DE19982497T1 - Elektronikmontagevorrichtung mit Höhenerfassungssensor - Google Patents
Elektronikmontagevorrichtung mit HöhenerfassungssensorInfo
- Publication number
- DE19982497T1 DE19982497T1 DE19982497T DE19982497T DE19982497T1 DE 19982497 T1 DE19982497 T1 DE 19982497T1 DE 19982497 T DE19982497 T DE 19982497T DE 19982497 T DE19982497 T DE 19982497T DE 19982497 T1 DE19982497 T1 DE 19982497T1
- Authority
- DE
- Germany
- Prior art keywords
- detection sensor
- mounting device
- height detection
- electronics mounting
- electronics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Operations Research (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Processing (AREA)
- Wire Bonding (AREA)
- Stereoscopic And Panoramic Photography (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Closed-Circuit Television Systems (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10718898P | 1998-11-05 | 1998-11-05 | |
US10750598P | 1998-11-06 | 1998-11-06 | |
US13199699P | 1999-04-30 | 1999-04-30 | |
US14461699P | 1999-07-20 | 1999-07-20 | |
US14461499P | 1999-07-20 | 1999-07-20 | |
PCT/US1999/026076 WO2000028278A1 (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with height sensing sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19982497T1 true DE19982497T1 (de) | 2001-02-01 |
Family
ID=27537179
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19982498T Withdrawn DE19982498T1 (de) | 1998-11-05 | 1999-11-04 | Elektronikmontagevorrichtung mit verbessertem Bilderzeugungssystem |
DE19982450T Withdrawn DE19982450T1 (de) | 1998-11-05 | 1999-11-05 | Elektronikmontagevorrichtung mit Stereo-Vision-Zeilenabtastsensor |
DE19982497T Withdrawn DE19982497T1 (de) | 1998-11-05 | 1999-11-05 | Elektronikmontagevorrichtung mit Höhenerfassungssensor |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19982498T Withdrawn DE19982498T1 (de) | 1998-11-05 | 1999-11-04 | Elektronikmontagevorrichtung mit verbessertem Bilderzeugungssystem |
DE19982450T Withdrawn DE19982450T1 (de) | 1998-11-05 | 1999-11-05 | Elektronikmontagevorrichtung mit Stereo-Vision-Zeilenabtastsensor |
Country Status (6)
Country | Link |
---|---|
US (2) | US6610991B1 (de) |
JP (3) | JP2002529907A (de) |
KR (3) | KR20010040321A (de) |
DE (3) | DE19982498T1 (de) |
GB (3) | GB2347741A (de) |
WO (3) | WO2000026640A1 (de) |
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KR100540442B1 (ko) * | 2002-10-01 | 2006-01-16 | 가부시키가이샤 도쿄 웰드 | 조명방법 및 조명장치 |
CH696615A5 (de) * | 2003-09-22 | 2007-08-15 | Esec Trading Sa | Verfahren für die Justierung des Bondkopfs eines Die Bonders. |
US7559134B2 (en) | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US7706595B2 (en) | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
DE102004052884B4 (de) * | 2004-11-02 | 2010-05-20 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Beleuchtungsanordnung und optisches Meßsystem zum Erfassen von Objekten |
US7359068B2 (en) * | 2004-11-12 | 2008-04-15 | Rvsi Inspection Llc | Laser triangulation method for measurement of highly reflective solder balls |
DE102005054921A1 (de) * | 2004-12-13 | 2006-06-22 | Assembléon N.V. | Berührungslose Schnittstelle für Bestückungsmaschinen |
