CN1361906A - 覆盖模制的电子器件 - Google Patents

覆盖模制的电子器件 Download PDF

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CN1361906A
CN1361906A CN00810358A CN00810358A CN1361906A CN 1361906 A CN1361906 A CN 1361906A CN 00810358 A CN00810358 A CN 00810358A CN 00810358 A CN00810358 A CN 00810358A CN 1361906 A CN1361906 A CN 1361906A
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J·约卡姆
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Avid Identification Systems Inc
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    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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    • B29C45/14598—Coating tubular articles

Abstract

本发明揭示一种制造、组成覆盖模制部件(32)的方法,该覆盖模制部件由上述方法制造并组装有例如用于无线电频率识别装置的覆盖模制转发器(10)电路。

Description

覆盖模制的电子器件
技术领域
本发明一般涉及含有铁氧体磁芯、粉末金属磁芯和高能材料磁芯的覆盖模制的电子器件和装置领域中的产品和材料，具体而言，本发明涉及上述材料及通过对含该材料的电子器件进行覆盖模制而制得的产品。本发明尤其可用于通过覆盖模制过程制造的电子识别(“EID”)或无线电频率识别(“RFID”)器件和装置领域。
背景技术
钐-钴或钕-铁-硼等铁氧体磁芯、粉末金属磁芯和高能材料磁体具有某些有利的磁场和电场特性，从而用于某种类型的电子器件和电路是理想的。这类材料是脆弱的，但该材料可制成各种形状且通常在压负荷下呈现良好的机械性能。但是这些易碎材料通常拉伸强度不足，在经受相对适中的拉伸、结合或碰撞载荷时，往往导致破裂或断裂。制成材料中的破裂和断裂可显著降低有益的磁、电场特性并对其期望性能产生负面影响。这类易碎材料的最大利用要求考虑并适应其有限的物理特性。
得益于使用铁氧体磁芯作为电路一部分的应用例子是用于EID或RFID系统的电子识别(“FID”)或无线电频率识别(“RFID”)转发器电路。EID和RFID系统通常包含信号发射机或“读出器”，可发射千赫(KHz)频段的高频信号或兆赫(MHz)频段的超高频信号。由读出器发射的信号被“转发器”接收，后者在检测或接收读出器信号时以某种方式启动。在EID和RFID系统中，转发器产生信号或电感性耦合至读出器，使后者从转发器的存储器中获得识别码或数据。
通常，EID或RFID系统中的转发器包含附于诸如线圈等天线的信号处理电路。对某些应用，该线圈可缠绕在铁氧体芯、金属粉末芯或磁芯上。信号处理电路如本领域技术人员所知，包括许多包含不同工作器件的集成电路，其中即使不是所有工作器件也是许多工作器件均可制成一个作为EID和RFID设备信号处理电路主器件的单个集成电路中。
例如，某类“有源”RTID转发器可包含电池等电源，也附于电路板和集成电路。电池用于在转发器工作期间向信号处理电路供电。其它类型的转换器，例如“半双工”(“HDX”)转发器包含从读出器接收能量的元件(如线圈)和转换并存储能量的元件(如变压器/电容器)。在HDX系统中，读出器产生的发射信号按周期接通和断开，在发射周期电感性耦合至线圈，对电容器充电。在读取器发射信号停止时，电容器对转发器电路放电以对转发器供电，从而该转发器可发射或产生读取器接收的信号。
