CN1845827B - Audio message transfer sheet and manufacturing method thereof, and power supply circuit - Google Patents

Audio message transfer sheet and manufacturing method thereof, and power supply circuit Download PDF

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Publication number
CN1845827B
CN1845827B CN2004800249076A CN200480024907A CN1845827B CN 1845827 B CN1845827 B CN 1845827B CN 2004800249076 A CN2004800249076 A CN 2004800249076A CN 200480024907 A CN200480024907 A CN 200480024907A CN 1845827 B CN1845827 B CN 1845827B
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China
Prior art keywords
audio
chip
frequency information
frequency
information
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Expired - Fee Related
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CN2004800249076A
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Chinese (zh)
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CN1845827A (en
Inventor
伊势谷之彦
冈田贵章
清水秀郎
井手义章
福田泰弘
山上刚
花泽文浩
山崎晃
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Priority claimed from JP2003304720A external-priority patent/JP2005079160A/en
Priority claimed from JP2003406656A external-priority patent/JP2005165156A/en
Priority claimed from JP2004107536A external-priority patent/JP2005292472A/en
Priority claimed from JP2004158299A external-priority patent/JP4357364B2/en
Priority claimed from JP2004158298A external-priority patent/JP4362086B2/en
Priority claimed from JP2004177024A external-priority patent/JP4528033B2/en
Priority claimed from JP2004177021A external-priority patent/JP2006004656A/en
Priority claimed from JP2004177023A external-priority patent/JP2006001038A/en
Priority claimed from JP2004177025A external-priority patent/JP2006001040A/en
Application filed by Toppan Forms Co Ltd filed Critical Toppan Forms Co Ltd
Priority claimed from PCT/JP2004/012465 external-priority patent/WO2005021280A1/en
Publication of CN1845827A publication Critical patent/CN1845827A/en
Publication of CN1845827B publication Critical patent/CN1845827B/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

Sheet-like audio information recording/reproducing means capable of recording/reproducing audio information is sandwiched between two support sheets from front and back only in part of the area thereof and these two support sheets are further sandwiched between two surface sheets and the support sheets and surface sheets are bonded together.

Description

Audio message transfer sheet and manufacturing approach thereof and power circuit
Technical field
The present invention relates to a kind of audio message transfer sheet and manufacturing approach, a kind of audio-frequency information output chip, a kind of POP (purchasing the attraction, Point of Purchase) indicator, a kind of acoustic information delivery device, a kind of audio-frequency information delivery components, a kind of label and a kind of power circuit and manufacturing approach thereof that is used for it with built-in audio information recording/transcriber that can the recoding/reproduction audio-frequency information.
Background technology
Traditionally, for for example direct mail or the such article that will send of greeting card, transmit leg is created article, specifies the destination of article and then the article delivery of creating is arrived the designated destination.The article of creating in this manner and sending are made up of printed article, and said printed article has explained that transmit leg hopes to notify the information that is attached to the destination on the envelope or transmit leg to hope to notify to be printed on the information of the destination on the scraps of paper of postcard etc. for example.
In the destination of article delivery, after receiving article, browse the information that is printed on the article and recognize that in this manner transmit leg hopes to notify the information to the destination.
Yet; When send by transmit leg to send, have transmit leg when hoping to notify the article to the printing information of destination; Be located in the information that is printed on the article of sending by transmit leg of browsing in purpose; Hope to notify the information to the destination to be sent to the destination transmit leg thus, the hope message that can only visually will send the transmit leg of article is sent to the destination, has limited in this manner and can transmit type of info.
Therefore, imagination tectonic information carrier has the message of audio frequency so that in direct mail, comprise audio frequency apparatus that can the recoding/reproduction audio-frequency information and transmit.
Fig. 1 a is the plane with information carrier of the audio frequency apparatus that can recoding/reproduction be included in the audio-frequency information in the direct mail, and Fig. 1 b is the sectional view along the line A-A ' among Fig. 1 a.
Shown in Fig. 1 a, 1b, this conventional example comprises the direct mail assembly 501a with display part 502, has printed address information etc. on the said display part 502; And built-in audio frequency apparatus 503 that can the recoding/reproduction audio-frequency information.In addition; This audio frequency apparatus 503 comprises PC plate 507 that the IC memory 512 that is used for record audio information and power-supply battery 511 have been installed, loudspeaker 509 that output is recorded in the audio-frequency information of IC memory 512, when the switch of when loudspeaker 509 outputs are recorded in the audio-frequency information the IC memory 512, operating 508; All component is installed in support 503a and goes up and stick on the direct mail assembly 501a; Covering has the lid 513 in hole, exposes switch 508 and loudspeaker 509 through said hole.
In the direct mail 501 of as above constructing; Address information etc. is printed on the display part 502; And in audio frequency apparatus 503 record audio information, then, the audio frequency apparatus 503 that will have an audio frequency of the information that write down sticks on direct mail assembly 501a and goes up and be delivered to the destination.In the destination of direct mail 501, after receiving direct mail 501, if console switch 508 then is recorded in the audio-frequency information in the audio frequency apparatus 503 through loudspeaker 509 outputs.The open No.1999-70770 of Japanese patent application discloses this direct mail 501.
Yet; Install or paste the audio frequency apparatus on the direct mail assembly that has printed address information etc. above that because the information carrier that comprises above-mentioned audio frequency apparatus comprises; The zone that the problem that exists has been to paste audio frequency apparatus becomes very thick, to such an extent as to can not when comprising audio frequency apparatus, print address information etc.Therefore, under the situation of above-mentioned information carrier, at first on the direct mail assembly, print address information etc., then audio frequency apparatus is installed or sticked on the direct mail assembly.
In addition, because audio frequency apparatus is installed or is sticked on the direct mail assembly and should the zone thicker, if folding direct mail or this zone applied external force may make audio frequency apparatus peel off from the direct mail assembly.When rolling over or rolling over direct mail two for zigzag, should fold direct mail according to avoiding that the regional mode of audio frequency apparatus has been installed, this problem that causes has been to limit the zone that audio frequency apparatus is installed maybe becomes fold line when folding direct mail zone.
In addition; Above-mentioned audio-frequency information output chip that can the recoding/reproduction audio-frequency information need be equipped with sound information output device; For example be used to export the loudspeaker of the audio-frequency information that is write down; But for example the sound information output device of loudspeaker needs tool to have the dimensions to guarantee the volume of being scheduled to, and this problem that causes is, is difficult to reduce the size of whole audio-frequency information output chip.
In addition; Traditionally; The POP indicator that on it advertising message of goods etc. is shown as POP is appended to the show window that shop (for example department store, supermarket or convenience store in recent years) is located, and it is movable to utilize these POP indicators to be directed against the promotional discount of goods etc.For this POP indicator, considered that various display packings or the various profile of POP indicator is so that be attracted to client's notice in the shop.
For example; The open No.2001-178599 of Japanese patent application discloses a kind of POP indicator; Have in show window, form, through its can see the inventory tag that appends to the POP indicator window and with the attractive decoration shape window frame of the integrated formation in POP display part, attract notice thus for the advertising message that on the POP display part, shows.
Yet; In traditional P OP indicator, only the advertising message with goods is shown as POP, and therefore the client to the shop can only visually recognize advertising message; And have following situation: depend on the design of POP or the size of characteristic etc., this POP indicator is not enough to attracts attention.
In addition, under the situation of POP indicator, its size restrictions be shown as the information content of the advertising message of POP; And often the POP indicator is attached in the show window, in this case, the size of POP indicator had better not be excessive; From show window, during shopping goods, can avoid client, therefore with convenient client; The problem that exists is, is difficult to a large amount of advertising messages is shown as POP.
In addition, existence can recoding/reproduction various types of equipment of the acoustic information of audio frequency for example.Along with battery size in recent years diminishes, the size decreases of record controls elements small, pronunciation equipment etc., proposed to combine the thin acoustic data recording/reproducing device of these elements.As the product that uses this audio recording/transcriber; For example; The open No.1997-202072 of Japanese patent application discloses and a kind of slim data recording/reproducing device has been included in the mail card in two-sided of a slice, is designed to come from recoding/reproduction device output audio through the switching manipulation that the open operation with another sheet is linked.In addition, the open No.2003-246165 of Japan Patent also discloses a kind of duplicating and has sent cutting, and the recoding/reproduction device that has write down the audio-frequency information that points to the destination that article will send is combined with cutting.
Now; Only design the above-mentioned cutting of sending that is equipped with the recoding/reproduction device; So that the transmit leg of article is imported audio frequency and reproduced audio frequency by the recipient, therefore,, sending direction recipient transmission can not cause too much time and trouble when having the message of audio frequency; And be feasible, this is because can stay the impression of giving article sincerely to the recipient in this manner.
Yet, have only when sending the article that will send and actual when self can be used in the recoding/reproduction device that sends message and not being the main article that will send with audio frequency, could use this recoding/reproduction device.Therefore, need that it is thin, volume is little, can be utilized in the recoding/reproduction device that record or reproduction period have excellent availability and send message with audio frequency.
In addition, Japan's specification of having examined open No.1991-45433 of application and Japan Patent No.2889151 discloses a kind of audio card that can the recoding/reproduction audio-frequency information.
This audio card has been equipped with: be used for importing audio-frequency information input unit, be used to write down tape deck, be used to export the audio output device of the audio-frequency information that is recorded in tape deck, record button, the playback button of when through audio output device output audio information, pushing and the control device of when through voice input device input audio-frequency information, pushing that is used to control these operations through the audio-frequency information of voice input device input; Design said audio card, so that come record audio information and reproduce audio-frequency information through pushing playback button through pushing record button.
Here, according to utilizing audio-frequency information through the voice input device input to come overwrite to be recorded in the mode of the audio-frequency information in the tape deck, with audio information recording in can the audio card of record audio information.Therefore, after in tape deck, having write down audio-frequency information,, wiped and be recorded in the audio-frequency information in the tape deck if push record button by error.Therefore, above-mentioned Japan has examined the open No.1991-45433 of application and discloses a kind of technology, the structure that it adopts record button to be easy to dismantle, so that after having write down audio-frequency information, the dismounting record button avoids the maloperation of record button to wipe audio-frequency information thus.In addition; Construct the audio card described in the specification of above-mentioned Japan Patent No.2889151 according to following mode: after record audio information; When pushing playback button and record button simultaneously; Carry out control,, avoided the maloperation of record button to wipe audio-frequency information thus so that forbid further audio information recording.
Yet; As stated; Be easy to dismantle so that dismantle record button after having write down audio-frequency information at record button and avoid the maloperation of record button to wipe under the situation of structure of audio-frequency information thus; When sending when having the audio card that has wherein write down audio-frequency information, the audio card of part audio card dismounting is delivered to the destination, the outward appearance of the audio card that the problem that causes is to send has lost attraction.
In addition, after record audio information, when pushing playback button and record button simultaneously so that forbid that the problem of existence is visually to confirm whether to forbid the record of audio-frequency information under the situation of structure of further audio information recording.Therefore, although record possibly occur after record audio information, also not forbidding, the user sends audio card and audio card is not arranged in the illegal state of be sure oing static record.In this case, may push record button by error subsequently and wipe the audio-frequency information that has write down.In addition, in order to forbid the record of audio-frequency information, push record button so that therefore record audio information, when before pushing playback button, pushing record button, may wipe the part audio-frequency information that part writes down.
In addition, be generally used for the for example multiple application of event invitation letter with sending the dual-purpose postcard that message card and response message card combine, for example, the order form of the opposing party of wedding, goods or service etc.The address information of for example recipient's address and name is write on the front of this transmission message card, and the information that will from the transmit leg to recipient, send is write overleaf.In addition, the address information of the address of for example transmit leg and name is write on the front of response message card, and be provided with at its back side and be used to import the zone that sends to recipient's information from transmit leg.
Join domain folds the dual-purpose postcard of structure in this manner between message card and the response message card along sending; So that expose recipient for example address and name address information and send to the destination; In the destination; Cut transmission message card along join domain from the response message card, under the back side of response message card, will send to the information of transmit leg, and only the response message card sent it back transmit leg from the recipient.
Therefore; In conjunction with send message card and response message card dual-purpose postcard have can be from the transmit leg to recipient or from recipient to the transmit leg the limited information amount; And send the message card and all need comprise address information with reception message card, this has further limited its information content.
Therefore; The open No.2001-121858 of Japanese patent application discloses a kind of dual-purpose postcard with following structure: vertical dimension is equaled or is twice in the standard vertical size of postcard and sheet fold that horizontal size is four times of standard level sizes is the size of postcard, therefore can transmit the more information amount according to the standard size of postcard.
Yet, although utilize this dual-purpose postcard to increase the information content that can transmit, the information that is sent to the recipient or is sent to transmit leg from the recipient from transmit leg just visually, this has limited the type of info that can transmit.
Here, if disclosed audio card among the open No.1991-45433 of the careful application of above-mentioned Japan is applied to above-mentioned dual-purpose postcard, can utilizes from the transmit leg of dual-purpose postcard and come transmission information to recipient or the audio frequency from recipient to the transmit leg.For example; Under the situation of the opposing party's of wedding invitation letter; If structure response message card so as can record audio information and the message that is recorded in the response message card of transmit leg of invitation letter of utilization send replying that whether the opposing party of wedding attend from the recipient of invitation letter, the transmit leg of invitation letter can receive the message that has from the recipient's of invitation letter audio frequency.
Yet; Prevent that the maloperation of record button from wiping audio-frequency information even have the record button structure that is easy to dismantle so that after record audio information, dismantle the above-mentioned dual-purpose postcard of record button structure; As stated; When utilization is recorded in audio-frequency information in the response message card when sending this response message, the response message card of part dismounting is sent it back transmit leg, the outward appearance of the response message card that this problem that causes is to send it back has lost attraction.
This problem is not limited to above-mentioned dual-purpose postcard, also appears to combine to send in the audio-frequency information delivery components of message part and response message part.
In addition, traditionally,, be provided with according to various patterns it is constructed so that utilize adhesive can it be sticked on the label on the object (for example article) of wanting mark according to using and being used for various application.This label can utilize printing or write on its lip-deep information and come transmission information.
In addition, in recent years, the open No.2001-242788 of Japanese patent application discloses a kind of label, has shown the information that will transmit on its surface and it is treated to the convex form that comprises the Braille character, also can transmit information to the visual disability personage.In this manner, on label surface, show the information that to transmit and it is treated to the convex form that comprises the Braille character makes and be presented at lip-deep information and can be transmitted to healthy subjects and make and handle the personage that the information of expressing can be transmitted to visual disability through convex form.
Yet; To its surface applications comprise that the above-mentioned label that the convex form of Braille character is handled can be sent to the visual disability personage that can read the Braille character with the information of expressing with the Braille character, but can not send information to can not read the Braille character visual disability personage.
Here, the people that can read the Braille character account for all visual disability personage total amounts less than 20%, when comprising amblyopia and old crowd, proportion is less than 5%.Therefore, even still there is the problem that is difficult to the information that transmits to numerous visual disability and amblyopia personage in the label that has used to its surface applications the convex form that comprises the Braille character to handle.
In addition, in recent years, need a large amount of battery-operated products to come the space of conserver power source part,,, use the coin shape battery as the means that satisfy this demand so that realize dimension shrinks and multi-functional.In addition, above-mentioned audio card etc. needs the battery of not noticeable (low-profile).
Here, in recent years, the open No.2000-502206 of Japanese patent application pending trial discloses a kind of paper battery, has through electrolyte layers positive electrode and the coarctate structure of positive electrode layer.By electrolyte layers this battery is divided into positive electrode and negative electrode, and each electrodes exposed of positive electrode and negative electrode is in the different surfaces of paper battery.Therefore; When this paper battery being installed on the circuit substrate so that during the structure power circuit; One of positive electrode and negative electrode be not in the face of circuit substrate; The electrode in the face of circuit substrate does not have splicing ear, is used for being provided to through (linking to each other in circuit substrate through it) such as solder joints the connection of continuous circuit substrate.Yet when the electrode of paper battery linked to each other with circuit substrate through splicing ear, the resistance between electrode and the circuit substrate increased.In addition, the operation that this action need is additional, this causes productivity ratio to reduce and cost increases.
Therefore, the specification of Japan Patent No.2866383 discloses a kind of technology of folded part paper battery, so that on similar face, form positive electrode and negative electrode.Folding its positive electrode of this technology and negative electrode are formed on the part of the paper battery on the different surfaces; Dielectric film through being equipped with the hole is superimposed upon this paper battery on the circuit substrate; Expose part positive electrode and negative electrode through this hole, and link to each other with circuit substrate with negative electrode through the positive electrode of these holes with paper battery.
Yet; As stated; When the folded part paper battery also forms positive electrode and negative electrode thus on similar face; This means and use the paper battery with partially folded paper battery constantly, the problem that relates to is to compare with the paper battery that cannot not use foldingly, is using paper battery for paper battery in unfavorable environment.
In addition; As stated; Constituting under the situation of power circuit by the paper battery that is laminated on the circuit substrate, for example, can anisotropy/conducting film or anisotropy/electroconductive binder be coated on the splicing ear of paper battery; Be installed on paper battery on the circuit substrate then and utilize anisotropy/conducting film or anisotropy/electroconductive binder, paper battery and circuit substrate are electrically connected and are bonded together.
Yet; As stated; When utilizing anisotropy/conducting film or anisotropy/electroconductive binder that paper battery is linked to each other with circuit substrate and paper battery being installed on the circuit substrate so that when making power circuit thus; At first anisotropy/conducting film or anisotropy/electroconductive binder are coated on the electrode of paper battery; Paper battery and circuit substrate are curled then temporarily, and subsequently that paper battery and circuit substrate is curling fully, and this problem that causes is that this manufacturing step is too complicated and has reduced productivity ratio.
In addition, the problem that also exists is easily to control anisotropy/conducting film or anisotropy/electroconductive binder, and this causes the expensive and complicated control of needs thus of cost, and has increased the manufacturing cost of power circuit.
Summary of the invention
The object of the present invention is to provide a kind of can, flexible or folding audio message transfer sheet on it with the information printing, and manufacturing approach.
In addition, another object of the present invention is to provide a kind of audio-frequency information output chip, and it can realize that volume reduces when guaranteeing predetermined volume.
In addition, another object of the present invention is to provide a kind of POP indicator, and it can attract the enough notices of consumer and comprise mass advertising information.
In addition, challenge of the present invention is to make above-mentioned data recording/reproducing device to be sent based on the delivery system of sending cutting according to tradition, and another object of the present invention is to be beneficial to the speech message of sending as present.
In addition, another object of the present invention is to provide a kind of audio message transfer sheet, and when forbidding record audio information, its outward appearance can not become and lose its reliss, and can visually confirm to forbid record.
In addition; Another object of the present invention is to provide a kind of audio-frequency information delivery components; Said assembly comprises transmission message part and the response message part that links together; Wherein construct the response message part,, and can prevent to wipe the audio-frequency information that is write down by error and can not damage outward appearance so that can record audio information.
In addition, another object of the present invention is to provide a kind of label, can likewise information be sent to healthy subjects and visual disability personage.
In addition; Another object of the present invention is to provide a kind of power circuit that is installed on the paper battery on the sheet circuit substrate that comprises; The positive electrode and the negative electrode of said paper battery are exposed to different surfaces; Can form said power circuit, and can not increase the resistance between paper battery and the circuit substrate, also need not the fan-fold paper battery.
In addition, another object of the present invention is to provide a kind of method of making power circuit, and said power circuit comprises the paper battery that links to each other with circuit substrate, can improve productivity ratio and can not increase manufacturing cost.
In the present invention; Audio information recording/transcriber that can the recoding/reproduction audio-frequency information has laminated structure; This audio information recording/transcriber is clipped between two support chips, and said support chip also is clipped between two surface patch, and said surface patch allows crooked or folding said audio information recording/transcriber; Only in the subregion of two support chips facing audio information recording/transcriber; Between from front and back audio information recording/transcriber being clipped in, therefore, although audio information recording/transcriber is comprised wherein; Reduced to comprise zone and other of the audio information recording/transcriber difference in thickness between regional, this makes it possible to printing information on surface patch.
In addition, the exterior contour that makes the exterior contour of two support chips equal surface patch can make the thickness of whole audio message transfer sheet come down to uniformly.
In addition, in two support chips each is divided into the bending and the folding free degree that a plurality of parts can increase audio message transfer sheet.
In addition, adopt the location that is beneficial to two support chips along the structure of two support chips of sweep connection.
In addition, when being provided for audio information recording/transcriber so that the sound information output device of output audio information is when comprising following assembly: the piezoelectric element of output audio information; Have the diaphragm greater than the diameter of piezoelectric element, said diaphragm pastes a surface of piezoelectric element; And be equipped with porose vibrating membrane; Said hole has greater than the diameter of piezoelectric element and less than the diameter of the diameter of diaphragm; Said vibrating membrane is adhered on the diaphragm according to the mode of piezoelectric element mating holes; Only in said vibrating membrane and surface that said diaphragm engages, do not engage in the zone of said diaphragm, said vibrating membrane is engaged with said support chip, can prevent to increase the thickness in the zone that is provided with sound information output device; And sound information output device is fixed on the surface patch and do not engage, avoided interference piezoelectric element and vibration vibration of membrane thus.
In addition; Through adopting following structure: two support chips are between operating means is clipped in audio information recording/transcriber on every side; Audio information recording/transcriber is installed on the support chip in the zone that is provided with operating means; And the height that makes operating means is lower than the thickness of support chip, surrounds operating means by thickness greater than the support chip of the height of operating means, can prevent thus when operation device when the outside applies force majeure.
In addition, if black receiving layer is laminated to not at least one the surface in the face of two surface patch of support chip, when subsequently through ink-jet printer on surface patch during type information, can be on surface patch type information clearly.
In addition; If before the support chip between audio information recording/transcriber is clipped in is sandwiched between the surface patch; Should the China ink receiving layer be added on the surface patch, the black receiving layer that can lamination has excellent surface patch flatness, and when surface patch is made up of the monolithic from the serialgram cutting; Black receiving layer is laminated on the continuous surface sheet, and this is beneficial to the lamination of black receiving layer.
In addition; According to the present invention; Can be along the zone of the output of audio-frequency information at least of the audio information recording/transcriber of sweep folded clip between two surface patch; Therefore, through with respect to the folding zone that comprises the audio-frequency information output at least, other zone, can realize that volume reduces and need not to reduce the size of audio-frequency information output.
In addition,, when being installed on the object, the advertising message that shows as POP on the surface patch can be visually recognized, when the operation device, the audio-frequency information that is recorded in audio information recording/transcriber can be reproduced through installation component according to the present invention.
In this manner; In audio information recording/transcriber, this audio-frequency information is designed to operating means capable of using and reproduces, therefore with audio information recording; If record is as the advertising message of audio-frequency information in audio information recording/transcriber; Can visually recognize advertising message and provide, in this manner, can attract consumer's notice and comprise a large amount of advertising messages as audio-frequency information.
In addition, since this operating means with pasted surface patch in the zone of operating means from other regional projection, easily operation device.
In addition,, not only advertising message can be on surface patch, printed, the durability of surface patch can also be improved as POP if surface patch is processed by the synthetic paper that is suitable for printing.Especially in the zone of having pasted operating means, may the damaging surface sheet when the operation device, but utilize synthetic paper can suppress the damage of surface patch.
In addition; When the power unit that power supply is provided to audio information recording/transcriber comprises a plurality of paper battery of the positive electrodes that expose from different surfaces and negative electrode formation; If said a plurality of paper battery series connection; The audio frequency substrate of audio information recording/transcriber being installed and having been linked to each other with power unit comprise first conductive region that one of two electrodes with power unit link to each other with two electrodes of the power unit that is formed on different surfaces in another second conductive region that links to each other; So that two electrodes of power unit link to each other with second conductive region with first conductive region; Required just links to each other a plurality of paper batteries two positions with the audio frequency substrate, this can reduce manufacturing cost.
In addition; According to the present invention; When conductive member was sandwiched between two surface patch, the IC chip that will have storage area through conductive member was electrically connected with second switch, if under this condition, operate second switch; To be used for being input to the IC chip, and audio information recording that will be through audio-frequency information input/output device input is in the IC chip in second command signal of IC chip record audio information.Then; If remove conductive member from two surface patch; IC chip and second switch keep opens, even under this condition, operate second switch, also can second command signal that be used at IC chip record audio information be input in the IC chip; Even thus through audio-frequency information input unit input audio-frequency information, can be in the IC chip with audio information recording yet.Therefore, if,, can not wipe the audio-frequency information that is recorded in the IC chip even operate second switch subsequently in that audio information recording is removed conductive member from two surface patch after the IC chip yet.
Therefore; Launch IC chip sound intermediate frequency recording of information through being clipped in two conductive members between the surface patch; And through forbidding IC chip sound intermediate frequency recording of information from two these conductive members of surface patch removal, therefore, even forbid IC chip sound intermediate frequency recording of information; Surface patch as the outward appearance of audio message transfer sheet also can keep its original appearance, prevents that outward appearance from losing its reliss.In addition, therefore the existence through conductive member/do not exist to determine whether to forbid IC chip sound intermediate frequency recording of information, can visually confirm to forbid record.
In addition, audio information recording in being clipped in two first audio information recording/transcribers between the surface patch, wherein being sent message part and partly links to each other with response message.So; Message part partly separates with response message along the coupling part so that when sending the response message part when sending; Cut off being clipped in the wiring that is used for record audio information between two surface patch, thereby across being clipped in the transmission message part and the response message part of two first audio information recording/transcribers between the surface patch.In this manner, when sending message part and partly separate with response message, can not be in first audio information recording/transcriber record audio information, prevented to wipe by error the audio-frequency information that is recorded in first audio information recording/transcriber.In addition; In first audio information recording/transcriber; Part except that the wiring that is used for record audio information is sandwiched between two surface patch of response message part side; Therefore, the recipient of response message part can be reproduced in the audio-frequency information that writes down in first audio information recording/transcriber.
In addition; According to the present invention, record audio information in being clipped in two audio information recording/transcribers between the flat substrates pastes this label on the object; And through the destination that correspondence is offered audio-frequency information such as sending; Then, be located in to reproduce in the purpose of audio-frequency information and be recorded in the audio-frequency information in audio information recording/transcriber, the audio-frequency information with hope sends to the destination thus.
In addition; According to the present invention, a kind of paper battery is made up of positive electrode and the negative electrode through the electrolyte layers lamination, wherein exposes negative electrodes from different surfaces; Paper battery is linked to each other with the sheet circuit substrate; Formed the conductive region that links to each other with electrode on the said circuit substrate, a kind of power circuit is formed by paper battery and conductive region, links to each other with one of negative electrode with positive electrode in order to make lip-deep first conductive region that is formed on circuit substrate; Paper battery is installed on the surface that forms first conductive region; Another electrode in positive electrode and the negative electrode be formed on another lip-deep second conductive region and link to each other, in this manner, form power circuit by paper battery, first and second conductive regions.
In this manner; The positive electrode that exposes from the different surfaces of paper battery links to each other with one that is formed on the sheet circuit substrate lip-deep first conductive region with one of negative electrode; In positive electrode and the negative electrode another be formed on another lip-deep second conductive region and link to each other, form power circuit thus, therefore; Can form power circuit and need not to increase the resistance between paper battery and the circuit substrate, need not the fan-fold paper battery simultaneously.
In addition; The ifs circuit substrate has been equipped with the groove that is used for another electrode so that cooperate dorsal part from the positive side of circuit substrate; It is gone up a side of formation second conductive region and links to each other with second conductive region thereby another electrode of paper battery is through groove fit; Even when paper battery is installed in the arbitrary portion of dividing circuit substrate one end, another electrode of paper battery can be linked to each other through the opposite side of groove fit circuit substrate and with second conductive region.
In addition; When forming many group first and second conductive regions and installing and count the paper battery of similar number with the group of first and second conductive regions so that when linking to each other with a plurality of first and second conductive regions; And link to each other so that during the series connection of a plurality of paper batteries when a plurality of first and second conductive regions; If form first and second conductive regions so that at least a portion in a plurality of paper battery overlaps each other, can reduce to have installed on it a plurality of paper batteries circuit substrate area and realize that cost dwindles.
According to the present invention; When paper battery being installed on the circuit substrate so that the positive electrode of paper battery and negative electrode are in the face of being arranged on two splicing ears on the circuit substrate, then ultrasonic vibration being put on when facing with each other the zone; Melted the positive electrode and the negative electrode of paper battery, two of the positive electrode of paper battery and negative electrode and circuit substrate splicing ears engage through ultrasonic wave and are electrically connected thus.
Through this operation, can be electrically connected paper battery and circuit substrate, and need not to use expensive material (for example anisotropy/conducting film or anisotropy/electroconductive binder), prevent that manufacturing cost from increasing, simplify manufacturing step and having improved productivity ratio.
In addition, if in the zone of the splicing ear that forms circuit substrate, form the hole, the positive electrode and this hole of negative electrode inflow of the paper battery through the ultrasonic vibration fusing, this has increased the engaging force between paper battery and the circuit substrate.
In addition; When being installed in paper battery on the circuit substrate; If in the subregion of the positive electrode of facing circuit substrate and negative electrode, do not form splicing ear; Melted in the face of the positive electrode of circuit substrate and the subregion of negative electrode through ultrasonic vibration, increased the engaging force between paper battery and the circuit substrate thus.
Description of drawings
With reference to showing the accompanying drawing of example of the present invention, above and other purpose, feature and advantage of the present invention will be more obvious.