JP2007042766A (ja) * | 2005-08-02 | 2007-02-15 | Matsushita Electric Ind Co Ltd | 電子部品の実装装置および実装方法 |
WO2007015561A1 (en) * | 2005-08-02 | 2007-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounter and mounting method |
GB0616410D0 (en) * | 2006-08-21 | 2006-10-18 | Anaglyph Ltd | Visual aid for manufacturing assembly/component placement |
JP4939391B2 (ja) * | 2007-03-28 | 2012-05-23 | ヤマハ発動機株式会社 | 実装機 |
JP5239561B2 (ja) * | 2008-07-03 | 2013-07-17 | オムロン株式会社 | 基板外観検査方法および基板外観検査装置 |
DE102009016288B4 (de) | 2009-01-02 | 2013-11-21 | Singulus Technologies Ag | Verfahren und Vorrichtung für die Ausrichtung von Substraten |
SG173068A1 (en) * | 2009-02-06 | 2011-08-29 | Agency Science Tech & Res | Methods for examining a bonding structure of a substrate and bonding structure inspection devices |
US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
EP2415021B1 (de) * | 2009-04-03 | 2016-07-27 | Singulus Technologies AG | Verfahren und vorrichtung für die ausrichtung von substraten |
US20100295935A1 (en) * | 2009-05-06 | 2010-11-25 | Case Steven K | On-head component alignment using multiple area array image detectors |
JP5780712B2 (ja) * | 2009-05-29 | 2015-09-16 | 富士機械製造株式会社 | 撮像システムおよび電子回路部品装着機 |
US8670031B2 (en) | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8388204B2 (en) | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8681211B2 (en) | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
US8894259B2 (en) | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
US8872912B2 (en) | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
JP2011080932A (ja) * | 2009-10-09 | 2011-04-21 | Fujitsu Ltd | 表面検査装置及び表面検査方法 |
JP5562906B2 (ja) * | 2011-06-09 | 2014-07-30 | ヤマハ発動機株式会社 | 部品撮像方法、部品撮像装置および同装置を備えた部品実装装置 |
KR20130077813A (ko) * | 2011-11-08 | 2013-07-09 | 가부시키가이샤 메가 트레이드 | 프린트 기판의 검사 장치 |
JP6078826B2 (ja) * | 2011-12-27 | 2017-02-15 | シーシーエス株式会社 | ライン光照射装置 |
JP5863547B2 (ja) | 2012-04-20 | 2016-02-16 | ヤマハ発動機株式会社 | プリント基板の検査装置 |
US9200890B2 (en) | 2012-05-22 | 2015-12-01 | Cognex Corporation | Machine vision systems and methods with predictive motion control |
US10083496B2 (en) | 2012-05-22 | 2018-09-25 | Cognex Corporation | Machine vision systems and methods with predictive motion control |
TWI493201B (zh) * | 2012-11-09 | 2015-07-21 | Ind Tech Res Inst | 電子零件腳位判斷與插件之方法與系統 |
US11176635B2 (en) * | 2013-01-25 | 2021-11-16 | Cyberoptics Corporation | Automatic programming of solder paste inspection system |
DE102013215430B4 (de) * | 2013-08-06 | 2016-07-14 | Lufthansa Technik Ag | Bearbeitungseinrichtung |
US9743527B2 (en) | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
EP3057390B1 (de) * | 2013-10-09 | 2020-02-19 | FUJI Corporation | Programm zur ladepositionsoptimierung |
US9704232B2 (en) | 2014-03-18 | 2017-07-11 | Arizona Board of Regents of behalf of Arizona State University | Stereo vision measurement system and method |
CN104236609A (zh) * | 2014-10-17 | 2014-12-24 | 珠海格力电工有限公司 | 一种漆包线检测头总成 |
JP6485064B2 (ja) * | 2015-01-21 | 2019-03-20 | 株式会社ジェイテクト | 球体位置計測方法 |
MY184276A (en) * | 2015-02-16 | 2021-03-30 | Exis Tech Sdn Bhd | Device and method for conveying and flipping a component |