作为比较，“全双工”(“FDX”)系统包含的转发器通常不含电池或存储能量的元件。代之以，在FDX转发器中，读取器发射的场的能量电感耦合至转发器的天线或线圈并传至整流器，以获得电力驱动转发器的信号处理电路并与发送读出器发射信号的同时产生对读出器的响应。
HDX和FDX有源转发器的许多不同电路设计是本技术领域熟知的并在许多公告专利中已有叙述，因而这里不再详细说明。目前使用的许多种EID和RFID转发器具有的特定优点源由其可以某种方式植入或埋置在识别对象中从而可隐藏而免于被可视观察或检测。对这类应用，最好整个转发器封闭在密封部件中，从而例如允许植入待识别的生物物品中，或可用于浸没、腐蚀或易误用的环境中。各参考文献，包括专利号为4262632、525550、5211129、5223851、5281855和5482008的美国专利揭示了把各转发器电路完全密封在陶瓷、玻璃或金属容器中的方案。
为密封转发器，通常是先组装转发器电路，然后把该电路插入一端已密封的玻璃、陶瓷或金属柱体中。通常玻璃圆柱体的开启端用火焰熔化从而形成密封的容器。如例如专利号为5482008的美国专利中所述，其它类型的玻璃、陶瓷或金属容器通过把一个盖粘接或机械结合至柱体开启端而用该盖密封开启端。进而，如上述专利所讨论的那样，为防止转发器电路在容器内侧移动，已知可利用环氧树脂材料把转发器电路粘合在容器内表面。
如例如USP4262632(该专利通过引用与本申请结合)所示，把EID和RFID用于例如家畜识别等生物应用的潜在优点已研究了多年。如USP 4262632中所讨论，研究表明，如果EID“丸”状转发器比重为2或2以上和/或其总重量超过60克，该丸状转发器适用于放置在反刍动物的蜂窝胃中并保持在其中不定时间。由于EID电路仅需要集成电路、天线和少量其它元件，其通常很小且很轻，从而对这类应用，丸状转发器常要求配重部件。例如在USP4262632中已计论，在包含EID转发器的密封物中放置铁氧体配重件。
适用于反刍动物的丸状转发器设计的优点也来自适当使用磁芯或铁氧体芯以增强转发器信号发送特性，同时提供必要重量使该丸状转发器比重为2或大于2和/或其总重超过60克。但是为使EID丸状转发器装置对于反刍动物的应用被普遍接收，该装置的设计和制造还必须理解家畜应用的物理和经济要求。这样，尽管研究用于蜂窝胃环境的陶瓷密封的丸状转发器，陶瓷的成本及其易碎的物理性能却影响其付诸商用。从而制造EID转换器容器或壳体的密封物不受陶瓷、玻璃或金属密封物限制，尤其对于丸状转发器将十分有利。
发明内容
本发明关注对电子装置进行覆盖模制的方法、设备和材料，该电子装置包含铁氧体芯、粉末金属芯和磁芯材料及相关电路(如用于EID或RFID转发器的电路)，从而密封材料是适于要应用的环境的塑料、聚合物或弹性体(橡胶)或其它可注塑模制的材料。根据本发明，密封材料可用于注模或挤压模制处理中以对转发器中的芯和电路进行覆盖模制。进而，本发明关注一种对于保护电子部件免受环境破坏特别有用的新被覆材料。
附图说明
图1是根据本发明制造的含覆盖模制芯的转发器的侧视剖面图。
图2是图1所示转发器的剖面图。
图3是用于进行覆盖模制处理以制造图1所示转发器的模制工具的立体图。
图4是在把模制材料注入模制工具开始阶段期间图3所示模制工具的剖面图。
图5是表示模制过程稍后阶段的图3所示模制工具的第2剖面图。
图6是表示模制过程更后阶段的图3所示的模制工具的另一剖面图。
图7是图3所示工具的另一剖面图，表示芯的中央插脚缩回工具的模制过程。
图8是尚未被模压材料覆盖的转发器另一结构的侧视图。
图9是图8所示转发器的前视图。
图10表示在注模过程与图6所示相同阶段置入图3所示模制工具的图8和图9所示转发器。
图11表示在覆盖模制注模过程中与图6所示步骤相同的阶段置入图3所示工具的易碎芯件。
图12是根据本发明方法用覆盖模制材料覆盖模制的易碎芯的剖面图。
图13是模制工具另一设计中在覆盖模制过程由一个或一个以上中央部件定位的转发器的立体图。