Fig. 1 a is the plane with information carrier of the audio frequency apparatus that can recoding/reproduction be included in the audio-frequency information in the direct mail;
Fig. 1 b is the sectional view along the line A-A ' shown in Fig. 1 a;
Fig. 2 a is the plane according to the audio message transfer sheet of first embodiment of the invention;
Fig. 2 b shows the internal structure of the audio message transfer sheet shown in Fig. 2 a;
Fig. 2 c is the sectional view along the line A-A shown in Fig. 2 a;
Fig. 3 shows the laminar structure of Fig. 2 a to the audio message transfer sheet shown in the 2c;
Fig. 4 a shows Fig. 2 a to 2c and the support chip shown in Figure 3 and the laminar structure of audio information recording/reproducing part;
Fig. 4 b shows Fig. 2 a to 2c and the support chip shown in Figure 3 and the laminar structure of audio information recording/reproducing part;
Fig. 5 a shows the structure when Fig. 2 c and two support chips shown in Figure 3 are made up of a sheet;
Fig. 5 b shows how along the sweep pleated sheet shown in Fig. 5 a;
Fig. 6 shows the structure of audio-frequency information output shown in Fig. 2 b;
Fig. 7 shows the switch sectional view on every side of audio message transfer sheet shown in Fig. 2 b;
Fig. 8 a is the plane according to the audio message transfer sheet of second embodiment of the invention;
Fig. 8 b shows the internal structure of the audio message transfer sheet shown in Fig. 8 a;
Fig. 8 c is the sectional view along the line A-A ' shown in Fig. 8 a;
Fig. 9 a is the plane according to the audio message transfer sheet of third embodiment of the invention;
Fig. 9 b shows the internal structure of the audio message transfer sheet shown in Fig. 9 a;
Fig. 9 c is the sectional view along the line A-A ' shown in Fig. 9 a;
Figure 10 shows the posting field of the IC chip shown in Fig. 9 b;
Figure 11 a is the plane according to the audio message transfer sheet of fourth embodiment of the invention;
Figure 11 b shows the internal structure of the audio message transfer sheet 301 shown in Figure 11 a;
Figure 11 c is the sectional view along the line A-A ' shown in Figure 11 a;
Figure 12 a is the plane according to the audio message transfer sheet of fifth embodiment of the invention;
Figure 12 b shows the internal structure of the audio message transfer sheet shown in Figure 12 a;
Figure 12 c is the sectional view along the line A-A ' shown in Figure 12 a;
Figure 13 a is the plane according to the audio message transfer sheet of sixth embodiment of the invention;
Figure 13 b shows the internal structure of the audio message transfer sheet shown in Figure 13 a;
Figure 13 c is the sectional view along the line A-A ' shown in Figure 13 a;
Figure 14 a shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 14 b shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 14 c shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 14 d shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 14 e shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 14 f shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c;
Figure 15 a is the plane according to the audio-frequency information output chip of seventh embodiment of the invention;
Figure 15 b shows the internal structure of the audio-frequency information output chip shown in Figure 15 a;
Figure 15 c is the sectional view along the line A-A ' shown in Figure 15 a;
Figure 16 shows the laminar structure of Figure 15 a to the audio-frequency information output chip shown in the 15c;
Figure 17 a shows Figure 15 b, 15c and the support chip shown in Figure 16 and the laminar structure of audio information recording/reproducing part;
Figure 17 b shows Figure 15 b, 15c and the support chip shown in Figure 16 and the laminar structure of audio information recording/reproducing part;
Figure 18 a shows and does not use the situation of Figure 15 a to 15c and audio-frequency information output chip shown in Figure 16;
Figure 18 b shows and uses the situation of Figure 15 a to 15c and audio-frequency information output chip shown in Figure 16;
Figure 19 a is the plane according to the audio-frequency information output chip of eighth embodiment of the invention;
Figure 19 b shows the internal structure of the audio-frequency information output chip shown in Figure 19 a;
Figure 19 c is the sectional view along the line A-A ' shown in Figure 19 a;
Figure 20 a shows and does not use the situation of Figure 19 a to the audio-frequency information output chip shown in the 19c;
Figure 20 b shows and uses the situation of Figure 19 a to the audio-frequency information output chip shown in the 19c;
Figure 21 a is the plane according to the POP indicator of nineth embodiment of the invention;
Figure 21 b shows the internal structure of the POP indicator shown in Figure 21 a;
Figure 22 shows the laminar structure of the POP indicator shown in Figure 21 a, the 21b;
Figure 23 a shows Figure 22 b and the support chip shown in Figure 23 and the laminar structure of audio information recording/reproducing part;
Figure 23 b shows Figure 22 b and the support chip shown in Figure 23 and the laminar structure of audio information recording/reproducing part;
Figure 24 a is the plane of the structure of the paper battery shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b;
Figure 24 b is the sectional view along the line A-A ' shown in Figure 24 a;
Figure 24 c is the sectional view along the line B-B ' shown in Figure 24 a;
Figure 25 shows shown in Figure 21 b, Figure 22 and Figure 23 a, 23b, and Figure 24 a is to three paper batteries of connecting shown in the 24c;
Figure 26 a shows the audio frequency substrate shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b and how to link to each other with paper battery shown in Figure 25;
Figure 26 b shows the audio frequency substrate shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b and how to link to each other with paper battery shown in Figure 25;
Figure 27 a is the plane according to the POP indicator of tenth embodiment of the invention;
Figure 27 b shows the internal structure of the POP indicator shown in Figure 27 a;
Figure 28 shows the acoustic information delivery device according to eleventh embodiment of the invention;
Figure 29 is the enlarged drawing of the encapsulation of acoustic information delivery device shown in Figure 28;
Figure 30 shows acoustic information delivery system shown in Figure 28 and is broken down into encapsulation, data recording/reproducing device carrier and sends cutting;
Figure 31 is the sectional view of sending cutting of acoustic information delivery device shown in Figure 28;
Figure 32 a is the plane according to the audio message transfer sheet of twelveth embodiment of the invention;
Figure 32 b shows the internal structure of the audio message transfer sheet shown in Figure 32 a;
Figure 32 c is the sectional view along the line A-A ' shown in Figure 32 a;
Figure 32 d is the sectional view along the line B-B ' shown in Figure 32 a;
Figure 33 shows the laminar structure of Figure 32 a to the audio message transfer sheet shown in the 32d;
Figure 34 a shows Figure 32 a to Figure 32 d and the support chip shown in Figure 33 and the laminar structure of audio information recording/reproducing part;
Figure 34 b shows Figure 32 a to Figure 32 d and the support chip shown in Figure 33 and the laminar structure of audio information recording/reproducing part;
Figure 35 a shows the detailed structure of the audio frequency substrate shown in Figure 32 b;
Figure 35 b is along the sectional view of the line A-A ' of the switch shown in Figure 35 a when inoperation;
Figure 35 c is the sectional view along the line A-A ' of the switch shown in Figure 35 a when when operation;
Figure 35 d shows the structure of the conductive member shown in Figure 32 d;
Figure 35 e is the sectional view along the line B-B ' shown in Figure 35 a;
Figure 36 a is the plane according to the dual-purpose postcard of thriteenth embodiment of the invention, and it has constituted the audio-frequency information delivery components;
Figure 36 b shows the internal structure of the dual-purpose postcard shown in Figure 36 a;
Figure 36 c is the rearview of the dual-purpose postcard shown in Figure 36 a;
Figure 36 d is the sectional view along the line A-A ' shown in Figure 36 a;
Figure 37 shows the laminar structure of Figure 36 a to the dual-purpose postcard shown in the 36d;
Figure 38 a shows Figure 36 a to Figure 36 d and the support chip shown in Figure 37 and the laminar structure of audio information recording/reproducing part;
Figure 38 b shows Figure 36 a to Figure 36 d and the support chip shown in Figure 37 and the laminar structure of audio information recording/reproducing part;
Figure 39 a is near the sectional view the switch when not through the record button push switch shown in Figure 36 a, the 26b;
Figure 39 b is near the sectional view the switch when through the record button push switch shown in Figure 36 a, the 26b;
Figure 40 shows the internal structure of Figure 36 a to the dual-purpose postcard shown in the 36d, and said dual-purpose postcard is separated into along the coupling part sends message card and response message card;
Figure 41 a is the plane according to the dual-purpose postcard of fourteenth embodiment of the invention, and it has constituted the audio-frequency information delivery components;
Figure 41 b is the plane of the internal structure of the dual-purpose postcard shown in Figure 41 a;
Figure 41 c is the rearview of the dual-purpose postcard shown in Figure 41 a;
Figure 41 d is the rearview of the internal structure of the dual-purpose postcard shown in Figure 41 a;
Figure 41 e is the sectional view along the line A-A ' shown in Figure 41 a;
Figure 42 shows the laminar structure of Figure 41 a to the dual-purpose postcard shown in the 41e;
Figure 43 a shows Figure 41 a to Figure 41 e and the support chip shown in Figure 42 and the laminar structure of audio information recording/reproducing part;
Figure 43 b shows Figure 41 a to Figure 41 e and the support chip shown in Figure 42 and the laminar structure of audio information recording/reproducing part;
Figure 44 a is the plane according to the label of fifteenth embodiment of the invention;
Figure 44 b shows the internal structure of the label shown in Figure 44 a;
Figure 44 c is the sectional view along the line A-A ' shown in Figure 44 a;
Figure 45 shows the laminar structure of the label shown in Figure 44 a to 44;
Figure 46 a shows Figure 44 a to Figure 44 c and the support chip shown in Figure 45 and the laminar structure of audio information recording/reproducing part;
Figure 46 b shows Figure 44 a to Figure 44 c and the support chip shown in Figure 45 and the laminar structure of audio information recording/reproducing part;
Figure 47 a is the plane according to the label of sixteenth embodiment of the invention;
Figure 47 b shows the internal structure of the label shown in Figure 47 a;
Figure 47 c is the sectional view along the line A-A ' shown in Figure 47 a;
Figure 47 d is the sectional view along the line B-B ' shown in Figure 47 a;
Figure 48 shows the laminar structure of Figure 47 a to the label shown in the 47d;
Figure 49 a be when not when the record button push switch Figure 47 a near the sectional view the switch shown in the 47c;
Figure 49 b be when Figure 47 a when the record button push switch near the sectional view the switch shown in the 47c;
Figure 50 shows when along perforation cuts being the internal structures of two a of Figure 47 when regional to the label shown in the 47d;
Figure 51 a is the plane according to the label of seventeenth embodiment of the invention;
Figure 51 b shows the internal structure of the label shown in Figure 51 a;
Figure 51 c is the sectional view along the line A-A ' shown in Figure 51 a;
Figure 52 shows the laminar structure of Figure 51 a to the label shown in the 51c;
Figure 53 a is the plane of embodiment that is used for the paper battery of power circuit according to eighteenth embodiment of the invention;
Figure 53 b is the sectional view along the line A-A ' shown in Figure 53 a;
Figure 53 c is the sectional view along the line B-B ' shown in Figure 53 a;
Figure 54 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 53 a has been installed to the paper battery shown in the 53c on the said substrate, and paper battery 7001 has been installed on it;
Figure 54 b shows the structure with Figure 54 a institute presentation surface facing surfaces;
Figure 55 a shows the structure on the surface of power circuit, and wherein Figure 53 a is installed on the circuit substrate shown in Figure 54 a, the 54b to the paper battery shown in the 53c, and paper battery 7001 has been installed on it;
Figure 55 b shows the structure with Figure 55 a institute presentation surface facing surfaces;
Figure 56 a shows the manufacturing approach of the power circuit shown in Figure 55 a, the 55b;
Figure 56 b shows the manufacturing approach of the power circuit shown in Figure 55 a, the 55b;
Figure 56 c shows the manufacturing approach of the power circuit shown in Figure 55 a, the 55b;
Figure 56 d shows the manufacturing approach of the power circuit shown in Figure 55 a, the 55b;
Figure 57 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 53 a has been installed to the paper battery shown in the 53c on the said substrate, and paper battery has been installed on it;
Figure 57 b shows the structure with Figure 57 a institute presentation surface facing surfaces;
Figure 58 a shows the structure on the surface of power circuit, and wherein Figure 53 a is installed on the circuit substrate shown in Figure 57 a, the 57b to the paper battery shown in the 53c, and paper battery has been installed on it;
Figure 58 b shows the structure with Figure 58 a institute presentation surface facing surfaces;
Figure 59 a is the plane of embodiment that is used for the paper battery of power circuit according to twentieth embodiment of the invention;
Figure 59 b is the sectional view along the line A-A ' shown in Figure 59 a;
Figure 59 c is the sectional view along the line B-B ' shown in Figure 59 a;
Figure 60 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 59 a has been installed to the paper battery shown in the 59c on the said substrate, and paper battery has been installed on it;
Figure 60 b shows the structure with Figure 60 a institute presentation surface facing surfaces;
Figure 61 a shows the structure on the surface of power circuit, and wherein Figure 59 a is installed on the circuit substrate shown in Figure 60 a, the 60b to the paper battery shown in the 59c, and paper battery has been installed on it;
Figure 61 b shows the structure with Figure 61 a institute presentation surface facing surfaces;
Figure 62 a is according to 21st embodiment of the invention, is used to utilize the plane of embodiment of the paper battery of the power circuit that the method for making power circuit makes;
Figure 62 b is the sectional view along the line A-A ' shown in Figure 62 a;
Figure 62 c is the sectional view along the line B-B ' shown in Figure 62 a;
Figure 63 shows Figure 62 a to three paper batteries of connecting shown in the 62c;
Figure 64 a shows according to 21st embodiment of the invention, is used to utilize the structure on a surface of embodiment of the sheet circuit substrate of the power circuit that the method for making power circuit makes;
Figure 64 b shows another surperficial structure of the circuit substrate shown in Figure 64 a;
Figure 65 a shows the structure on a surface that is installed in shown in Figure 64 a, the 64b on the circuit substrate, has the power circuit of paper battery shown in Figure 63;
Figure 65 b shows another surperficial structure of the power circuit shown in Figure 65 a;
Figure 66 a shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b;
Figure 66 b shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b;
Figure 66 c shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b;
Figure 66 d shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b;
Figure 66 e shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b;
Figure 67 shows and utilizes Figure 66 a to the substrate of the power circuit of the manufacturing of the manufacturing approach shown in the 66e and the connection status between the paper battery;
Figure 68 a shows according to 22nd embodiment of the invention, is used to utilize the structure on a surface of embodiment of the sheet circuit substrate of the power circuit that the method for making power circuit makes;
Figure 68 b shows another surperficial structure of the circuit substrate shown in Figure 68 a;
Figure 69 a shows the structure on a surface that is installed in shown in Figure 68 a, the 68b on the circuit substrate, has the power circuit of paper battery shown in Figure 63;
Figure 69 b shows another surperficial structure of the power circuit shown in Figure 69 a;
Figure 70 a shows the manufacturing approach of the power circuit shown in Figure 69 a, the 69b;
Figure 70 b shows the manufacturing approach of the power circuit shown in Figure 69 a, the 69b;
Figure 70 c shows the manufacturing approach of the power circuit shown in Figure 69 a, the 69b;
Figure 70 d shows the manufacturing approach of the power circuit shown in Figure 69 a, the 69b; And
Figure 71 shows and utilizes Figure 70 a to the connection status between the substrate of the power circuit of the manufacturing of the manufacturing approach shown in the 70d.
The specific embodiment
(first embodiment)
Fig. 2 a is the plane according to the audio message transfer sheet of first embodiment of the invention, and Fig. 2 b shows the internal structure of the audio message transfer sheet shown in Fig. 2 a, and Fig. 2 c is the sectional view along the line A-A shown in Fig. 2 a.In addition, Fig. 3 shows the laminar structure of Fig. 2 a to the audio message transfer sheet shown in the 2c 1.
Like Fig. 2 a to 2c and shown in Figure 3; Present embodiment comprises and is clipped in sheet audio information recording/reproducing part 30 between two support chip 20a, the 20b, can the recoding/reproduction audio-frequency information; Said support chip 20a, 20b are processed by the flexible thin material of for example paper base material; Wherein audio information recording/reproducing part 30 also is sandwiched in and support chip 20a, 20b have between two the surface patch 10a, 10b of same external profile, and said surface patch 10a, 10b are processed by the flexible thin material of for example paper base material.The bonding work (adhesive work) at the preceding and back side through being applied to support chip 20a, 20b is engaged with each other surface patch 10a, 10b, support chip 20a, 20b and audio information recording/reproducing part 30 together.For example, the preceding and back side through double-sided belt being pasted support chip 20a, 20b or apply heat-fusible adhesive to it and can realize this bonding work.
In addition, audio information recording/reproducing part 30 comprises: the sheet audio-frequency information output 40 by piezoelectric element 41, vibrating membrane 42 and the diaphragm explained after a while constitute is used to export the audio-frequency information that is write down; The audio frequency substrate 32 of slim IC chip 34 and slim switch 33 has been installed; Said slim IC chip 34 is the audio information recording devices that are used for record audio information; Slim switch 33 is operating means, and operation is used for being recorded in from 40 outputs of audio-frequency information output the audio-frequency information of IC chip 34; And the flexible paper battery 31 that links to each other with audio frequency substrate 32, being used for to 32 power supplies of audio frequency substrate, audio frequency substrate 32 also has been equipped with splicing ear 35, is used for from the outside to IC chip 34 input audio-frequency informations.In this manner, audio information recording/reproducing part 30 has laminated structure.Here; Audio frequency substrate 32 is by fiberglass reinforced plastic (FRP; Fiberglass reinforced plastics), polyethylene terephthalate (PET; Polyethylene terephthalate), the flexible thin substrate processed such as polyimides or lead frame; Wherein utilize anisotropy/electroconductive binder (ACP, anisotropic/conductiveadhesive), anisotropy/conducting film (ACF, anisotropic/conductive film), wire-bonded etc. engage with IC chip 34.
In addition, when with 30 stacks of audio information recording/reproducing part, support chip 20a has been equipped with hole 21a, 22,23,24a in the zone in the face of paper battery 31, switch 33, IC chip 34 and audio-frequency information output 40 respectively.In addition, when with 30 stacks of audio information recording/reproducing part, support chip 20b has been equipped with hole 21b, 24b in the zone in the face of paper battery 31 and audio-frequency information output 40 respectively.
In this manner; In the zone of the support chip 20a that faces paper battery 31, switch 33, IC chip 34 and audio-frequency information output 40, hole 21a, 22,23,24a have been formed; In the zone of the support chip 20b that faces paper battery 31 and audio-frequency information output 40, hole 21b, 24b have been formed; This has reduced the difference of thickness between paper battery 31, switch 33, IC chip 34 and audio-frequency information output 40 and other zone, has improved the flatness of surface patch 10a, 10b and is beneficial at surface patch 10a, the last printing information of 10b.In addition, be equal to or greater than the thickness of audio information recording/reproducing part 30 thicks, can make surface patch 10a, 10b smooth in fact through the gross thickness that makes support chip 20a, 20b.In this case, for example,, fixed audio frequency substrate 32 through the thin part of audio information recording/reproducing part 30 being clipped in the zone of the audio frequency substrate 32 between support chip 20a, the 20b.Because the zone of paper battery 31 links to each other with audio frequency substrate 32, need not this zone is clipped between support chip 20a, the 20b.In addition; Because surface patch 10a, 10b are pasted support chip 20a, 20b; Even when audio information recording/reproducing part 30 has ledge and sunk part, can make surface patch 10a, 10b recessed through pushing, but under like the inkjet type situation during no pressure; Surface patch 10a, 10b can keep smooth, also can print thus.
Fig. 4 a shows Fig. 2 a to 2c and support chip 20a shown in Figure 3 and be laminated to audio information recording/reproducing part 30 together, and Fig. 4 b shows Fig. 2 a to 2c and support chip 20b shown in Figure 3 and be laminated to audio information recording/reproducing part 30 together.
Shown in Fig. 4 a; Be formed in the face of the hole 21a in the zone of the support chip 20a of paper battery 31 less than paper battery 31; Be formed in the face of the hole 22 in the zone of switch 33 greater than switch 33; Be formed in the face of the hole 23 in the zone of IC chip 34 greater than IC chip 34, and be formed in the face of the hole 24a in the zone of audio-frequency information output 40 greater than audio-frequency information output 40.
In addition, shown in Fig. 4 b, be formed in the face of the hole 21b in the zone of the support chip 20b of paper battery 31 less than paper battery 31, and be formed in the face of the hole 24b in the zone of audio-frequency information output 40 less than audio-frequency information output 40.
In this manner, the bonding work at the preceding and back side through being applied to support chip 20a, 20b, lamination and fixed-audio information recording/regenerating part 30, wherein in the past and the back side only in the subregion of support chip, be sandwiched between two support chip 20a, the 20b.
In addition; In two surface patch 10a, 10b; The surface patch 10a that faces switch 33 and IC chip 34 through the hole 22,23 of support chip 20a is equipped with information display area territory 2, wherein when this audio message transfer sheet 1 of mailing, has printed address information etc.; The zone of facing switch 33 through the hole 22 of support chip 20a is equipped with printing playback button 3, is used for console switch 33.In addition, in the face of in the zone of audio-frequency information output 40, formed the audio frequency output area 4 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information output 40 at the hole 24a through support chip 20a.Even when the preceding and back side of audio-frequency information output 40 has covered surface patch 10a, 10b, become audio frequency output area 4 also can compensate by the minute aperture matrix-like and reduce from the volume of audio-frequency information output 40 outputs.At audio frequency output area 4,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.Therefore, with the punching that utilizes pin etc. or bore a hole differently, can not form burr and have burr to block these holes never.In addition; In Fig. 1,, on the whole surface of surface patch 10a, print the information that comprises playback button 3 in the reality although information display area territory 2 is not arranged on the top of audio frequency output area 4; Therefore, still information display area territory 2 is arranged on audio frequency output area 4 tops.In addition, replace playback button 3 being set on the surface patch 10a, can also after information being printed on the surface patch 10a, strip of paper used for sealing be pasted the zone in the face of switch 33 through being printed on.
Here; Under the situation of as above constructing audio message transfer sheet 1; As stated; The bonding work at the preceding and back side through being applied to support chip 20a, 20b, lamination and fixed-audio information recording/regenerating part 30, wherein in the past and the back side only in a part of zone of support chip, be sandwiched between two support chip 20a, the 20b.Because support chip 20a, 20b have been equipped with hole 21a, 21b, 22,23,24a, 24b in the zone of paper battery 31, switch 33, IC chip 34 and the audio-frequency information output 40 of facing audio information recording/reproducing part 30; When lamination support chip 20a, 20b and audio information recording/reproducing part 30, must will be formed on hole 21a, 22,23, the 24a among the support chip 20a and the hole 21b, the 24b that are formed among the support chip 20b accurately aim at.
Therefore; Support chip 20a, 20b can be made up of a sheet; Thereby construct two support chip 20a, 20b through folding this sheet, and will be formed on hole 21a, 22,23, the 24a among the support chip 20a and the hole 21b, the 24b that are formed among the support chip 20b accurately aim at.
Fig. 5 a shows the structure of Fig. 2 c that sheet constitutes and two support chips shown in Figure 3, and Fig. 5 b shows how to come pleated sheet along the sweep shown in Fig. 5 a.
Shown in Fig. 5 a, 5b; Fig. 2 c and two support chip 20a, 20b shown in Figure 3 are connected with each other along hemisect (half-cut) sweep 25; Along sweep 25 folding support chip 20a, 20b; Thereby audio information recording/reproducing part 30 is clipped between these two support chip 20a, the 20b, and the bonding work on two surfaces through being applied to support chip 20a, 20b fixes audio information recording/reproducing part 30.In this manner, be formed on hole 21a, 22,23, the 24a among the support chip 20a and the hole 21b, the 24b that are formed among the support chip 20b accurately aim at.
To specify the structure of audio-frequency information output 40 below.
Fig. 6 shows the structure of audio-frequency information output shown in Fig. 2 b, is audio-frequency information output 40 sectional view on every side of audio message transfer sheet 1 shown in Fig. 2 b.
As shown in Figure 6, the audio-frequency information output 40 of present embodiment comprises: flexible piezoelectric element 41 is used for exporting the audio-frequency information that is recorded in IC chip 34; Flexible film sheet 43 sticks on a side of piezoelectric element 41; And flexible diaphragm 42, be adhered to diaphragm 43 and process by styrene paper etc., be used for the vibration of amplifying piezo-electric element 41.Here; The diameter of diaphragm 43 is designed to the diameter greater than piezoelectric element 41; Therefore; When piezoelectric element 41 being pasted 43 last times of diaphragm, on the surface of the diaphragm that does not have sticking piezoelectric element 41 43, around piezoelectric element 41, having kept does not have sticking piezoelectric element 41 and area exposed.In addition; Vibrating membrane 42 is designed to have diameter greater than piezoelectric element 41 and less than the hole of the diameter of diaphragm 43; Therefore, only can vibrating membrane 42 be pasted on the diaphragm 43, so that piezoelectric element 41 matches with lip-deep this hole of the diaphragm 43 of having pasted piezoelectric element 41.With the regions engaged of this vibrating membrane 42, there is not bonding work album leave diaphragm 43 there through the both sides that are applied to support chip 20b with the surface of having pasted diaphragm 43 support chip 20b in addition.This thickness that has prevented to be provided with the zone of audio-frequency information output 40 increases, and can audio-frequency information output 40 is fixed to surface patch 10a, 10b and need not to engage, and has avoided disturbing the vibration of piezoelectric element 41 and vibrating membrane 42 thus.In addition, for example a side length of vibrating membrane 42 is set to 2.8 times of diameter of piezoelectric element 41, can access from the max volume effect of the audio-frequency information of piezoelectric element 41 outputs.The audio-frequency information output 40 of structure also with the microphone that acts on the input audio-frequency information, in this case, need be provided with the switch (not shown) on audio frequency substrate 32 in this manner, is used for through audio-frequency information output 40 input audio-frequency informations.In addition, for piezoelectric element 41, can use have diameter 27mm, the material of thickness 0.16mm based on PZT-PMN (lead-zirconates-titanate+lead magnesium niobate, lead-zironate-titanate+lead magnesium niobate).
To specify the peripheral structure of switch 33 below.
Fig. 7 shows the sectional view of periphery of the switch 33 of audio message transfer sheet shown in Fig. 2 b.
Switch 33 shown in Fig. 2 b has flexibility.In addition, as shown in Figure 7, among the support chip 20a in the zone that switch 33 has been installed, the 20b; Only there is support chip 20a in facing the zone of switch 33, to be equipped with porose 22; Therefore, around switch 33, audio frequency substrate 32 is clipped in the middle and fixing by two support chip 20a, 20b; And in the zone of the audio frequency substrate 32 that switch 33 has been installed, through the bonding work that is applied to support chip 20b both sides audio frequency substrate 32 is installed in support chip 20b and goes up and fix.Here, if the height of hypothesis switch 33 less than the thickness of support chip 20a, then switch 33 is surrounded by the support chip 20a of thickness greater than the thickness of switch 33, when when the outside applies force majeure, this has been avoided console switch 33.When audio message transfer sheet when utilizing the destination sorter (mail sorting systems) of postcode; This has prevented to push playback button 3; And prevent invalidly to consume paper battery 31, or prevent between delivery period overwrite or wipe the audio-frequency information that is recorded in the IC chip 34.
To be described in detail in the method for record audio information in the above-mentioned audio message transfer sheet 1 below.
As stated, can through audio-frequency information output 40 with audio information recording in IC chip 34, but in this case, maybe noise be sneaked in the audio-frequency information, greatly worsened the quality that is recorded in the sound in the IC chip 34.Therefore, the splicing ear 35 that is arranged on the audio frequency substrate 32 links to each other with the audio frequency input source so that through splicing ear 35 record audio information in IC chip 34, thus can be in IC chip 34 record audio information, and can not cause any noise therein.In this case, replace paper battery 31 is linked to each other with audio frequency substrate 32,, when record audio information in IC chip 34, can not consume paper battery 31 if from the outside to the audio frequency substrate power supply is provided through splicing ear 35.
Can above-mentioned audio message transfer sheet 1 be configured to the size of postcard and as mail, maybe can be configured to card sizes also as business card with audio frequency or message card etc.
(second embodiment)
Fig. 8 a is the plane according to the audio message transfer sheet of second embodiment of the invention, and Fig. 8 b shows the internal structure of the audio message transfer sheet shown in Fig. 8 a, and Fig. 8 c is the sectional view along the line A-A ' shown in Fig. 8 a.
Like Fig. 8 a to shown in the 8c; The difference of the present embodiment and first embodiment only is; Audio frequency substrate 32 is equipped with the switch 33b that when record audio information in IC chip 34, will push, and has printed record button 3b in the zone of the switch 33b of opposed face sheet 10a.Identical with the situation of playback button 3a, needn't be on surface patch 10a hard copy button 3b, can also be on surface patch 10a printing information, then strip of paper used for sealing is pasted the zone in the face of switch 33b.
In the audio message transfer sheet 101 of as above constructing; When record audio information in IC chip 34; If through audio-frequency information output 40 input audio-frequency informations, wherein depress the record button 3b that is arranged on the surface patch 10a, record is through the audio-frequency information of audio-frequency information output 40 inputs in IC chip 34; If push the playback button that is arranged on the surface patch 10a, be recorded in the audio-frequency information in the IC chip 34 through 40 outputs of audio-frequency information output.
(the 3rd embodiment)
Fig. 9 a is the plane according to the audio message transfer sheet of third embodiment of the invention, and Fig. 9 b shows the internal structure of the audio message transfer sheet 201 shown in Fig. 9 a, and Fig. 9 c is the sectional view along the line A-A ' shown in Fig. 9 a.In addition, Figure 10 shows the posting field of the IC chip 234 shown in Fig. 9 b.
Shown in Fig. 9 a, 9b; Present embodiment is equal to first embodiment, also on audio frequency substrate 32, has been equipped with three switch 233a that when reproducing the audio-frequency information be recorded in IC chip 234, will push to 233c and be printed on above the surface patch 10a three the playback button 203as of switch 233a in the zone of 233c to 203c.In addition, shown in figure 10, the posting field of the IC chip 234 that has wherein write down audio-frequency information is divided into three regional 234a to 234c, and in each regional 234a different audio-frequency information section of record in the 234c.
