DE3269800D1 - Impedance matching stripline transition for microwave signals - Google Patents

Impedance matching stripline transition for microwave signals

Info

Publication number
DE3269800D1
DE3269800D1 DE8282850145T DE3269800T DE3269800D1 DE 3269800 D1 DE3269800 D1 DE 3269800D1 DE 8282850145 T DE8282850145 T DE 8282850145T DE 3269800 T DE3269800 T DE 3269800T DE 3269800 D1 DE3269800 D1 DE 3269800D1
Authority
DE
Germany
Prior art keywords
impedance matching
microwave signals
stripline transition
matching stripline
transition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282850145T
Other languages
English (en)
Inventor
Lars Gustaf Josefsson
Bengt Tomas Svensson
Lars Felix Moeschlin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE3269800D1 publication Critical patent/DE3269800D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
DE8282850145T 1981-06-30 1982-06-24 Impedance matching stripline transition for microwave signals Expired DE3269800D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8104097A SE426894B (sv) 1981-06-30 1981-06-30 Impedansriktig koaxialovergang for mikrovagssignaler

Publications (1)

Publication Number Publication Date
DE3269800D1 true DE3269800D1 (en) 1986-04-17

Family

ID=20344178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282850145T Expired DE3269800D1 (en) 1981-06-30 1982-06-24 Impedance matching stripline transition for microwave signals

Country Status (4)