图14是图13所示中央部件的立体图。
较佳实施例的详细叙述
图1是根据本发明制成的转发器10的侧视剖面图。图2是图1的转发器10的端视图。转发器10包含信号处理电路，如与电容器16等其它电路元件一起安装在电路板14上的集成电路12。该信号处理电路可是有源、半双工(HDX)或全双工(FDX)转发器电路。
集成电路12和电容器16附于电路板14并在导电线18的引线端或末端22和24，电耦联至构成线圈20的该导线。在图1和图2所示实施例中，线圈20绕在绕线管26上后覆盖芯30，并与附于芯30一端的电路板14一起形成转发器组件10a。如下所述，转发器组件10a最好覆盖模制在注模材料32中以形成完整转发器10，注模材料可是塑料、聚合或环氧树脂材料。
线圈20围绕芯30的轴向相对位置对转发器10的最佳动作十分重要。具体而言，转发器10最好包含调谐线圈20与电容器16的组合。通常，在转发器中，通过使构成线圈20的导线18的长度与电容器16的容量相匹配来完成调谐。然而，必须把导线18绕到绕线管26后装在芯30外面时，在设计和制造期间不能有利地控制导线18的精确长度及其电感，使线圈20的电感与电容器16的容量匹配从而调谐转发器10。应理解，如果不适当调谐转发器，则会降低数据读取和转发能力。
但业已发现，因为线圈20的电感量随铁氧体芯30的轴向定位而变，从而即使导线18的长度不是最佳，也可通过把芯30置于线圈20中的合适轴向位置而调谐转发器10。对于铁氧体芯30和线圈20组合的一组给定设计参数(包含芯周长和长度、导线18的长度和电容器16的容量)，在制造过程中可进行下述步骤制成调谐的转发器组件10a：沿铁氧体芯30的长轴轴向移动线圈20直到建立谐振的电感/电容系统，然后把带有线圈20的线管26固定在铁氧体芯30上。
在组装转发器组件10a的电路后，把转发器组件10a转移到注塑成型机中。具体而言，转发器组件10a置于示于图3～7中的模制工具40、42中。图3是其中不放置转发器组件10a的模制工件40、42的立体图。该模制工具40、42在闭合时限定一个空腔44，其尺寸适合在用塑料、聚合物或环氧树脂等注模材料32覆盖模制的准备工序中接纳转发器10a。但应注意，虽然表示为圆柱形，但在有助于特定应用时，模制工具40、42的内壁的表面特征可限定完整转发器10外表面的各种形状或图形。完整转发器的外形设计的潜在变化，例如可是圆柱形、弹丸形、两相对侧锥形或扁平椭圆形，其外壁可是光滑、粗糙或高低不平的，取决于预期的应用。
如图3所示，模制工具40、42包含向里突出的销46、48，用于在注模过程中对转发器组件10a进行定位并固定在工具40、42中。销46、48构成为可由压力响应销收缩器50、52在注入周期将结束时缩至模制工具40、42加。模制工具40、42的一端是注入口56，经该注入口由注模机(未图示)注入注模材料32。立体图3还显示，制模工具40、42可包含工具42上的导向销60，该导向销在模制工具闭合时与工具40上的导向销接收孔62对准并与之啮合，以在注入周期中保持模制工具40、42对准。
图4～图7是模制工具40、42和在其中定位的转发器组件10a的剖面图，用于顺序说明在注模过程中塑模材料32的进展。如图所示，销46、48用于在模具腔44中对转发器组件10a进行同轴和中央定位。在注模机压力下注入热塑化模制材料32时，塑化模制材料32经注入口56注入并如箭头70所示碰撞芯30的端64，并把芯30轴向压向定位成与转发器组件10a的相对端66接触的销48。
模制材料32然后如图4和图5箭头72所示，沿铁氧体芯30的端部64径向向外流动。当已有足够的模制材料32注入并填满空腔44的端部时，则如图6箭头74所示，模制材料32的前进面沿转发器组件10a的径向外表面68前进。该覆盖模制注入过程在整个注入周期的任何时候仅使芯30经受压缩负荷，而不使芯30经受伸张负荷。从而，通过本发明的覆盖模制注入过程，芯30不会以可降低芯电或磁特性的方式受到损害。