In the audio message transfer sheet 201 of as above constructing; For three playback button 203a to 203c; For example, when pushing playback button 203a, export the audio-frequency information that is recorded in posting field 234a the IC chip 234, that be recorded in IC chip 234 from audio-frequency information output 40; When pushing playback button 203b; Be recorded in the audio-frequency information of posting field 234b the IC chip 234, that be recorded in IC chip 234 from 40 outputs of audio-frequency information output, and when pushing playback button 203c, export the audio-frequency information that is recorded in posting field 234c the IC chip 234, that be recorded in IC chip 234 from audio-frequency information output 40.
In this manner; The a plurality of playback button 203a that are arranged on the surface patch 10a through record a plurality of audio-frequency information sections and optionally pushing in an IC chip 234 can optionally export from audio-frequency information output 40 and be recorded in a plurality of audio-frequency information sections the IC chip 234 to 203c.
Present embodiment be equipped with three playback button 203a to 203c and switch 233a to 233c; And the information recording area in the IC chip 234 is divided into three regional 234a to 234c; Yet the number of divided information posting field is not limited to 3 in the number of playback button and switch and the IC chip.
(the 4th embodiment)
Figure 11 a is the plane according to the audio message transfer sheet of fourth embodiment of the invention, and Figure 11 b shows the internal structure of the audio message transfer sheet 301 shown in Figure 11 a, and Figure 11 c is the sectional view along the line A-A ' shown in Figure 11 a.
Like Figure 11 a to shown in the 11c; Present embodiment is equal to first embodiment; Two audio- frequency information output 340a, 340b also on audio information recording/reproducing part 330, have been equipped with; And surface patch 310a has been equipped with audio frequency output area 304a, 304b, is used for the audio-frequency information from these audio- frequency information outputs 340a, 340b through sweep 305a, 305b output.In addition, support chip 320a, 320b are divided into three parts,, thereby can fold audio frequency output area 304a, 304b along sweep 305a, 305b so that with corresponding along three adjacent areas of the sweep 305a of surface patch 310a, 305b.Information display area territory 2 is set, so that come across three adjacent areas along sweep 305a, 305b.
In the audio message transfer sheet 301 of as above constructing, be recorded in the audio-frequency information the IC chip 34 from two audio- frequency information output 340a, 340b output, therefore compare with first embodiment, can increase the volume of output audio information.In this case; Piezoelectric element 41 usefulness act on the equipment that output is recorded in the audio-frequency information in the IC chip 34; Even so, can not shorten the life-span of paper battery 31 from two audio-frequency information output 340a, when 340b output is recorded in the audio-frequency information the IC chip 34 yet.
In addition; Because along two sweep 305a, folding two the audio frequency output area 304a of 305b, 304b; When not being recorded in the audio-frequency information in the IC chip 34 through audio- frequency information output 340a, 340b output; Can be along sweep 305a, the folding audio frequency output area 304a of 305b, 304b, so that improve the portability of audio message transfer sheet 301.For example, when along the folding audio frequency output area 304a of sweep 305a, 305b, 304b, the size of sheet is made as name card size makes and can audio message transfer sheet 301 be received in the cards folder etc.
In addition, can also be from two audio-frequency information output 340a, the different audio-frequency information section of 340b output.This make audio message transfer sheet 301 to listen to be recorded in the IC chip 34, for example as the information of stereophonic broadcasting.
Present embodiment has been equipped with two audio- frequency information output 340a, 340b, but the number of audio-frequency information output is not limited to 2.In addition, along on three adjacent areas of sweep 305a, 305b across being provided with information display area territory 2, but can also be only along in some zone of three adjacent areas of sweep 305a, 305b information display area territory 2 being set.
In addition; According to present embodiment; An audio frequency substrate 32 links to each other with two audio- frequency information output 340a, 340b; But can also an audio frequency substrate be set to each two audio- frequency information output 340a, 340b, and export the audio-frequency information that writes down in the IC chip that is arranged on the audio frequency substrate through operating in each switch that is provided with on the audio frequency substrate.
In addition; According to present embodiment; Support chip 320a, 320b are divided into three parts; So that with corresponding along three adjacent areas of the sweep 305a of surface patch 310a, 305b, the further support chip divided of division is so that corresponding with three adjacent areas along sweep 305a, 305b.Adopt this structure further to increase the crooked or folding free degree of audio message transfer sheet 301.In this manner support chip is divided into a plurality of parts and is not limited to present embodiment, the 5th and the 6th embodiment that can be applied to above-mentioned first to the 4th embodiment and will explain subsequently.
(the 5th embodiment)
Figure 12 a is the plane according to the audio message transfer sheet of fifth embodiment of the invention, and Figure 12 b shows the internal structure of the audio message transfer sheet shown in Figure 12 a, and Figure 12 c is the sectional view along the line A-A ' shown in Figure 12 a.
To shown in the 12c, the difference of the present embodiment and first embodiment only is that the exterior contour of support chip 420a, 420b is less than the exterior contour of surface patch 10a, 10b like Figure 12 a.
Therefore, the present invention's exterior contour that can be applied to support chip 420a, 420b less than the exterior contour of the situation of the exterior contour of surface patch 10a, 10b and support chip 420a, the 420b situation greater than the exterior contour of surface patch 10a, 10b with being equal to.
(the 6th embodiment)
Figure 13 a is the plane according to the audio message transfer sheet of sixth embodiment of the invention, and Figure 13 b shows the internal structure of the audio message transfer sheet shown in Figure 13 a, and Figure 13 c is the sectional view along the line A-A ' shown in Figure 13 a.
To shown in the 13c, present embodiment is corresponding to first embodiment like Figure 13 a, and its China and Mexico's receiving layer 511 is superimposed upon surface patch 10a not in the face of on the surface of support chip 20a.
In the audio message transfer sheet 501 of constructing as stated; China ink receiving layer 511 is laminated on surface patch 10a not in the face of on the surface of support chip 20a; Be provided with information display area territory 2 on it; Therefore when utilizing ink-jet printer on information display area territory 2 during type information, can be on information display area territory 2 type information clearly.
The method of making above-mentioned audio message transfer sheet 501 will be described below.
Figure 14 a shows the method for shop drawings 13a to the audio message transfer sheet shown in the 13c 501 to Figure 14 f.
At first, the black receiving layer 511 shown in Figure 14 b is superimposed upon on the surface patch shown in Figure 14 a.When from the conitnuous forms paper, surface patch 10a being cut into monolithic, if black receiving layer 511 is superimposed upon on the surface patch 10a of conitnuous forms paper, black receiving layer 511 can easily superpose.
Next, shown in Figure 14 c, as stated, superposeed above that through laser beam processing that to form diameter among the surface patch 10a of black receiving layer 511 be the hole of 0.1mm, so that audio frequency output area 4 to be set.
In addition, shown in Figure 14 d, audio information recording/reproducing part 30 is clipped between two support chip 20a, the 20b.
Then, shown in Figure 14 e, the support chip 20a that has wherein pressed from both sides audio information recording/reproducing part 30,20b further are clipped between surface patch 10a, the 10b.
This has accomplished the audio message transfer sheet that does not have the lip-deep information that is printed on surface patch 10a; Then; Shown in Figure 14 f, the surface patch 10a of the black receiving layer 511 that superposeed above that goes up printing playback button 3, and utilizes ink-jet printer that information is printed on information display area territory 2.
As an example; Present embodiment has been explained black receiving layer 511 has been superimposed upon the situation on the surface patch 10a of the audio message transfer sheet 1 shown in first embodiment; Can also black receiving layer 511 be superimposed upon on the surface patch 10b of audio message transfer sheet 1; Or only black receiving layer 511 is superimposed upon the surface patch 10a of the audio message transfer sheet shown in above-mentioned second to the 5th embodiment, or surface patch 10a, 10b are last.
In the present invention shown in above-mentioned first to the 6th embodiment; Audio information recording/transcriber that can the recoding/reproduction audio-frequency information has laminated structure; Between pressed from both sides two support chips of audio information recording/transcriber to the back side in the past the zone be bonded together and face audio information recording/transcriber; Only between these zones, audio information recording/transcriber is clipped in the middle to the back side in the past, therefore can easily crooked or folding this sheet also can be on surface patch printing information.
In addition, when two support chips have the exterior contour identical with surface patch, can make the thickness of whole audio message transfer sheet even in fact.
In addition, when two support chips are divided into a plurality of part, can increase crooked with the folding free degree of audio message transfer sheet.
In addition, when two support chips being connected together through sweep, can two support chips are easily aligned with each other.
In addition, comprise under the situation with the structure of lower component being arranged at sound information output device on audio information recording/transcriber, that be used for output audio information: the piezoelectric element that is used for output audio information; Have the diaphragm greater than the diameter of piezoelectric element, said diaphragm pastes a surface of piezoelectric element; And be equipped with porose vibrating membrane; Said hole has greater than the diameter of piezoelectric element and less than the diameter of diaphragm diameter; Said vibrating membrane is adhered on the diaphragm according to the mode of piezoelectric element mating holes, wherein, only in joining the surface of diaphragm to, does not have in the zone of bonding film sheet; Vibrating membrane is engaged with support chip; Can prevent to increase the thickness in the zone that is provided with sound information output device, and sound information output device is fixed on the surface patch and does not engage, prevent interference piezoelectric element and vibration vibration of membrane thus.
In addition; Under the situation of following structure: two support chips are between operating means is clipped in audio information recording/transcriber on every side; Audio information recording/transcriber is installed on the support chip is provided with in the zone of operating means; If the height of operating means is lower than the thickness of support chip, then surround operating means greater than the support chip of the height of operating means by thickness, this can be avoided when operation device when the outside applies force majeure.
In addition, under the situation of following structure: black receiving layer is not superimposed upon not on the surface in the face of at least one support chip of two surface patch, if subsequently through ink-jet printer type information on surface patch, can be on surface patch type information clearly.
In addition; Under the situation of following structure: before the support chip between audio information recording/transcriber is clipped in is sandwiched between the surface patch; Black receiving layer is added on the surface patch, and can superpose has the black receiving layer of excellent surface patch flatness, and when surface patch is the monolithic from the cutting of conitnuous forms paper; Black receiving layer is superimposed upon on the surface patch of conitnuous forms paper, is beneficial to the stack of black receiving layer.
(the 7th embodiment)
Figure 15 a is the plane according to the audio-frequency information output chip of seventh embodiment of the invention, and Figure 15 b shows the internal structure of the audio-frequency information output chip shown in Figure 15 a, and Figure 15 c is the sectional view along the line A-A ' shown in Figure 15 a.In addition, Figure 16 shows the laminar structure of Figure 15 a to the audio-frequency information output chip shown in the 15c.
Like Figure 15 a to 15c and shown in Figure 16; Construct present embodiment in such a way: sheet audio information recording/reproducing part 1030 that can the recoding/reproduction audio-frequency information is sandwiched between two support chip 1020a, the 1020b; Said support chip 1020a, 1020b are processed by the flexible thin sill of for example paper base material; The support chip 1020a, the 1020b that have wherein pressed from both sides audio information recording/reproducing part 1030 are sandwiched between two surface patch 1010a, the 1010b; Said surface patch 1010a, 1010b are processed by the flexible thin sill of for example paper base material, can fold said as the zone of sweep along the sweep 1015a that wherein is provided with surface patch 1010a, 1010b, 1015b.The bonding work at the preceding and back side through being applied to support chip 1020a, 1020b is engaged with each other surface patch 1010a, 1010b, support chip 1020a, 1020b and audio information recording/reproducing part 1030 together.The preceding and back side through double-sided belt being pasted support chip 1020a, 1020b or apply heat-fusible adhesive to it and can realize this bonding work.
In addition, audio information recording/reproducing part 1030 comprises: sheet audio-frequency information output 1040 is used to export the audio-frequency information that is write down; The audio frequency substrate 1032 of slim IC chip 1034 and slim switch 1033 has been installed; Said slim IC chip 1034 is the audio information recording devices that are used for record audio information, and slim switch 1033 operations are used for being recorded in from 1040 outputs of audio-frequency information output the audio-frequency information of IC chip 1034; And the flexible paper battery 1031 that links to each other with audio frequency substrate 1032, be used for to 1032 power supplies of audio frequency substrate; And connection substrate 1036; Said connection substrate is processed by polyimide film; Formed on it and be used for wiring pattern 1037 that IC chip 1034 is linked to each other with audio-frequency information output 1040; Audio frequency substrate 1032 also has been equipped with splicing ear 1035, be used for from/to IC chip 1034 to/from outside I/O audio-frequency information.In this manner, audio information recording/reproducing part 1030 has laminated structure.Here; Audio frequency substrate 1032 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 1034.Connect substrate 1036 and be not limited to process, can use by having any film that flexible resin (for example PET) is processed at least by polyimide film.
In addition; In the time of on being superimposed upon surface patch 1010a; Zone through in the face of sweep 1015a is divided into two parts with support chip 1020a; When being superimposed upon 1030 last times of audio information recording/reproducing part, in the face of the zone of paper battery 1031, switch 1033, IC chip 1034 and audio-frequency information output 1040, form hole 1021a, 1022,1023,1024a respectively.In addition; In the time of on being superimposed upon surface patch 1010b; Zone through in the face of sweep 1015b is divided into two parts with support chip 1020b; When being superimposed upon 1030 last times of audio information recording/reproducing part, in zone, form hole 1021b, 1024b respectively in the face of paper battery 1031 and audio-frequency information output 1040.
In addition, between the zoning of support chip 1020a, 1020b, be provided with the connection substrate 1036 in the middle of being sandwiched in, be used for dividing 1040 to link to each other IC chip 1034 and information output part.
Figure 17 a shows Figure 15 b, 15c and the support chip 1020a shown in Figure 16 and the laminar structure of audio information recording/reproducing part 1030, and Figure 17 b shows Figure 15 b, 15c and the support chip 1020b shown in Figure 16 and the laminar structure of audio information recording/reproducing part 1030.
Shown in Figure 17 a; Be formed in the face of the hole 1021a in the zone of the support chip 1020a of paper battery 1031 less than paper battery 1031; Be formed in the face of the hole 1022 in the zone of switch 1033 greater than switch 1033; Be formed in the face of the hole 1023 in the zone of IC chip 1034 greater than IC chip 1034, and be formed in the face of the hole 1024a in the zone of audio-frequency information output 1040 greater than audio-frequency information output 1040.
In addition, shown in Figure 17 b, be formed in the face of the hole 1021b in the zone of the support chip 1020b of paper battery 1031 less than paper battery 1031, and be formed in the face of the hole 1024b in the zone of audio-frequency information output 1040 less than audio-frequency information output 1040.
In this manner; The bonding work at the preceding and back side through being applied to support chip 1020a, 1020b; Lamination and fixed-audio information recording/regenerating part 1030, wherein the past and the back side only are sandwiched in the subregion of support chip between two support chip 1020a, the 1020b.
In addition; In two surface patch 1010a, 1010b, the surface patch 1010a that faces switch 1033 and IC chip 1034 through the hole 1022,1023 of support chip 1020a is equipped with information display area territory 1002, wherein; For example when this audio message transfer sheet 1001 is used as business card; Printed address information etc., the zone of facing switch 1033 through the hole 1022 of support chip 1020a is equipped with playback button 1003, is used for console switch 1033.In addition; Face in the zone of audio-frequency information output 1040 at hole 1024a through support chip 1020a; Formed the audio frequency output area 1004 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information output 1040; With respect to other zone, the zone that forms audio frequency output area 1004 can be folding along sweep 1015a.Even when the preceding and back side of audio-frequency information output 1040 has covered surface patch 1010a, 1010b, become audio frequency output area 1004 also can compensate by the minute aperture matrix-like and reduce from the volume of audio-frequency information output 1040 outputs.At audio frequency output area 1004,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.
The as above method for using of the audio-frequency information output chip 1001 of structure will be described below.
Figure 18 a shows and does not use the situation of Figure 15 a to 15c and audio-frequency information output chip 1001 shown in Figure 16, and Figure 18 b shows and uses the situation of Figure 15 a to 15c and audio-frequency information output chip 1001 shown in Figure 16.
When not using Figure 15 a, shown in Figure 18 a, along sweep 1015a, the folding audio-frequency information output chip 1001 of 1015b to 15c and audio-frequency information output chip 1001 shown in Figure 16.Under this condition; With respect to other zone; Zone along the audio-frequency information output 1040 of sweep 1015a, the audio information recording/reproducing part 1030 of 1015b folded clip between support chip 1020a, 1020b and surface patch 1010a, 1010b; If suppose that the size of this condition subaudio frequency information output chip 1001 is name card sizes, can folding audio-frequency information output chip 1001 be inserted cards folder etc., thereby improve portability.In addition, under this condition, do not expose the audio frequency output area 1004 that is arranged on the surface patch 1010a so that will output to the outside from the audio frequency of audio-frequency information output 1040.In addition; Owing to connect IC chip 1034 and audio-frequency information output 1040 through the wiring pattern 1037 that is formed on the connection substrate 1036 between the zoning that is clipped in support chip 1020a, 1020b; Even can fold audio-frequency information output chip 1001 along folded part 1015a, 1015b, can avoid the wiring between IC chip 1034 and the audio-frequency information output 1040 to be fractureed.In addition; When shown in Figure 18 a, folding audio-frequency information output chip 1001; If the interval between the zoning of adjustment support chip 1020a, 1020b, make its be equal to or greater than become folded part outside, between the surface patch 1010b apart from the time, promptly; At least be two times of thickness of audio-frequency information output chip 1001, then can keep folded state.
When using Figure 15 a to 15c and audio-frequency information output chip 1001 shown in Figure 16; Shown in Figure 18 b; When opening folding audio-frequency information output chip 1001 and pushing playback button 1003, be recorded in the audio-frequency information the IC chip 1034 of audio information recording/reproducing part 1030 from audio-frequency information output 1040 output.Here, under this condition, expose the audio frequency output area 1004 that is arranged on the surface patch 1010a so that will output to the outside from the audio frequency of audio-frequency information output 1040.In addition, shown in Figure 18 b, adjacent area forms certain angle along sweep 1015a if audio-frequency information output chip 1001 stays open, and can utilize the audio-frequency information output chip 1001 that is placed on the desktop etc. to come output audio information.
In this manner, when not using, folding audio-frequency information output chip 1001; And when using audio-frequency information output chip 1001; Open audio-frequency information output chip 1001 and output audio information, therefore can make the card miniaturization, guarantee the volume of audio-frequency information output simultaneously.
According to present embodiment; With respect to other zone; The zone that only has audio-frequency information output 1040 wherein to be sandwiched in the audio information recording/reproducing part 1030 between support chip 1020a, 1020b and surface patch 1010a, the 1010b is folding; But can also adopt following structure: with respect to other zone, the zone of the audio information recording/reproducing part 1030 between wherein audio-frequency information output 1040 and the subregion except that audio-frequency information output 1040 are sandwiched in is folding.In this case; Identical with the situation that connects substrate 1036; If audio frequency substrate 1032 is processed by polyimide film; Even it is clipped between support chip 1020a, 1020b and surface patch 1010a, the 1010b so that audio frequency substrate 1032 extends sweep 1015a, 1015b, the operation with respect to along sweep 1015a, the folding audio-frequency information output chip 1001 of 1015b can guarantee durability.
In addition; According to present embodiment; Even when the time along the folding audio-frequency information output chip 1001 of sweep 1015a, 1015b; Be arranged on this position that exposes playback button 1003 with being pressed so that export the playback button 1003 that is recorded in the audio-frequency information the IC chip 1034 from audio-frequency information output 1040; Yet, can also playback button 1003 be arranged on when along the folding audio-frequency information output chip 1001 of sweep 1015a, 1015b, can not expose in the zone of surface patch 1010a of playback button 1003.In this case, can prevent when along the folding audio-frequency information output chip 1001 of sweep 1015a, 1015b, to push playback button 1003, and avoid the unnecessary consumption of paper battery 1031.
In addition, can also make audio-frequency information output 1040 microphone as the input audio-frequency information, and through audio-frequency information output 1040 with audio information recording in IC chip 1034.Yet in this case, audio frequency substrate 1032 needs to be equipped with the switch (not shown), is used for through audio-frequency information output 1040 input audio-frequency informations.
(the 8th embodiment)
Figure 19 a is the plane according to the audio-frequency information output chip of eighth embodiment of the invention, and Figure 19 b shows the internal structure of the audio-frequency information output chip 1101 shown in Figure 19 a, and Figure 19 c is the sectional view along the line A-A ' shown in Figure 19 a.
Like Figure 19 a to shown in the 19c; The difference of present embodiment and the 7th embodiment is; Connect substrate 1036a, last wiring pattern 1037a, the 1037b of 1036b through being formed on; Two audio-frequency information output 1140a, 1140b are linked to each other with audio frequency substrate 1032, and with respect to other zone, along sweep 1105a, the folding audio-frequency information output 1140a between support chip 1120a, 1120b and surface patch 1110a, the 1110b, the zone of 1140b of being sandwiched in of 1115a.Identical with the situation of the 7th embodiment, also through in the face of be arranged on the sweep 1105a on the surface patch 1110a, the zone of 1115a is divided into three zones with support chip 1120a, 1120b.
The as above method for using of the audio-frequency information output chip 1101 of structure will be described below.
Figure 20 a shows and does not use the situation of Figure 19 a to the audio-frequency information output chip 1101 shown in the 19c, and Figure 20 b shows and uses the situation of Figure 19 a to the audio-frequency information output chip shown in the 19c.
When not using Figure 19 a, shown in Figure 20 a, along sweep 1105a, 1105b, 1115a, the folding audio-frequency information output chip 1101 of 1115b to the audio-frequency information output chip 1101 shown in the 19c.Under this condition; With respect to other zone; Be sandwiched in the zone of the audio information recording/reproducing part 1130 between support chip 1120a, 1120b and surface patch 1110a, the 1110b along sweep 1105a, 1105b, 1115a, the folding audio-frequency information output 1140a of 1115b, 1140b; If suppose that the size of this condition subaudio frequency information output chip 1101 is name card sizes, can folding audio-frequency information output chip 1101 be inserted cards folder etc., this has improved portability.In addition, under this condition, do not expose the audio frequency output area 1104a that is arranged on the surface patch 1110a, 1104b so that will output to the outside from the audio frequency of audio-frequency information output 1140a, 1140b.In addition; Under this condition; Do not expose and be pressed so that be recorded in the playback button 1003 of the audio-frequency information the IC chip 1034 from audio-frequency information output 1140a, 1140b output, therefore can not push playback button 1003 by error, this has been avoided the unnecessary consumption of paper battery 1031.
In addition; When using Figure 19 a to the audio-frequency information output chip 1101 shown in the 19c; Shown in Figure 20 b; Through opening folding audio-frequency information output chip 1101 and pushing playback button 1003, export the audio-frequency information the IC chip 1034 that is recorded in audio information recording/reproducing part 1130 from audio-frequency information output 1140a, 1140b.Under this condition, expose the audio frequency output area 1104a that is arranged on the surface patch 1110a, 1104b so that will output to the outside from the audio frequency of audio-frequency information output 1140a, 1140b.In addition, shown in Figure 20 b, adjacent area forms predetermined angular along sweep 1105a, 1115a if audio-frequency information output chip 1101 stays open, and can utilize the audio-frequency information output chip 1101 that is placed on desktop etc. to come output audio information.
In this manner, present embodiment adopted along sweep 1105a, 1105b can three foldings structure, therefore in folded state, can guarantee area size in a big way to its output audio information, realize bigger volume thus.
In the present embodiment; Can also adopt following structure: with respect to other zone, wherein the zone of audio-frequency information output 1140a, 1140b and the audio information recording/reproducing part 1130 between audio-frequency information output 1140a, subregion the 1140b are sandwiched in is folding.In this case; If audio frequency substrate 1032 is processed by polyimide film; Even audio frequency substrate 1032 is clipped between surface patch 1110a, 1110b and support chip 1120a, the 1120b so that audio frequency substrate 1032 extends sweep 1105a, 1115a; Operation with respect to along sweep 1105a, the folding audio-frequency information output chip 1101 of 1115a can guarantee durability.
In addition, the audio-frequency information section of exporting from audio-frequency information output 1140a, 1140b is differed from one another.In this manner, for example can listen to be recorded in the IC chip 1034, as the information of stereophonic broadcasting.
In addition, present embodiment is equipped with two audio-frequency information output 1140a, 1140b, but the number of audio-frequency information output 1140a, 1140b is not limited to 2.In this case, in two zones and other zone that are clipped between support chip 1120a, 1120b and surface patch 1110a, the 1110b, at least one audio-frequency information output can three foldings.For example, can adopt three folded structures that are provided with four audio-frequency information outputs, form two zones by two set that are clipped in audio-frequency information output between support chip 1120a, 1120b and surface patch 1110a, the 1110b and other zone.In this case, same, through adopt the structure that different audio-frequency information sections is outputed to two zones, for example can listen to be recorded in the IC chip 1034, as the information of stereophonic broadcasting.
In addition; Replacing being restricted to like present embodiment can three folded structure, can also be along sweep 1105a, 1115a, with audio frequency output area 1104a, 1104b adjacent areas in along sweep foldable area is set; That is, audio frequency substrate 1032 is clipped in the top of accompanying drawing or the zone of bottom.In this case, same, preferably; Be sandwiched in support chip 1120a, the 1120b between surface patch 1110a, the 1110b along the sweep division, but in this case, same; When folding audio-frequency information output chip 1101; If the interval between the zoning of adjustment support chip 1120a, 1120b, it is equal to or greater than becomes folded part distance outside, between the surface patch 1110b, then can keep folded state.For example; When along in the zone of sweep 1105a, audio frequency output area 1104a that 1115a is adjacent, 1104b; When being provided with in the upper and lower in the drawings along the folding zone of sweep, shown in Figure 20 a, at first folding audio-frequency information output chip 1101; Above-mentioned zone in the folding then upper and lower; If adjustment makes two times of its thickness that is equal to or greater than the audio-frequency information output chip along the sweep 1105a of support chip 1120a, 1120b, the interval between the 1115a adjacent areas, and adjustment audio frequency substrate 1032 is sandwiched in the zone between support chip 1120a, the 1120b and constitutes the interval between the zone of its upper and lower; Making it is three times of thickness of audio-frequency information output chip 1101 at least, can keep folded state.
In addition, according to the 7th and the 8th embodiment, divide support chip along sweep, but can also process support chip, thereby do not divide support chip by the material that is easy to fold.
According to the present invention shown in the 7th and the 8th embodiment; Can be along the folding zone that comprises the audio information recording/transcriber of audio-frequency information output at least of sweep; And with respect to the folding zone that comprises the audio-frequency information output, other zone, thereby realize miniaturization, therefore; Needn't reduce the size of audio-frequency information output, and can realize that miniaturization guarantees the volume of being scheduled to simultaneously.
In addition; Under the situation of following structure: audio information recording/transcriber is processed by the flat substrates material; Two support chips and in the past and the audio information recording/transcriber of the back side between being sandwiched in be bonded together, divide two support chips along sweep, and only in the face of in some zones of audio information recording/transcriber; Between the past and the back side are clipped in audio information recording/transcriber; Can improve the flatness on surface, and irrelevant, thereby be beneficial to the printing of information on the surface patch with folding structure.
In addition; Under the situation of following structure: when folding audio-frequency information output chip; Interval between the zoning of support chip is equal to or greater than distance beyond the folded part at two surface patch, between the surface patch; When along the folding audio-frequency information output chip of sweep, can keep folded state.
In addition; Under the situation of following structure: audio information recording/transcriber comprises a plurality of audio-frequency information outputs; With respect to other zone; Can fold each along sweep and all comprise a plurality of zones of at least one audio-frequency information output, can increase the volume of audio-frequency information output, and need not to increase the size of folded state sound intermediate frequency information output chip.
(the 9th embodiment)
Figure 21 a is the plane according to the POP indicator 2001 of nineth embodiment of the invention, and Figure 21 b shows the internal structure of the POP indicator 2001 shown in Figure 21 a.In addition, Figure 22 shows the laminar structure of the POP indicator 2001 shown in Figure 21 a, the 21b.
Like Figure 21 a, 21b and shown in Figure 22; Construct present embodiment in such a way: sheet audio information recording/reproducing part 2030 that can the recoding/reproduction audio-frequency information is sandwiched between two support chip 2020a, the 2020b; Said support chip 2020a, 2020b are processed by the flexible thin material of for example paper base material; Support chip 2020a, 2020b between audio information recording/reproducing part 2030 is clipped in further are sandwiched between surface patch 2010a and the back sheet 2010b; Said surface patch 2010a and back sheet 2010b have and support chip 2020a, exterior contour that 2020b is identical, and are processed by the flexible thin material of for example paper base material.In addition, be provided with installation component 2005, be used for POP indicator 2001 is installed in the for example object of show window.The bonding work at the preceding and back side through being applied to support chip 2020a, 2020b; Surface patch 2010a, back sheet 2010b, support chip 2020a, 2020b and audio information recording/reproducing part 2030 are engaged with each other together, thus audio information recording/reproducing part 2030 are pasted the surface of surface patch 2010a.The preceding and back side through double-sided belt being pasted support chip 2020a, 2020b or apply heat-fusible adhesive to it and can realize this bonding work.In addition, some zones of surface patch 2010a, back sheet 2010b, support chip 2020a, 2020b and audio information recording/reproducing part 2030 are regional outstanding with respect to other.
In addition; Audio information recording/reproducing part 2030 comprises: installed as the IC chip 2034 of audio information recording device and as audio frequency substrate 2032, audio-frequency information output 40 and three paper battery 2050a of the switch 2033 of operating means to 2050c, the zone of audio frequency substrate 2032 that switch 2033 has been installed on it is regional outstanding with respect to other.
IC chip 2034 is designed to record audio information, and output was recorded in the audio-frequency information in the IC chip 2034 when audio-frequency information output 2040 was designed to push switch 2033.In addition, utilize anisotropy/electroconductive binder (ACP) or anisotropy/conducting film (ACF) that three paper battery 2050a are connected to 2050c, its two ends link to each other with audio frequency substrate 2032, so that serve as the power supply to 2032 power supplies of audio frequency substrate.