US10575451B2 (en) * | 2015-06-16 | 2020-02-25 | Fuji Corporation | Insertion component positioning inspection method and insertion component mounting method, and insertion component positioning inspection device and insertion component mounting device |
US10621745B2 (en) * | 2015-06-19 | 2020-04-14 | Yamaha Hatsudoki Kabushiki Kaisha | Component mounting device and component mounting method |
JP6660774B2 (ja) * | 2016-03-08 | 2020-03-11 | オリンパス株式会社 | 高さデータ処理装置、表面形状測定装置、高さデータ補正方法、及びプログラム |
CN110651538B (zh) * | 2017-05-31 | 2021-05-04 | 株式会社富士 | 作业机及运算方法 |
US11178801B2 (en) | 2017-07-12 | 2021-11-16 | Mycronic AB | Method and system for determining component illumination settings |
US11272648B2 (en) * | 2017-08-09 | 2022-03-08 | Fuji Corporation | Component mounting machine |
SG11202003745TA (en) * | 2017-10-26 | 2020-05-28 | Shinkawa Kk | Bonding apparatus |
US10842026B2 (en) * | 2018-02-12 | 2020-11-17 | Xerox Corporation | System for forming electrical circuits on non-planar objects |
KR20220038664A (ko) | 2019-07-25 | 2022-03-29 | 필립모리스 프로덕츠 에스.에이. | 에어로졸 발생 물품용 자동판매 장치 |
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1999
- 1999-11-04 WO PCT/US1999/026186 patent/WO2000026640A1/en not_active Application Discontinuation
- 1999-11-04 JP JP2000579970A patent/JP2002529907A/ja active Pending
- 1999-11-04 DE DE19982498T patent/DE19982498T1/de not_active Withdrawn
- 1999-11-04 US US09/434,325 patent/US6610991B1/en not_active Expired - Fee Related
- 1999-11-04 KR KR1020007007461A patent/KR20010040321A/ko not_active Application Discontinuation
- 1999-11-04 US US09/434,320 patent/US6608320B1/en not_active Expired - Fee Related
- 1999-11-04 GB GB0014999A patent/GB2347741A/en not_active Withdrawn
- 1999-11-05 WO PCT/US1999/026162 patent/WO2000026850A1/en not_active Application Discontinuation
- 1999-11-05 DE DE19982450T patent/DE19982450T1/de not_active Withdrawn
- 1999-11-05 JP JP2000581414A patent/JP2002529722A/ja active Pending
- 1999-11-05 GB GB0015002A patent/GB2346693A/en not_active Withdrawn
- 1999-11-05 JP JP2000580156A patent/JP2002529711A/ja active Pending
- 1999-11-05 GB GB0014172A patent/GB2346970A/en not_active Withdrawn
- 1999-11-05 WO PCT/US1999/026076 patent/WO2000028278A1/en active IP Right Grant
- 1999-11-05 DE DE19982497T patent/DE19982497T1/de not_active Withdrawn
- 1999-11-05 KR KR1020007007475A patent/KR20010033900A/ko not_active Application Discontinuation
- 1999-11-05 KR KR1020007007462A patent/KR100615912B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20010033888A (ko) | 2001-04-25 |
GB2346693A (en) | 2000-08-16 |
KR20010033900A (ko) | 2001-04-25 |
WO2000028278A1 (en) | 2000-05-18 |
US6608320B1 (en) | 2003-08-19 |
GB0015002D0 (en) | 2000-08-09 |
KR20010040321A (ko) | 2001-05-15 |
KR100615912B1 (ko) | 2006-08-28 |
GB2346970A (en) | 2000-08-23 |
US6610991B1 (en) | 2003-08-26 |
WO2000026850A1 (en) | 2000-05-11 |
DE19982498T1 (de) | 2001-02-22 |
GB0014172D0 (en) | 2000-08-02 |
WO2000028278A9 (en) | 2002-08-22 |
WO2000026640A1 (en) | 2000-05-11 |
GB2347741A (en) | 2000-09-13 |
JP2002529722A (ja) | 2002-09-10 |
DE19982450T1 (de) | 2001-05-17 |
GB0014999D0 (en) | 2000-08-09 |
JP2002529711A (ja) | 2002-09-10 |
JP2002529907A (ja) | 2002-09-10 |
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