塑化模制材料32完全充满模腔44时，腔44中的内压力增大。在腔44内定位转发器组件10a的销46、48与压力敏感的销收缩器50、52相联。在模腔中压力达到预定级时，销46、48如箭头76、78所示缩回到模腔，从而如图7所示，销46、48腾出的空间被模制材料32所充满。但因模制材料32已封闭转发器10，在注入覆盖模制周期的固化或变硬阶段，模制材料32将使转发器10保持就位。覆盖模制处理完成时，模制工具40、42开启并使完成的转发器10出模。
图8和图9分别是转发器80另一实施例的侧视图和前视图，该转发器不包含图1转发器1的芯30，代之以，构成线圈20的导线18围绕其上安装集成电路12和电容器16的电路板缠绕。如上述参照图1讨论过的那样，线圈20经引线22和24互连至电路板14及其上的集成电路12。图8和图9的转发器80通常比图1的组件小得多，转发器80中不含芯30从而不会因使用图1的芯30而带来的附加重量和体积。但是图8和图9的转发器80也可以与上述参照图4-7所示的处理相似的处理进行覆盖模制。
为了简要说明该处理，转发器80如图10所示画成置于组装的，与图3～图7所讨论的模制工具40和42类似的模制工具中。在图10的说明中，塑化模制材料32注入已进展至与图6所示大致相同的阶段，其中，模制材料32的前进面纵向前进至转发器80的外表面，销46和48把转发器80中央定位于模制工具40、42中。形成的覆盖模制转发器组件60的外形也可是任何期望形状，仅受形状成型性限制。应注意，在覆盖模制处理前，转发器80可封闭在玻璃中，但该玻璃容器未显示。
图11表示本发明覆盖模制处理的另一种应用，其中，易碎的芯110置于图3的模制工具40和42中并在覆盖模制处理过程中由销46和48定位。覆盖模制处理大体上以与参照图4～图7所讨论的方式相同的方式进行。图11说明大致与图6相应的阶段，其中，塑化模制材料32的前进面沿易碎芯110的径向外表面纵向前进。完成覆盖模制处理后，从模制工具弹出密封的易碎芯110。如图12剖面图所示，完成的组件100是密封在覆盖模制材料112中的易碎芯110。在本实施例中，易碎芯可由铁氧体、粉末金属或钐-钴和钕-铁-硼等高能材料磁性材料构成。
图13是另一种设计的模制工具中的转发器的剖面图，该转发器在覆盖模制过程中由一个或多个中心部件120定位以制成类似于图1所示的转发器。该中心部件120设计成具有一个围绕芯30的中心部分如套筒22。该中心部件120还可包含径向向外突出的肋或销124，用于在覆盖模制处理过程中使转发器位于中央，从而不需要上述讨论并图示的可收缩的销。
本发明的覆盖模制处理把易碎芯110密封在保护壳体中，从而使易碎芯材料可用于原本不允许这种材料易碎物理特性的应用中。例如，用覆盖模制处理密封在相对簿的塑料或聚合材料覆盖物中的钐-钴和钕-铁-硼磁体，可用于原本会导致磁芯破裂、断裂或其它物理和磁损害的经受冲击、碰撞或振动负荷的对象。
图14是中央部件120的立体图，其中显示套筒122和径向突出肋或销124。该中央部件120可由塑料或与覆盖模制转发器所用材料同类型的材料构成。还可设想中央部件可简单地是图1的绕线管26的一部分或与之相连，其中，销124直接从绕线管一端或两端径向向外延伸。
选用于覆盖模制转换器组件10a、转发器60或易碎芯的材料部分取决于所完成部件的具体应用。各类热塑性材料可用于这类部件的注模。按照这里的用词，热塑性应广义解释，包括例如受热时软化或塑化而在冷却至环境温度时回复至硬化状态的线型聚合物和直链或支链大分子。术语聚合物应广义理解为包含任何类型聚合物，如无规聚合物、嵌段聚合物和接枝聚合物。
大量热塑性聚合材料预期对本发明覆盖模制转发器和易碎芯是有用的。这些热塑性材料可单独或混合使用。适宜的热塑性材料包括(但不限于)橡胶改性聚烯烃、金属茂、聚醚酯嵌段共聚物、聚醚-酰胺嵌段共聚物、热塑性聚氨酯、乙烯与丁烯和马来酸酐的共聚物、氢化马来酸酐、聚酯聚己内酯、聚酯聚己二酸酯、聚丁二醇醚、热塑性弹性体、聚丙烯、乙烯类热塑性物质、氯化聚醚、聚对苯二甲酸丁二醇酯、聚甲基戊烯、聚硅酮、聚氯乙烯、热塑性聚氯酯、聚碳酸酯、聚氨酯、聚酰胺、聚丁烯、聚乙烯、及其混合物。