Country Link
US (1) US4494083A (de)
EP (1) EP0069102B1 (de)
DE (1) DE3269800D1 (de)
SE (1) SE426894B (de)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
GB2171257A (en) * 1984-12-20 1986-08-20 Marconi Co Ltd A dipole array
US4609892A (en) * 1985-09-30 1986-09-02 Motorola, Inc. Stripline filter apparatus and method of making the same
JP2507476B2 (ja) * 1987-09-28 1996-06-12 株式会社東芝 半導体集積回路装置
US4851794A (en) * 1987-10-09 1989-07-25 Ball Corporation Microstrip to coplanar waveguide transitional device
US4816791A (en) * 1987-11-27 1989-03-28 General Electric Company Stripline to stripline coaxial transition
US4837529A (en) * 1988-03-24 1989-06-06 Honeywell, Inc. Millimeter wave microstrip to coaxial line side-launch transition
US4846696A (en) * 1988-06-15 1989-07-11 M/A-Com Omni Spectra, Inc. Microwave stripline connector
US5136271A (en) * 1989-01-09 1992-08-04 Mitsubishi Denki Kabushiki Kaisha Microwave integrated circuit mountings
US4994771A (en) * 1989-06-28 1991-02-19 Hughes Aircraft Company Micro-connector to microstrip controlled impedance interconnection assembly
US5032803A (en) * 1990-02-02 1991-07-16 American Telephone & Telegraph Company Directional stripline structure and manufacture
JPH042202A (ja) * 1990-04-19 1992-01-07 Sumitomo Electric Ind Ltd マイクロ波デバイス
US5057798A (en) * 1990-06-22 1991-10-15 Hughes Aircraft Company Space-saving two-sided microwave circuitry for hybrid circuits
US5065122A (en) * 1990-09-04 1991-11-12 Motorola, Inc. Transmission line using fluroplastic as a dielectric
FR2671232B1 (fr) * 1990-12-27 1993-07-30 Thomson Csf Charge pour ligne triplaque hyperfrequences a substrat dielectrique.
JPH04352305A (ja) * 1991-05-29 1992-12-07 Murata Mfg Co Ltd 三層構造スパイラルインダクタのインダクタンスの調整方法
US5184095A (en) * 1991-07-31 1993-02-02 Hughes Aircraft Company Constant impedance transition between transmission structures of different dimensions
FR2681732B1 (fr) * 1991-09-25 1993-11-05 Commissariat A Energie Atomique Systeme de connexion electrique pour cable plat.
US5229727A (en) * 1992-03-13 1993-07-20 General Electric Company Hermetically sealed microstrip to microstrip transition for printed circuit fabrication
GB9215707D0 (en) * 1992-07-23 1992-09-09 Cambridge Computer Rf waveguide signal transition apparatus
US5347241A (en) * 1993-02-08 1994-09-13 Hughes Aircraft Company Dual junction back-to-back microstrip four-port circulators
US5426404A (en) * 1994-01-28 1995-06-20 Motorola, Inc. Electrical circuit using low volume multilayer transmission line devices
JPH08508615A (ja) * 1994-01-28 1996-09-10 モトローラ・インコーポレイテッド 低容量多層伝送線装置を用いる電気回路
US5499005A (en) * 1994-01-28 1996-03-12 Gu; Wang-Chang A. Transmission line device using stacked conductive layers
US5467064A (en) * 1994-01-28 1995-11-14 Motorola, Inc. Embedded ground plane for providing shielded layers in low volume multilayer transmission line devices
US5644277A (en) * 1995-02-27 1997-07-01 Hughes Aircraft Company Three-wire-line vertical interconnect structure for multilevel substrates
US5631446A (en) * 1995-06-07 1997-05-20 Hughes Electronics Microstrip flexible printed wiring board interconnect line
GB9515233D0 (en) * 1995-07-25 1995-09-20 Cinch Connectors Ltd Co-axial connector system
US5757252A (en) * 1995-08-31 1998-05-26 Itt Industries, Inc. Wide frequency band transition between via RF transmission lines and planar transmission lines
KR100355263B1 (ko) * 1995-09-05 2002-12-31 가부시끼가이샤 히다치 세이사꾸쇼 동축공진형슬롯안테나와그제조방법및휴대무선단말
US5662816A (en) * 1995-12-04 1997-09-02 Lucent Technologies Inc. Signal isolating microwave splitters/combiners
US5644276A (en) * 1996-05-29 1997-07-01 The United States Of America As Represented By The Secretary Of The Army Multi-layer controllable impedance transition device for microwaves/millimeter waves
JPH10173410A (ja) * 1996-12-12 1998-06-26 Sharp Corp ストリップ線路を用いた伝送回路
US5842877A (en) * 1996-12-16 1998-12-01 Telefonaktiebolaget L M Ericsson Shielded and impedance-matched connector assembly, and associated method, for radio frequency circuit device
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
SE512166C2 (sv) 1997-11-21 2000-02-07 Ericsson Telefon Ab L M Mikrostripanordning
SE512566C2 (sv) * 1998-08-28 2000-04-03 Ericsson Telefon Ab L M Metod för vertikal förbindning av ledare i en anordning på mikrovågsområdet
JP4204150B2 (ja) * 1998-10-16 2009-01-07 パナソニック株式会社 多層回路基板
US6388206B2 (en) * 1998-10-29 2002-05-14 Agilent Technologies, Inc. Microcircuit shielded, controlled impedance “Gatling gun”via
US6181219B1 (en) * 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US6388208B1 (en) * 1999-06-11 2002-05-14 Teradyne, Inc. Multi-connection via with electrically isolated segments
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
SE518181C2 (sv) 1999-12-10 2002-09-03 Ericsson Telefon Ab L M Förfarande och anordning vid elektroniska kretsarrangemang
DE19959708A1 (de) * 1999-12-10 2001-06-13 Bosch Gmbh Robert Monolithisch integriertes Mikrowellenleiter-Bauelement zur Hochfrequenz-Überkopplung
US6539137B1 (en) 2000-03-08 2003-03-25 Fujitsu Limited Thermo-electric signal coupler
JP2001308547A (ja) * 2000-04-27 2001-11-02 Sharp Corp 高周波多層回路基板
US6919773B2 (en) * 2000-11-21 2005-07-19 Marconi Communications Gmbh Monolithically integrated microwave guide component for radio frequency overcoupling
US7501695B2 (en) * 2001-04-06 2009-03-10 Juhola Tarja A High frequency integrated circuit (HFIC) microsystems assembly and method for fabricating the same