In addition; Audio frequency substrate 2032 has been equipped with splicing ear 2035; Be used for from the outside to IC chip 34 input audio-frequency informations; Said audio frequency substrate 2032 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to link to each other with IC chip 2034.
In addition; Support chip 2020a is processed by slim sill; And its thickness suitably is set according to required durability; When with audio information recording/reproducing part 2030 stack, in the zone of 2050c, switch 2033, IC chip 2034 and audio-frequency information output 2040, forming hole 2021a, 2022,2023,2024a in the face of paper battery 2050a, and the zone that has wherein formed hole 22 is with respect to other regional giving prominence to.
In addition; Support chip 2020b is processed by slim sill; And its thickness suitably is set according to required durability; When with 2030 stacks of audio information recording/reproducing part, in the zone of 2050c and audio-frequency information output 2040, forming hole 2021b, 2024b in the face of paper battery 2050a, and regional outstanding with respect to other through audio frequency substrate 2032 in the face of the zone of switch 2033.
Figure 23 a shows Figure 22 b and the support chip 2020a shown in Figure 23 and the laminar structure of audio information recording/reproducing part 2030, and Figure 23 b shows Figure 22 b and the support chip 2020b shown in Figure 23 and the laminar structure of audio information recording/reproducing part 2030.
Shown in Figure 23 a; Be formed on size in the face of the hole 2021a of paper battery 2050a in the zone of the support chip 2020a of 2050c less than the size of three paper battery 2050a that link to each other to 2050c; Be formed in the face of the hole 2022 in the zone of switch 2033 greater than switch 2033; Be formed in the face of the hole 2023 in the zone of IC chip 2034 greater than IC chip 2034, and be formed in the face of the hole 2024a in the zone of audio-frequency information output 2040 greater than audio-frequency information output 2040.
In addition; Shown in Figure 23 b; Be formed in the face of the hole 2021b of paper battery 2050a in the zone of the support chip 2020b of 2050c less than three paper battery 2050a that link to each other to 2050c, and be formed in the face of the hole 2024b in the zone of audio-frequency information output 2040 less than audio-frequency information output 2040.
In this manner; The bonding work at the preceding and back side through being applied to support chip 2020a, 2020b; Lamination and fixed-audio information recording/regenerating part 2030, thus from the preceding and back side of sheet, only its part is sandwiched between two support chip 2020a, the 2020b.
In addition; Surface patch 2010a is equipped with information display area territory 2002; Printed advertising message on it, be provided with playback button 2003 in the face of in the support chip 2020a zone of switch 2033, be used for console switch 2033 through hole 2022 as POP; In the face of in the zone of audio-frequency information output 2040, formed the audio frequency output area 2004 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information output 2040 at the hole 2024a through support chip 2020a.Owing to become audio frequency output area 2004 by this minute aperture matrix-like,, also can compensate the volume of exporting from audio-frequency information output 2040 and reduce even when the preceding and back side of audio-frequency information output 2040 has covered surface patch 2010a and back sheet 2010b.In audio frequency output area 2004,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.Therefore, with the punching that utilizes pin etc. or bore a hole differently, can not form burr and have burr to block these holes never, audio frequency output area 2004 can also print the advertising message as POP.In addition, when audio information recording/reproducing part 2030 was clipped in the middle, setting surface patch 2010a and back sheet 2010b were so that it is regional outstanding with respect to other to comprise the zone of switch 2033.In addition,, not only advertising message can be on surface patch 2010a, printed, the durability of surface patch 2010a can also be improved as POP if surface patch 2010a is processed by the synthetic paper that is suitable for printing (for example foam PET (polyethylene terephthalate)).Especially in the zone that is provided with playback button 2003, may damaging surface sheet 2010a when pushing playback button 2003, but utilize synthetic paper can suppress the damage of surface patch 2010a.In addition, if process all surface sheet 2010a, back sheet 2010b and support chip 2020a, 2020b by synthetic paper equally, can improve the watertightness of whole POP indicator 2001.
Use the as above POP indicator 2001 of structure through utilizing installation component 2005 that it is hung from show window etc.Advertising message is shown 2002 as the POP information that is printed on, make the client in the shop that POP indicator 2001 has been installed visually to recognize advertising message.In addition, when client pushes playback button 2003, be recorded in the audio-frequency information the IC chip 2034 through 2004 reproductions of audio frequency output area and from 2040 outputs of audio-frequency information output.Therefore; If the product information that for example will be presented in advance in the show window writes in the IC chip 2034; Utilize installation component 2005 from show window suspension POP indicator 2001; When client pushes playback button 2003, through the information of audio frequency output area 2004 outputs, as audio frequency from audio-frequency information output 2040 at the product of the show window demonstration of having hung POP indicator 2001.Client can recognize as product information of audio-frequency information etc.In addition, can also in IC chip 2034, write down the information of for example test and music, and when pushing playback button 2003, from audio-frequency information output 2040 these information of output.In addition, owing to be recorded in containing much information in the IC chip 2034, can bulk information be provided to client in the information content that is printed on the information display area territory 2002.
Below detailed description is included in paper battery 2050a in the above-mentioned POP indicator 2001 to 2050c.
Figure 24 a is the plane of the paper battery 2050a shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b to the structure of 2050c, and Figure 24 b is the sectional view along the line A-A ' shown in Figure 24 a, and Figure 24 c is the sectional view along the line B-B ' shown in Figure 24 a.
Shown in Figure 24 a, 24b, each paper battery 2050a of present embodiment to 2050c have through gel electrolyte layer 2053 be laminated to together, the positive electrode layer of processing by manganese dioxide etc. 2051 and the positive electrode layer of processing by zinc etc. 2052.Be superimposed upon positive electrode layer 2051 sides with being coated with diaphragm 2056 conductive ink 2054, that process by PET (polyethylene terephthalate) etc., and will be coated with diaphragm 2057 conductive ink 2055, that process by PET etc. and be superimposed upon positive electrode layer 2052 sides.In addition; The diaphragm 2056 that is coated with conductive ink 2054 comprises from the outstanding outburst area 2058 of the exterior contour of positive electrode layer 2051, positive electrode layer 2052 and electrolyte layers 2053; The diaphragm 2057 that is coated with conductive ink 2055 comprises that the exterior contour place of positive electrode layer 2051, positive electrode layer 2052 and the electrolyte layers 2053 of these outburst areas 2058,2059 in the zone that differs from one another is outstanding from the outstanding outburst area 2059 of the exterior contour of positive electrode layer 2051, positive electrode layer 2052 and electrolyte layers 2053.Here, positive electrode layer 2051 sides and positive electrode layer 2052 sides owing to conductive ink 2054,2055 being coated in diaphragm 2056,2057 respectively differ from one another from its surface that exposes the outburst area 2058,2059 of conductive ink 2054,2055.
At the paper battery 2050a of as above structure in 2050c; The conductive ink 2054 that is coated on the diaphragm 2056 is electrically connected with positive electrode layer 2051; Therefore, the conductive ink 2054 in the outburst area 2058 constitutes positive electrode, and the conductive ink 2055 that is coated on the diaphragm 2057 is electrically connected with positive electrode layer 2052; Therefore, the conductive ink in the outburst area 2,059 2055 constitutes negative electrode.
Figure 25 shows shown in Figure 21 b, Figure 22 and Figure 23 a, 23b, Figure 24 a to three paper battery 2050a that connect shown in the 24c to 2050c.
Shown in figure 25; Connect three paper battery 2050a in such a way to 2050c: utilize in the face of the conductive ink 2055 in the outburst area 2059 conductive ink 2054, paper battery 2050a in the outburst area 2058 of paper battery 2050b; Paper battery 2050a and paper battery 2050b are superimposed together; And utilize in the face of the conductive ink 2055 in the outburst area 2059 conductive ink 2054, paper battery 2050b in the outburst area 2058 of paper battery 2050c, paper battery 2050b and paper battery 2050c are superimposed together.In this manner, utilize the conductive ink 2055 that constitutes negative electrode in the outburst area 2059 of the conductive ink 2054 that constitutes positive electrode in the outburst area 2058 of paper battery 2050a and paper battery 2050c, three paper battery 2050a are connected to 2050c.
Figure 26 a, 26b show the audio frequency substrate 2032 shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b and how to link to each other to 2050c with paper battery 2050a shown in Figure 25.
Shown in Figure 26 a, 26b; On the surface of the audio frequency substrate 2032 shown in Figure 21 b, Figure 22 and Figure 23 a, the 23b; Form platform (land) 2031a; As first conductive region that will link to each other, and platform 2031a is passed through wiring pattern 2037a link to each other with IC chip 2034 with the conductive ink 2054 in the outburst area 2058 of paper battery 2050a.In addition; On the back side of audio frequency substrate 2032; Form platform (land) 2031b; As second conductive region that will link to each other, and platform 2031b is passed through wiring pattern 2037b link to each other, this through hole 2036 is linked to each other with IC chip 2034 with through hole 2036 with the conductive ink 2055 in the outburst area 2059 of paper battery 2050c.
In this manner, supply power to audio frequency substrate 2032 to the power unit of 2050c from three paper battery 2050a that comprise series connection.
(the tenth embodiment)
Figure 27 a is the plane according to the POP indicator 2101 of tenth embodiment of the invention, and Figure 27 b shows the internal structure of the POP indicator 2101 shown in Figure 27 a.
Shown in Figure 27 a, 27b, present embodiment is provided with installation component 2005 below the assembly of the POP indicator 2101 shown in Figure 21 a, the 21b, and on the top of POP indicator 2101 playback button 2003 is provided.All the other structures are same as described above with corresponding internal structure.
When as above constructing; Utilize installation component 2005 that the POP indicator 2101 of present embodiment is installed to use; So that the assembly of POP indicator 2101 is placed on the surface of show window, and utilize installation component 2005 relative from the POP indicator 2001 show window suspension, shown in Figure 21 a, 21b to using.
In the above-mentioned the 9th and the tenth embodiment; Give prominence to respect to other zone of surface patch 2010a, back sheet 2010b, support chip 2020a, 2020b and audio information recording/reproducing part 2030 in the zone that is provided with the switch 2033 of audio frequency substrate 2032; But the present invention is not limited thereto, and the part in surface patch 2010a, back sheet 2010b, support chip 2020a, 2020b and the audio information recording/reproducing part 2030 needn't be outstanding with respect to other zone.
In addition; The the above-mentioned the 9th and the tenth embodiment has explained the POP indicator; Wherein as an example; Advertising message as POP is printed on the information display area territory 2002 that is arranged on the surface patch 2010a, is printed on the indicator that on the surface patch and does not use POP but the present invention can also be applied to advertising message.
The present invention shown in the above-mentioned the 9th and the tenth embodiment is a kind of POP indicator; Be equipped with write on it as at least one surface patch of the advertising message of POP be used for surface patch is installed to the installation component on the object; Said POP indicator comprises and is adhered to the audio information recording/transcriber surface patch back side, can the recoding/reproduction audio-frequency information; Said POP indicator in audio information recording/transcriber, and can reproduce this audio-frequency information through operating means with audio information recording, therefore; If with advertising message as audio information recording in audio information recording/transcriber; Can visually recognize advertising message and the advertising message as audio-frequency information is set, can attract consumer's notice thus, and can comprise mass advertising information.In addition, this operating means with pasted surface patch in the zone of this operating means and be beneficial to the operation of operating means with respect to other regional projection.
In addition, the surface patch of being processed by the synthetic paper that is suitable for printing not only allows advertising message is printed on the surface patch as POP, has also improved the durability of surface patch.
In addition; Power unit to audio information recording/transcriber power supply comprises a plurality of series connection paper batteries that are made up of positive electrode that exposes from different surfaces and negative electrode; The audio frequency substrate of audio information recording/transcriber being installed on it and having been linked to each other with power unit comprises: with one of two electrodes of power unit first conductive region that links to each other and second conductive region that links to each other with another electrode of the power unit that is formed on different surfaces; Therefore; Only need to locate a plurality of paper batteries are linked to each other with the audio frequency substrate, can reduce manufacturing cost at 2.
(the 11 embodiment)
Figure 28 shows the acoustic information delivery device according to eleventh embodiment of the invention.In addition, Figure 29 is the enlarged drawing of the encapsulation of acoustic information delivery device 3001 shown in Figure 28.In addition, Figure 30 shows acoustic information delivery system 3001 shown in Figure 28 and is broken down into encapsulation, data recording/reproducing device carrier and sends cutting.In addition, Figure 31 is the sectional view of sending cutting of acoustic information delivery device 3001 shown in Figure 28.
The acoustic information delivery device 3001 of present embodiment is envelope shape encapsulation 3002, slim data recording/reproducing device carrier 30 as one kind 03 and the combination of sending cutting 3004.Shown in figure 29; To encapsulate 3002 and be shaped to envelope shape; Comprise the egative film 3006 that is placed on the bottom, anter 3005 positioned opposite to each other and back sheet 3007, the overlapping width 3009 that on the both sides of the anter 3005 that pastes back sheet 3007, links to each other with lateral plate 3008; Wherein form opening 3010, be used to insert object at the top.In addition, through top flat 3011 with the outside overlapping of the back cover plate that links to each other of sheet 3,007 3012 and anter 3005 and paste on it.
In addition, transplant a cutting 3004 when inserting cap seals and adorning 3002, expose sending and transplant a cutting the delivery information of 3004 precalculated position explanation when sending.In order to expose the delivery information of sending cutting 3004 that inserts in this manner and visually to check delivery information as required; Be provided with window as shown in the figure; Delivery information display part that sending cutting 3,004 3013 on anter 3005 is punctual with 3012 pairs of the cover plates that covers this anter 3005, and its size allows the whole delivery information of exposure display part 3013.
Data recording/reproducing device carrier 30 as one kind 03 is secured on the outer surface of anter 3005 of this encapsulation 3002.This data recording/reproducing device carrier 30 as one kind 03 comprises the for example paper material 3016 and built-in slim audio information recording/transcriber 3017 of ground paper, and said paper material 3016 has the opening 3015 that is arranged on window 3014 opposite position places.This audio information recording/transcriber 3017 comprises for example thin battery part 3018, acoustic information I/O part 3019, switch sections 3020 and the recoding/reproduction control section 3021 of paper battery.Recoding/reproduction control section 3021 is made up of the IC chip; When the scheduled operation that the power that provides from battery part 3018 when utilization is used to write down in switch sections 3020 execution was provided with, recoding/reproduction control section 3021 records were from the acoustic information of acoustic information I/O part 3019 inputs.In the memory that is included in the IC chip, carry out this record.When the scheduled operation that the power that provides from battery part 3018 when utilization is used to write down in switch sections 3020 execution was provided with, recoding/reproduction control section 3021 operation acoustic information I/O parts 3019 were to export the acoustic information that is write down.
The dual-purpose slim microphone/speaker that preferably will be made up of piezoelectric element etc. in the present embodiment, is as acoustic information I/O part 3019.In addition,, preferably use slim switch, for example the touch-sensor type switch of pressure-responsive type switch or detection electric capacity for switch sections 3020.In addition, as battery part 3018, preferably use the for example low profile flexible battery of lithium integrated battery.Here, can also be consistently from 3018 power supplies of battery part, and need not to depend on the operation of switch sections 3020.
In this manner; Audio information recording/transcriber 3017 has simple and thin structure; Therefore in the time of in covering 3016 layers of paper material, audio information recording/transcriber 3017 is within the thickness range of paper material 3016, or outstanding slightly; Because it is not noticeable wherein to be provided with the audio information recording/transcriber carrier 30 as one kind 03 of said audio information recording/transcriber 3017, acoustic information delivery device 3001 self attenuation.
In addition; In the present embodiment; On lid 3012, print and show the position of the switch sections 3020 of acoustic information I/O part 3019 and acoustic information data recording/reproducing device 3017, wherein various piece reaches extreme outer surfaces, so that recording operation and reproduction operation.
Transplant a cutting 3004 when being placed on the inside of encapsulation 3002 when sending; Transplant a cutting 3004 position exposing through the opening 3015 that encapsulates 3002 window 3014 and data recording/reproducing device carrier 30 as one kind 03 to send; Send to transplant a cutting and 3004 be equipped with delivery information display part 3013, the for example delivery information of sender address and name and recipient address and name has been described.In addition,, be provided with announcement information display part 3022, be used to utilize the recipient's announcement information to acoustic information delivery device 3001 such as character, pattern removing the desired location place of delivery information display part 3013 with exterior domain.
Shown in figure 31, send at this and to transplant a cutting in 3004, will constitute except that the sheet 3024 of delivery information display part 3013 according to inseparable mode and paste on the support 3023, and in this sheet 3024, announcement information display part 3022 will be set with exterior domain.In addition; Through groove on every side; The sheet 3025 in the zone that constitutes delivery information display part 3013 is right after with sheet 3024 with flushing is placed on sheet 3024 next doors, with inseparable mode this sheet 3025 is pasted support 3023, and construct the delivery information display part 3013 of having printed sender address and name and recipient address and name etc. on it at the top of sheet 3025; In this manner, delivery information display part 3013 can be from support 3023 dismountings.
In order to make delivery information display part 3013 detachable; Can 3028 engage last slice through adhesive 3029 with support 3023; Said last slice 3028 the back side is equipped with printing (printing) 3027; Be used to regulate the regional corresponding engaging force with this delivery information display part 3013, this makes and is difficult to two and be provided with groove 3026 thus separated from one another.Yet the present invention is not limited to present embodiment.
Delivery information display part 3013 has is enough to the size that is removed from the opening 3015 that encapsulates 3002 window 3014 and data recording/reproducing device carrier 30 as one kind 03.In addition; As shown in the figure; This delivery information display part 3013 comprises a plurality of cutting 3030; Each is transplanted a cutting and to transplant a cutting or receipt as being arranged on sending on the similar face, has write on it with each and has transplanted a cutting 3030 the corresponding delivery information of function, and constructed said delivery information display part 3013 according to taking out each mode of 3030 of transplanting a cutting seriatim.
Because acoustic information delivery device 3001 is equipped with the delivery information display part 3013 that can take out as required, can utilize existing delivery system that it is sent.In the present embodiment, delivery information display part 3013 comprises a plurality of cutting 3030, but this delivery information display part 3013 can also comprise piece of paper.
In addition; Encapsulation 3002 not only can be held to send and transplants a cutting 3004 so that utilize existing delivery system to send this acoustic information delivery device 3001; Can also (that is, at the back side of sending cutting 3004) hold thin articles and send cutting 3004 in the position that does not prevent to expose delivery information display part 3013.The example of this thin articles is the message card 3031 that appends on the photo as shown in the figure, but thin articles is not limited to this message card.
In addition, the encapsulation 3002 of present embodiment has the structure that cover plate 3012 has covered the whole surface of anter 3005, but can also adopt salable mail card matrix, and it comes sealed open 3010 through the upside that cover plate 3012 only covers anter 3005.In addition; Paste cover plate 3012,, or cover plate 3012 is processed salable mail card matrix so that cover the whole surface of anter 3005; To cover the upside of anter 3005; But can also make this cover plate 3012 cover anters closing opening, thereby can open it or close, and need not to join cover plate 3012 to anter 3005.
In addition; Data recording/reproducing device carrier 30 as one kind 03 is pasted the front portion of the anter 3005 of encapsulation 3002; But when the part of audio information recording/transcriber 3017 is given prominence at the back side of data recording/reproducing device carrier 30 as one kind 03; Can also form opening, to avoid the outstanding of audio information recording/transcriber 3017 on the anter 3005.In addition, can also construct data recording/reproducing device carrier 30 as one kind 03, so as with its paste the inner surface of anter 3005 or be received into the encapsulation 3002 in.
In addition, if the recipient of acoustic information delivery device 3001 is hanging to this acoustic information delivery device 3001 on the wall etc., this also is beneficial to and reproduces operation, therefore, can also on the sheet of back, hook etc. be set, and is installed on the wall being convenient to.
In addition, the upside of envelope assembly 3002 is appointed as the opening that is used to insert, but can also short cross side be appointed as the opening that is used to insert.In addition; The part that the present invention is not limited to send cutting is used as this structure of sending the display part and separating existence; Also might a plurality of cutting be grouped together with separable mode and adopt the manifolding type, make that writing on the delivery information of transplanting a cutting on top is made carbon copies in the cutting of bottom simultaneously.Under this situation, the delivery information display part on each is transplanted a cutting should be corresponding to position of window, just as the situation in the present embodiment.
According to the above-mentioned shown invention of the 11 embodiment; The cutting of sending that has comprised delivery information is inserted in the encapsulation; Make and to check delivery information from the outside with visual mode; And described encapsulation has the data recording/reproducing device carrier, thus might be in data recording/reproducing device recorded voice, be easy to send message to this sound as present.
In addition; The delivery information display part of sending cutting can be removed through the window of encapsulation and the opening of data recording/reproducing device carrier; This makes that sending object more is appropriate to common delivery system, that is, send based on the information that writes on the delivery information display part.
(the 12 embodiment)
Figure 32 a is the plane according to the audio message transfer sheet of twelveth embodiment of the invention; Figure 32 b shows the internal structure of the audio message transfer sheet 4001 shown in Figure 32 a; Figure 32 c is the sectional view along the line A-A ' shown in Figure 32 a, and Figure 32 d is the sectional view along the line B-B ' shown in Figure 32 a.In addition, Figure 33 shows the laminar structure of Figure 32 a to the audio message transfer sheet shown in the 32d 4001.
Like Figure 32 a to 32d and shown in Figure 33; Present embodiment comprises: be sandwiched in sheet audio information recording/reproducing part 4030 between two support chip 4020a, the 4020b, can the recoding/reproduction audio-frequency information; Said support chip 4020a, 4020b are processed by the flexible thin sill of for example paper base material; The support chip 4020a, the 4020b that have wherein pressed from both sides audio information recording/reproducing part 4030 further are sandwiched between two surface patch 4010a, the 4010b; Said surface patch 4010a, 4010b are processed by the flexible thin sill of for example paper base material, have and support chip 4020a, exterior contour that 4020b is identical; And be inserted in the part of audio information recording/reproducing part 4030 and the conductive member 4059 between the support chip 4020a removably.The bonding work at the preceding and back side through being applied to support chip 4020a, 4020b is engaged with each other surface patch 4010a, 4010b, support chip 4020a, 4020b and audio information recording/reproducing part 4030 together.In addition, through bonding work with a surface engagement of conductive member 4050 to support chip 4020a.For example, the preceding and back side through double-sided belt being pasted support chip 4020a, 4020b or apply heat-fusible adhesive to it and can realize this bonding work.
In addition, audio information recording/reproducing part 4030 is equipped with: the sheet audio-frequency information I/O part 4040 by piezoelectric element (not shown) or vibrating membrane (not shown) constitute is used for the I/O audio-frequency information; The audio frequency substrate 4032 of the second switch of slim IC chip 4034, component (for example capacitor and resistor) and the first switch 4033a and 4033b has been installed; Said slim IC chip 4034 has the memory area as storage area, is used to write down the audio-frequency information through 4040 inputs of audio-frequency information I/O part; And the flexible paper battery 4031 that links to each other with audio frequency substrate 4032; Be used for to 4032 power supplies of audio frequency substrate; Audio frequency substrate 4032 also has been equipped with splicing ear 4035, is used for importing audio-frequency informations from the outside to IC chip 4034, and the audio-frequency information that maybe will be recorded in the IC chip 4034 outputs to the outside.In this manner, audio information recording/reproducing part 4030 has laminated structure.Here; Audio frequency substrate 4032 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc.; Wherein utilize anisotropy/electroconductive binder (ACP, anisotripic/conductive adhesive), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 4034.In addition, the record of the audio-frequency information through audio-frequency information I/O part 4040 input and the output that is recorded in memory area sound intermediate frequency information through 4040 controls of audio-frequency information I/O part in the IC chip 4034 control storage zones.In addition; First switch 4033a operation is used for being recorded in through 4040 outputs of audio-frequency information I/O part the audio-frequency information of the memory area of IC chip 4034, and second switch 4033b operation is used for passing through at the memory area record of IC chip 4034 audio-frequency information of audio-frequency information I/O part 4040 inputs.
In addition; When being superimposed upon 4030 last times of audio information recording/reproducing part; Support chip 4020a is equipped with porose 4021a, 4022,4023,4024a respectively in the face of the zone of paper battery 4031, switch 4033a, 4033b, IC chip 4034 and audio-frequency information I/O part 4040; And when being superimposed upon 4030 last times of audio information recording/reproducing part, support chip 4020b forms hole 4021b, 4024b respectively in the zone in the face of paper battery 4031 and audio-frequency information I/O part 4040.
In this manner; Through in the zone of the support chip 4020a that faces paper battery 4031, switch 4033a, 4033b, IC chip 4034 and audio-frequency information I/O part 4040, having formed hole 4021a, 4022,4023,4024a and in the zone of the support chip 4020b that faces paper battery 4031 and audio-frequency information I/O part 4040, having formed hole 4021b, 4024b; Can reduce to install the difference of thickness between zone and other zone of paper battery 4031, switch 4033a, 4033b, IC chip 4034 and audio-frequency information I/O part 4040, improve the flatness of surface patch 4010a, 4010b thus and be beneficial at surface patch 4010a, the last printing information of 4010b.
Figure 34 a shows Figure 32 a to Figure 32 d and the support chip 4020a shown in Figure 33 and the laminar structure of audio information recording/reproducing part 4030, and Figure 34 b shows Figure 32 a to Figure 32 d and the support chip 4020b shown in Figure 33 and the laminar structure of audio information recording/reproducing part 4030.
Shown in Figure 34 a; Be formed in the face of the hole 4021a in the zone of the support chip 4020a of paper battery 4031 less than paper battery 4031; The hole 4022 that is formed in the zone of facing switch 4033a, 4033b has comprised switch 4033a, 4033b; Be formed in the face of the hole 4023 in the zone of IC chip 4034 greater than IC chip 4034, and be formed in the face of the hole 4024a in the zone of audio-frequency information I/O part 4040 greater than audio-frequency information I/O part 4040.
In addition; Shown in Figure 34 b; Be formed in the face of the hole 4021b in the zone of the support chip 4020b of paper battery 4031 less than paper battery 4031, and be formed in the face of the hole 4024b in the zone of audio-frequency information I/O part 4040 less than audio-frequency information I/O part 4040.
In this manner; The bonding work at the preceding and back side through being applied to support chip 4020a, 4020b; Lamination and fixed-audio information recording/regenerating part 4030 in such a way: in the past and the back side, only its part is sandwiched between two support chip 4020a, the 4020b.
In addition; In two surface patch 4010a, 4010b, the surface patch 4010a that faces switch 4033a, 4033b and IC chip 4034 through the hole 4022,4023 of support chip 4020a is equipped with information display area territory 4002, wherein; When this audio message transfer sheet 4001 of mailing; Printed address information etc., the zone of facing the support chip 4020a of switch 4033a through hole 4022 is equipped with printing playback button 4003a, is used for console switch 4033a; The zone of facing the support chip 4020a of switch 4033b through hole 4022 is equipped with print record button 4003b; Be used for console switch 4033b, and in, formed the audio frequency output area 4004 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information output 4040 through the zone of 4024a in the face of the support chip 4020a of audio-frequency information output 4040.Even when the preceding and back side of audio-frequency information output 4040 has covered surface patch 4010a, 4010b, become audio frequency output area 4004 also can compensate by the minute aperture matrix-like and reduce from the volume of audio-frequency information I/O part 4040 outputs.In audio frequency output area 4004,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.Therefore, with the punching that utilizes pin etc. or bore a hole differently, can not form burr and have burr to block these holes never.In addition; In Figure 32 a; Although information display area territory 4002 is not set at audio frequency output area 4004; The information that will comprise playback button 4003a and record button 4003b in the reality is printed on the whole surface of surface patch 4010a, therefore, also in audio frequency output area 4004, is provided with information display area territory 4002.In addition, replace playback button 4003a and record button 4003b being set among the surface patch 4010a, can also after information is printed to surface patch 4010a, strip of paper used for sealing be pasted the zone in the face of switch 4033a, 4033b through being printed on.
Below the operation of operating above-mentioned audio message transfer sheet 4001 at audio information recording/reproduction period will be described.
Figure 35 a shows the detailed structure of the audio frequency substrate 4032 shown in Figure 32 b; Figure 35 b is along the sectional view of the line A-A ' of the switch 4033a shown in Figure 35 a when inoperation; Figure 35 c is the sectional view along the line A-A ' of the switch 4033a shown in Figure 35 a when when operation; Figure 35 d shows the structure of the conductive member 4050 shown in Figure 32 d, and Figure 35 e is the sectional view along the line B-B ' shown in Figure 35 a.
Shown in Figure 35 a; On audio frequency substrate 4032, form the wiring pattern 4037a that links to each other with the positive electrode of paper battery 4031; So that extend to the bottom of switch 4033a, 4033b; On audio frequency substrate 4032; Be used for exporting the wiring pattern 4037b that the port terminal of first command signal of the audio-frequency information of the memory area that is recorded in IC chip 4034 links to each other to its input in the port terminal of formation and IC chip 4034, so that extend to the bottom of switch 4033a, and can contact layout pattern 4037a.In addition; On audio frequency substrate 4032; The wiring pattern 4037c that the port terminal of second command signal of the audio-frequency information that is used for importing through audio-frequency information I/O part 4040 at the memory area record of IC chip 4034 to its input in the port terminal of formation and IC chip 4034 links to each other; So that extend to the bottom that is clipped in the conductive member 4050 between audio frequency substrate 4032 and the support chip 4020a; And on audio frequency substrate 4032, form the wiring pattern 4037d that extends to the bottom of conductive member 4050 from the bottom of switch 4033b, so that not contact layout pattern 4037a, 4037c.When the port terminal that links to each other with wiring pattern 4037b becomes the electrical source voltage as the electromotive force of first command signal; The audio-frequency information that IC chip 4034 is exported in the memory area that is recorded in IC chip 4034; When the port terminal that links to each other with wiring pattern 4037c becomes the electrical source voltage as the electromotive force of second command signal; As long as the port terminal that links to each other with wiring pattern 4037c is in electrical source voltage, IC chip 4034 writes down the audio-frequency information through 4040 inputs of audio-frequency information I/O part in the memory area of IC chip 4034.