最好热塑性材料包括橡胶改性聚烯烃、金属茂、聚醚-酰胺嵌段共聚物和聚醚酯嵌段共聚物。最好橡胶改性聚烯烃是市售的Advanced Elastomer System公司的商品名为VISTAFLEXTM、Shell公司的KRATONTM、Montell公司的HIFAXTM、M.A.Hanna的X1019-28TM、DSM公司的SAR LINKTM和Advanced Elastomer System公司的SANTOPRENETM。最好金属茂是市售的DOW公司的ENGAGETM和AFFINITYTM。最好聚醚-酰胺嵌段共聚物是市售的EIG Auto-Chem的PEBAXTM。最好聚醚酯嵌段共聚物是市售的DuPong公司的HYTRELTM。
本发明的热塑性覆盖模制壳体还可包含适当的填充物或配重材料以调节完成的壳体和/或转发器的性能。例如通过附加适当的材料可调整覆盖模制壳体的比重和密度，这些材料是如硫酸钡、氧化锌、碳酸钙、二氧化钛、碳黑、高岭土、硅酸铝镁、二氧化硅、氧化铁、玻璃球和硅灰石。充堆物和配重材料存在量将调节覆盖模制壳体和制成的转发器的比重。配重材料附加范围从约重量5％至约重量70％。此外，本发明壳体的覆盖模制材料还可包含适当的增塑剂或其它添加剂以改进覆盖模制材料的加工性能和物理特性，如流动性和可起模性。增塑剂存在量将调节各种应用必需的注模期间的流动性。
值得注意的是，对于上述各类注模材料，尤其是那些通过附加增稠剂而密度增大的材料，在其注入过程的增塑状态具有较低粘滞性。从而，这类材料的注模要求高注入压力，转而导致高应力在注入过程中施加于芯材料。由于上述理由，强烈希望在注入过程中把除压负荷外的其它加至易碎芯的负荷减至最小或加以避免。
本发明的覆盖模制壳体最好其壁厚为约0.010英寸至大于1英寸，但对多数应用，壁厚最好小于0.5英寸。取决于完成组件的期望外形和芯的形状，壳体壁厚可是均匀的或在芯的不同位置显著变化。
对于试图用于反刍动物体内的丸状转发器10，其覆盖模制壳体材料必须具有特定物理性能。覆盖模制壳体材料必须能耐受反刍动物消化系统中的酸环境，该材料必须对反刍动物消化系统中活性的微化物和酶是不可渗透的，且最好具有一定物理性能使在用于反刍动物前丸状转发器10易于装运和处理。此外，丸形转发器10其比重至少为1.7较佳，最好至少为2。通常希望使用配重材料以增大覆盖模制材料的容积密度或比重，从而，使覆盖模制材料有特定比重以有助于把制成的丸状转发器10的比重保持在期望范围中。
从而对丸形转发器10已确定，DuPont公司的热塑性聚酯弹性体HYTREL3078TM与硫酸钡混合作为增稠剂的较佳组合提供一种可接受组合用作丸状覆盖模制材料，并以适当比率提供一种具有比重范围在1.7至2之间的注模材料。
提供一种特定例子，可接受的覆盖模制材料可由下述混合物制得：HYTREL3078TM或类似的热塑性聚酯弹性体(TPE)与硫酸钡以约20～90％TPE与80％至10％的硫酸钡的比例混合。该混合物提供一种合适的覆盖模制材料以构成丸形转发器10的壳体。如例如对美国Cyanamid公司颁发的美国专利No.5322697中所述，最好净化的USP级硫酸钡或重晶石细粉用作增稠剂，因为这些材料已与巴西棕榈蜡及药物混合形成用于反刍动物的丸剂。
已发现上述方法用于制造丸剂的优点是显著的。首先，避免了必须密封陶瓷，从而与陶瓷密封丸剂的制造成本比较，可显著降低材料价格。此外，由于与注模过程相关的效率和自动化，显著降低了制造成本，即降低了制造与器件成本区分的丸剂的成本。从而，对于制造密封在陶瓷材料中的丸形转发器的等价成本，总成本的节省超过50％。且，已发现陶瓷密封丸状体相对较脆弱，从而在跌落或甚至运送过程中卡搭碰在一起也可能受到损害，用含硫酸钡的热塑性聚酯橡胶(TPE)覆盖模制材料密封的丸状体具有已证明的物理特性，可避免上述问题。此外，本发明的丸状转发器10可封装在具有最少封装材料的容积中，因为在各丸状体运送期间的振动不会引起破裂。最后，TPE硫酸钡组合提供用于反刍动物胃中所需的物理特性。该混合物不受酸环境影响，对于生物菌、微生物和酶是中性的，该混合物具有较佳的比重从而可滞留在反刍动物胃中。
对于试图用于植入应用的图8～图10所示的转发器80，最好使用6医药级环氧树脂。或者，可用公知方法把转发器80密封在玻璃材料中，然后用这里讨论的塑料或聚合材料覆盖模制，以提供玻璃密封转发器缺少的性能，即提供附加强度、抗冲击性能及韧性。
应理解，本领域技术人员一旦阅读了本发明的上述说明，本发明的替换和变化即是显而易见的。从而，本发明的保护范围仅由所附权利要求限定。

Claims (20)

1.一种用于电子识别系统的覆盖模制转发器，其特征在于它包括：
天线；
含电互连至所述天线的信号处理电路的转发器电路；
其上安装所述天线和转发器电路的芯部件；
通过下述过程形成的覆盖模制壳体：把所述天线、转发器电路和芯部件置于注模设备的模制工具形成的空腔中并向所述空腔注入壳体材料，从而密封所述芯部件、转发器电路和天线。
2.一种覆盖模制器件，其特征在于它包括：
由易碎材料形成的芯部件；
通过下述过程形成的覆盖模制壳体：把所述芯部件置于注模设备的模制工具形成的空腔中并向所述空腔注入壳体材料，从而密封所述芯部件的易碎材料而不使其经受拉伸负荷。
3.一种形成用于电子识别系统的覆盖模制转发器的方法，其特征在于，它包括下述步骤：
提供含与天线电互连的信号处理电路的转发器电路；
把所述天线和转发器电路安装在芯部件上构成一组件；
把所述转发器电路和芯部件组件置于注入模制设备中模制工具形成的空腔中并把壳体材料注入所述空腔，从而覆盖模制并密封所述芯部件和所述转发器电路。
4.一种含易碎芯的部件的覆盖模制方法，其特征在于包括下述步骤：
把易碎芯置于注模设备中模制工具形成的空腔中；
对所述易碎芯进行定位，使所述易碎芯与所述工具隔开；
把壳体材料注入所述空腔，使向所述易碎芯主要施加压负荷而实质上不施加拉负荷和弯曲负荷从而把所述易碎芯密封在所述壳体材料中；
使所述壳体材料固化；
从所述空腔使所述部件出模。
5.一种适于覆盖电子部件的壳体材料，其特征在于包括：热塑性聚酯弹性体即TPE与硫酸钡以约20％至90％的TPE与80％至10％的硫酸钡的比例混合的混合物。
6.一种适用于覆盖电子或易碎部件的壳体材料，其特征在于包括：
重量约20％至90％的热塑性材料，该材料选自下列组中的一组或多组：橡胶改性聚烯烃、金属茂、聚醚酯嵌段共聚物、聚醚-酰胺嵌段共聚物、热塑性聚氨酯、乙烯与丁烯及马来酸酐的共聚物、氢化马来酸酐、聚酯聚己内酯、聚酯聚己二酸酯、聚丁二醇醚、热塑性弹性体、聚丙烯、乙烯基类热塑性物质、氯化聚醚、聚对苯二甲酸丁二醇酯、聚甲基戊烯、聚硅酮、聚氯乙烯、热塑性聚氨酯、聚碳酸酯、聚氨酯、聚酰胺、聚丁烯、聚乙烯；
取决于所选热塑性材料重量百分比，重量约80％至10％的选自下述组的配重材料：硫酸钡、氧化锌、碳酸钙、二氧化钛、炭黑、高岭土、硅酸铝镁、二氧化硅、氧化铁、玻璃球和硅灰石。
7.如权利要求1至6中任一所述的发明，其特征在于，所述壳体材料提供的壁厚在约0.010英寸至1英寸之间。
8.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料选自塑料、聚合物和环氧树脂材料组成的组。
9.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是热塑性聚酯弹性体即TPE与硫酸钡以约20％至90％的TPE与80％至10％的硫酸钡的比例混合的混合物。
10.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是热塑性材料，该热塑性材料选自加热时软化或塑化而冷却时返回硬化状态的线型聚合物和直链及支链大分子组成的组。
11.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是选自无规聚合物、嵌段聚合物和接枝聚合物组成的组的聚合物。
12.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是热塑性材料，选自橡胶改性聚烯烃、金属茂、聚醚酯嵌段共聚物、聚醚-酰胺嵌段共聚物、热塑性聚氨酯、乙烯与丁烯及马来酸酐的共聚物、氢化马来酸酐、聚酯聚己内酯、聚酯聚己二酸酯、聚丁二醇醚、热塑性弹性体、聚丙烯、乙烯基类热塑性物质、氯化聚醚、聚对苯二甲酸丁二醇酯、聚甲基戊烯、聚硅酮、聚氯乙烯、热塑性聚氨酯、聚碳酸酯、聚氨酯、聚酰胺、聚丁烯、聚乙烯及上述材料混合物构成的组。
13.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料包含配重材料，选自硫酸钡、氧化锌、碳酸钙、二氧化钛、炭黑、高岭土、硅酸铝镁、二氧化硅、氧化铁、玻璃球和硅灰石组成的组。
14.如权利要求13所述的发明，其特征在于，所述配重材料存在量在约5％(重量)至约70％(重量)之间。
15.如权利要求1至6中任一所述的发明，其特征在于，所述壳体材料还包括数量足以在注模过程中调节流动特性的增塑剂。
16.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是热塑性聚酯弹性体即TPE与硫酸钡及增塑剂的混合物。
17.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是下述材料的组合：
热塑性材料，选自下述材料中的至少一组：橡胶改性聚烯烃、金属茂、聚醚酯嵌段共聚物、聚醚-酰胺嵌段共聚物、热塑性聚氨酯、乙烯与丁烯及马来酸酐的共聚物、氢化马来酸酐、聚酯聚己内酯、聚酯聚己二酸酯、聚丁二醇醚、热塑性弹性体、聚丙烯、乙烯基类热塑性物质、氯化聚醚、聚对苯二甲酸丁二醇酯、聚甲基戊烯、聚硅酮、聚氯乙烯、热塑性聚氨酯、聚碳酸酯、聚氨酯、聚酰胺、聚丁烯、聚乙烯及其混合物构成的组；
配重材料，选自下述材料组成的组：硫酸钡、氧化锌、碳酸钙、二氧化钛、炭黑、高岭土、硅酸铝镁、二氧化硅、氧化铁、玻璃球和硅灰石。
18.如权利要求1至4中任一所述的发明，其特征在于，所述壳体材料是热塑性聚酯弹性体即TPE与硫酸钡以约20％至90％的TPE与80％至10％的硫酸钡的比例混合的混合物；其比重在约1.7至2范围中。
19.如权利要求1至3中任一所述的发明，其特征在于，所述芯部件由构成易碎芯的易碎材料制成。
20.如权利要求4或19所述的发明，其特征在于，所述易碎芯由选自铁氧体、粉末金属及钐-钴和钕-铁-硼等高能产品弹性体组成的组的材料构成。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101919110A (zh) * 2008-01-11 2010-12-15 木加哈特控股公司 使用铁氧体芯增强去往/来自无源id电路的能量传递效率
CN105698838A (zh) * 2014-12-11 2016-06-22 埃内沃公司 无线测量装置及其制造方法

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7584298A (en) * 1997-05-21 1998-12-11 E.S.P. Communications, Inc. System, method and apparatus for "caller only" initiated two-way wireless communication with caller generated billing
US7009506B2 (en) * 1998-02-10 2006-03-07 Bridgestone Firestone North American Tire, Llc Electronic monitoring device and patch assembly
AU2001217746A1 (en) 1998-05-14 2002-05-27 Calypso Medical, Inc. Systems and methods for locating and defining a target location within a human body