US6727777B2 (en) * 2001-04-16 2004-04-27 Vitesse Semiconductor Corporation Apparatus and method for angled coaxial to planar structure broadband transition
GB2379096A (en) * 2001-08-22 2003-02-26 Ubinetics Ltd Apparatus and method for making an RF connection to an RF module
US7049903B2 (en) 2002-03-07 2006-05-23 Cyoptics (Israel) Ltd. Transition from a coaxial transmission line to a printed circuit transmission line
US6842084B2 (en) 2002-03-07 2005-01-11 Dov Herstein Transition from a coaxial transmission line to a printed circuit transmission line
DE10305855A1 (de) * 2003-02-13 2004-08-26 Robert Bosch Gmbh HF-Multilayer-Platine
US7336502B1 (en) * 2003-06-03 2008-02-26 Force10 Networks, Inc. High-speed router with backplane using tuned-impedance thru-holes and vias
US7030712B2 (en) * 2004-03-01 2006-04-18 Belair Networks Inc. Radio frequency (RF) circuit board topology
WO2005086554A1 (en) * 2004-03-09 2005-09-15 Nec Corporation Via transmission lines for multilayer printed circuit boards
US7205486B2 (en) * 2004-07-16 2007-04-17 Cardiac Pacemakers, Inc. Thermally isolated via structure
US20060039126A1 (en) * 2004-08-13 2006-02-23 Dan Gorcea Multilayer structure with device for improving integrity of signals propagating between signal layers
US7053729B2 (en) * 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
TWI248330B (en) * 2005-01-14 2006-01-21 Ind Tech Res Inst High frequency and wide band impedance matching via
CN101662882B (zh) * 2005-01-25 2011-05-25 财团法人工业技术研究院 高频宽带阻抗匹配的传输孔
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器
US7492146B2 (en) * 2005-05-16 2009-02-17 Teradyne, Inc. Impedance controlled via structure
US20070018752A1 (en) * 2005-07-20 2007-01-25 Efficere, Llc Optimization of through plane transitions
US7361994B2 (en) * 2005-09-30 2008-04-22 Intel Corporation System to control signal line capacitance
JP4755209B2 (ja) 2007-02-01 2011-08-24 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電磁気バンドギャップ構造物及び印刷回路基板
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
JP2008262989A (ja) * 2007-04-10 2008-10-30 Toshiba Corp 高周波回路基板
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
GB2461882B (en) * 2008-07-15 2012-07-25 Thales Holdings Uk Plc Integrated microwave circuit
US20100134376A1 (en) * 2008-12-01 2010-06-03 Toyota Motor Engineering & Manufacturing North America, Inc. Wideband rf 3d transitions
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
CN101945537A (zh) * 2009-07-10 2011-01-12 英华达(上海)电子有限公司 一种具有过孔结构的印刷电路板及其制造方法
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
US9054403B2 (en) 2012-06-21 2015-06-09 Raytheon Company Coaxial-to-stripline and stripline-to-stripline transitions including a shorted center via
US8957325B2 (en) 2013-01-15 2015-02-17 Fujitsu Limited Optimized via cutouts with ground references
DE102016007052A1 (de) * 2016-06-06 2017-12-07 Kathrein-Werke Kg Leiterplattenanordnung zur Signalversorgung eines Strahlers
IL250253B (en) 2017-01-24 2021-10-31 Arbe Robotics Ltd A method for separating targets and echoes from noise, in radar signals
JP6845118B2 (ja) * 2017-10-25 2021-03-17 株式会社Ｓｏｋｅｎ 高周波伝送線路
IL255982A (en) 2017-11-29 2018-01-31 Arbe Robotics Ltd Detection, mitigation and prevention of mutual interference between fixed water radars in vehicles
DE102018105349A1 (de) * 2018-03-08 2019-09-12 Infineon Technologies Ag Vorrichtung mit mindestens einem Streifenleiter
JP7072563B2 (ja) * 2018-03-09 2022-05-20 古河電気工業株式会社 高周波伝送線路、その高周波伝送線路を備えるレーダ装置及び無線機器
IL259146A (en) * 2018-05-03 2018-06-28 Arbe Robotics Ltd Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof
IL259190A (en) 2018-05-07 2018-06-28 Arbe Robotics Ltd System and method for frequency hopping MIMO FMCW imaging radar
IL260696A (en) 2018-07-19 2019-01-31 Arbe Robotics Ltd Method and device for structured self-testing of radio frequencies in a radar system
IL260695A (en) 2018-07-19 2019-01-31 Arbe Robotics Ltd Method and device for eliminating waiting times in a radar system
IL260694A (en) 2018-07-19 2019-01-31 Arbe Robotics Ltd Method and device for two-stage signal processing in a radar system
IL261636A (en) 2018-09-05 2018-10-31 Arbe Robotics Ltd Deflected MIMO antenna array for vehicle imaging radars
NL2022186B1 (en) * 2018-12-12 2020-07-02 Ampleon Netherlands Bv Power divider
JP6691622B1 (ja) * 2019-04-11 2020-04-28 株式会社フジクラ 導波路装置
IL271269A (en) 2019-12-09 2021-06-30 Arbe Robotics Ltd Radom for a planar antenna for car radar
DE102020202137A1 (de) 2020-02-19 2021-08-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Vorrichtung für lineare variable Kapazität
CN112020214B (zh) * 2020-09-01 2022-07-19 北京子兆信息技术有限公司 多层高频pcb板及其信号过孔优化方法
CN114900947A (zh) * 2022-04-15 2022-08-12 深南电路股份有限公司 印制电路板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
US3533023A (en) * 1967-09-19 1970-10-06 Motorola Inc Multilayered circuitry interconnections with integral shields
US4080579A (en) * 1972-03-07 1978-03-21 Raytheon Company Stripline four port hybrid junction
US3757272A (en) * 1972-07-12 1973-09-04 Raytheon Co Strip transmission line coupler
US3895435A (en) * 1974-01-23 1975-07-22 Raytheon Co Method for electrically interconnecting multilevel stripline circuitry
US4262265A (en) * 1979-03-29 1981-04-14 Ford Aerospace & Communications Corporation Side-launch transition for air stripline conductors

Also Published As

Publication number Publication date
SE8104097L (sv) 1982-12-31
SE426894B (sv) 1983-02-14
EP0069102A2 (de) 1983-01-05
US4494083A (en) 1985-01-15
EP0069102B1 (de) 1986-03-12
EP0069102A3 (en) 1983-03-16

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