In the audio message transfer sheet 4001 of as above structure, when not through playback button 4003a push switch 4033a, shown in Figure 35 b, there not be electrical connection to be formed on wiring pattern 4037a and the wiring pattern 4037b on the audio frequency substrate 4032.Therefore; One of port terminal of the IC chip 4034 that links to each other with wiring pattern 4037b (promptly; Imported the port terminal of first command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 4034 to it) keep open circuit, and do not export the audio-frequency information in the memory area that is recorded in IC chip 4034.
On the other hand, when when the playback button 4003a push switch 4033a, shown in Figure 35 c, the conductive agent 4036 at the back side through being applied to switch 4033a is electrically connected and is formed on wiring pattern 4037a and the wiring pattern 4037b on the audio frequency substrate 4032.Because wiring pattern 4037a links to each other with the positive electrode of paper battery 4031; The port terminal that links to each other with wiring pattern 4037b (promptly; Imported the port terminal of first command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 4034 to it) become electrical source voltage; And first command signal is input to IC chip 4034, is recorded in the audio-frequency information in the memory area of IC chip 4034 through audio-frequency information I/O part 4040 output.Therefore, cause being recorded in the audio-frequency information in the memory area of IC chip 4034 through playback button 4003a push switch 4033a through audio-frequency information I/O part 4040 output.
In addition; In the operating period of the switch 4033b that passes through record button 4003b and the operating period of passing through the switch 4033a of playback button 4003a; When not through record button 4003b push switch 4033b; Do not have to be electrically connected and be formed on wiring pattern 4037a and the wiring pattern 4037b on the audio frequency substrate 4032; When the record button 4003b push switch 4033b, the conductive agent (not shown) at the back side through being applied to switch 4033b is electrically connected wiring pattern 4037a and wiring pattern 4037b.
Here; In the present embodiment; Wiring pattern 4037d with to its port terminal of importing second command signal of IC chip 4034 does not directly link to each other, and also controls the record of audio-frequency information in IC chip 4034 through 4040 inputs of audio-frequency information I/O part through conductive member 4050.
Shown in Figure 35 d; Be clipped in the conductive region 4052 that conductive member 4050 between audio frequency substrate 4032 and the support chip 4020a comprises that the part at the back side through conductive agent being applied to diaphragm 4051 forms; And conductive member is sandwiched between audio frequency substrate 4032 and the support chip 4020a, so that the surface that forms conductive region 4052 on it is to audio frequency substrate 4032.
Shown in Figure 35 e; When conductive member 4050 was sandwiched between audio frequency substrate 4032 and the support chip 4020a, the conductive region 4052 at the back side through being arranged on conductive member 4050 was electrically connected and is formed on wiring pattern 4037c and the wiring pattern 4037d on the audio frequency substrate 4032.Under this condition; If through record button 4003b push switch 4033b, conductive agent, the wiring pattern 4037d at the back side through being applied to switch 4033b and the conductive region that is arranged on the back side of conductive member 4050 are electrically connected and are formed on wiring pattern 4037a and the wiring pattern 4037c on the audio frequency substrate 4032.Because wiring pattern 4037a links to each other with the positive electrode of paper battery 4031; The port terminal that links to each other with wiring pattern 4037c (promptly; Imported the port terminal of second command signal of the audio-frequency information that is used for importing through audio-frequency information I/O part 4040 to it at the memory area of IC chip 4034 record) become electrical source voltage; This means second command signal is input to IC chip 4034; If under this condition through audio-frequency information I/O part 4040 input audio-frequency informations, then with the audio information recording of input in the memory area of IC chip 4034.In this manner; Utilization is clipped in the conductive member 4050 between audio frequency substrate 4032 and the support chip 4020a; When through record button 4003b push switch 4033b and simultaneously through audio-frequency information I/O part 4040 input audio-frequency informations, the audio information recording that will import through audio-frequency information I/O part 4040 is in IC chip 4034.Here; When conductive member 4050 being clipped between audio frequency substrate 4032 and the support chip 4020a; Through with bonding job applications in support chip 4020a with a surface engagement of conductive member 4050 to support chip 4020a; Fixed a surface of conductive member 4050, this has prevented conductive member 4050 displacements.
On the other hand; When between audio frequency substrate 4032 and support chip 4020a, removing conductive member 4050; Wiring pattern 4037c and wiring pattern 4037d opens, therefore, even pass through record button 4003b push switch 4033b to be electrically connected between wiring pattern 4037c and the wiring pattern 4037d; Can not become electrical source voltage to its port terminal of having imported second command signal of IC chip 4034 yet; Therefore, even through audio-frequency information I/O part 4040 input audio-frequency informations, never with the memory area of the audio information recording of importing at IC chip 4034.
In this manner; Present embodiment inserts conductive member 4050 between audio frequency substrate 4032 and the support chip 4020a removably; And second command signal is input to IC chip 4034 through conductive member 4050; So that have only when passing through record button 4003b push switch 4033b under this condition; Audio information recording that just will be through audio-frequency information I/O part 4040 input is in the memory area of IC chip 4034; Therefore, if after audio information recording is in the memory area of IC chip 4034, removed this conductive member 4050, even utilize subsequently when coming through audio-frequency information I/O part 4040 input audio-frequency informations through record button 4003b push switch 4033b; Can be in the memory area of IC chip 4034 with audio information recording yet, prevent thus to wipe the audio-frequency information that has write down by the maloperation of the switch 4033b through record button 4003b.
In the present embodiment; Audio information recording/reproducing part 4030 and conductive member 4050 are clipped between two support chip 4020a, the 4020b; And these support chips 4020a, 4020b further be clipped between two surface patch 4010a, the 4010b; But can also adopt following structure: only audio information recording/reproducing part 4030 and conductive member 4050 are clipped between surface patch 4010a, the 4010b, and need not support chip 4020a, 4020b.
The described the present invention of above-mentioned the 12 embodiment allows to come record audio information in the IC chip through being clipped in two conductive members between the surface patch; And through forbidding IC sound intermediate frequency recording of information from two these conductive members of surface patch removal; Therefore, even when forbidding in the IC chip record audio information, the surface patch that becomes the outward appearance of audio message transfer sheet keeps original appearance; Prevented that outward appearance from losing its reliss; Utilize the existence of conductive member/do not exist, can determine whether to forbid record audio information in the IC chip, whether this inspection that can be forbids record.
In addition; Conductive member is being fixed under two situation between the surface patch removably, when conductive member is sandwiched between two surface patch, is fixing conductive member; Thereby can prevent that conductive member is shifted between two surface patch; Or prevent IC chip and second switch opens, and cause the operation second switch between two surface patch even simultaneously conductive member is clipped in, can not record audio information.
(the 13 embodiment)
Figure 36 a is the plane according to the dual-purpose postcard of thriteenth embodiment of the invention; It has constituted the audio-frequency information delivery components; Figure 36 b shows the internal structure of the dual-purpose postcard 5001 shown in Figure 36 a; Figure 36 c is the rearview of the dual-purpose postcard 5001 shown in Figure 36 a, and Figure 36 d is the sectional view along the line A-A ' shown in Figure 36 a.Figure 37 shows the laminar structure of Figure 36 a to the dual-purpose postcard 5001 shown in the 36d.
Like Figure 36 a to 36d and shown in Figure 37; Present embodiment is a kind of dual-purpose postcard 5001; Comprise the transmission message card 5002 that constitute to send message part with 5004 that connect together through the coupling part, constitute the response message part should message card 5003; Said dual-purpose postcard 5001 comprises: be sandwiched in sheet audio information recording/reproducing part 5030 between two support chip 5020a, the 5020b, can the recoding/reproduction audio-frequency information; Said support chip 5020a, 5020b are processed by the flexible thin sill of for example paper base material; The support chip 5020a, the 5020b that have wherein pressed from both sides audio information recording/reproducing part 5030 further are sandwiched between two surface patch 5010a, the 5010b, and said surface patch 5010a, 5010b are processed by the flexible thin sill of for example paper base material.The bonding work at the preceding and back side through being applied to support chip 5020a, 5020b is engaged with each other surface patch 5010a, 5010b, support chip 5020a, 5020b and audio information recording/reproducing part 5030 together.For example, the preceding and back side through double-sided belt being pasted support chip 5020a, 5020b or apply heat-fusible adhesive to it and can realize this bonding work.
In addition, audio information recording/reproducing part 5030 comprises: the sheet audio-frequency information I/O part 5040 by piezoelectric element (not shown) or vibrating membrane (not shown) constitute is used for the I/O audio-frequency information; Slim IC chip 5034, component (for example capacitor and resistor) and first switch 5033a that is electrically connected with IC chip 5034 and the audio frequency substrate 5032 of second switch 5033b have been installed; Said slim IC chip 5034 comprises the memory area as storage area, has wherein write down the audio-frequency information through 5040 inputs of audio-frequency information I/O part; The flexible paper battery 5031 that links to each other with audio frequency substrate 5032 is used for to 5032 power supplies of audio frequency substrate; And connect substrate 5050, formed the wiring pattern 5037e that is used to be electrically connected switch 5033b and IC chip 5034 on it.In this manner, audio information recording/reproducing part 5030 has laminated structure.In addition, audio frequency substrate 5032 also has been equipped with: splicing ear 5035, be used for importing audio-frequency informations from the outside to IC chip 5034, and the audio-frequency information that maybe will be recorded in the IC chip 5034 outputs to the outside; Wiring pattern 5037a is used for the positive electrode of paper battery 5031 is linked to each other with switch 5033a, 5033b; Wiring pattern 5037b is used for port terminal with IC chip 5034 is used for exporting the port terminal of first command signal from the audio-frequency information of the memory area that is recorded in IC chip 5034 to its input and links to each other with switch 5033a; Wiring pattern 5037c is used for the port terminal of IC chip 5034 is used in the memory area record of IC chip 5034 port terminal through second command signal of the audio-frequency information of audio-frequency information I/O part 5040 inputs with to be formed on the wiring pattern 5037e that is connected on the substrate 5050 continuous to its input; And wiring pattern 5037d, be used for wiring pattern 5037e is linked to each other with switch 5033b.Here,, wiring pattern 5037a is not electrically connected with wiring pattern 5037b, and, wiring pattern 5037a is not electrically connected with wiring pattern 5037d in the bottom of switch 5033b in the bottom of switch 5033a.In addition; Audio frequency substrate 5032 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 5034.In addition; The record of audio-frequency information and the output that is recorded in memory area sound intermediate frequency information through 5040 controls of audio-frequency information I/O part through audio-frequency information I/O part 5040 input in the IC chip 5034 control storage zones; When the port terminal that links to each other with wiring pattern 5037b becomes the electrical source voltage as the electromotive force of first command signal; The audio-frequency information that IC chip 5034 is exported in the memory area that is recorded in IC chip 5034 through audio-frequency information I/O part 5040; And as long as the port terminal that links to each other with wiring pattern 5037c is in the electrical source voltage as the electromotive force of second command signal, IC chip 5034 writes down the audio-frequency information through 5040 inputs of audio-frequency information I/O part in the memory area of IC chip 5034.In addition; First switch 5033a operation is used for being recorded in through 5040 outputs of audio-frequency information I/O part the audio-frequency information of the memory area of IC chip 5034, and second switch 5033b operation is used for passing through at the memory area record of IC chip 5034 audio-frequency information of audio-frequency information I/O part 5040 inputs.
The audio-frequency information I/O part 5040, audio frequency substrate 5032, paper battery 5031 and the connection substrate 5050 that constitute audio information recording/reproducing part 5030 are sandwiched between support chip 5020a, the 5020b, thereby audio-frequency information I/O part 5040, audio frequency substrate 5032, paper battery 5031 and a part that is connected substrate 5050 are placed on response message card 5003 sides.Promptly; These parts are sandwiched between support chip 5020a, the 5020b, thus be formed on wiring pattern 5037e on the connection substrate 5050 of audio information recording/reproducing part 5030 through coupling part 5004 across transmission message card 5002 and response message card 5003.
In addition; Shown in figure 37; In the time of on being superimposed upon surface patch 5010a; Through support chip 5020a being divided into two parts,, in zone, hole 5021a, 5022,5023,5024a have been formed respectively in the face of paper battery 5031, switch 5033a, 5033b, IC chip 5034 and audio-frequency information I/O part 5040 when being superimposed upon 5030 last times of audio information recording/reproducing part in the face of the zone of coupling part 5004; And when being superimposed upon surface patch 5010b and going up; Through support chip 5020b being divided into two parts,, in zone, form hole 5021b, 5024b respectively in the face of paper battery 5031 and audio-frequency information I/O part 5040 when being superimposed upon 5030 last times of audio information recording/reproducing part in the face of the zone of coupling part 5004.
In this manner; Through in the zone of the support chip 5020a that faces paper battery 5031, switch 5033a, 5033b, IC chip 5034 and audio-frequency information I/O part 5040, having formed hole 5021a, 5022,5023,5024a and in the zone of the support chip 5020b that faces paper battery 5031 and audio-frequency information I/O part 5040, having formed hole 5021b, 5024b; Can reduce to install the difference of thickness between zone and other zone of paper battery 5031, switch 5033a, 5033b, IC chip 5034 and audio-frequency information I/O part 5040, improve the flatness of surface patch 5010a, 5010b thus and be beneficial at surface patch 5010a, the last printing information of 5010b.
Figure 38 a shows Figure 36 a to Figure 36 d and the support chip 5020a shown in Figure 37 and the laminar structure of audio information recording/reproducing part 5030, and Figure 38 b shows Figure 36 a to Figure 36 d and the support chip 5020b shown in Figure 37 and the laminar structure of audio information recording/reproducing part 5030.
Shown in Figure 36 a; Be formed in the face of the hole 5021a in the zone of the support chip 5020a of paper battery 5031 less than paper battery 5031; The hole 5022 that is formed in the zone of facing switch 5033a, 5033b has comprised switch 5033a, 5033b; Be formed in the face of the hole 5023 in the zone of IC chip 5034 greater than IC chip 5034, and be formed in the face of the hole 5024a in the zone of audio-frequency information I/O part 5040 greater than audio-frequency information I/O part 5040.
In addition; Shown in Figure 36 b; Be formed in the face of the hole 5021b in the zone of the support chip 5020b of paper battery 5031 less than paper battery 5031, and be formed in the face of the hole 5024b in the zone of audio-frequency information I/O part 5040 less than audio-frequency information I/O part 5040.
In this manner; The bonding work at the preceding and back side through being applied to support chip 5020a, 5020b; Lamination and fixed-audio information recording/regenerating part 5030 in such a way: in the past and the back side, only its part is sandwiched between two support chip 5020a, the 5020b.
In addition; Shown in Figure 36 a; In two surface patch 5010a, 5010b; The surface patch 5010a that faces switch 5033a, 5033b and IC chip 5034 through the hole 5022,5023 of support chip 5020a is equipped with address information input area 5015; Be used at the recipient's who becomes this dual-purpose postcard 5001 of zone input that sends message card 5002 through coupling part 5004 address and name etc., the zone that the coupling part 5004 of facing switch 5033a through the hole 5022 of support chip 5020a becomes response message card 5003 has printed article, has indicated the playback button 5011a that is used for console switch 5033a; The zone of facing the support chip 5020a of switch 5033b through hole 5022 has printed article, has indicated the record button 5011b that is used for console switch 5033b.And in through the zone of hole 5024a, formed by being used for that the audio frequency from audio-frequency information output 5040 is outputed to the audio frequency output area 5014 that outside minute aperture array constitutes in the face of the support chip 5020a of audio-frequency information output 5040.Even when the preceding and back side of audio-frequency information output 5040 has covered surface patch 5010a, 5010b, become audio frequency output area 5014 also can compensate by the minute aperture matrix-like and reduce from the volume of audio-frequency information I/O part 5040 outputs.In audio frequency output area 5014,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.Therefore, with the punching that utilizes pin etc. or bore a hole differently, can not form burr and have burr to block these holes never.In addition; The zone that becomes the surface patch 5010a of response message card 5003 through coupling part 5004 is equipped with information input domain 5013, and the recipient's input that is used for dual-purpose postcard 5001 will utilize this response message card 5003 to send to the information of the transmit leg of dual-purpose postcard 5001.In Figure 36 a, although, will comprise in the reality that the information of playback button 11a and record button 11b is printed on the whole surface of surface patch 5010a not at audio frequency output area 5014 printing informations, therefore, can also be in audio frequency output area 5014 printing information.In addition, replace playback button 5011a and record button 5011b being set among the surface patch 5010a, can also after information is printed onto surface patch 5010a, strip of paper used for sealing be pasted the zone in the face of switch 5033a, 5033b through being printed on.In addition, preferably coupling part 5004 is configured to through forming the structure that perforation is easy to dismantle.In the present embodiment, owing to divided support chip 5020a, 5020b through zone in the face of coupling part 5004, in surface patch 5010a, the last formation perforation of 5010b.
Method for using at above-mentioned dual-purpose postcard 5001 will be described below.
At first; The transmit leg of dual-purpose postcard 5001 prints playback button 5011a, 5011b and information input domain 5013 in the zone of the surface patch 5010a that becomes response message card 5003; Printing will become the guide information 5017 of the recipient's who is sent to this dual-purpose postcard 5001 information in the zone that becomes the surface patch 5010b that sends message card 5002, and in the zone that will become response message card 5003, prints the for example address of response message card 5003 and the address information 5016 of name.
In addition, utilize the switch 5033b that presses through record button 5011b, will send to the recipient's of dual-purpose postcard 5001 audio-frequency information, and it is recorded in the memory area of IC chip 5034 through 5040 inputs of audio-frequency information I/O part.
Figure 39 a is near the sectional view the switch 5033b when not through the record button 5011b push switch 5033b shown in Figure 36 a, the 26b, and Figure 39 b is near the sectional view the switch 5033b when through the record button 5011b push switch 5033b shown in Figure 36 a, the 26b.
Utilize Figure 36 a to the dual-purpose postcard 1 shown in the 36d, when not through record button 5011b push switch 5033b, shown in Figure 39 a, do not have electrical connection to be formed on wiring pattern 5037a and the wiring pattern 5037d on the audio frequency substrate 5032.Therefore; One of port terminal of the IC chip 5034 that links to each other with wiring pattern 5037d through wiring pattern 5037c, 5037e (promptly; Imported the port terminal that is used for writing down second command signal of the audio-frequency information of importing through audio-frequency information I/O part 5040 to it at the memory area of IC chip 5034) keep opening a way; Even and when under this condition, passing through audio-frequency information I/O part 5040 input audio-frequency informations, the audio-frequency information that also record is imported in the memory area of IC chip 5034.
On the other hand, when when the record button 5011b push switch 5033b, shown in Figure 39 b, the conductive agent 5038 at the back side through being applied to switch 5033b is electrically connected and is formed on wiring pattern 5037a and the wiring pattern 5037d on the audio frequency substrate 5032.Because wiring pattern 5037a links to each other with the positive electrode of paper battery 5031; The port terminal that links to each other with wiring pattern 5037d through wiring pattern 5037c, 5037e (promptly; Imported the port terminal of second command signal of the audio-frequency information that is used for importing through audio-frequency information I/O part 5040 to it at the memory area of IC chip 5034 record) become electrical source voltage; This means second command signal is input to IC chip 5034; Thus, when under this condition during through audio-frequency information I/O part 5040 input audio-frequency informations, with the audio information recording of input in the memory area of IC chip 5034.
As stated,, the different audio-frequency information sections that record is hoped can be located in, printing can also be after record audio information, carried out in the purpose of dual-purpose postcard 5001 through record audio information after the printing on dual-purpose postcard 5001.In addition, replace to import audio-frequency information from the outside through the splicing ear 5035 that is arranged on the audio frequency substrate 5032 through audio-frequency information I/O part 5040 input audio-frequency informations.In this case; Not only can be through splicing ear 5035 input audio-frequency informations; Can also import the instruction that is used to import this audio-frequency information, when input should be instructed, IC chip 5034 write down the audio-frequency information through splicing ear 5035 inputs in memory area.Can also output to the outside through the audio-frequency information that splicing ear 5035 will be recorded in the memory area of IC chip 5034.In this case; Import the instruction of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 5034 through splicing ear 5035; When input should be instructed, IC chip 5034 was stored in the audio-frequency information in the memory area through splicing ear 5035 outputs.
In this manner; When printing information; Send the dual-purpose postcard 5001 of audio-frequency information with record; When the recipient receives and when the playback button 5011a push switch 5033a, be recorded in the audio-frequency information in the memory area of IC chip 5034 through 5040 outputs of audio-frequency information I/O part.
Identical with situation through record button 5011b push switch 5033b; When not through playback button 5011a push switch 5033a; Do not have to be electrically connected and be formed on wiring pattern 5037a and the wiring pattern 5037b on the audio frequency substrate 5032; Therefore; One of port terminal of the IC chip 5034 that links to each other with wiring pattern 5037b (that is, having imported the port terminal of first command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 5034 to it) keeps open circuit, and does not export the audio-frequency information in the memory area that is recorded in IC chip 5034.
On the other hand, when when the playback button 5011a push switch 5033a, the conductive agent (not shown) at the back side through being applied to switch 5033a is electrically connected and is formed on wiring pattern 5037a and the wiring pattern 5037b on the audio frequency substrate 5032.Because wiring pattern 5037a links to each other with the positive electrode of paper battery 5031; The port terminal that links to each other with wiring pattern 5037b (promptly; Imported the port terminal of first command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 5034 to it) become electrical source voltage; And first command signal is input to IC chip 5034, is recorded in the audio-frequency information in the memory area of IC chip 5034 through audio-frequency information I/O part 5040 output.In this manner, through utilizing playback button 5011a push switch 5033a, be recorded in the audio-frequency information in the IC chip 5034 through 5040 outputs of audio-frequency information I/O part.
In addition; The information that will utilize this response message card 5003 to send to the transmit leg of dual-purpose postcard 5001 as the recipient of dual-purpose postcard 5001 is input to information input domain 5013; And 5004 will send message card 5002 and separate with response message card 5003 time along the coupling part, cut off the connection substrate 5050 of audio information recording/reproducing part 5030 thus and cut off being formed on the wiring pattern 5037e that connects on the substrate 5050.Here; Connecting substrate 5050 is processed by material for example film, that be easy to cut; And in facing the zone of coupling part 5004, form groove 5051, its shape can not slacken the condition of contact of wiring pattern 5037e, and reduces the live width of wiring pattern 5037e; In the time of will sending message card 5002 and separate through coupling part 5004 with box lunch, be easy to cut off wiring pattern 5037e with response message card 5003.In addition; In zone, form perforation rather than groove 5051 also can provide following structure: in the time will sending message card 5002 through coupling part 5004 and separate, be easy to cut off wiring pattern 5037e with response message card 5003 in the face of the coupling part 5004 that connects substrate 5050.
Figure 40 shows the internal structure of Figure 36 a to the dual-purpose postcard 5001 shown in the 36d, and said dual-purpose postcard 5004 is separated into and sends message card 5002 and response message card 5003 along the coupling part.
Shown in figure 40, in the time will sending message card 5002 through coupling part 5004 and separate, cut off and connect substrate 5050, and cut off thus and be formed on the wiring pattern 5037e that connects on the substrate 5050 with response message card 5003.Under this condition; There are not to be electrically connected wiring pattern 5037d that links to each other with switch 5033b and the wiring pattern 5037c that links to each other with port terminal (having imported the port terminal that is used for writing down second command signal of the audio-frequency information of importing through audio-frequency information I/O part 5040) at the memory area of IC chip 5034 to it; Therefore, imported to it and to be used for also can not becoming electrical source voltage in the memory area record of IC chip 5034 port terminal through second command signal of the audio-frequency information of audio-frequency information I/O part 5040 inputs even through record button 5011b push switch 5033b.Therefore, even under this condition, import audio-frequency informations, the audio-frequency information that also record is imported in the memory area of IC chip 5034 through audio-frequency information I/O part 5040.
Then; The recipient of dual-purpose postcard 5001 sends response message card 5003; But as stated, even through record button 5011b push switch 5033b, can be in IC chip 5034 yet record audio information; Therefore can prevent after sending response message card 5003, because the audio-frequency information that has write down is wiped in the maloperation of the switch 5033b through record button 5011b.
After the response message card 5003 that will send in this manner is delivered to the recipient of response message card 5003; If the recipient of response message card 5003 is through playback button 5011a push switch 5033a, the transmit leg of exporting by response message card 5003 through audio-frequency information I/O part 5040 is recorded in the audio-frequency information in the IC chip 5034.
(the 14 embodiment)
Figure 41 a is the plane according to the dual-purpose postcard of fourteenth embodiment of the invention; It has constituted the audio-frequency information delivery components; Figure 41 b is the plane of the internal structure of the dual-purpose postcard 5101 shown in Figure 41 a; Figure 41 c is the rearview of the dual-purpose postcard 5101 shown in Figure 41 a, and Figure 41 d is the rearview of the internal structure of the dual-purpose postcard 5101 shown in Figure 41 a, and Figure 41 e is the sectional view along the line A-A ' shown in Figure 41 a.In addition, Figure 42 shows the laminar structure of Figure 41 a to the dual-purpose postcard shown in the 41e.
Like Figure 41 a to shown in the 41e; The difference of present embodiment and the 13 embodiment is: sheet audio information recording/reproducing part 5130 that can the recoding/reproduction audio-frequency information is set at sends message card 5002 sides, and said transmission message card 5002 is sandwiched between two support chip 5020a, 5020b and surface patch 5010a, the 5010b.
This audio information recording/reproducing part comprises: the sheet audio-frequency information output 5140 by piezoelectric element (not shown) or vibrating membrane (not shown) constitute is used for output audio information; The audio frequency substrate 5132 of the switch 5133 of slim IC chip 5134, component (for example capacitor and resistor) being installed and being electrically connected with IC chip 5134; Said slim IC chip 5134 comprises the memory area as storage area, has wherein write down audio-frequency information; And the flexible paper battery 5131 that links to each other with audio frequency substrate 5132, be used for to 5132 power supplies of audio frequency substrate.In this manner, audio information recording/reproducing part 5130 has laminated structure.In addition, audio frequency substrate 5132 also has been equipped with: splicing ear 5135, be used for importing audio-frequency informations from the outside to IC chip 5134, and the audio-frequency information that maybe will be recorded in the IC chip 5134 outputs to the outside; Wiring pattern 5137a is used for the positive electrode of paper battery 5131 is linked to each other with switch 5133; Wiring pattern 5137b is used for port terminal with IC chip 5134 is used for exporting the port terminal of command signal from the audio-frequency information of the memory area that is recorded in IC chip 5134 to its input and links to each other with switch 5133.Here, in the bottom of switch 5133, wiring pattern 5137a is not electrically connected with wiring pattern 5137b.In addition; Audio frequency substrate 5132 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 5134.In addition; The record of audio-frequency information and the output that is recorded in memory area sound intermediate frequency information through 5140 controls of audio-frequency information output through splicing ear 5135 input in the IC chip 5134 control storage zones; When the port terminal that links to each other with wiring pattern 5137b became the electrical source voltage as the electromotive force of command signal, 5134 outputs of IC chip were recorded in the audio-frequency information in the memory area of IC chip 5134.In addition, switch 5033 operations are used for being recorded in through 5140 outputs of audio-frequency information output the audio-frequency information of the memory area of IC chip 5134.
In addition; Shown in figure 42; Identical with the situation of the 13 embodiment; When being superimposed upon surface patch 5010a and going up, divide support chip 5020a through zone, and will send on message card 5002 sides zone and other regional division between audio information recording/reproducing part 5130 is sandwiched in the face of coupling part 5004.In addition, in this zone,, in zone, form hole 5121b, 5124b respectively in the face of paper battery 5131 and audio-frequency information output 5140 when being superimposed upon 5130 last times of audio information recording/reproducing part.In response message card 5003 sides; Identical with the situation of the 13 embodiment; When being superimposed upon 5030 last times of audio information recording/reproducing part, in zone, hole 5021a, 5022,5023,5024a have been formed respectively in the face of paper battery 5031, switch 5033, IC chip 5034 and audio-frequency information I/O part 5040.
In addition; Identical with the situation of the 13 embodiment; When being superimposed upon surface patch 5010b and going up, divide support chip 5020b through zone, and will send on message card 5002 sides zone and other regional division between audio information recording/reproducing part 5130 is sandwiched in the face of coupling part 5004.In addition, in this zone,, in the face of the zone of paper battery 5131, switch 5133, IC chip 5134 and audio-frequency information output 5140, form hole 5121a, 5122,5123,5124a respectively when being superimposed upon 5130 last times of audio information recording/reproducing part.In response message card 5003 sides, identical with the situation of the 13 embodiment, when being superimposed upon 5030 last times of audio information recording/reproducing part, in zone, formed hole 5021b, 5024b respectively in the face of paper battery 5031 and audio-frequency information I/O part 5040.
In this manner; Through in the zone of the support chip 5020a that faces paper battery 5031,5131, switch 5033a, 5033b, IC chip 5034 and audio-frequency information I/ O part 5040,5140, having formed hole 5021a, 5121a, 5022,5023,5024a5124a and in the zone of the support chip 5020b that faces paper battery 5031,5131, audio-frequency information I/ O part 5040,5140, switch 5133 and IC chip 5134, having formed hole 5021b, 5121b, 5024b, 5124b, 5122,5123; Can reduce to install the difference of thickness between zone and other zone of paper battery 5031,5131, switch 5033a, 5033b, 5133, IC chip 5034,5134 and audio-frequency information I/ O part 5040,5140, improve the flatness of surface patch 5010a, 5010b thus and be beneficial at surface patch 5010a, the last printing information of 5010b.
Figure 43 a shows Figure 41 a to Figure 41 e and the support chip 5020a shown in Figure 42 and the laminar structure of audio information recording/reproducing part 5130, and Figure 43 b shows Figure 41 a to Figure 41 e and the support chip 5020b shown in Figure 42 and the laminar structure of audio information recording/reproducing part 5130.Figure 43 a, 43b only show the support chip 5020a that is superimposed upon on audio information recording/reproducing part 5130, the zone of 5020b.
Shown in Figure 43 a; Be formed in the face of the hole 5121b in the zone of the support chip 5020b of paper battery 5131 less than paper battery 5131; Be formed in the face of the hole 5122 in the zone of switch 5133 greater than switch 5133; Be formed in the face of the hole 5123 in the zone of IC chip 5134 greater than IC chip 5134, and be formed in the face of the hole 5124b in the zone of audio-frequency information output 5140 greater than audio-frequency information output 5140.
In addition, shown in Figure 43 b, be formed in the face of the hole 5121a in the zone of the support chip 5020a of paper battery 5131 less than paper battery 5131, and be formed in the face of the hole 5124a in the zone of audio-frequency information output 5140 less than audio-frequency information output 5140.
In this manner; The bonding work at the preceding and back side through being applied to support chip 5020a, 5020b; Lamination and fixed-audio information recording/regenerating part 5130 in such a way: in the past and the back side, only its part is sandwiched between two support chip 5020a, the 5020b.
In addition; Shown in Figure 41 a; The surface patch 5010b of present embodiment and the difference of the 13 embodiment are; In become the zone of sending message card 5002 through coupling part 5004, form perforation 5118; So that will be wherein zone and other zone between audio information recording/reproducing part 5130 is sandwiched in be separated,, formed in the face of in the zone of audio-frequency information output 5140 at the hole 5124b through support chip 5020b by being used to export the audio frequency output area 5114 that the minute aperture array exported from the audio frequency of audio-frequency information output 5140 constitutes; And the hole 5122 through support chip 5020b is faced in the zone of switch 5133, and printing is used for the playback button 5118 of console switch 5133.
Method for using at above-mentioned dual-purpose postcard 5101 will be described below.
At first; The transmit leg of dual-purpose postcard 5101 prints above-mentioned information in the zone of surface patch 5010a, 5010b; Through the record audio information in IC chip 5134 of the splicing ear 5135 on the audio frequency substrate 5132 that is arranged on audio information recording/reproducing part 5130, and should send to the recipient by dual-purpose postcard 5101.In this case, through splicing ear 5135, input is used to import the instruction and the audio-frequency information of audio-frequency information, and IC chip 5134 is according to this instruction record audio information in memory area.In addition; Identical with the situation of the 13 embodiment; Can also utilize the switch 5033b that presses through record button 5011b; Through audio-frequency information I/O part 5040 input audio-frequency informations and in IC chip 5034 record audio information, said record button 5011b is set in the zone that becomes the response message of surface patch 5010a card 5003.
When dual-purpose postcard 5101 is sent to the recipient; The recipient of dual-purpose postcard 5101 pushes the switch 5133 of audio information recording/reproducing part 5130 through the playback button 5111 that is arranged on the surface patch 5010b, and is recorded in the audio-frequency information in the IC chip 5134 through 5140 outputs of audio-frequency information output.
Then; Identical with the situation of the 13 embodiment; The recipient of dual-purpose postcard 5101 is record audio information in the IC of audio information recording/reproducing part 5130 chip 5134, separates response message card 5003 through coupling part 5004, and sends it to the destination of response message card 5003.
According to present embodiment, zone and other zone of the transmission message card 5002 between can audio information recording/reproducing part 5130 being sandwiched in are separated.Therefore; If dual-purpose postcard 5101 usefulness are accomplished the opposing party's of wedding invitation letter; For example; Printed in the zone between the audio information recording/reproducing part 5130 of sending message card 5002 is sandwiched in indication date and the opposing party the place guide information 5017 and when being recorded in its detailed information etc. in audio information recording/reproducing part 5130; Zone between the recipient of dual-purpose postcard 5101 can be sandwiched in audio information recording/reproducing part 5130 is separated with sending message card 5002, and carries the opposing party's the place of the small-sized mail visit wedding of his/her invitation letter.In addition; As stated; Even when not printing the guide information 5017 in the place of having indicated date and wedding the opposing party in the zone between the audio information recording/reproducing part 5130 of sending message card 5002 is sandwiched in, also can in memory, keep separated region as card.In addition; Can also will in memory, keep being applied to the zone of response message card 5003 sound intermediate frequency information recording/regenerating parts 5130 between being sandwiched in according to same way as as institute's record audio information of card; In this case; Be necessary to form perforation etc., be used for the zone between wherein audio information recording/reproducing part 5130 is sandwiched in and other zone of response message card 5003 are separated.
The the above-mentioned the 13 and the 14 embodiment has adopted the structure of dividing support chip 5020a, 5020b in the face of the zone of coupling part 5004; Can also adopt by being easy to cut or, dividing support chip 5020a, 5020b in the face of the zone of coupling part 5004 so that can't help at the support chip 5020a, the 5020b that process in the face of the material that is easy to form perforation in the zone of coupling part 5004.Equally, in the 14 embodiment, can also not send the zone of dividing support chip 5020a, 5020b on message card 5002 sides.
In addition; In the above-mentioned the 13 and the 14 embodiment; Audio information recording/reproducing part 5030 is sandwiched between two support chip 5020a, the 5020b; And support chip 5020a, 5020b further are sandwiched between two surface patch 5010a, the 5010b, can also adopt following structure: support chip 5020a, 5020b are not set, only audio information recording/reproducing part 5030 are clipped between two surface patch 5010a, the 5010b.
In addition; The above-mentioned the 13 has explained the dual-purpose postcard 5001,5101 that is made up of transmission message card that links to each other through coupling part 5,004 5002 and response message card 5003 with the 14 embodiment; But audio-frequency information delivery components of the present invention is not limited thereto, and the present invention can be applied to it and send any audio-frequency information delivery components that the message card links to each other with the response message card.
The above-mentioned the 13 with a kind of audio-frequency information delivery components that partly constitutes by transmission message part that links to each other and response message that the invention provides shown in the 14 embodiment; Have and be sandwiched in first audio information recording/transcriber between two surface patch, can the recoding/reproduction audio-frequency information; The wiring that is used for record audio information is across sending message part and response message part; Therefore in first audio information recording/transcriber after the record audio information; Can will send message part and response message along the coupling part partly is separated to send the response message part; Cut-out is clipped between two surface patch, be used to write down the wiring of the audio-frequency information of first audio information recording/transcriber; Prevent record audio information in first audio information recording/transcriber, and prevent thus to wipe the audio-frequency information that is write down by error, and quality that can deteriorate appearance.
In addition; Second audio information recording/transcriber can the recoding/reproduction audio-frequency information is sandwiched under the situation of the structure between the zone that becomes the transmission of two surface patch message part; Zone and other zone of transmission message part that wherein is provided with second audio information recording/transcriber is separable; Zone between second audio information recording of the audio-frequency information that the recipient of dual-purpose postcard can write down having/transcriber is sandwiched in is separated with sending message part, and carries this zone or hold it in the memory.
(the 15 embodiment)
Figure 44 a is the plane according to the label of fifteenth embodiment of the invention, and Figure 44 b shows the internal structure of the label 6001 shown in Figure 44 a, and Figure 44 c is the sectional view along the line A-A ' shown in Figure 44 a.In addition, Figure 45 shows the laminar structure of the label 6001 shown in Figure 44 a to 44.
Like Figure 44 a to 44c and shown in Figure 45; Present embodiment comprises: be sandwiched in sheet audio information recording/reproducing part 6030 between two support chip 6020a, the 6020b, can the recoding/reproduction audio-frequency information; Said support chip 6020a, 6020b are processed by the flexible thin sill of for example paper base material; The support chip 6020a, the 6020b that have wherein pressed from both sides audio information recording/reproducing part 6030 further are sandwiched between two surface patch 6010a, the 6010b, and said surface patch 6010a, 6010b are processed by the flexible thin sill of for example paper base material.Adhesive 6028a, the 6029a at the preceding and back side through being applied to support chip 6020a and adhesive 6028a, the 6029a that is applied to the preceding and back side of support chip 6020b are engaged with each other surface patch 6010a, 6010b, support chip 6020a, 6020b and audio information recording/reproducing part 6030 together.In addition, adhesive 6050 is applied to not on the surface in the face of the surface patch 6010b of support chip 6020b, and adheres to release paper 6060 according to strippable mode through adhesive 6050.A flat substrates is made up of these surface patch 6010a and support chip 6020a, and a flat substrates is made up of surface patch 6010b and support chip 6020b, and audio information recording/reproducing part 6030 is sandwiched between these two flat substrates.
In addition, audio information recording/reproducing part 6030 comprises: the sheet audio-frequency information output 6040 by piezoelectric element 6041 and vibrating membrane 6042 grades constitute is used to export the audio-frequency information that is write down; The audio frequency substrate 6032 of slim IC chip 6034, component (for example capacitor and resistor) and slim switch 6033 has been installed; Said slim IC chip 6034 has write down audio-frequency information, and said slim switching manipulation is used for being recorded in from 6040 outputs of audio-frequency information output the audio-frequency information of IC chip 6034; And the flexible paper battery 6031 that links to each other with audio frequency substrate 6032, be used for to 6032 power supplies of audio frequency substrate.In addition, audio frequency substrate 6032 also has been equipped with splicing ear 6035, is used for importing audio-frequency informations from the outside to IC chip 6034, and the audio-frequency information that maybe will be recorded in the IC chip 6034 outputs to the outside.In this manner, audio information recording/reproducing part 6030 has laminated structure.Here; Audio frequency substrate 6032 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 6034.
In addition; When being superimposed upon 6030 last times of audio information recording/reproducing part, support chip 6020a has been equipped with hole 6021a, 6022,6023,6024a respectively in the zone in the face of paper battery 6031, switch 6033, IC chip 6034 and audio-frequency information output 6040.In addition, when being superimposed upon 6030 last times of audio information recording/reproducing part, support chip 6020b forms hole 6021b, 6024b respectively in the zone in the face of paper battery 6031 and audio-frequency information 6 outputs 6040.
In this manner; In the zone of the support chip 6020a that faces paper battery 6031, switch 6033, IC chip 6034 and audio-frequency information output 6040, form hole 6021a, 6022,6023,6024a and in the zone of the support chip 6020b that faces paper battery 6031 and audio-frequency information output 6040, formed hole 6021b, 6024b; This has reduced to install the difference of thickness between zone and other zone of paper battery 6031, switch 6033, IC chip 6034 and audio-frequency information 6 outputs 6040, has improved the flatness of surface patch 6010a thus and has been beneficial to printing information on surface patch 6010a.
Figure 46 a shows Figure 44 a to Figure 44 c and the support chip 6020a shown in Figure 45 and the laminar structure of audio information recording/reproducing part 6030, and Figure 46 b shows Figure 44 a to Figure 44 c and the support chip 6020b shown in Figure 45 and the laminar structure of audio information recording/reproducing part 6030.
Shown in Figure 46 a; Be formed in the face of the hole 6021a in the zone of the support chip 6020a of paper battery 6031 less than paper battery 6031; Be formed in the face of the hole 6022 in the zone of switch 6033 greater than switch 6033; Be formed in the face of the hole 6023 in the zone of IC chip 6034 greater than IC chip 6034, and be formed in the face of the hole 6024a in the zone of audio-frequency information output 6040 greater than audio-frequency information output 6040.
In addition, shown in Figure 46 b, be formed in the face of the hole 6021b in the zone of the support chip 6020b of paper battery 6031 less than paper battery 6031, and be formed in the face of the hole 6024b in the zone of audio-frequency information 6 outputs 6040 less than audio-frequency information output 6040.
In this manner; The adhesive 6029a at the back side through being applied to support chip 6020a and the adhesive 6028b that is applied to the front of support chip 6020b; Lamination and fixed-audio information recording/regenerating part 6030 in such a way: in the past and the back side, only its part is sandwiched between two support chip 6020a, the 6020b.
In addition; In two surface patch 6010a, 6010b; The surface patch 6010a that faces switch 6033 and IC chip 6034 through the hole 6022,6023 of support chip 6020a is equipped with information display area territory 6002; Wherein printed the recipient's that will send to this label 6001 information etc.; The zone of facing the support chip 6020a of switch 6033 through hole 6022 has printed article; Show the playback button 6003 that is used for console switch 6033, and in through the zone of hole 6024a, formed by being used for that the audio frequency from audio-frequency information output 6040 is outputed to the audio frequency output area 6004 that outside minute aperture array constitutes in the face of the support chip 6020a of audio-frequency information output 6040.Even when the preceding and back side of audio-frequency information output 6040 has covered surface patch 6010a, 6010b, become audio frequency output area 6004 also can compensate by the minute aperture matrix-like and reduce from the volume of audio-frequency information output 6040 outputs.In audio frequency output area 6004,, form the hole that diameter is 0.1mm horizontally and vertically with the interval of 1.5mm through laser beam processing.Therefore, with the punching that utilizes pin etc. or bore a hole differently, can not form burr and have burr to block these holes never.In addition, can also the information of playback button 6003 on being printed on information display area territory 6002 be printed on the surface patch 6010a, can also after information being printed on the information display area territory 6002, strip of paper used for sealing be pasted the zone in the face of switch 6033.
In above-mentioned label 6001; If information is printed on the information display area territory 6002; To send to the recipient's of label 6001 audio-frequency information through splicing ear 6035 inputs of audio information recording/reproducing part 6030; And it is recorded in the IC chip 6034, when label 6001 being pasted on the object and subsequently it being delivered to the recipient of label 6001, visually send the information that is printed on the information display area territory 6002 in the destination of label 6001; When the recipient passes through playback button 6003 push switches 6033, be recorded in the audio-frequency information the IC chip 6034 from 6040 outputs of audio-frequency information output.
In this manner; Information is printed on the information display area territory 6002, and record audio information in IC chip 6034 is then through utilizing playback button 6003 push switches 6033 to come output audio information; Therefore, can be used for healthy subjects and visual disability personage equally so that send the information of hoping.
(the 16 embodiment)
Figure 47 a is the plane according to the label of sixteenth embodiment of the invention, and Figure 47 b shows the internal structure of the label 6101 shown in Figure 47 a, and Figure 47 c is the sectional view along the line A-A ' shown in Figure 47 a, and Figure 47 d is the sectional view along the line B-B ' shown in Figure 47 a.In addition, Figure 48 shows the laminar structure of Figure 47 a to the label shown in the 47d 6101.
Like Figure 47 a to 47d and shown in Figure 48; According to present embodiment; A kind of sheet audio information recording/reproducing part 6130 that can the recoding/reproduction audio-frequency information is sandwiched between two size various supports sheet 6120a, the 6120b; Said support chip 6120a, 6120b are processed by the flexible thin sill of for example paper base material, are superimposed on not on the surface in the face of the support chip 6120a of audio information recording/reproducing part 6130 by the surface patch 6110a that processes with support chip 6120b flexible thin sill same size, for example paper base material.In addition, according to strippable mode release paper 6160 is sticked on the surface of the support chip 6120b that does not face audio information recording/reproducing part 6130.Adhesive 6128a, 6129a are applied to the preceding and back side of support chip 6120a, and adhesive 6128b, 6129b are applied to the preceding and back side of support chip 6120b.In the face of in the zone of support chip 6120a, join surface patch 6110a to support chip 6120a through adhesive 6128a, and, join surface patch 6110a to support chip 6120b through adhesive 6128b in the face of in the zone of support chip 6120b.In addition, according to strippable mode, support chip 6120b and release paper 6060 are bonded together through adhesive 6129b.A flat substrates is made up of surface patch 6110a and support chip 6120a; Another flat substrates is made up of support chip 6120b; And audio information recording/reproducing part 6130 is sandwiched between these two flat substrates; The adhesive 6129a at the back side through being applied to support chip 6120a and the adhesive 6128b that is applied to the front of support chip 6120b, fixed-audio information recording/regenerating part 6130.
In addition, audio information recording/reproducing part 6130 comprises: the sheet audio-frequency information I/O part 6140 by piezoelectric element 6041 and vibrating membrane 6042 grades constitute is used for the I/O audio-frequency information; Slim IC chip 6134, component (for example capacitor and resistor) and first switch 6133b that is electrically connected with IC chip 6134 and the audio frequency substrate 6132 of second switch 6133a have been installed; Said slim IC chip 6134 is equipped with memory area, has wherein write down the audio-frequency information through 6140 inputs of audio-frequency information I/O part; The flexible paper battery 6131 that links to each other with audio frequency substrate 6132 is used for to 6132 power supplies of audio frequency substrate; With and on formed the connection substrate 6170 of wiring pattern 6171, said wiring pattern 6171 is used for the switch 6133b at record IC chip 6134 record audio informations is electrically connected with IC chip 6134.In this manner, audio information recording/reproducing part 6130 has laminated structure.In addition, audio frequency substrate 6132 also has been equipped with: splicing ear 6135, be used for importing audio-frequency informations from the outside to IC chip 6134, and the audio-frequency information that maybe will be recorded in the IC chip 6134 outputs to the outside; Wiring pattern 6137a is used for the positive electrode of paper battery 6131 is linked to each other with switch 6133a, 6133b; Wiring pattern 6137b is used for port terminal with IC chip 6134 is used for exporting the port terminal of command signal from the audio-frequency information of the memory area that is recorded in IC chip 6134 to its input and links to each other with switch 6133a; Wiring pattern 6137c is used for the port terminal of IC chip 6134 is used in the memory area record of IC chip 6134 port terminal through the command signal of the audio-frequency information of audio-frequency information I/O part 6140 inputs with to be formed on the wiring pattern 6171 that is connected on the substrate 6170 continuous to its input; And wiring pattern 6137d, wiring pattern 6171 is linked to each other with switch 6133b.In the bottom of switch 6133a, wiring pattern 6137a is not electrically connected with wiring pattern 6137b, in the bottom of switch 6133b, wiring pattern 6137a is not electrically connected with wiring pattern 6137d.In addition; Audio frequency substrate 6132 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 6032.In addition, connect substrate 6170 and also need have above-mentioned flexibility, also need process by the material of the similar film that is easy to cut.In addition, the record of the audio-frequency information through audio-frequency information I/O part 6140 input and the output that is recorded in memory area sound intermediate frequency information through 6140 controls of audio-frequency information I/O part in the IC chip 6134 control storage zones.When the port terminal that links to each other with wiring pattern 6137b becomes electrical source voltage; The audio-frequency information that IC chip 6134 is exported in the memory area that is recorded in IC chip 6134; And as long as the port terminal that links to each other with wiring pattern 6137c is in electrical source voltage, IC chip 6134 writes down the audio-frequency information through 6140 inputs of audio-frequency information I/O part in the memory area of IC chip 6134.In addition; Switch 6133a operation is used for being recorded in through 6140 outputs of audio-frequency information I/O part the audio-frequency information of the memory area of IC chip 6134, and switch 6133b operation is used for passing through at the memory area record of IC chip 6134 audio-frequency information of audio-frequency information I/O part 6140 inputs.
Constitute audio-frequency information I/O part 6140, audio frequency substrate 6132, the paper battery 6131 of audio information recording/reproducing part 6130 and connect substrate 6170 and be sandwiched between support chip 6120a, 6120b and the surface patch 6110a; Thereby audio-frequency information I/O part 6140, audio frequency substrate 6132, paper battery 6131 and be connected substrate 6170 and only be retained in surface patch 6110a and support chip 6120b and be divided in one of them zone in two zones along perforation 6105,6125 formed thereon connect substrate 6170 across two zones.
In addition; Shown in figure 48; Setting support chip 6120a; So that only it is superimposed upon on the surface patch 6110a that divides through the perforation that is formed on surface patch 6110a and the support chip 6120b and one of two zones of support chip 6120b respectively,, in the zone of facing paper battery 6131, switch 6133a, 6133b, IC chip 6134 and audio-frequency information I/O part 6140, hole 6121a, 6122,6123,6124a have been equipped with respectively when being superimposed upon 6130 last times of audio information recording/reproducing part.In addition, the thickness of support chip 6120a is less than the thickness of the switch 6133a of audio information recording/reproducing part 6130.
In this manner; When audio information recording/reproducing part 6130 being clipped between support chip 6120a, 6120b and the surface patch 6110a; Only have the surf zone of the surface patch 6110a that wherein is provided with playback button 6103a regional outstanding with respect to other, this makes can discern playback button 6103a through the touch from the outside.In addition; Replace adopting following structure: in this manner; Through comparing the thickness that reduces support chip 6120a with the thickness of switch 6133a; Thereby the surf zone that the surface patch 6110a that wherein is provided with playback button 6103a only arranged is regional outstanding with respect to other, and the protruding job applications of the Braille character of for example indicating playback button 6103a in the zone of the playback button 6103a that has been equipped with surface patch 6110a, can also be made through the touch from the outside and can discern playback button 6103a.
In addition; When being superimposed upon 6130 last times of audio information recording/reproducing part; In in the face of the zone of support chip 6120b that is formed at the perforation 6105 on the surface patch 6110a, form perforation 6125, and in zone, form hole 6121b and 6124b in the face of paper battery 6131 and audio-frequency information I/O part 6140.
In addition; Information display area territory 6102 is equipped with shown in Figure 47 a, in surface patch 6110a; Wherein in through 6105 the zones between audio information recording/reproducing part 6130 is clipped in of boring a hole; Printed the information that will send to the recipient of this label 6101, in through the zone of hole 6122, be provided with printed article, be used to illustrate the playback button 6103a that is used for console switch 6133a in the face of the support chip 6120a of switch 6133a; And in through the zone of hole 6122, be provided with printed article in the face of the support chip 6120a of switch 6133b, be used to illustrate the record button 6103a that is used for console switch 6133b.In addition; In through the zone of hole 6124a, formed the audio frequency output area 6104 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information I/O part 6140 in the face of the support chip 6120a of audio information recording/reproducing part 6130.Even when the surface coverage of audio-frequency information I/O part 6040 during surface patch 6010a, the audio frequency output area 6104 that is formed by this minute aperture array also can compensate from the volume of audio-frequency information output 6140 outputs and reduce.
In this manner, audio information recording/reproducing part 6130 is clipped between surface patch 6110 and support chip 6120a, the 6120b.
The method for using of above-mentioned label 6101 will be described below.
At first, the transmit leg of label 6101 prints the information that will send in the information display area territory 6102 of surface patch 6110a, and printing playback button 6103a and record button 6103b.
In addition, utilize the switch 6133b that presses through record button 6103b, will send to the recipient's of label 6101 audio-frequency information, and it is recorded in the memory area of IC chip 6134 through 6140 inputs of audio-frequency information I/O part.
Figure 49 a be when not when the record button 6103b push switch 6133b Figure 47 a near the sectional view the switch 6133b shown in the 47c, Figure 49 b be when passing through record button 6103b push switch 6133b Figure 47 a near the sectional view the switch 6133b shown in the 47c.
In the label shown in the 47c 6101, when not through record button 6103b push switch 6133b, shown in Figure 49 a, there is not electrical connection to be formed on wiring pattern 6137a and the wiring pattern 6137d on the audio frequency substrate 6132 at Figure 47 a.Therefore; One of port terminal of the IC chip 6134 that links to each other with wiring pattern 6137d through wiring pattern 6137c, 6171 (promptly; Imported the port terminal that is used for writing down the command signal of the audio-frequency information of importing through audio-frequency information I/O part 6140 to it at the memory area of IC chip 6134) keep opening a way; And under this condition; Even during through audio-frequency information I/O part 6140 input audio-frequency informations, the audio-frequency information that also record is not imported in the memory area of IC chip 6134.
On the other hand, when when the record button 6103b push switch 6133b, shown in Figure 49 b, the conductive agent 6138 at the back side through being applied to switch 6133b is electrically connected and is formed on wiring pattern 6137a and the wiring pattern 6137d on the audio frequency substrate 6132.Because wiring pattern 6137a links to each other with the positive electrode of paper battery 6131; The port terminal that links to each other with wiring pattern 6137d through wiring pattern 6137c, 6171 (promptly; Imported the port terminal of the command signal of the audio-frequency information that is used for importing through audio-frequency information I/O part 6140 to it at the memory area of IC chip 6134 record) become electrical source voltage; Under this condition; When through audio-frequency information I/O part 6140 input audio-frequency informations, with the audio information recording of input in the memory area of IC chip 6134.
As stated,, the different audio-frequency informations that record is hoped can be located in, printing can also be after record audio information, carried out in the purpose of label 6101 through record audio information after the printing on label 6101.In addition, replace to import audio-frequency information from the outside through the splicing ear 6135 that is arranged on the audio frequency substrate 6132 through audio-frequency information I/O part 6140 input audio-frequency informations.In this case; Not only can be through splicing ear 6135 input audio-frequency informations; Can also import the instruction that is used to import this audio-frequency information, when input should be instructed, IC chip 6134 write down the audio-frequency information of input in memory area through splicing ear 6135.In addition, can also output to the outside through the audio-frequency information that splicing ear 6135 will be recorded in the memory area of IC chip 6134.In this case; Import the instruction of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6134 through splicing ear 6135; When input should be instructed, IC chip 6134 was stored in the audio-frequency information in the memory area through splicing ear 6135 outputs.
In this manner; When printing information and with audio information recording after IC chip 6134; If cut off surface patch 6110a and support chip 6120b through perforation 6105,6125; The connection substrate 6170 that this has caused cutting off audio information recording/reproducing part 6130 has broken off the wiring pattern 6171 that is formed on the connection substrate 6170 thus.In zone in the face of perforation 6105,6125; Form groove 6172; Its shape can not slacken the condition of contact of wiring pattern 6171; Since narrower in the face of the live width in the zone of perforation 6105,6125 wiring pattern 6171, when cutting off surface patch 6110a and support chip 6120b, be easy to 6105,6125 cut off these sheets through boring a hole through perforation 6105,6125.
Figure 50 shows when be cut into the internal structure of two a of Figure 47 when regional to the label shown in the 47d 6101 along perforation 6105,6125.
Shown in figure 50, connect substrate 6170 when 6105,6125 surface patch 6110a and support chip 6120b being cut into two when regional through boring a hole, cutting off, this causes also having cut off and is formed on the wiring pattern 6171 that connects on the substrate 6170.Under this condition; There are not to be electrically connected wiring pattern 6137d that links to each other with switch 6133b and the wiring pattern 5137c that links to each other with port terminal (having imported the port terminal that is used for writing down the command signal of the audio-frequency information of importing through audio-frequency information I/O part 6140) at the memory area of IC chip 6134 to it; Therefore, imported to it and to be used for also can not becoming electrical source voltage in the memory area record of IC chip 6134 port terminal through the command signal of the audio-frequency information of audio-frequency information I/O part 6140 inputs even through record button 6103b push switch 6133b.Therefore, even under this condition, import audio-frequency informations, the audio-frequency information that also record is imported in the memory area of IC chip 6134 through audio-frequency information I/O part 6140.
Then; In label 6101 through perforation 6105,6125 cutting its surface patch 6110a and support chip 6120b; The surface that is provided with playback button 6103a and record button 6103b on it is pasted on the object, and this object is provided to the destination of label 6101.In this case; In the label that pastes object 6101; Owing to broken off the wiring pattern 6171 that is used at IC chip 6134 record audio informations, even through record button 6103b push switch 6133b, can be in IC chip 6134 yet record audio information.
In addition, as the recipient of label 6101 during, be recorded in the audio-frequency information in the memory area of IC chip 6134 through 6140 outputs of audio-frequency information I/O part through playback button 6103a push switch 6133a.
With identical through the situation of above-mentioned record button 6103b push switch 6133b; When not through playback button 6103a push switch 6133a; Do not have to be electrically connected and be formed on wiring pattern 6137a and the wiring pattern 6137b on the audio frequency substrate 6132; Therefore; One of port terminal of the IC chip 6134 that links to each other with wiring pattern 6137b (that is, having imported the port terminal of the command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6134 to it) keeps open circuit, and does not export the audio-frequency information in the memory area that is recorded in IC chip 6134.
On the other hand, when when the playback button 6103a push switch 6133a, the conductive agent (not shown) at the back side through being applied to switch 6133a is electrically connected and is formed on wiring pattern 6137a and the wiring pattern 6137b on the audio frequency substrate 6132.Because wiring pattern 6137a links to each other with the positive electrode of paper battery 6131; The port terminal that links to each other with wiring pattern 6137b (promptly; Imported the port terminal of the command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6134 to it) become electrical source voltage, and the audio-frequency information of exporting in the memory area that is recorded in IC chip 6134 through audio-frequency information I/O part 6140 thus.Therefore, cause being recorded in the audio-frequency information in the IC chip 6134 through playback button 6103a push switch 6133a through 6140 outputs of audio-frequency information I/O part.
Present embodiment is not provided with the arbitrary surfaces sheet in the object that will paste one side; But the adhesive 6129b at the back side through being applied to support chip 6120b implements the stickup of object; Therefore; With separable be to compare shown in the 15 embodiment in two zones, only need on a surface patch 6110a, form perforation 6105, and can realize that also cost reduces.
(the 17 embodiment)
Figure 51 a is the plane according to the label of seventeenth embodiment of the invention, and Figure 51 b shows the internal structure of the label 6201 shown in Figure 51 a, and Figure 51 c is the sectional view along the line A-A ' shown in Figure 51 a.In addition, Figure 52 shows the laminar structure of Figure 51 a to the label shown in the 51c 6201.
