DE19882929T1 - Temperaturkontrollsystem für eine Werkstückhalterung - Google Patents
Temperaturkontrollsystem für eine WerkstückhalterungInfo
- Publication number
- DE19882929T1 DE19882929T1 DE19882929T DE19882929T DE19882929T1 DE 19882929 T1 DE19882929 T1 DE 19882929T1 DE 19882929 T DE19882929 T DE 19882929T DE 19882929 T DE19882929 T DE 19882929T DE 19882929 T1 DE19882929 T1 DE 19882929T1
- Authority
- DE
- Germany
- Prior art keywords
- control system
- temperature control
- workpiece holder
- workpiece
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/12—Arrangements for cooling or lubricating parts of the machine
- B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
- B23Q11/141—Methods or arrangements for maintaining a constant temperature in parts of machine tools using a closed fluid circuit for cooling or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
- B23Q11/143—Methods or arrangements for maintaining a constant temperature in parts of machine tools comprising heating means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
- F25B41/22—Disposition of valves, e.g. of on-off valves or flow control valves between evaporator and compressor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/001,887 US6415858B1 (en) | 1997-12-31 | 1997-12-31 | Temperature control system for a workpiece chuck |
US09/001,887 | 1997-12-31 | ||
PCT/US1998/023716 WO1999034159A1 (en) | 1997-12-31 | 1998-11-09 | Temperature control system for a workpiece chuck |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19882929T1 true DE19882929T1 (de) | 2001-01-04 |
DE19882929B4 DE19882929B4 (de) | 2008-05-08 |
Family
ID=21698290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19882929T Expired - Fee Related DE19882929B4 (de) | 1997-12-31 | 1998-11-09 | Temperaturkontrollsystem für eine Werkstückhalterung |
Country Status (4)
Country | Link |
---|---|
US (3) | US6415858B1 (de) |
JP (1) | JP2002500432A (de) |
DE (1) | DE19882929B4 (de) |
WO (1) | WO1999034159A1 (de) |
Families Citing this family (162)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
JP2000283500A (ja) * | 1999-03-29 | 2000-10-13 | Canon Inc | 環境制御装置、半導体製造装置および検査・測定装置 |
US6552561B2 (en) * | 2000-07-10 | 2003-04-22 | Temptronic Corporation | Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode |
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US7051801B1 (en) * | 2000-07-28 | 2006-05-30 | Hydrogenics Corporation | Method and apparatus for humidification and temperature control of incoming fuel cell process gas |
CN1314154C (zh) * | 2000-07-28 | 2007-05-02 | 洁能氏公司 | 对引入燃料电池的过程气体进行增湿和温度控制的方法和装置 |
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JP3973853B2 (ja) * | 2001-03-28 | 2007-09-12 | 大日本スクリーン製造株式会社 | 熱処理装置 |
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EP1692714A1 (de) * | 2003-11-26 | 2006-08-23 | Temptronic Corporation | Vorrichtung und verfahren zur verringerung von elektrischem rauschen in einer thermisch gesteuerten einspannvorrichtung |
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-
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-
1998
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- 1998-11-09 JP JP2000526769A patent/JP2002500432A/ja active Pending
- 1998-11-09 DE DE19882929T patent/DE19882929B4/de not_active Expired - Fee Related
-
2000
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-
2002
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Also Published As
Publication number | Publication date |
---|---|
DE19882929B4 (de) | 2008-05-08 |
US6415858B1 (en) | 2002-07-09 |
US6505478B1 (en) | 2003-01-14 |
JP2002500432A (ja) | 2002-01-08 |
US20020062954A1 (en) | 2002-05-30 |
WO1999034159A1 (en) | 1999-07-08 |
US6802368B2 (en) | 2004-10-12 |
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