DE3274659D1 - Process for metallising electrically insulating plastics articles, and intermediate articles for carrying out the same - Google Patents

Process for metallising electrically insulating plastics articles, and intermediate articles for carrying out the same

Info

Publication number
DE3274659D1
DE3274659D1 DE8282420173T DE3274659T DE3274659D1 DE 3274659 D1 DE3274659 D1 DE 3274659D1 DE 8282420173 T DE8282420173 T DE 8282420173T DE 3274659 T DE3274659 T DE 3274659T DE 3274659 D1 DE3274659 D1 DE 3274659D1
Authority
DE
Germany
Prior art keywords
articles
metallising
carrying
same
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282420173T
Other languages
English (en)
Inventor
Robert Cassat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhodia Chimie SAS
Original Assignee
Rhone Poulenc Specialites Chimiques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Specialites Chimiques filed Critical Rhone Poulenc Specialites Chimiques
Application granted granted Critical
Publication of DE3274659D1 publication Critical patent/DE3274659D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
DE8282420173T 1981-12-14 1982-12-06 Process for metallising electrically insulating plastics articles, and intermediate articles for carrying out the same Expired DE3274659D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8123472A FR2518126B1 (fr) 1981-12-14 1981-12-14 Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede

Publications (1)

Publication Number Publication Date
DE3274659D1 true DE3274659D1 (en) 1987-01-22

Family

ID=9265079

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282420173T Expired DE3274659D1 (en) 1981-12-14 1982-12-06 Process for metallising electrically insulating plastics articles, and intermediate articles for carrying out the same

Country Status (6)