Like Figure 51 a to shown in 51c and Figure 52; Present embodiment comprises: be sandwiched in sheet audio information recording/reproducing part 6230 between two support chip 6220a, 6220b and the surface patch 6210a, can the recoding/reproduction audio-frequency information; Said support chip 6220a, 6220b are processed by the flexible thin sill of for example paper base material; Said surface patch 6210 is processed by the flexible thin sill of for example paper base material, and is engaged to the surface of not facing the support chip 6220a of audio information recording/reproducing part 6230.In addition, according to strippable mode release paper 6260 is bonded on a part of surface of the support chip 6220b that does not face audio information recording/reproducing part 6230.Adhesive 6228a, 6229a are applied to the preceding and back side of support chip 6220a; Adhesive 6228b is applied to the surface of support chip 6220b, and adhesive 6229b is applied to one of two zones that can be through being formed at the perforation 6225b back side that separate, support chip 6220b on the support chip 6220b.Through being applied to the adhesive 6228a of support chip 6220a; Join surface patch 6210a to support chip 6220a; And, support chip 6220b is joined to release paper 6260 according to strippable mode through being applied to the adhesive 6229b of support chip 6220b.A flat substrates is made up of surface patch 6210a and support chip 6220a; A flat substrates is made up of support chip 6220b; And audio information recording/reproducing part 6230 is sandwiched between these two flat substrates; The adhesive 6229a at the back side through being applied to support chip 6220a and the adhesive 6228b that is applied to the surface of support chip 6220b, fixed-audio information recording/regenerating part 6230.Adhesive 6229b is not applied to the back side in one of zone, and release paper 6260 is not engaged with this zone through the support chip 6220b that divided of perforation 6225b.
In addition, audio information recording/reproducing part 6230 comprises: the sheet audio-frequency information I/O part 6240 by piezoelectric element 6241 and vibrating membrane 6242 grades constitute is used for the I/O audio-frequency information; The audio frequency substrate 6232 of the second switch 6233a that slim IC chip 6234, component (for example capacitor and resistor) has been installed and has been electrically connected with IC chip 6234; Said slim IC chip 6234 is equipped with memory area; Wherein write down the audio-frequency information through 6240 inputs of audio-frequency information I/O part, said second switch 6233a operation is used for exporting the audio-frequency information that is recorded in IC chip 6234; The flexible paper battery 6231 that links to each other with audio frequency substrate 6232 is used for to 6232 power supplies of audio frequency substrate; And connect substrate 6270, operation is installed on it is used for through audio-frequency information I/O part 6240 at first switch 6233b of IC chip 6234 record audio informations and wiring pattern 6271a, the 6271b that is used to be electrically connected IC chip 6234 and paper battery 6231 and switch 6233b.In this manner, audio information recording/reproducing part 6230 has laminated structure.In addition, audio frequency substrate 6232 also has been equipped with: splicing ear 6235, be used for importing audio-frequency informations from the outside to IC chip 6234, and the audio-frequency information that maybe will be recorded in the IC chip 6234 outputs to the outside; Wiring pattern 6237a is used for the positive electrode of paper battery 6231 is linked to each other with switch 6233a; Wiring pattern 6237b is used for port terminal with IC chip 6234 is used for exporting the port terminal of command signal from the audio-frequency information of the memory area that is recorded in IC chip 6234 to its input and links to each other with switch 6233a; And wiring pattern 6237c, be used for the port terminal of IC chip 6234 is used in the memory area record of IC chip 6234 port terminal through the command signal of the audio-frequency information of audio-frequency information I/O part 6240 inputs with to be formed on the wiring pattern 6271b that is connected on the substrate 6270 continuous to its input.Here,, wiring pattern 6237a is not electrically connected with wiring pattern 6237b, and, wiring pattern 6271a is not electrically connected with wiring pattern 6271b in the bottom of switch 6233b in the bottom of switch 6233a.In addition; Audio frequency substrate 6232 is flexible thin substrates of being processed by fiberglass reinforced plastic (FRP), polyethylene terephthalate (PET), polyimides or lead frame etc., wherein utilizes anisotropy/electroconductive binder (ACP), anisotropy/conducting film (ACF), wire-bonded etc. to engage with IC chip 6234.In addition, connect substrate 6270 and also need have above-mentioned flexibility, also need process by the material of the similar film that is easy to cut.In addition; The record of audio-frequency information and the output that is recorded in memory area sound intermediate frequency information through 6240 controls of audio-frequency information I/O part through audio-frequency information I/O part 6240 input in the IC chip 6234 control storage zones; When the port terminal that links to each other with wiring pattern 6237b becomes electrical source voltage; The audio-frequency information that IC chip 6234 is exported in the memory area that is recorded in IC chip 6234; And as long as the port terminal that links to each other with wiring pattern 6237c is in electrical source voltage, IC chip 6234 writes down the audio-frequency information through 6240 inputs of audio-frequency information I/O part in the memory area of IC chip 6234.In addition; Switch 6233a operation is used for being recorded in through 6240 outputs of audio-frequency information I/O part the audio-frequency information of the memory area of IC chip 6234, and switch 6233b operation is used for passing through at the memory area record of IC chip 6234 audio-frequency information of audio-frequency information I/O part 6240 inputs.
Constitute audio-frequency information I/O part 6240, audio frequency substrate 6232, the paper battery 6231 of audio information recording/reproducing part 6230 and connect substrate 6270 and be sandwiched between support chip 6220a, the 6220b; Thereby audio-frequency information I/O part 6240, audio frequency substrate 6232 and paper battery 6231 only are retained in and are divided in one of them zone in two zones along perforation 6225a, 6225b; Connect substrate 6270 across two zones being divided along perforation 6225a, 6225b, and switch 6233b with regional different zone between audio-frequency information I/O part 6240, audio frequency substrate 6232 and paper battery 6231 are sandwiched in.
In addition; Shown in Figure 52; When being superimposed upon 6230 last times of audio information recording/reproducing part; In the zone of the support chip 6220a that faces the perforation 6205 that is formed at surface patch 6210a, form perforation 6225a, and in the face of the zone of paper battery 6231, switch 6233a, 6233b, IC chip 6234 and audio-frequency information I/O part 6240, form hole 6221a, 6222,6223,6224a respectively.In addition, its thickness is less than the thickness of the switch 6233a of audio information recording/reproducing part 6230.
In this manner; When audio information recording/reproducing part 6230 being clipped between support chip 6220a, 6220b and the surface patch 6210a; Only have the surf zone of the surface patch 6210a that is provided with playback button 6203a on it regional outstanding with respect to other, this makes can discern playback button 6203a through the touch from the outside.
In addition; When being superimposed upon 6230 last times of audio information recording/reproducing part; In in the face of the zone of support chip 6220b that is formed at the perforation 6205 on the surface patch 6210a, form perforation 6225b, and in zone, form hole 6221b and 6224b in the face of paper battery 6231 and audio-frequency information I/O part 6240.
In addition; Shown in Figure 51 a; In through 6205 the zones between audio information recording/reproducing part 6230 is clipped in of boring a hole, surface patch 6210a is equipped with information display area territory 6202, has wherein printed the information that will send to the recipient of this label 6201; In through the zone of hole 6222a, be provided with printed article in the face of the support chip 6220a of switch 6233a; Be used to illustrate the playback button 6203a that is used for console switch 6233a, and in through the zone of hole 6222b, be provided with printed article, be used to illustrate the record button 6203a that is used for console switch 6233b in the face of the support chip 6220a of switch 6233b.In addition; In through the zone of hole 6224a, formed the audio frequency output area 6204 that constitutes by the minute aperture array that is used to export from the audio frequency output of audio-frequency information I/O part 6240 in the face of the support chip 6220a of audio information recording/reproducing part 6230.Even when the surface coverage of audio-frequency information I/O part 6240 during surface patch 6210a, the audio frequency output area 6204 that is formed by this minute aperture array also can compensate from the volume of audio-frequency information output 6240 outputs and reduce.In addition, form Braille character information 6206, be used to express the information that is printed on information display area territory 6202 and the information that shows playback button 6303a etc.
In this manner, audio information recording/reproducing part 6230 is clipped between surface patch 6210 and support chip 6220a, the 6220b.
The method for using of above-mentioned label 6201 will be described below.
At first, the transmit leg of label 6201 prints the information that will send in the information display area territory 6202 of surface patch 6210a, and printing playback button 6203a and record button 6203b.
In addition, utilize the switch 6233b that presses through record button 6203b, will send to the recipient's of label 6201 audio-frequency information, and it is recorded in the memory area of IC chip 6234 through 6240 inputs of audio-frequency information I/O part.
In the label shown in the 51c 6201, when not through record button 6203b push switch 6233b, there are not to be electrically connected the wiring pattern 6271a and the wiring pattern 6271b that are formed on the connection substrate 6270 at Figure 51 a.Therefore; One of port terminal of the IC chip 6234 that links to each other with wiring pattern 6271b through wiring pattern 6237c (promptly; Imported the port terminal that is used for writing down the command signal of the audio-frequency information of importing through audio-frequency information I/O part 6240 to it at the memory area of IC chip 6234) keep opening a way; And under this condition, even through audio-frequency information I/O part 6240 input audio-frequency informations, the audio-frequency information that also record is not imported in the memory area of IC chip 6234.
On the other hand, when when the record button 6203b push switch 6233b, the conductive agent (not shown) at the back side through being applied to switch 6233b is electrically connected and is formed on wiring pattern 6271a and the wiring pattern 6271b that connects on the substrate 6270.Because the wiring pattern 6237a that is formed on the audio frequency substrate 6232 links to each other with the positive electrode of paper battery 6231; The port terminal that links to each other with wiring pattern 6271b through wiring pattern 6237c (promptly; Imported the port terminal of the command signal of the audio-frequency information that is used for importing through audio-frequency information I/O part 6240 to it at the memory area of IC chip 6234 record) become electrical source voltage; Under this condition; If through audio-frequency information I/O part 6240 input audio-frequency informations, then with the audio information recording of input in the memory area of IC chip 6234.
As stated,, the different audio-frequency informations that record is hoped can be located in, printing can also be after record audio information, carried out in the purpose of label 6201 through record audio information after the printing on label 6201.In addition, replace to import audio-frequency information from the outside through the splicing ear 6235 that is arranged on the audio frequency substrate 6232 through audio-frequency information I/O part 6240 input audio-frequency informations.In this case; Not only can be through splicing ear 6235 input audio-frequency informations; Can also import the instruction that is used to import this audio-frequency information, when input should be instructed, IC chip 6234 write down the audio-frequency information of input in memory area through splicing ear 6235.In addition, can also output to the outside through the audio-frequency information that splicing ear 6235 will be recorded in the memory area of IC chip 6234.In this case; Import the instruction of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6234 through splicing ear 6235; When input should be instructed, IC chip 6234 was stored in the audio-frequency information in the memory area through splicing ear 6235 outputs.
In this manner; When printing information and with audio information recording after IC chip 6234; If through perforation 6205,6225a, 6225b cut-out surface patch 6210a and support chip 6220a, 6220b; The connection substrate 6270 that this has caused cutting off audio information recording/reproducing part 6230 has broken off the wiring pattern 6271a, the 6271b that are formed on the connection substrate 6270 thus.In zone in the face of perforation 6205,6225a, 6225b; Form groove 6272; Its shape can not slacken the condition of contact of wiring pattern 6271; Since in the face of the live width in the zone of the wiring pattern 6271a of perforation 6205,6225a, 6225b, 6271b narrower, when cutting off surface patch 6210a and support chip 6220a, 6220b through perforation 6205,6225a, 6225b, be easy to through bore a hole 6205,6225a, 6225b cut off these sheets.
When through bore a hole 6205,6225a, 6225b be cut into two when regional with surface patch 6210a and support chip 6220a, 6220b; Cut off and connect substrate 6270; Cut off being formed on wiring pattern 6271a, the 6271b that connects on the substrate 6270 thus, operation is used for being separated with paper battery 6231 at the switch 6233b and the IC chip 6234 of IC chip 6234 records through the audio-frequency information of audio-frequency information I/O part 6240 inputs.
Then; In label 6201 through perforation 6205,6225a, 6225b cutting its surface patch 6210a and support chip 6220a, 6220b; Side between IC chip 6234 on it and paper battery 6231 be sandwiched in pastes on the object, and this object is provided to the destination of label 6201.In this case, do not have record button 6203b owing to paste on the label 6201 of object, can be in IC chip 6234 record audio information.
In addition, as the recipient of label 6201 during, be recorded in the audio-frequency information in the memory area of IC chip 6234 through 6240 outputs of audio-frequency information I/O part through playback button 6203a push switch 6233a.
With identical through the situation of above-mentioned record button 6203b push switch 6233b; When not through playback button 6203a push switch 6233a; Do not have to be electrically connected and be formed on wiring pattern 6237a and the wiring pattern 6237b on the audio frequency substrate 6232; Therefore; One of port terminal of the IC chip 6234 that links to each other with wiring pattern 6237b (that is, having imported the port terminal of the command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6234 to it) keeps open circuit, and does not export the audio-frequency information in the memory area that is recorded in IC chip 6234.
On the other hand, when when the playback button 6203a push switch 6233a, the conductive agent (not shown) at the back side through being applied to switch 6233a is electrically connected and is formed on wiring pattern 6237a and the wiring pattern 6237b on the audio frequency substrate 6232.Because wiring pattern 6237a links to each other with the positive electrode of paper battery 6231; The port terminal that links to each other with wiring pattern 6237b (promptly; Imported the port terminal of the command signal of the audio-frequency information that is used for exporting the memory area that is recorded in IC chip 6234 to it) become electrical source voltage, and the audio-frequency information of exporting in the memory area that is recorded in IC chip 6234 through audio-frequency information I/O part 6240 thus.Therefore, cause being recorded in the audio-frequency information in the IC chip 6234 through playback button 6203a push switch 6233a through 6240 outputs of audio-frequency information I/O part.
As stated; In the zone of the support chip 6210b of two support chip 6210a, 6210b; Present embodiment not with any adhesive application in 6225 being cut and not being adhered on surface object, that paste object (becoming a side that will paste object) through boring a hole, prevent thus to stick on by error that be adhered to should separate areas before the object.
For example, can the label 6001,6101,6201 shown in above-mentioned the 15 to the 17 embodiment be used to paste first-aid dressing.
The present invention shown in above-mentioned the 15 to the 17 embodiment is a kind of label that could be adhered on the object; It is constructed in such a way: with audio information recording in being sandwiched in two sheet audio information recording/transcribers between the flat substrates; Audio-frequency information that can reproducing recorded; Therefore; When the label that will wherein write down the information that will send (as audio-frequency information) pastes on the object and object is delivered to the destination of audio-frequency information, can likewise send the information of hoping to healthy subjects and visual disability.
In addition; When two flat substrates being separated into two zones and audio information recording/transcriber being clipped between two flat substrates wiring for use in record audio information across two when regional; If audio-frequency information is recorded in audio information recording/transcriber, then, when pasting this label on the object, flat substrates is separated into two zones; Break off the wiring of record audio information, can prevent in pasting the label of object record audio information by error thus.
In addition; When two flat substrates being separated into two zones and audio information recording/transcriber being clipped between two flat substrates so that operation is used for that first switch of record audio information is placed on one of two zones that other member of constituting audio information recording/transcriber is placed on another zone; If audio-frequency information is recorded in audio information recording/transcriber; Then; When pasting this label on the object, flat substrates is separated into two zones; First switch that operation is not used for the audio-frequency information of record audio information data recording/reproducing device pastes object, can prevent in pasting the label of object record audio information by error thus.
In addition; Under the situation of following structure: in the zone between first switch is sandwiched in; Not on the surface with the object of the flat substrates of bonding job applications in will pasting two flat substrates, can prevent thus between first switch is sandwiched in and be adhered to object before should paste on the object by error in the separate areas.
In addition; Under the situation of following structure: through touch from the outside; Can discern zone in the face of two flat substrates of second switch; When reproduction is recorded in the audio-frequency information in audio information recording/transcriber, operate said second switch, visual disability personage can more easily recognize this second switch.
(the 18 embodiment)
Figure 53 a is the plane of embodiment that is used for the paper battery of power circuit according to eighteenth embodiment of the invention, and Figure 53 b is the sectional view along the line A-A ' shown in Figure 53 a, and Figure 53 c is the sectional view along the line B-B ' shown in Figure 53 a.
, comprise to shown in the 53c like Figure 53 a according to the paper battery of present embodiment: through gel electrolyte layer 7030 be laminated to together, the positive electrode layer of processing by manganese dioxide etc. 7010 and the positive electrode layer of processing by zinc etc. 7020; By the diaphragm 7012 that PET (polyethylene terephthalate) etc. processes, be coated with conductive ink 7011 on it and be laminated on positive electrode layer 7010 sides; And, be coated with conductive ink 7021 on it and be laminated on positive electrode layer 7020 sides by the diaphragm 7022 that PET etc. processes.In addition; The diaphragm 7012 that is coated with conductive ink 7011 comprises from the outstanding outburst area 7013 of the exterior contour of positive electrode layer 7010, positive electrode layer 7020 and electrolyte layers 7030; The diaphragm 7022 that is coated with conductive ink 7021 comprises that the exterior contour place of positive electrode layer 7010, positive electrode layer 7020 and the electrolyte layers 7030 of these outburst areas 7013,7023 in zones of different is outstanding from the outstanding outburst area 7023 of the exterior contour of positive electrode layer 7010, positive electrode layer 7020 and electrolyte layers 7030.Here, positive electrode layer 7010 sides and positive electrode layer 7020 sides owing to conductive ink 7011,7021 being coated in diaphragm 7012,7022 respectively differ from one another from its surface that exposes the outburst area 7013,7023 of conductive ink 7011,7021.
In the paper battery 1 of as above structure; The conductive ink 7011 that is coated on the diaphragm 7012 is electrically connected with positive electrode layer 7010; Therefore, the conductive ink 7011 in the outburst area 7013 constitutes positive electrode, and the conductive ink 7021 that is coated on the diaphragm 7022 is electrically connected with positive electrode layer 7020; Therefore, the conductive ink in the outburst area 7,023 7021 constitutes negative electrode.
Below the power circuit that utilizes above-mentioned paper battery will be described.
Figure 54 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 53 a has been installed to the paper battery shown in the 53c 7001 on the said substrate, and Figure 54 b shows the structure with Figure 54 a institute presentation surface facing surfaces.In addition; Figure 55 a shows the structure on the surface of power circuit; Wherein Figure 53 a is installed on the circuit substrate shown in Figure 54 a, the 54b to the paper battery shown in the 53c 7001, and paper battery 7001 has been installed on it, and Figure 55 b shows the structure with Figure 55 a institute presentation surface facing surfaces.
Shown in Figure 54 a, 54b; On the surface of substrate 7002; Formation becomes the platform 7003a of first conductive region; On the back side of substrate 7002, become the platform 7003b of second conductive region, and the mode that links to each other with platform 7003a, 7003b according to counting circuit 7005 is with on counting circuit 7005 surfaces that form platform 7003a mounted thereto.The platform 7003b that is formed on the relative side with the side that counting circuit 7005 has been installed links to each other with counting circuit 7005 through through hole 7006.In addition, substrate 7002 is equipped with groove 7004, and when on the surface of the substrate 7002 that counting circuit 7005 has been installed mounted thereto with paper battery 7001, said substrate 7002 matches with the outburst area 7023 of paper battery 7001 through said groove 7004.
When on the circuit substrate that the paper battery 7001 shown in Figure 53 a, the 53b is installed in structure as stated; Paper battery 7001 is installed in such a way: the outburst area 7013 of paper battery 7001 contacts with the lip-deep platform 7003a that forms the substrate 7002 that counting circuit 7005 has been installed above that; For example, utilize the conductive material of anisotropy/conducting film (ACF), anisotropy/electroconductive binder (ACP) or silver paste that outburst area 7013 is bonded together with platform 7003a.In addition; In this case; The outburst area 7023 of paper battery 1 is through being arranged on groove on the substrate 7002 and penetrating with the surperficial facing surfaces that counting circuit 7005 has been installed and contact platform 7003a, and for example utilizes that the conductive material of ACF, ACP or silver paste is bonded together outburst area 7023 and platform 7003b.Here; Touch on the surface of outburst area 7013 of platform 7003a and be coated with the conductive ink 7011 that is electrically connected with the positive electrode layer 7010 of paper battery 7001; Therefore; When joining outburst area 7013 to a time-out with platform 7003a, the positive electrode layer 7010 of paper battery 7001 is electrically connected with platform 7003a.In addition; Touch on the surface of outburst area 7023 of platform 7003b and be coated with the conductive ink 7021 that is electrically connected with the positive electrode layer 7020 of paper battery 7001; Therefore; When joining outburst area 7023 to a time-out with platform 7003b, the positive electrode layer 7020 of paper battery 7001 is electrically connected with platform 7003b.In this manner, paper battery 7001 has formed the power circuit that is used for to counting circuit 7005 power supplies with platform 7003a, 7003b.
The manufacturing approach of above-mentioned power circuit will be described below.
Figure 56 a shows the manufacturing approach of the power circuit shown in Figure 55 a, the 55b to 56d.
At first, shown in Figure 56 a, when a plurality of substrate 7002 is set, on each substrate 7002, form platform 7003a, 7003b, shown in Figure 56 b, counting circuit 7005 is installed also, so that it links to each other with platform 7003a, 7003b.
Next, shown in Figure 56 c, form platform 7003a, 7003b, and will subtract the circuit substrate that counting circuit 7005 has been installed on it and be separated into single section.In this case, side by side in substrate 7002, form groove 7004, therefore need not to provide the extention that forms groove 7004 with separating of circuit substrate.
Then, shown in Figure 56 d, paper battery 7001 is installed on each circuit substrate in the single section state, and the outburst area 7013,7023 of platform 7003a, 7003b and paper battery 7001 is bonded together.
(the 19 embodiment)
Figure 57 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 53 a has been installed to the paper battery shown in the 53c 7001 on the said substrate, and paper battery 7001 has been installed on it, and Figure 57 b shows the structure with Figure 57 a institute presentation surface facing surfaces.In addition; Figure 58 a shows the structure on the surface of power circuit; Wherein Figure 53 a is installed on the circuit substrate shown in Figure 57 a, the 57b to the paper battery shown in the 53c 7001, and paper battery 7001 has been installed on it, and Figure 58 b shows the structure with Figure 58 a institute presentation surface facing surfaces.
Shown in Figure 57 a, 57b; In the circuit substrate of present embodiment; Three platform 7103a that constitute first conductive region on the surface of substrate 7102, have been formed; On the back side of substrate 7102, formed three platform 7103b that constitute second conductive region, and with on counting circuit 7105 sides that form platform 7103a mounted thereto, so as with these three platform 7103a and three platform 7103b in each link to each other.In three platform 7103a; The platform 7103a that is formed in the nearest zone of distance calculation circuit 7105 links to each other with counting circuit 7105; In three platform 7103b, the platform 7103b that is formed in distance calculation circuit 7105 zone farthest links to each other with counting circuit 7105 through through hole 7106.In addition; In platform 7103a; The platform 7103a that is formed in distance calculation circuit 7105 zone farthest passes through through hole 7106; Platform 7103b in the zone far away with being formed on distance calculation circuit 7,105 second among three platform 7103b is electrically connected; And the platform 7103a that is formed in platform 7103a middle distance counting circuit 7,105 second zone far away is electrically connected with the back side of substrate 7102 through through hole 7106, and with three platform 7103b in the platform 7103b that is formed in the nearest zone of distance calculation circuit 7105 link to each other.Therefore in addition, substrate 7102 is equipped with three grooves 7104, and when on the surface of the substrate 7102 that counting circuit 7105 has been installed mounted thereto with three paper batteries 7001, the outburst area 7023 of three paper batteries 7001 cooperates.In addition, along the length direction that is provided with outburst area 7013,7023, the pitch-row of three platform 7103a, 7103b is length half that except that outburst area 7013,7023, is installed in the paper battery 7001 on the substrate 7102.In this manner, when a plurality of paper batteries 7001 being installed on the circuit substrate so that with platform 7103a, when 7103b links to each other, a plurality of paper batteries 7001 overlap each other with the mode of imbrication (imbricate).In this manner, in the overlapping region, have only two continuous paper batteries 7001 to overlap each other.In this manner; The structure that adopts the part in a plurality of paper batteries 7001 to overlap each other can reduce the area of circuit substrate and realize that cost reduces; Only adopting two adjacent paper batteries 7001 to overlap each other under the situation of present embodiment of structure, can reduce the thickness of the overlapping region of paper battery 7001 considerably.
When on the circuit substrate that three paper batteries 7001 shown in Figure 53 a, the 53b is installed in structure as stated; The outburst area 7013 that 7001: three paper batteries 7001 of paper battery are installed in such a way contacts with the lip-deep platform 7003a that forms the counting circuit 7105 that substrate 7102 has been installed above that, and for example utilizing, the conductive material of ACF, ACP or silver paste is bonded together three outburst areas 7013 and platform 7103a.In addition; In this case; The outburst area 7023 of three paper batteries 7001 is through being arranged on groove on the substrate 7102 and penetrating with the surperficial facing surfaces that counting circuit 7105 has been installed and contact platform 7103a, and for example utilizes that the conductive material of ACF, ACP or silver paste is bonded together three outburst areas 7023 and platform 7103b.Begin from distance calculation circuit 7105 zone farthest, sequentially carry out the installation of three paper batteries 1 on substrate 7102 and the joint of outburst area 7013 and platform 7103a.Here; Outburst area 7013 is coated with the conductive ink 7011 that is electrically connected with the positive electrode layer 7010 of paper battery 7001 on it to the surface that touches platform 7103a; Therefore; When joining outburst area 7013 to a time-out with platform 7103a, the positive electrode layer 7010 of paper battery 7001 is electrically connected with platform 7103a.In addition; Outburst area 7023 touches on the surface of platform 7103b and is coated with the conductive ink 7021 that is electrically connected with the positive electrode layer 7020 of paper battery 7001 on it; Therefore; When joining outburst area 7023 to a time-out with platform 7103b, the positive electrode layer 7020 of paper battery 7001 is electrically connected with platform 7103b.In addition; In platform 7103a; The platform 7103a that is in distance calculation circuit 7105 zone farthest is electrically connected with the back side of substrate 7102 through through hole 7106; Be electrically connected with the platform 7103b that is formed in distance calculation circuit 7105 zone farthest among three platform 7103b, and the platform 7103a that is formed in distance calculation circuit 7,105 second zone far away is electrically connected with the back side of substrate 7102 through through hole 7106, and with three platform 7103a in the platform 7103b that is formed in the nearest zone of distance calculation circuit 7105 link to each other; Therefore; When paper battery 7001 being installed on the substrate 7102 so that with platform 7103a, when 7103b links to each other, these three paper batteries, 7001 series connection, three paper batteries 7001 and platform 7103a, the 7103b of series connection have formed the power circuit that is used for to counting circuit 7105 power supplies.
In above-mentioned the 18 embodiment; The outburst area 7023 of paper battery 7001 penetrates with the opposite face of circuit substrate and with platform 7003a and links to each other through being arranged on groove 7004 on the circuit substrate; Can also construct power unit; Identical with the situation of the paper battery 7001 farthest of three paper battery 7001 middle distance counting circuits 7105 shown in the 19 embodiment; Outburst area 7023 only an end place of circuit substrate penetrate with the circuit substrate facing surfaces in, and at least one paper battery 7001 links to each other with platform 7103b.
(the 20 embodiment)
Figure 59 a is the plane of embodiment that is used for the paper battery of power circuit according to twentieth embodiment of the invention, and Figure 59 b is the sectional view along the line A-A ' shown in Figure 59 a, and Figure 59 c is the sectional view along the line B-B ' shown in Figure 59 a.
Like Figure 59 a to shown in the 59c; In paper battery according to present embodiment; The positive electrode layer 7210 that to be processed by manganese dioxide etc. through gel electrolyte layer 7230 and the positive electrode layer of being processed by zinc etc. 7220 are laminated to together; To be laminated on positive electrode layer 7210 sides by the diaphragm 7212 that PET etc. processes, and will be laminated on positive electrode layer 7220 sides by the diaphragm 7222 that PET etc. processes.Remove a part of diaphragm 7212,7222, this has constituted exposed region 7213,7223, on different surface, exposes a part of positive electrode layer 7210 and positive electrode layer 7220 through said exposed region.
In the paper battery 7201 of as above structure, the exposed region 7213 that therefrom exposes positive electrode layer 7210 has constituted positive electrode, and the exposed region 7223 that therefrom exposes positive electrode layer 7220 has constituted negative electrode.
Below the power circuit that utilizes above-mentioned paper battery 7201 will be described.
Figure 60 a shows the structure on surface of the embodiment of sheet circuit substrate, Figure 59 a has been installed to the paper battery shown in the 59c 7201 on the said substrate, and paper battery 7201 has been installed on it, and Figure 60 b shows the structure with Figure 60 a institute presentation surface facing surfaces.In addition; Figure 61 a shows the structure on the surface of power circuit; Wherein Figure 59 a is installed on the circuit substrate shown in Figure 60 a, the 60b to the paper battery shown in the 59c 7201, and paper battery 7201 has been installed on it, and Figure 61 b shows the structure with Figure 61 a institute presentation surface facing surfaces.
Shown in Figure 60 a, 60b; In the circuit substrate of present embodiment; On the surface of substrate 7202, form the platform 7203a that constitutes first conductive region; On the back side of substrate 7202, form the platform 7203b that constitutes second conductive region, and with on counting circuit 7205 surfaces that form platform 7203a mounted thereto, so that it links to each other with platform 7203a, 7203b.Be formed on the surperficial apparent surface that counting circuit 7205 has been installed on platform 7203b link to each other with counting circuit 7205 through through hole 7206.In addition, substrate 7202 is equipped with groove 7204, and when on the surface of the substrate 7202 that counting circuit 7205 has been installed mounted thereto with paper battery 7201, said substrate 7202 matches with the outburst area 7223 of paper battery 7201 through said groove 7204.
In the time of on being installed in the paper battery 7201 shown in Figure 59 a, the 59b according to the circuit substrate of aforesaid way structure; Paper battery 7201 is installed in such a way: the exposed region 7213 of paper battery 7201 contacts with the lip-deep platform 7203a that forms the substrate 7202 that counting circuit 7205 has been installed above that; For example, for example utilizing, the conductive material of ACF, ACP or silver paste is bonded together exposed region 7213 and platform 7203a.In addition; In this case; The exposed region 7223 of paper battery 7201 is through being arranged on groove on the substrate 7202 and penetrating with the surperficial facing surfaces that counting circuit 7205 has been installed and contact platform 7203a, and for example utilizes that the conductive material of ACF, ACP or silver paste is bonded together exposed region 7223 and platform 7203b.Here; Owing on the surface of the exposed region 7213 that contacts platform 7203a, expose the positive electrode layer 7210 of paper battery 7201; When joining exposed region 7213 to a time-out with platform 7203a, the positive electrode layer 7210 of paper battery 7201 is electrically connected with platform 7203a.In addition; Owing on the surface of the exposed region 7223 that contacts platform 7203b, expose the positive electrode layer 7220 of paper battery 7201; When joining exposed region 7223 to a time-out with platform 7203b, the positive electrode layer 7220 of paper battery 7201 is electrically connected with platform 7203b.In this manner, paper battery 7201 has formed the power circuit that is used for to counting circuit 7205 power supplies with platform 7203a, 7203b.
The present invention shown in above-mentioned the 18 to the 20 embodiment is a kind of power circuit; Comprise the paper battery that constitutes by the positive electrode and the negative electrode that are laminated to through electrolyte layers together; Wherein expose said positive electrode and negative electrode from different surface; Link to each other with the sheet circuit substrate that has formed the conductive region that is used for linking to each other with electrode on it, and said paper battery has following structure: second conductive region that on different surfaces, forms first conductive region that will link to each other with one of negative electrode with positive electrode and will link to each other with another electrode in the negative electrode with positive electrode is installed in paper battery on the surface that is equipped with first conductive region; So that an electrode links to each other with first conductive region; And another electrode links to each other with second conductive region, therefore, can form power circuit; And can not increase the resistance between paper battery and the circuit substrate, and need not the fan-fold paper battery.
In addition; Under the situation of following structure: circuit substrate comprises groove; So that another electrode penetrates the back side from the front of circuit substrate; Another electrode of paper battery penetrates on it the side that forms second conductive region through groove and links to each other with second conductive region, even when paper battery is installed in the arbitrary portion of dividing circuit substrate one end, also can make another electrode of paper battery penetrate the opposite side of circuit substrate and link to each other with second conductive region through groove.
In addition; Under the situation of following structure: when on circuit substrate, forming many group first and second conductive regions; And the paper battery of counting similar number with the group of first and second conductive regions is installed; So that when linking to each other with a plurality of first and second conductive regions, a plurality of first and second conductive regions are linked to each other so that during the series connection of a plurality of paper batteries, can form power circuit with a plurality of paper batteries series connection.
In addition; Under the situation of following structure: when first and second conductive regions are installed on circuit substrate so that a plurality of paper battery is when linking to each other with a plurality of first and second conductive regions; At least a portion in a plurality of paper batteries overlaps each other, can reduce to have installed on it a plurality of paper batteries circuit substrate area and realize that cost reduces.
(the 21 embodiment)
Figure 62 a is according to 21st embodiment of the invention; Be used to utilize the plane of embodiment of the paper battery of the power circuit that the method for making power circuit makes; Figure 62 b is the sectional view along the line A-A ' shown in Figure 62 a, and Figure 62 c is the sectional view along the line B-B ' shown in Figure 62 a.
Like Figure 62 a to shown in the 62c; Construct the paper battery of present embodiment in such a way: through gel electrolyte layer 8030; The positive electrode layer 8010 that to be processed by manganese dioxide etc. and the positive electrode layer of being processed by zinc etc. 8020 are laminated to together; The diaphragm 8012 of being processed and be coated with on it conductive ink 8011 by PET (polyethylene terephthalate) etc. is laminated on positive electrode layer 8010 sides, and is laminated on positive electrode layer 8020 sides by the diaphragm 8022 that PET etc. processed and be coated with on it conductive ink 8021.In addition; The diaphragm 8012 that is coated with conductive ink 8011 comprises from the outstanding outburst area 8013 of the exterior contour of positive electrode layer 8010, positive electrode layer 8020 and electrolyte layers 8030; The diaphragm 8022 that is coated with conductive ink 8021 comprises that the exterior contour place of positive electrode layer 8010, positive electrode layer 8020 and the electrolyte layers 8030 of these outburst areas 8013,8023 in zones of different is outstanding from the outstanding outburst area 8023 of the exterior contour of positive electrode layer 8010, positive electrode layer 8020 and electrolyte layers 8030.Because conductive ink 8011,8021 is coated in respectively on the diaphragm 8012,8022 on positive electrode layer 8010 sides and positive electrode layer 8020 sides, the surface that in outburst area 8013,8023, exposes conductive ink 8011,8021 is a different surface.In addition, in diaphragm 8012,8022, in outburst area 8013,8023, there is the lip-deep zone that exposes diaphragm 8012,8022 and conductive ink 8011,8021 is not applied to be coated with conductive ink 8011,8021.
In the paper battery 8001 of as above structure; Because the conductive ink 8011 that is coated on the diaphragm 8012 is electrically connected with positive electrode layer 8010; Therefore, the conductive ink 8011 in the outburst area 8013 constitutes positive electrode, and the conductive ink 8021 that is coated on the diaphragm 8022 is electrically connected with positive electrode layer 8020; Therefore, the conductive ink in the outburst area 8,023 8021 constitutes negative electrode.
Figure 63 shows Figure 62 a to three paper batteries 8001 of connecting shown in the 62c.
Shown in Figure 63; In the following manner three paper battery 8001a are linked to each other to 8001c: paper battery 8001a is superimposed upon paper battery 8001b upward and with it is bonded together; So that the conductive ink in the outburst area 8023 of paper battery 8001a 8021 is in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001b; And paper battery 8001b is superimposed upon that paper battery 8001c goes up and it is bonded together, so that the conductive ink in the outburst area 8023 of paper battery 8001b 8021 is in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001c.In this manner, three the paper battery 8001a that connect are to 8001c, so that the conductive ink in the outburst area 13 of paper battery 8001a 8011 constitutes positive electrode, and the conductive ink 8021 in the outburst area 8023 of paper battery 8001c constitutes negative electrode.
Below the power circuit that utilizes above-mentioned paper battery 8001 will be described.
Figure 64 a shows according to 21st embodiment of the invention; Be used to utilize the structure on a surface of embodiment of the sheet circuit substrate of the power circuit that the method for making power circuit makes, Figure 64 b shows another surperficial structure of the circuit substrate shown in Figure 64 a.In addition, Figure 65 a shows and is installed in shown in Figure 64 a, the 64b on the circuit substrate, has the structure of the 8001a of paper battery shown in Figure 63 to a surface of the power circuit of 8001c, and Figure 65 b shows another surperficial structure of the power circuit shown in Figure 65 a.
Shown in Figure 64 a, 64b; In the circuit substrate of present embodiment; On a surface of the plate shape substrates of processing by the resin of for example PET 8032, computing element 8034 has been installed, and has been formed the platform 8031a that constitutes splicing ear; Be used for linking to each other with the conductive ink 8011 (becoming the positive electrode of the paper battery 8001a shown in Figure 63) of outburst area 8013; On another surface of substrate 8032, form platform 8031b as splicing ear, be used for linking to each other with the conductive ink 8021 (becoming the negative electrode of the paper battery 8001c shown in Figure 63) of outburst area 8023; Through wiring pattern 8037a computing element 8034 is linked to each other with platform 8031a, and with wiring pattern 8037b computing element 8034 is linked to each other with platform 8031b through through hole 8036.In addition, in each zone that forms platform 8031a, 8031b, form a plurality of meticulous hole 8033a, 8033b.
When on the circuit substrate that the paper battery 8001a shown in Figure 63 is installed in structure in this manner to 8001c; Shown in Figure 65 a, 65b; Paper battery 8001a is installed on the circuit substrate to 8001c; So that the conductive ink 8011 that becomes in the outburst area 8013 of positive electrode of paper battery 8001a contacts with platform 8031a; And the conductive ink 8021 that becomes in the outburst area 8023 of negative electrode of paper battery 8001c contacts with platform 8031b, and the outburst area 8013 that engages paper battery 8001a through ultrasonic wave joins to together with platform 8031a, and the outburst area 8023 that engages paper battery 8001c through ultrasonic wave joins to together with platform 8031b.Here; Because the conductive ink 8011 that touches in the outburst area 8013 platform 8031a, paper battery 8001a links to each other with the positive electrode layer 8010 of paper battery 8001a; If the outburst area 8013 of paper battery 8001a is joined to platform 8031a, the positive electrode layer 8010 of paper battery 8001a is electrically connected with platform 8031a.In addition; Because the conductive ink 8021 that touches in the outburst area 8023 platform 8031b, paper battery 8001c links to each other with the positive electrode layer 8020 of paper battery 8001a; If the outburst area 8023 of paper battery 8001c is joined to platform 8031b, the positive electrode layer 8020 of paper battery 8001c is electrically connected with platform 8031b.In this manner, the paper battery 8001a of series connection has formed the power circuit that is used for to computing element 8034 power supplies to 8001c and platform 8031a, 8031b.
The manufacturing approach of above-mentioned power circuit will be described below.
Figure 66 a shows the manufacturing approach of the power circuit shown in Figure 65 a, the 65b to 66e.Figure 66 a only shows a surface of the power circuit shown in Figure 65 a, the 65b to 66e, but following explanation is also followed on other surface.
At first; Shown in Figure 66 a; On a surface of the plate shape substrates of processing by the resin of for example PET 8032; Form platform 8031a and the wiring pattern 8037a that will link to each other, and on another surface of substrate 8032, form platform 8031b and the wiring pattern 8037b that will link to each other with this platform 8031b with this platform 8031a.In addition, also on substrate 8032, form through hole 8036.For example, can be made of copper platform 8031a, 8031b, wiring pattern 8037a, 8037b and through hole 8036 also forms through etching.
Next, shown in Figure 66 b, in each zone of the substrate 8032 that forms platform 8031a and 8031b, formation be penetrated into from the front of substrate 8032 back side, diameter is approximately 0.5 to 2mm a plurality of hole 8033a, 8033b.Can also side by side realize hole 8033a, 8033b with 8032 steps that form through 8036 on substrate.
Next, shown in Figure 66 c, computing element 8034 is installed on the substrate 8032, so that wiring pattern 8037a is linked to each other with through hole 8036.
In addition; Shown in Figure 63, paper battery 8001a is superimposed upon on the paper battery 8001b, so that the conductive ink in the outburst area 8023 of paper battery 8001a 8021 is in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001b; Paper battery 8001b is superimposed upon on the paper battery 8001c; So that the conductive ink in the outburst area 8023 of paper battery 8001b 8021 under this condition, is carried out ultrasonic vibration to overlap-add region in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001c.Then; Melted the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 and paper battery 8001b in the outburst area 8023 of paper battery 8001a through this vibration; And the outburst area 8023 of paper battery 8001a and the outburst area 8013 of paper battery 8001b are bonded together through the ultrasonic wave joint; Melted the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 and paper battery 8001c in the outburst area 8023 of paper battery 8001b through this vibration, and engaged through ultrasonic wave the outburst area 8023 of paper battery 8001b and the outburst area 8013 of paper battery 8001c are bonded together.In this manner, shown in Figure 66 d, three the paper battery 8001a that connected are to 8001c.In addition; In this case; Be melted in diaphragm 8022 that exposes in the outburst area 8023 of paper battery 8001a and the diaphragm 8012 that in the outburst area 8013 of paper battery 8001b, exposes; And engage through ultrasonic wave it is bonded together, be melted in diaphragm 8022 that exposes in the outburst area 8023 of paper battery 8001b and the diaphragm 8012 that in the outburst area 8013 of paper battery 8001c, exposes, and engage through ultrasonic wave it is bonded together.
In the present embodiment; On the surface of the outburst area that is coated with conductive ink 8011,8,021 8013,8023; There is the zone that does not have coating electrically conductive China ink 8011,8021 and expose diaphragm 8012,8022; And in these zones, engage through ultrasonic wave diaphragm 8012,8022 is bonded together, but can also adopt following structure: conductive ink 8011 is coated on the whole surface of a side that is coated in diaphragm 8022 on the whole surface of a side of diaphragm 8012 and with conductive ink 8021.In this case; If using ultrasound ripple vibration as stated; Only, can the outburst area 8023 of paper battery 8001a and the outburst area 8013 of paper battery 8001b be bonded together through the ultrasonic wave joint through the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 in the outburst area 8023 of fusing paper battery 8001a and paper battery 8001b.In addition; Equally; Only, can the outburst area 8023 of paper battery 8001b and the outburst area 8013 of paper battery 8001c be bonded together through the ultrasonic wave joint through the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 in the outburst area 8023 of fusing paper battery 8001b and paper battery 8001c.
Then; The paper battery 8001a of series connection is installed on the substrate 8032 to 8001c; So that the conductive ink in the outburst area 8013 of paper battery 8001a 8011 is in the face of the platform 8031a of substrate 8032; And the conductive ink in the outburst area 8023 of paper battery 8001c 8021 is in the face of the platform 8031b of substrate 8032, under this condition, and the part that ultrasonic vibration is applied to face with each other.Then, shown in Figure 66 e, through the conductive ink 8011 in the outburst area 8013 of ultrasonic vibration fusing paper battery 8001a, and the outburst area 8013 that engages paper battery 8001a through ultrasonic wave is bonded together with platform 8031a.In addition, also through the conductive ink 8021 in the outburst area 8023 of ultrasonic vibration fusing paper battery 8001c, and the outburst area 8023 that engages paper battery 8001c through ultrasonic wave is bonded together with platform 8031b.In this manner, the paper battery 8001a that is electrically connected series connection is to 8001c and platform 8031a, and paper battery 8001a has formed the power circuit that is used for to computing element 8034 power supplies to 8001c and platform 8031a, 8031b.In this case, conductive ink 8011 inflows of melting through ultrasonic vibration are formed on the hole 8033a on the platform 8031a, and are formed on the hole 8033b on the platform 8031b through conductive ink 8021 inflows of ultrasonic vibration fusing.
Figure 67 shows the substrate 8032 that utilizes the power circuit that Figure 66 a makes to the manufacturing approach shown in the 66e and paper battery 8001a to the connection status between the 8001c, and shows along the sectional view of the line A-A ' shown in Figure 66 e.
Shown in Figure 67, conductive ink 8011,8021 inflows of melting through ultrasonic vibration are formed on platform 8031a, last hole 8033a, the 8033b of 8031b.Also will be in this manner engage the outburst area 8013 that be engaged with paper battery 8011a together and the outburst area 8023 of platform 8031a and paper battery 8001c is bonded together in hole 8033a, 8033b with platform 8031b through ultrasonic wave, this has increased engaging zones and has improved engaging force.
In the present embodiment; In platform 8031a, 8031b, form hole 8033a, the 8033b that penetrates the back side from the front of substrate 8032 respectively; If but allow to flow into each hole through the conductive ink 8011,8021 of ultrasonic vibration fusing; Then do not need hole 8033a, 8033b to penetrate, and can be the groove that replaces the hole.In addition, can also use work, so that the surperficial roughening of platform 8031a, 8031b.
(the 22 embodiment)
Figure 68 a shows according to 22nd embodiment of the invention; Be used to utilize the structure on a surface of embodiment of the sheet circuit substrate of the power circuit that the method for making power circuit makes, Figure 68 b shows another surperficial structure of the circuit substrate shown in Figure 68 a.In addition, Figure 69 a shows and is installed in shown in Figure 68 a, the 68b on the circuit substrate, has the structure of the 8001a of paper battery shown in Figure 63 to a surface of the power circuit of 8001b, and Figure 69 b shows another surperficial structure of the power circuit shown in Figure 69 a.
Shown in Figure 68 a, 68b; In the circuit substrate of present embodiment; On a surface of the plate shape substrates of processing by the resin of for example PET 8132, computing element 8134 has been installed, and has been formed the platform 8131a that constitutes splicing ear; Be used for linking to each other with the conductive ink 8011 (becoming the positive electrode of the paper battery 8001a shown in Figure 63) of outburst area 8013; On another surface of substrate 8132, form the platform 8131b that constitutes splicing ear, be used for linking to each other with the conductive ink 8021 (becoming the negative electrode of the paper battery 8001c shown in Figure 63) of outburst area 8023; Through wiring pattern 8137a computing element 8134 is linked to each other with platform 8131a, and computing element 8134 is linked to each other with platform 8131b through wiring pattern 8137b.Here; According to present embodiment; Setting platform 8131a, 8131b; In such a way paper battery 8001a is installed in 8132 last times of substrate to 8001c with box lunch: the outburst area 8013 of the paper battery 8001a shown in Figure 63 in the face of the outburst area 8023 of platform 8131a and paper battery 8001c in the face of platform 8131b, then in a part of zone, do not form platform 8131a, 8131b in the face of the outburst area 8013,8023 of paper battery 8001a.
When on the circuit substrate that the paper battery 8001a shown in Figure 63 is installed in structure in this manner to 8001c; Shown in Figure 69 a, 69b; Paper battery 8001a is installed on the circuit substrate to 8001c; So that the conductive ink 8011 that becomes in the outburst area 8013 of positive electrode of paper battery 8001a contacts with platform 8131a; And the conductive ink 8021 that becomes in the outburst area 8023 of negative electrode of paper battery 8001c contacts with platform 8131b, and the outburst area 8013 that engages paper battery 8001a through ultrasonic wave joins to together with platform 8131a, and the outburst area 8023 that engages paper battery 8001c through ultrasonic wave joins to together with platform 8131b.Here; Because the conductive ink 8011 that touches in the outburst area 8013 platform 8131a, paper battery 8001a links to each other with the positive electrode layer 8010 of paper battery 8001a; The outburst area 8013 of therefore working as paper battery 8001a joins a time-out to platform 8131a, and the positive electrode layer 8010 of paper battery 8001a is electrically connected with platform 8131a.In addition; Because the conductive ink 8021 that touches in the outburst area 8023 platform 8131b, paper battery 8001c links to each other with the positive electrode layer 8020 of paper battery 8001a; The outburst area 8023 of therefore working as paper battery 8001c joins a time-out to platform 8131b, and the positive electrode layer 8020 of paper battery 8001c is electrically connected with platform 8131b.In this manner, the paper battery 8001a of series connection has formed the power circuit that is used for to computing element 8134 power supplies to 8001c and platform 8131a, 8131b.
The manufacturing approach of above-mentioned power circuit will be described below.
Figure 70 a shows the manufacturing approach of the power circuit shown in Figure 69 a, the 69b to Figure 70 d.Figure 70 a only shows a surface of the power circuit shown in Figure 69 a, the 69b to 70d, but following explanation is also followed on other surface.
At first; Shown in Figure 70 a; On a surface of the plate shape substrates of processing by the resin of for example PET 8132; Form platform 8131a and the wiring pattern 8137a that will link to each other, and on another surface of substrate 8132, form platform 8131b and the wiring pattern 8137b that will link to each other with this platform 8131b with this platform 8131a.And embodiment does not form platform 8131a, 8131b in a part of zone of the outburst area 8013,8023 of facing paper battery 8001a; Therefore when paper battery 8001a is installed in 8132 last times of substrate to 8011c; The outburst area 8013 of paper battery 8001a is in the face of platform 8131a, and the outburst area 8023 of paper battery 8001c is in the face of platform 8131b.In addition, also on substrate 8132, form through hole 8136.For example, can be made of copper platform 8131a, 8131b, wiring pattern 8137a, 8137b and through hole 8136 also forms through etching.
Next, shown in Figure 70 b, computing element 8134 is installed on the substrate 8132, so that wiring pattern 8137a is linked to each other with through hole 8136.
In addition; Shown in Figure 63, paper battery 8001a is superimposed upon on the paper battery 8001b, so that the conductive ink in the outburst area 8023 of paper battery 8001a 8021 is in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001b; And paper battery 8001b is superimposed upon on the paper battery 8001c; So that the conductive ink in the outburst area 8023 of paper battery 8001b 8021 under this condition, is carried out ultrasonic vibration to the overlapping region in the face of the conductive ink 8011 in the outburst area 8013 of paper battery 8001c.Then; Melted the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 and paper battery 8001b in the outburst area 8023 of paper battery 8001a through this vibration; And the outburst area 8023 of paper battery 8001a and the outburst area 8013 of paper battery 8001b are bonded together through the ultrasonic wave joint; In addition; Melted the conductive ink 8011 in the outburst area 8013 of conductive ink 8021 and paper battery 8001c in the outburst area 8023 of paper battery 8001b through this vibration, and engaged through ultrasonic wave the outburst area 8023 of paper battery 8001b and the outburst area 8013 of paper battery 8001c are bonded together.In this manner, shown in Figure 66 d, three the paper battery 8001a that connected are to 8001c.In addition; In this case; Be melted in diaphragm 8022 that exposes in the outburst area 8023 of paper battery 8001a and the diaphragm 8012 that in the outburst area 8013 of paper battery 8001b, exposes; And engage through ultrasonic wave it is bonded together, be melted in diaphragm 8022 that exposes in the outburst area 8023 of paper battery 8001b and the diaphragm 8012 that in the outburst area 8013 of paper battery 8001c, exposes, and engage through ultrasonic wave it is bonded together.In present embodiment and the 21 embodiment; When on the whole surface that conductive ink 8011,8021 is coated in diaphragm 8012,8022; The conductive ink 8011 of the outburst area 8013 of the conductive ink 8021 of the outburst area 8023 through fusing paper battery 8001a and paper battery 8001b only; Utilizing ultrasonic wave to engage is bonded together the outburst area 8023 of paper battery 8001a and the outburst area 8013 of paper battery 8001b; And the conductive ink 8011 of the outburst area 8013 of conductive ink 8021 and the paper battery 8001c of the outburst area 8023 through fusing paper battery 8001b only, utilize ultrasonic wave to engage the outburst area 8023 of paper battery 8001b and the outburst area 8013 of paper battery 8001c are bonded together.
Then; The paper battery 8001a of series connection is installed on the substrate 8132 to 8001c; So that the conductive ink in the outburst area 8013 of paper battery 8001a 8011 is in the face of the platform 8131a of substrate 8132; And the conductive ink in the outburst area 8023 of paper battery 8001c 8021 is in the face of the platform 8131b of substrate 8132, under this condition, and the part that ultrasonic vibration is applied to face with each other.Then, shown in Figure 66 d, through the conductive ink 8011 in the outburst area 8013 of ultrasonic vibration fusing paper battery 8001a, and the outburst area 8013 that engages paper battery 8001a through ultrasonic wave is bonded together with platform 8131a.In addition, also through the conductive ink 8021 in the outburst area 8023 of ultrasonic vibration fusing paper battery 8001c, and the outburst area 8023 that engages paper battery 8001c through ultrasonic wave is bonded together with platform 8131b.In this manner, the paper battery 8001a that is electrically connected series connection is to 8001c and platform 8131a, and paper battery 8001a has formed the power circuit that is used for to computing element 8134 power supplies to 8001c and platform 8131a, 8131b.In this case; In the zone of the outburst area 8013 of facing paper battery 8001a; Also wherein do not form the zone of platform 8131a through the ultrasonic vibration fusing; And in the zone of the outburst area 8023 of facing paper battery 8001c, also wherein do not form the zone of platform 8131b through the ultrasonic vibration fusing.
Figure 71 shows the substrate 8132 that utilizes the power circuit that Figure 70 a makes to the manufacturing approach shown in the 70d and paper battery 8001a to the connection status between the 8001c, and shows along the sectional view of the line A-A ' shown in Figure 71 d.
Shown in Figure 71; When the outburst area that ultrasonic vibration is applied to paper battery 8001a 8013 in the face of the outburst area 8023 of the zone of the platform 8131a of substrate 8132 and paper battery 8001c during in the face of the platform 8131b of substrate 8132 regional; Melted the conductive ink 8011 in the outburst area 8013 of paper battery 8001a; And melted do not form platform 8131a, in the face of the substrate 8132 in the zone of this outburst area 8013, and it is bonded together.Equally, melted the conductive ink 8021 in the outburst area 8023 of paper battery 8001c, and melted do not form platform 8131b, in the face of the substrate 8132 in the zone of this outburst area 8023, and it is bonded together.In this manner, improved paper battery 8001a to the engaging force between 8001c and the substrate 8132.
Here, can also improve paper battery 8001a to the engaging force between 8001c and the substrate through the above-mentioned the 21 and the 22 embodiment is combined.
In addition; The the above-mentioned the 21 and the 22 embodiment is through being applied to diaphragm 8012,8022 with conductive ink 8011,8021; In the outburst area 8013,8023 of 8001c, constructed positive electrode and negative electrode at paper battery 8001a, but can also utilize one of optional preferred metallics (the for example mixture of graphite, iron, nickel, titanium, copper, stainless steel or these metals) to be configured in positive electrode and the negative electrode of paper battery 8001a to 8001c.
In the present invention shown in the above-mentioned the 21 and the 22 embodiment; Engage positive electrode and negative electrode and two splicing ears that electrical connection is arranged on the paper battery on the circuit substrate through ultrasonic wave; Therefore; During power circuit that the paper battery that on making by circuit substrate, links to each other constitutes, can improve productivity ratio and need not to improve manufacturing cost.
In addition; Under the situation of the structure that may further comprise the steps: in the zone of the circuit substrate that forms splicing ear, form the hole; The positive electrode and the negative electrode that then pass through the paper battery of ultrasonic vibration fusing flow into these holes; This has increased the engaging force between paper battery and the circuit substrate, and has improved reliability.
In addition; Under following structure situation: when on circuit substrate, paper battery being installed; In the subregion of the positive electrode of facing circuit substrate and negative electrode, do not form splicing ear; In the face of the positive electrode of circuit substrate and the subregion of negative electrode, this makes and has increased the engaging force between paper battery and the circuit substrate, and can improve durability and reliability for for example folding external force through the ultrasonic vibration fusing.
Although with particular term the preferred embodiments of the present invention have been described, this is explained only as demonstration purpose, is appreciated that under the prerequisite of spirit that does not break away from appended claims or scope, can change and variant.

Claims (4)

1. an audio message transfer sheet (1) comprises audio information recording/transcriber (30), can the recoding/reproduction audio-frequency information, and said audio message transfer sheet (1) is characterised in that:
Two support chips (20a, 20b); Each support chip all has at least one first hole (21a, 22,23,24a, 21b, 24b); Said support chip is bonded together and supports said audio information recording/transcriber, and at least one of wherein said support chip first hole is in the face of the ledge of said audio information recording/transcriber; And
Two surface patch (10a, 10b) that engage with said two support chips and processed by paper base material are between said surface patch is clipped in said two support chips;
Wherein, said audio information recording/transcriber comprises: sound information output device (40) is used to export the audio-frequency information that is write down; Said sound information output device comprises:
Piezoelectric element (41) is used to export said audio-frequency information;
Have the diaphragm (43) greater than the diameter of said piezoelectric element, said diaphragm pastes on the surface of said piezoelectric element; And
The vibrating membrane (42) in second hole is equipped with; Said second hole has greater than the diameter of said piezoelectric element and less than the diameter of the diameter of said diaphragm; Cooperate the mode in said second hole that said vibrating membrane is pasted on the said diaphragm according to said piezoelectric element; Only in said vibrating membrane and surface that said diaphragm engages, do not engage in the zone of said diaphragm, one in said vibrating membrane and said two support chips is engaged.
2. audio message transfer sheet according to claim 1, wherein said two support chips have the exterior contour identical with said surface patch.
3. audio message transfer sheet according to claim 1, each in wherein said two support chips is divided into a plurality of parts.
4. audio message transfer sheet according to claim 1, wherein said audio information recording/transcriber comprises:
Audio information recording device (34) is used to write down said audio-frequency information; And
Operating means (33), operation are used for being recorded in from said sound information output device output the audio-frequency information of said audio information recording device.
CN2004800249076A 2003-08-28 2004-08-30 Audio message transfer sheet and manufacturing method thereof, and power supply circuit Expired - Fee Related CN1845827B (en)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
JP2003304720A JP2005079160A (en) 2003-08-28 2003-08-28 Power supply circuit
JP2003304719 2003-08-28
JP304720/2003 2003-08-28
JP304719/2003 2003-08-28
JP406656/2003 2003-12-05
JP2003406656A JP2005165156A (en) 2003-12-05 2003-12-05 Pop indication tool
JP2004107536A JP2005292472A (en) 2004-03-31 2004-03-31 Speech information sending device
JP107536/2004 2004-03-31
JP158299/2004 2004-05-27
JP158298/2004 2004-05-27
JP2004158298A JP4362086B2 (en) 2003-08-28 2004-05-27 Voice message transmission sheet
JP2004158299A JP4357364B2 (en) 2004-05-27 2004-05-27 Audio information output sheet
JP2004177024A JP4528033B2 (en) 2004-06-15 2004-06-15 label
JP177023/2004 2004-06-15
JP177021/2004 2004-06-15
JP177025/2004 2004-06-15
JP2004177021A JP2006004656A (en) 2004-06-15 2004-06-15 Manufacturing method of power circuit and joining method of paper battery
JP177024/2004 2004-06-15
JP2004177023A JP2006001038A (en) 2004-06-15 2004-06-15 Speech information sending body
JP2004177025A JP2006001040A (en) 2004-06-15 2004-06-15 Voice message transmission sheet
PCT/JP2004/012465 WO2005021280A1 (en) 2003-08-28 2004-08-30 Speech-message delivery sheet, its manufacturing method, and power supply circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2008101361529A Division CN101318425B (en) 2003-08-28 2004-08-30 Audio message transfer sheet

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CN1845827A CN1845827A (en) 2006-10-11
CN1845827B true CN1845827B (en) 2012-05-30

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CN2004800249076A Expired - Fee Related CN1845827B (en) 2003-08-28 2004-08-30 Audio message transfer sheet and manufacturing method thereof, and power supply circuit
CN2008101361529A Expired - Fee Related CN101318425B (en) 2003-08-28 2004-08-30 Audio message transfer sheet

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DE102013104567A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Chip arrangement, chip card arrangement and method for producing a chip arrangement

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20010018809A1 (en) * 1996-07-23 2001-09-06 Heropoulos George W. Electroluminescent display apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010018809A1 (en) * 1996-07-23 2001-09-06 Heropoulos George W. Electroluminescent display apparatus

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