DE3564636D1 (en) 1988-09-29

Family

ID=26487230

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585108001T Expired DE3564636D1 (en) 1984-07-31 1985-06-27 Copper-type conductive coating composition

Country Status (3)

Country Link
US (2) US4663079A (de)
EP (1) EP0170063B1 (de)
DE (1) DE3564636D1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167702A (ja) * 1984-09-07 1986-04-07 Mitsui Mining & Smelting Co Ltd 導電性粉末及びこれを用いた導電性組成物
US4766027A (en) * 1987-01-13 1988-08-23 E. I. Du Pont De Nemours And Company Method for making a ceramic multilayer structure having internal copper conductors
US4997674A (en) * 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
JP2611347B2 (ja) * 1987-07-24 1997-05-21 三菱化学株式会社 銅系導電性塗料組成物
US5252255A (en) * 1988-06-08 1993-10-12 Akzo America Inc. Conductive metal-filled substrates via developing agents
US5059485A (en) * 1988-06-08 1991-10-22 Akzo America Inc. Conductive metallization of substances without developing agents
US4961879A (en) * 1988-06-08 1990-10-09 Akzo America Inc. Conductive metal-filled substrates via developing agents
CA2005414C (en) * 1988-12-19 1999-09-28 Joseph M. Wentzell Copper marine cladding composition
US5061566A (en) * 1989-12-28 1991-10-29 Chomerics, Inc. Corrosion inhibiting emi/rfi shielding coating and method of its use
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
JPH0412595A (ja) * 1990-05-02 1992-01-17 Mitsubishi Petrochem Co Ltd 導電性ペースト組成物
US5760103A (en) * 1990-10-31 1998-06-02 Joseph M. Wentzell Copper marine cladding composition
US5096951A (en) * 1990-12-13 1992-03-17 Hoechst Celanese Corporation Color stabilized polyoxymethylene molding compositions
US5270364A (en) * 1991-09-24 1993-12-14 Chomerics, Inc. Corrosion resistant metallic fillers and compositions containing same
US6515009B1 (en) 1991-09-27 2003-02-04 Neorx Corporation Therapeutic inhibitor of vascular smooth muscle cells
US5811447A (en) 1993-01-28 1998-09-22 Neorx Corporation Therapeutic inhibitor of vascular smooth muscle cells
US5372749A (en) * 1992-02-19 1994-12-13 Beijing Technology Of Printing Research Institute Chinese Method for surface treating conductive copper powder with a treating agent and coupler
JPH0768562B2 (ja) * 1992-11-25 1995-07-26 三井金属鉱業株式会社 半田付け可能な導電性塗料用銅粉の製造方法
JP3424958B2 (ja) * 1993-01-26 2003-07-07 住友電気工業株式会社 シールドフラットケーブル及びその製造方法
US6491938B2 (en) 1993-05-13 2002-12-10 Neorx Corporation Therapeutic inhibitor of vascular smooth muscle cells
US5631311A (en) * 1994-08-18 1997-05-20 E. I. Du Pont De Nemours And Company Transparent static dissipative formulations for coatings
EP0933010B1 (de) * 1996-08-16 2002-01-23 Hugh P. Craig Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten
US7022266B1 (en) 1996-08-16 2006-04-04 Dow Corning Corporation Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
AU6959898A (en) 1997-04-11 1998-11-11 David J. Grainger Compounds and therapies for the prevention of vascular and non-vascular pathol ogies
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6613083B2 (en) 2001-05-02 2003-09-02 Eckhard Alt Stent device and method
US6790888B2 (en) * 2001-05-16 2004-09-14 Crompton Corporation Thermoplastic resins in contact with metals or metal salts stabilized by blends of dithiocarbamates and metal deactivators
JP3728411B2 (ja) * 2001-09-18 2005-12-21 ソニー株式会社 磁性粒子の作製方法、磁性粒子および磁性材料
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
US7497935B2 (en) 2004-08-27 2009-03-03 Ppg Industries Ohio, Inc. Electrodepositable coating compositions and methods related thereto
WO2007013393A1 (ja) * 2005-07-25 2007-02-01 Sumitomo Metal Mining Co., Ltd. 銅微粒子分散液及びその製造方法
JP2008108539A (ja) * 2006-10-25 2008-05-08 Fujitsu Ltd 導電性ペーストおよびその製造方法
KR101398706B1 (ko) * 2006-12-26 2014-05-27 스미토모 베이클리트 컴퍼니 리미티드 도전성 페이스트
KR101399920B1 (ko) 2007-09-13 2014-05-28 헨켈 아게 운트 코. 카게아아 전기 전도성 조성물
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
TWI551656B (zh) * 2015-03-23 2016-10-01 Atomic Energy Council Antioxidant conductive copper ink and its preparation method
WO2016152214A1 (ja) * 2015-03-26 2016-09-29 三井金属鉱業株式会社 銅粉及びそれを含む導電性組成物
KR102526396B1 (ko) * 2015-06-12 2023-04-28 니치유 가부시키가이샤 표면 피복 구리 필러, 그 제조 방법, 및 도전성 조성물
US9637647B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
US9637648B2 (en) 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
CN109796615B (zh) * 2018-12-27 2021-10-26 袁瑞峰 一种基于石墨烯的抗静电及电磁兼容涂层
CN112954990A (zh) * 2021-01-27 2021-06-11 江门江益磁材有限公司 一种电磁波吸收片及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256237A (en) * 1964-06-30 1966-06-14 Sun Oil Co Polypropylene stabilized with organic thiophosphites
US3560434A (en) * 1969-12-12 1971-02-02 Argus Chem Enhancement of resistance of olefin polymers to copper-catalyzed oxidative degradation
US3708387A (en) * 1970-09-11 1973-01-02 Univ Drexel Metallic modified plastic compositions and method for the preparation thereof
US3907517A (en) * 1970-12-30 1975-09-23 Argus Chem Normally liquid hydrocarbon compositions containing amidatriazales
DE2164234A1 (de) * 1970-12-30 1972-07-13 S.A. Argus Chemical N.V., Brüssel 3-Amido-l,2,4-triazole, Olefinpolymer-Stabilisatoren und diese enthaltende Olefinpolymerprodukte
JPS5231334B2 (de) * 1972-08-03 1977-08-13
US3983075A (en) * 1974-06-21 1976-09-28 Kennecott Copper Corporation Copper filled conductive epoxy
US4122143A (en) * 1976-05-24 1978-10-24 Mitsui Toatsu Chemicals, Inc. Process for producing cured products
US4305847A (en) * 1979-07-26 1981-12-15 Acheson Industries, Inc. Copper coating composition for shielding electronic equipment and the like
JPS56103260A (en) * 1980-01-22 1981-08-18 Asahi Kagaku Kenkyusho:Kk Conductive paint containing copper powder

Also Published As

Publication number Publication date
US4663079A (en) 1987-05-05
EP0170063A2 (de) 1986-02-05
EP0170063B1 (de) 1988-08-24
US4705647A (en) 1987-11-10
EP0170063A3 (en) 1986-08-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee