DE3380945D1 - Wafer-transferierungssystem. - Google Patents

Wafer-transferierungssystem.

Info

Publication number
DE3380945D1
DE3380945D1 DE8383302951T DE3380945T DE3380945D1 DE 3380945 D1 DE3380945 D1 DE 3380945D1 DE 8383302951 T DE8383302951 T DE 8383302951T DE 3380945 T DE3380945 T DE 3380945T DE 3380945 D1 DE3380945 D1 DE 3380945D1
Authority
DE
Germany
Prior art keywords
transfer system
wafer transfer
wafer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8383302951T
Other languages
English (en)
Inventor
Richard John Hertel
Edward D Macintosh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Application granted granted Critical
Publication of DE3380945D1 publication Critical patent/DE3380945D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
DE8383302951T 1982-05-24 1983-05-23 Wafer-transferierungssystem. Expired - Fee Related DE3380945D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/381,085 US4449885A (en) 1982-05-24 1982-05-24 Wafer transfer system

Publications (1)

Publication Number Publication Date
DE3380945D1 true DE3380945D1 (de) 1990-01-11

Family

ID=23503594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383302951T Expired - Fee Related DE3380945D1 (de) 1982-05-24 1983-05-23 Wafer-transferierungssystem.

Country Status (4)

Country Link
US (1) US4449885A (de)
EP (1) EP0095368B1 (de)
JP (1) JPS58213438A (de)
DE (1) DE3380945D1 (de)

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US4776744A (en) * 1985-09-09 1988-10-11 Applied Materials, Inc. Systems and methods for wafer handling in semiconductor process equipment
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
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JPH068100Y2 (ja) * 1986-07-01 1994-03-02 東京エレクトロン相模株式会社 ウエハ移し替え突き上げ装置
JPS63164227U (de) * 1987-04-15 1988-10-26
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US5102291A (en) * 1987-05-21 1992-04-07 Hine Design Inc. Method for transporting silicon wafers
WO1988009303A1 (en) * 1987-05-21 1988-12-01 Hine Design Inc. Method and apparatus for aligning silicon wafers
US4892455A (en) * 1987-05-21 1990-01-09 Hine Derek L Wafer alignment and transport mechanism
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
KR0133676B1 (ko) * 1987-12-07 1998-04-23 후세 노보루 웨이퍼 이동 교체 장치 및 방법
US4957406A (en) * 1989-05-08 1990-09-18 Intelmatec Corporation Apparatus for transferring disks from one cassette to another with different pitch
US5265170A (en) * 1990-01-11 1993-11-23 Hine Design, Inc. Devices and methods for reading identification marks on semiconductor wafers
US5203445A (en) * 1990-03-17 1993-04-20 Tokyo Electron Sagami Limited Carrier conveying apparatus
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US5215420A (en) * 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US6712577B2 (en) 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US5664337A (en) * 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5784797A (en) * 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
AU2429395A (en) * 1994-04-28 1995-11-29 Semitool, Incorporated Semiconductor processing systems
US5544421A (en) * 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
US6833035B1 (en) 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
EP0757843A1 (de) * 1994-04-28 1997-02-12 Semitool, Inc. Halbleiter-bearbeitungseinrichtung mit ankoppel- und beladestation für plättchen-behälter
JPH07321176A (ja) * 1994-05-20 1995-12-08 Hitachi Ltd 基板搬送方法
KR970007078Y1 (en) * 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US5730575A (en) * 1996-04-11 1998-03-24 Micron Technology, Inc. Convertible wafer transfer machine
US6672820B1 (en) 1996-07-15 2004-01-06 Semitool, Inc. Semiconductor processing apparatus having linear conveyer system
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6203582B1 (en) 1996-07-15 2001-03-20 Semitool, Inc. Modular semiconductor workpiece processing tool
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US5839769A (en) * 1996-10-03 1998-11-24 Kinetrix, Inc. Expanding gripper with elastically variable pitch screw
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6077026A (en) * 1998-03-30 2000-06-20 Progressive System Technologies, Inc. Programmable substrate support for a substrate positioning system
FR2778496B1 (fr) 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
US6215897B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
US6176668B1 (en) * 1998-05-20 2001-01-23 Applied Komatsu Technology, Inc. In-situ substrate transfer shuttle
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6053694A (en) * 1998-06-26 2000-04-25 H-Square Corporation Rotatable wafer handler with retractable stops
US6244812B1 (en) 1998-07-10 2001-06-12 H-Square Corporation Low profile automated pod door removal system
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
JP4219562B2 (ja) 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
EP1332349A4 (de) * 2000-07-07 2008-12-17 Semitool Inc Automatisiertes verarbeitungssystem
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US7008802B2 (en) * 2001-05-29 2006-03-07 Asm America, Inc. Method and apparatus to correct water drift
WO2003018874A2 (en) 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US6900877B2 (en) 2002-06-12 2005-05-31 Asm American, Inc. Semiconductor wafer position shift measurement and correction
US7114903B2 (en) * 2002-07-16 2006-10-03 Semitool, Inc. Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
US6914251B1 (en) * 2003-03-07 2005-07-05 Axcelis Technologies, Inc. Alignment structure and method for mating a wafer delivery device to a wafer treatment tool
US6934661B2 (en) * 2003-12-16 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer edge detector
US7409263B2 (en) 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
US7720558B2 (en) 2004-09-04 2010-05-18 Applied Materials, Inc. Methods and apparatus for mapping carrier contents
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
US8041450B2 (en) * 2007-10-04 2011-10-18 Asm Japan K.K. Position sensor system for substrate transfer robot
US7685885B2 (en) * 2007-12-10 2010-03-30 Teradyne, Inc. Manipulator constant force spring counterbalance
KR101489963B1 (ko) * 2007-12-13 2015-02-04 한국에이에스엠지니텍 주식회사 박막 증착 장치 및 이를 이용한 증착 방법
US8273178B2 (en) * 2008-02-28 2012-09-25 Asm Genitech Korea Ltd. Thin film deposition apparatus and method of maintaining the same
US7963736B2 (en) 2008-04-03 2011-06-21 Asm Japan K.K. Wafer processing apparatus with wafer alignment device
US8936425B2 (en) * 2012-01-23 2015-01-20 Tera Autotech Corporation Ancillary apparatus and method for loading glass substrates into a bracket
US9196518B1 (en) 2013-03-15 2015-11-24 Persimmon Technologies, Corp. Adaptive placement system and method
CN107107336B (zh) 2014-11-18 2021-04-02 柿子技术公司 具有末端执行器位置估计的机器人自适应放置系统

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US4108323A (en) * 1977-09-28 1978-08-22 Rca Corporation Machine for changing the spacing of a plurality of wafers
US4367915A (en) * 1978-06-29 1983-01-11 Georges Michael P Automatic microscope slide
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system

Also Published As

Publication number Publication date
US4449885A (en) 1984-05-22
EP0095368A3 (en) 1986-03-26
JPS6329410B2 (de) 1988-06-14
EP0095368A2 (de) 1983-11-30
EP0095368B1 (de) 1989-12-06
JPS58213438A (ja) 1983-12-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.(N.

8339 Ceased/non-payment of the annual fee