Country Link
US (1) US4590115A (de)
EP (1) EP0082094B1 (de)
JP (1) JPS58122929A (de)
DE (1) DE3274659D1 (de)
FR (1) FR2518126B1 (de)
IE (1) IE53971B1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2544341A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants et articles obtenus
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus
FR2554303B1 (fr) * 1983-10-28 1986-04-18 Rhone Poulenc Rech Substrats metallisables pour circuits imprimes et leur procede de preparation
FR2566611A1 (fr) * 1984-06-25 1985-12-27 Rhone Poulenc Rech Nouveaux circuits imprimes injectes et procede d'obtention
JPS6250475A (ja) * 1985-08-29 1987-03-05 C-Ren Kk 導電性成形物
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
US4997674A (en) * 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
US4831210A (en) * 1987-12-02 1989-05-16 Macdermid, Incorporated Shields for electromagnetic radiation
US5049332A (en) * 1988-06-08 1991-09-17 Akzo Nv Method of making conductive metal-filled substrates without developing agents
JPH0379100A (ja) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd 光透過ペーストおよびそれを用いた金属銅析出方法
US5110633A (en) * 1989-09-01 1992-05-05 Ciba-Geigy Corporation Process for coating plastics articles
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5888623A (en) * 1993-03-20 1999-03-30 Hans Grohe Gmbh & Co. Kg Sanitary article or plumbing fitting with a coated surface and a print image applied thereto and a process for making the same
FR2707673B1 (fr) * 1993-07-16 1995-08-18 Trefimetaux Procédé de métallisation de substrats non-conducteurs.
JP2828584B2 (ja) * 1993-12-27 1998-11-25 株式会社小糸製作所 自動車用ヘッドランプ
FR2718673B1 (fr) * 1994-04-19 1996-05-24 Kermel Snc Article composite et procédé de fabrication de celui-ci.
US5441815A (en) * 1994-08-29 1995-08-15 Industrial Technology Research Institute Process for producing easily removable polyimide resin film
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
JP3641275B2 (ja) * 1995-08-14 2005-04-20 ユニヴァーサル・リソーセズ・アクチェンゲゼルシャフト 電気エネルギーの化学的源泉のための電極の製造方法
DE19602659A1 (de) * 1996-01-26 1997-07-31 Hoechst Ag Metallisierung von thermoplastischen Kunststoffen
US6546751B2 (en) * 1996-04-23 2003-04-15 Peter Jaeger Articles with selectively deposited overlay
GB2332209A (en) * 1997-12-09 1999-06-16 Devex Sa Electroplating involving the use of a preliminary coating
US6541080B1 (en) * 1998-12-14 2003-04-01 Enthone Inc. Double-dip Pd/Sn crosslinker
DE19927533B4 (de) * 1999-06-16 2004-03-04 Merck Patent Gmbh Miniaturisiertes Analysensystem
DE19927535B4 (de) * 1999-06-16 2004-06-17 Merck Patent Gmbh Miniaturisiertes Analysensystem mit Vorrichtung zum Ausschleusen von Substanzen
FR2819144B1 (fr) * 2000-12-29 2003-06-20 Kermel Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees
FR2812515B1 (fr) * 2000-07-27 2003-08-01 Kermel Procede de realisation d'une circuiterie comportant pistes, pastilles et microtraversees conductrices et utilisation de ce procede pour la realisation de circuits imprimes et de modules multicouches a haute densite d'integration
JP4051900B2 (ja) * 2000-12-20 2008-02-27 富士ゼロックス株式会社 金属薄膜を有する耐熱性樹脂フィルム及びその製造方法、無端状ベルト及びその製造方法並びに画像形成装置
US20040249364A1 (en) * 2003-06-03 2004-12-09 Ilya Kaploun Device and method for dispensing medication to tissue lining a body cavity
JP4803549B2 (ja) * 2006-03-03 2011-10-26 地方独立行政法人 大阪市立工業研究所 亜酸化銅膜に金属銅層を形成する方法
EP2033756A1 (de) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Herstellungsverfahren für ein Formprodukt
ES2416982T3 (es) 2010-02-12 2013-08-05 Atotech Deutschland Gmbh Procedimiento para la metalización de objetos que presentan al menos dos plásticos distintos sobre la superficie
EP2602357A1 (de) 2011-12-05 2013-06-12 Atotech Deutschland GmbH Neuartiges Haftmittel zur Metallisierung von Substratoberflächen
TW201337342A (zh) * 2012-02-14 2013-09-16 Fujifilm Corp 鏡面膜、其製造方法、以及太陽熱發電裝置用或太陽光發電裝置用鏡面膜
US9775239B2 (en) * 2014-04-08 2017-09-26 Panasonic Intellectual Property Management Co., Ltd. Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2690401A (en) * 1951-06-07 1954-09-28 Gen Am Transport Chemical nickel plating on nonmetallic materials
US3226256A (en) * 1963-01-02 1965-12-28 Jr Frederick W Schneble Method of making printed circuits
US3347724A (en) * 1964-08-19 1967-10-17 Photocircuits Corp Metallizing flexible substrata
US3764280A (en) * 1970-11-02 1973-10-09 Gen Electric Electroconductive coatings on non conductive substrates
US3775176A (en) * 1971-02-23 1973-11-27 Amicon Corp Method of forming an electroplatable microporous film with exposed metal particles within the pores
DE2141759A1 (de) * 1971-08-20 1973-03-01 Ver Flugtechnische Werke Verfahren zur metallisierung und kontaktierung nichtmetallischer werkstoffe
US3865699A (en) * 1973-10-23 1975-02-11 Int Nickel Co Electrodeposition on non-conductive surfaces
GB2000158B (en) * 1977-06-10 1982-01-13 Sumitomo Naugatuck Method for the preparation of a plated product
DE2837654A1 (de) * 1978-08-29 1980-03-13 Siemens Ag Schaltungsanordnung fuer fernsprechvermittlungssysteme, insbesondere fernsprechnebenstellenanlagen, mit zusaetzlichem datenverkehr, z.b. mit fernschreibern

Also Published As

Publication number Publication date
JPH0143038B2 (de) 1989-09-18
IE53971B1 (en) 1989-04-26
IE822956L (en) 1983-06-14
US4590115A (en) 1986-05-20
EP0082094A1 (de) 1983-06-22
FR2518126A1 (fr) 1983-06-17
JPS58122929A (ja) 1983-07-21
FR2518126B1 (fr) 1986-01-17
EP0082094B1 (de) 1986-12-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: RHONE-POULENC CHIMIE, COURBEVOIE, FR

8328 Change in the person/name/address of the agent

Free format text: WUESTHOFF, F., DR.-ING. FRHR. VON PECHMANN, E., DIPL.-CHEM. DR.RER.NAT. BEHRENS, D., DR.-ING. GOETZ, R., DIPL.-ING. DIPL.-WIRTSCH.-ING. HELLFELD VON, A., DIPL.-PHYS. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN