DE19882929T1 - Temperaturkontrollsystem für eine Werkstückhalterung - Google Patents

Temperaturkontrollsystem für eine Werkstückhalterung

Info

Publication number
DE19882929T1
DE19882929T1 DE19882929T DE19882929T DE19882929T1 DE 19882929 T1 DE19882929 T1 DE 19882929T1 DE 19882929 T DE19882929 T DE 19882929T DE 19882929 T DE19882929 T DE 19882929T DE 19882929 T1 DE19882929 T1 DE 19882929T1
Authority
DE
Germany
Prior art keywords
control system
temperature control
workpiece holder
workpiece
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19882929T
Other languages
English (en)
Other versions
DE19882929B4 (de
Inventor
Paul A Getchel
Kenneth M Cole
Henry A Lyden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Temptronic Corp
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of DE19882929T1 publication Critical patent/DE19882929T1/de
Application granted granted Critical
Publication of DE19882929B4 publication Critical patent/DE19882929B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/12Arrangements for cooling or lubricating parts of the machine
    • B23Q11/126Arrangements for cooling or lubricating parts of the machine for cooling only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/14Methods or arrangements for maintaining a constant temperature in parts of machine tools
    • B23Q11/141Methods or arrangements for maintaining a constant temperature in parts of machine tools using a closed fluid circuit for cooling or heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/14Methods or arrangements for maintaining a constant temperature in parts of machine tools
    • B23Q11/143Methods or arrangements for maintaining a constant temperature in parts of machine tools comprising heating means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00Fluid-circulation arrangements
    • F25B41/20Disposition of valves, e.g. of on-off valves or flow control valves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67103Apparatus for thermal treatment mainly by conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00Fluid-circulation arrangements
    • F25B41/20Disposition of valves, e.g. of on-off valves or flow control valves
    • F25B41/22Disposition of valves, e.g. of on-off valves or flow control valves between evaporator and compressor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
DE19882929T 1997-12-31 1998-11-09 Temperaturkontrollsystem für eine Werkstückhalterung Expired - Fee Related DE19882929B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/001,887 US6415858B1 (en) 1997-12-31 1997-12-31 Temperature control system for a workpiece chuck
US09/001,887 1997-12-31
PCT/US1998/023716 WO1999034159A1 (en) 1997-12-31 1998-11-09 Temperature control system for a workpiece chuck

Publications (2)

Publication Number Publication Date
DE19882929T1 true DE19882929T1 (de) 2001-01-04
DE19882929B4 DE19882929B4 (de) 2008-05-08

Family

ID=21698290

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882929T Expired - Fee Related DE19882929B4 (de) 1997-12-31 1998-11-09 Temperaturkontrollsystem für eine Werkstückhalterung

Country Status (4)

Country Link
US (3) US6415858B1 (de)
JP (1) JP2002500432A (de)
DE (1) DE19882929B4 (de)
WO (1) WO1999034159A1 (de)

Families Citing this family (162)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6866094B2 (en) * 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
US6328096B1 (en) 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP2000283500A (ja) * 1999-03-29 2000-10-13 Canon Inc 環境制御装置、半導体製造装置および検査・測定装置
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
US6545494B1 (en) 2000-07-10 2003-04-08 Temptronic Corporation Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
JP2004507886A (ja) * 2000-07-21 2004-03-11 テンプトロニック コーポレイション 温度制御された自動試験用熱プラットフォーム
US7051801B1 (en) * 2000-07-28 2006-05-30 Hydrogenics Corporation Method and apparatus for humidification and temperature control of incoming fuel cell process gas
CN1314154C (zh) * 2000-07-28 2007-05-02 洁能氏公司 对引入燃料电池的过程气体进行增湿和温度控制的方法和装置
EP1182449A1 (de) * 2000-08-21 2002-02-27 Motorola, Inc. Vorrichtung und Verfahren zum Umgang mit integrierten Schaltungen
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6467295B2 (en) * 2000-12-01 2002-10-22 Lg Electronics Inc. Refrigerated cooling apparatus for semiconductor device
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
JP3973853B2 (ja) * 2001-03-28 2007-09-12 大日本スクリーン製造株式会社 熱処理装置
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
US6748756B2 (en) 2002-07-02 2004-06-15 Delphi Technologies, Inc. HVAC system with periodic override of evaporator control
US6837061B2 (en) 2002-07-02 2005-01-04 Delphi Technologies, Inc. HVAC system shutdown sequence
US6758052B2 (en) 2002-07-02 2004-07-06 Delphi Technologies, Inc. HVAC system with post-shut down isolation and venting of evaporator using H-shaped valve
US7452712B2 (en) * 2002-07-30 2008-11-18 Applied Biosystems Inc. Sample block apparatus and method of maintaining a microcard on a sample block
US7044213B2 (en) * 2002-12-31 2006-05-16 Industrial Technology Research Institute Constant temperature refrigeration system for extensive temperature range application and control method thereof
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US20050114069A1 (en) * 2003-11-21 2005-05-26 Exco Technologies, Ltd. Die temperature control
EP1692714A1 (de) * 2003-11-26 2006-08-23 Temptronic Corporation Vorrichtung und verfahren zur verringerung von elektrischem rauschen in einer thermisch gesteuerten einspannvorrichtung
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
TWI296323B (en) * 2003-12-25 2008-05-01 Ind Tech Res Inst Constant temperature refrigeration system for extensive temperature range application and control method thereof
US7199597B2 (en) * 2004-02-16 2007-04-03 Delta Design, Inc. Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
US7196535B2 (en) * 2004-04-26 2007-03-27 Intel Corporation Thermal control system for environmental test chamber
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
JP2006153429A (ja) * 2004-10-25 2006-06-15 Nuflare Technology Inc 恒温流体供給システム
US7731798B2 (en) * 2004-12-01 2010-06-08 Ultratech, Inc. Heated chuck for laser thermal processing
DE102005001163B3 (de) 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
TWI288240B (en) * 2005-06-14 2007-10-11 Siliconware Precision Industries Co Ltd Electronic component test system including temperature measurement by light
JP4947949B2 (ja) * 2005-10-13 2012-06-06 株式会社東京精密 プローバ
DE102005049598B4 (de) * 2005-10-17 2017-10-19 Att Advanced Temperature Test Systems Gmbh Hybrid Chuck
US20070201734A1 (en) * 2006-02-24 2007-08-30 The University Of Chicago Automated multicolor fluorescent microscope with scanning and thermostatic ability
US20070240870A1 (en) * 2006-04-18 2007-10-18 Daytona Control Co., Ltd. Temperature control apparatus
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
WO2008060270A1 (en) * 2006-11-13 2008-05-22 Carrier Corporation Minichannel heat exchanger header insert for distribution
JP2010514558A (ja) * 2006-12-26 2010-05-06 フジフィルム ディマティックス, インコーポレイテッド 導電性要素を有するプリントシステム
US8896335B2 (en) * 2007-07-30 2014-11-25 Advantest Corporation Thermal controller for electronic devices
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5102005B2 (ja) * 2007-12-12 2012-12-19 関東精機株式会社 工作機械の温度制御装置
DE102008027424A1 (de) * 2008-06-10 2009-12-17 Hydac S.A. Fluidkühlvorrichtung
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
DE112008003714T5 (de) * 2008-10-29 2010-11-25 Advantest Corp. Temperatursteuerung für elektronische Bauelemente
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP5185790B2 (ja) * 2008-11-27 2013-04-17 株式会社日立ハイテクノロジーズ プラズマ処理装置
US20100244868A1 (en) * 2009-03-26 2010-09-30 Tektronix, Inc. Wireless Clamp-on Current Probe
EP2413045B1 (de) * 2010-07-30 2014-02-26 Grundfos Management A/S Wärmetauschereinheit
EP2413046B1 (de) * 2010-07-30 2016-03-30 Grundfos Management A/S Brauchwassererwärmungseinheit
US10283321B2 (en) 2011-01-18 2019-05-07 Applied Materials, Inc. Semiconductor processing system and methods using capacitively coupled plasma
KR20130031945A (ko) * 2011-09-22 2013-04-01 삼성전자주식회사 로딩용 척의 온도 제어 설비 및 온도 제어 방법
GB201118339D0 (en) * 2011-10-24 2011-12-07 Cambridge Reactor Design Ltd Heating and cooling apparatus
CN202796877U (zh) * 2012-04-16 2013-03-13 京东方科技集团股份有限公司 一种基板支撑梢
US8831529B2 (en) 2012-04-30 2014-09-09 Apple Inc. Wireless communications circuitry with temperature compensation
JP2012185184A (ja) * 2012-07-02 2012-09-27 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置
JP2012208132A (ja) * 2012-07-31 2012-10-25 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置
US9373517B2 (en) 2012-08-02 2016-06-21 Applied Materials, Inc. Semiconductor processing with DC assisted RF power for improved control
US9132436B2 (en) 2012-09-21 2015-09-15 Applied Materials, Inc. Chemical control features in wafer process equipment
US9244107B2 (en) * 2012-11-12 2016-01-26 Marvell World Trade Ltd. Heat sink blade pack for device under test testing
US9395404B2 (en) 2012-12-14 2016-07-19 Infineon Technologies Ag Method for testing semiconductor chips or semiconductor chip modules
US10256079B2 (en) 2013-02-08 2019-04-09 Applied Materials, Inc. Semiconductor processing systems having multiple plasma configurations
US20140361099A1 (en) * 2013-06-05 2014-12-11 Finishing Brands Holdings Inc. System and Method for Thermal Control of Flow Through a Conduit
US9309598B2 (en) 2014-05-28 2016-04-12 Applied Materials, Inc. Oxide and metal removal
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US11637002B2 (en) 2014-11-26 2023-04-25 Applied Materials, Inc. Methods and systems to enhance process uniformity
US10224210B2 (en) 2014-12-09 2019-03-05 Applied Materials, Inc. Plasma processing system with direct outlet toroidal plasma source
US10573496B2 (en) 2014-12-09 2020-02-25 Applied Materials, Inc. Direct outlet toroidal plasma source
US11257693B2 (en) * 2015-01-09 2022-02-22 Applied Materials, Inc. Methods and systems to improve pedestal temperature control
US20160225652A1 (en) 2015-02-03 2016-08-04 Applied Materials, Inc. Low temperature chuck for plasma processing systems
US9728437B2 (en) 2015-02-03 2017-08-08 Applied Materials, Inc. High temperature chuck for plasma processing systems
WO2016129044A1 (ja) * 2015-02-09 2016-08-18 富士通株式会社 冷却装置及び電子機器
US10381248B2 (en) * 2015-06-22 2019-08-13 Lam Research Corporation Auto-correction of electrostatic chuck temperature non-uniformity
US10386821B2 (en) 2015-06-22 2019-08-20 Lam Research Corporation Systems and methods for calibrating scalar field contribution values for a limited number of sensors including a temperature value of an electrostatic chuck and estimating temperature distribution profiles based on calibrated values
US10763142B2 (en) 2015-06-22 2020-09-01 Lam Research Corporation System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
US9779974B2 (en) 2015-06-22 2017-10-03 Lam Research Corporation System and method for reducing temperature transition in an electrostatic chuck
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US9349605B1 (en) 2015-08-07 2016-05-24 Applied Materials, Inc. Oxide etch selectivity systems and methods
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US9826574B2 (en) * 2015-10-28 2017-11-21 Watlow Electric Manufacturing Company Integrated heater and sensor system
CN106808309A (zh) * 2015-11-30 2017-06-09 湖南衡泰机械科技有限公司 一种铣床保温结构
TWI587114B (zh) 2016-02-05 2017-06-11 致茂電子股份有限公司 雙迴路溫度控制模組及具備該模組之電子元件測試設備
US10504754B2 (en) 2016-05-19 2019-12-10 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
US10522371B2 (en) 2016-05-19 2019-12-31 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
US10062575B2 (en) 2016-09-09 2018-08-28 Applied Materials, Inc. Poly directional etch by oxidation
US10629473B2 (en) 2016-09-09 2020-04-21 Applied Materials, Inc. Footing removal for nitride spacer
US9934942B1 (en) 2016-10-04 2018-04-03 Applied Materials, Inc. Chamber with flow-through source
US10062585B2 (en) 2016-10-04 2018-08-28 Applied Materials, Inc. Oxygen compatible plasma source
US10546729B2 (en) 2016-10-04 2020-01-28 Applied Materials, Inc. Dual-channel showerhead with improved profile
US10062579B2 (en) 2016-10-07 2018-08-28 Applied Materials, Inc. Selective SiN lateral recess
US9947549B1 (en) 2016-10-10 2018-04-17 Applied Materials, Inc. Cobalt-containing material removal
US9768034B1 (en) 2016-11-11 2017-09-19 Applied Materials, Inc. Removal methods for high aspect ratio structures
US10163696B2 (en) 2016-11-11 2018-12-25 Applied Materials, Inc. Selective cobalt removal for bottom up gapfill
US10242908B2 (en) 2016-11-14 2019-03-26 Applied Materials, Inc. Airgap formation with damage-free copper
US10026621B2 (en) 2016-11-14 2018-07-17 Applied Materials, Inc. SiN spacer profile patterning
US10566206B2 (en) 2016-12-27 2020-02-18 Applied Materials, Inc. Systems and methods for anisotropic material breakthrough
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
US10403507B2 (en) 2017-02-03 2019-09-03 Applied Materials, Inc. Shaped etch profile with oxidation
US10043684B1 (en) 2017-02-06 2018-08-07 Applied Materials, Inc. Self-limiting atomic thermal etching systems and methods
US10319739B2 (en) 2017-02-08 2019-06-11 Applied Materials, Inc. Accommodating imperfectly aligned memory holes
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
US10319649B2 (en) 2017-04-11 2019-06-11 Applied Materials, Inc. Optical emission spectroscopy (OES) for remote plasma monitoring
US11276590B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Multi-zone semiconductor substrate supports
US11276559B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Semiconductor processing chamber for multiple precursor flow
US10497579B2 (en) 2017-05-31 2019-12-03 Applied Materials, Inc. Water-free etching methods
US10049891B1 (en) 2017-05-31 2018-08-14 Applied Materials, Inc. Selective in situ cobalt residue removal
US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
US10541246B2 (en) 2017-06-26 2020-01-21 Applied Materials, Inc. 3D flash memory cells which discourage cross-cell electrical tunneling
US10727080B2 (en) 2017-07-07 2020-07-28 Applied Materials, Inc. Tantalum-containing material removal
US10541184B2 (en) 2017-07-11 2020-01-21 Applied Materials, Inc. Optical emission spectroscopic techniques for monitoring etching
US10354889B2 (en) 2017-07-17 2019-07-16 Applied Materials, Inc. Non-halogen etching of silicon-containing materials
US10043674B1 (en) 2017-08-04 2018-08-07 Applied Materials, Inc. Germanium etching systems and methods
US10170336B1 (en) 2017-08-04 2019-01-01 Applied Materials, Inc. Methods for anisotropic control of selective silicon removal
US10297458B2 (en) 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
US10283324B1 (en) 2017-10-24 2019-05-07 Applied Materials, Inc. Oxygen treatment for nitride etching
US10128086B1 (en) 2017-10-24 2018-11-13 Applied Materials, Inc. Silicon pretreatment for nitride removal
US10256112B1 (en) 2017-12-08 2019-04-09 Applied Materials, Inc. Selective tungsten removal
US10903054B2 (en) 2017-12-19 2021-01-26 Applied Materials, Inc. Multi-zone gas distribution systems and methods
US11328909B2 (en) 2017-12-22 2022-05-10 Applied Materials, Inc. Chamber conditioning and removal processes
US10854426B2 (en) 2018-01-08 2020-12-01 Applied Materials, Inc. Metal recess for semiconductor structures
US10679870B2 (en) 2018-02-15 2020-06-09 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus
US10964512B2 (en) 2018-02-15 2021-03-30 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus and methods
TWI716818B (zh) 2018-02-28 2021-01-21 美商應用材料股份有限公司 形成氣隙的系統及方法
US10593560B2 (en) 2018-03-01 2020-03-17 Applied Materials, Inc. Magnetic induction plasma source for semiconductor processes and equipment
US10319600B1 (en) 2018-03-12 2019-06-11 Applied Materials, Inc. Thermal silicon etch
US10497573B2 (en) 2018-03-13 2019-12-03 Applied Materials, Inc. Selective atomic layer etching of semiconductor materials
US10573527B2 (en) 2018-04-06 2020-02-25 Applied Materials, Inc. Gas-phase selective etching systems and methods
US10490406B2 (en) 2018-04-10 2019-11-26 Appled Materials, Inc. Systems and methods for material breakthrough
US10699879B2 (en) 2018-04-17 2020-06-30 Applied Materials, Inc. Two piece electrode assembly with gap for plasma control
US10886137B2 (en) 2018-04-30 2021-01-05 Applied Materials, Inc. Selective nitride removal
US10872778B2 (en) 2018-07-06 2020-12-22 Applied Materials, Inc. Systems and methods utilizing solid-phase etchants
US10755941B2 (en) 2018-07-06 2020-08-25 Applied Materials, Inc. Self-limiting selective etching systems and methods
US10672642B2 (en) 2018-07-24 2020-06-02 Applied Materials, Inc. Systems and methods for pedestal configuration
US11049755B2 (en) 2018-09-14 2021-06-29 Applied Materials, Inc. Semiconductor substrate supports with embedded RF shield
US10892198B2 (en) 2018-09-14 2021-01-12 Applied Materials, Inc. Systems and methods for improved performance in semiconductor processing
US11062887B2 (en) 2018-09-17 2021-07-13 Applied Materials, Inc. High temperature RF heater pedestals
US11417534B2 (en) 2018-09-21 2022-08-16 Applied Materials, Inc. Selective material removal
US11682560B2 (en) 2018-10-11 2023-06-20 Applied Materials, Inc. Systems and methods for hafnium-containing film removal
US11121002B2 (en) 2018-10-24 2021-09-14 Applied Materials, Inc. Systems and methods for etching metals and metal derivatives
US11437242B2 (en) 2018-11-27 2022-09-06 Applied Materials, Inc. Selective removal of silicon-containing materials
JP7304722B2 (ja) * 2018-11-29 2023-07-07 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
US10920319B2 (en) 2019-01-11 2021-02-16 Applied Materials, Inc. Ceramic showerheads with conductive electrodes
DE102019128942A1 (de) * 2019-10-28 2021-04-29 Infineon Technologies Ag Prober mit Kühlmechanismus zum direkten Kühlen einer zu prüfenden Vorrichtung
CN113752079A (zh) * 2021-09-13 2021-12-07 黑马瓦尔特防护技术(连云港)有限公司 一种带除尘机构的机床防护罩及其除尘方法
JP2023046600A (ja) * 2021-09-24 2023-04-05 東京エレクトロン株式会社 基板載置機構、検査装置、および検査方法
WO2024055100A1 (en) * 2022-09-12 2024-03-21 Photon Control Inc. Temperature measurement system using fiber bragg grating

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2182174A (en) * 1938-05-14 1939-12-05 B F Sturtevant Company Of Hyde Air conditioning system
US2466460A (en) * 1947-10-17 1949-04-05 Gen Electric Refrigerating system
US2934322A (en) * 1955-09-01 1960-04-26 Frederick E Hazard Heat exchanger
US2840352A (en) * 1955-09-01 1958-06-24 Dunham Bush Inc Evaporative condenser
US2917287A (en) * 1957-10-28 1959-12-15 Electro Temp Corp Heating and/or cooling system
US3066578A (en) * 1958-12-17 1962-12-04 Cincinnati Milling Machine Co Temperature control of machine tool
US3237415A (en) * 1964-12-31 1966-03-01 Borg Warner Zone controlled refrigeration system
US3313120A (en) * 1966-05-02 1967-04-11 Carier Corp Evaporative condenser
GB1454508A (en) * 1973-04-26 1976-11-03 Shipowners Cargo Res Assoc Refrigeration control systems
US3910345A (en) * 1974-04-22 1975-10-07 James J Whalen Heating and cooling system
US4071078A (en) * 1976-11-03 1978-01-31 Padden William R Hydronic heating and cooling system
US4415847A (en) * 1981-08-07 1983-11-15 Energy Development Associates, Inc. Method and apparatus for supplying cooling liquid to a storage battery
US4607220A (en) 1984-05-07 1986-08-19 The Micromanipulator Co., Inc. Method and apparatus for low temperature testing of electronic components
US4682857A (en) 1985-04-02 1987-07-28 Peng Tan Liquid crystal hot spot detection with infinitesimal temperature control
US4734872A (en) 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
JPS62148123A (ja) * 1985-12-18 1987-07-02 Mitsubishi Electric Corp 放電加工装置
US4802338A (en) * 1986-04-25 1989-02-07 Advantage Engineering Incorporated Precision-controlled water chiller
US4850201A (en) * 1986-04-25 1989-07-25 Advantage Engineering Incorporated Precision-controlled water chiller
US4872835A (en) * 1986-07-24 1989-10-10 Hewlett-Packard Company Hot chuck assembly for integrated circuit wafers
US5198752A (en) * 1987-09-02 1993-03-30 Tokyo Electron Limited Electric probing-test machine having a cooling system
FR2631165B1 (fr) * 1988-05-05 1992-02-21 Moulene Daniel Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support
EP0363098B1 (de) * 1988-10-03 1995-04-05 Canon Kabushiki Kaisha Vorrichtung zum Regeln der Temperatur
US4893914A (en) 1988-10-12 1990-01-16 The Micromanipulator Company, Inc. Test station
JP2737010B2 (ja) * 1989-08-01 1998-04-08 キヤノン株式会社 露光装置
US5192849A (en) 1990-08-10 1993-03-09 Texas Instruments Incorporated Multipurpose low-thermal-mass chuck for semiconductor processing equipment
US5183101A (en) * 1991-05-21 1993-02-02 Bio-Rad Laboratories, Inc. Circulating chiller for electrified solutions
US5226471A (en) * 1991-09-23 1993-07-13 General Electric Company Leak isolating apparatus for liquid cooled electronic units in a coolant circulation system
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5435379A (en) * 1992-08-14 1995-07-25 Texas Instruments Incorporated Method and apparatus for low-temperature semiconductor processing
US5567267A (en) * 1992-11-20 1996-10-22 Tokyo Electron Limited Method of controlling temperature of susceptor
DK0706633T3 (da) * 1993-07-03 1998-09-28 Honeywell Ag Pladevarmeveksler med kølemiddelfordeler
US5531266A (en) * 1993-12-28 1996-07-02 Uop Method of indirect heat exchange for two phase flow distribution
JP3188363B2 (ja) * 1994-01-21 2001-07-16 エフエスアイ・インターナショナル・インコーポレーテッド 循環クーラントを用いた温度コントローラ及びそのための温度制御方法
US5523640A (en) * 1994-04-22 1996-06-04 Cincinnati Milacron Inc. Liquid cooling for electrical components of a plastics processing machine
FI97694C (fi) 1994-09-27 1997-02-10 Hadwaco Ltd Oy Haihduttimen nesteenjakaja
US5491982A (en) * 1994-10-27 1996-02-20 Aec, Inc. Chiller bypass
JPH08189725A (ja) 1995-01-05 1996-07-23 Nippondenso Co Ltd 冷媒蒸発器
US5610529A (en) 1995-04-28 1997-03-11 Cascade Microtech, Inc. Probe station having conductive coating added to thermal chuck insulator
US6104203A (en) 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
FI98496C (fi) * 1995-08-22 1997-07-10 Hadwaco Ltd Oy Haihduttimen nesteenjakaja
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
JPH09157846A (ja) * 1995-12-01 1997-06-17 Teisan Kk 温度調節装置
US6063710A (en) * 1996-02-26 2000-05-16 Sony Corporation Method and apparatus for dry etching with temperature control
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
EP0827187A3 (de) 1996-08-26 2004-01-07 Applied Materials, Inc. Verfahren und Vorrichtung zum Kühlen eines Werkstücks mit einer elektrostatischen Halteplatte
US5846375A (en) * 1996-09-26 1998-12-08 Micron Technology, Inc. Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment
JPH10135315A (ja) * 1996-10-29 1998-05-22 Tokyo Electron Ltd 試料載置台の温度制御装置及び検査装置
US6026896A (en) * 1997-04-10 2000-02-22 Applied Materials, Inc. Temperature control system for semiconductor processing facilities
US5974689A (en) * 1997-09-23 1999-11-02 Gary W. Farrell Chemical drying and cleaning system
US6029896A (en) * 1997-09-30 2000-02-29 Microfab Technologies, Inc. Method of drop size modulation with extended transition time waveform
US6073681A (en) 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
JP4092603B2 (ja) 1998-12-14 2008-05-28 株式会社東京精密 ウェーハチャックテーブル
WO2000074117A1 (en) 1999-05-27 2000-12-07 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
JP2001244237A (ja) 2000-02-28 2001-09-07 Hitachi Ltd 半導体製造装置用冷媒パージ方法および冷媒パージシステム

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US6415858B1 (en) 2002-07-09
US6505478B1 (en) 2003-01-14
JP2002500432A (ja) 2002-01-08
US20020062954A1 (en) 2002-05-30
WO1999034159A1 (en) 1999-07-08
US6802368B2 (en) 2004-10-12

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