US6363940B1 (en) * 1998-05-14 2002-04-02 Calypso Medical Technologies, Inc. System and method for bracketing and removing tissue
EP1052595B1 (de) * 1999-05-14 2001-09-19 Sokymat Sa Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung
US6441741B1 (en) * 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
US7342496B2 (en) 2000-01-24 2008-03-11 Nextreme Llc RF-enabled pallet
US8077040B2 (en) 2000-01-24 2011-12-13 Nextreme, Llc RF-enabled pallet
US6943678B2 (en) 2000-01-24 2005-09-13 Nextreme, L.L.C. Thermoformed apparatus having a communications device
JP4433629B2 (ja) * 2001-03-13 2010-03-17 株式会社日立製作所 半導体装置及びその製造方法
US7135978B2 (en) * 2001-09-14 2006-11-14 Calypso Medical Technologies, Inc. Miniature resonating marker assembly
ES2241937T3 (es) * 2001-09-18 2005-11-01 Toyo Boseki Kabushiki Kaisha Metodo de moldeo por inyeccion a baja presion para resinas de poliester y composiciones de resinas.
WO2003056508A1 (en) * 2001-12-24 2003-07-10 Koninklijke Philips Electronics N.V. Transponder
DE10227683B4 (de) * 2002-06-20 2004-07-22 Aeg Identifikationssysteme Gmbh Verfahren zur Anbringung eines Transponders an einem Metallkörper und Metallkörper mit einem Transponder
DE10231340B3 (de) * 2002-07-09 2004-01-29 Hf-Elektronik Systeme Gmbh Transponderschaltung
TW545705U (en) * 2002-11-05 2003-08-01 Benq Corp Antenna structure
FI20022070A (fi) * 2002-11-20 2004-05-21 Rafsec Oy Transponderi
US7289839B2 (en) 2002-12-30 2007-10-30 Calypso Medical Technologies, Inc. Implantable marker with a leadless signal transmitter compatible for use in magnetic resonance devices
EP1586068B1 (en) * 2003-01-23 2008-07-30 U.S. Genomics, Inc. Methods for analyzing polymer populations
US20040238623A1 (en) * 2003-05-09 2004-12-02 Wayne Asp Component handling device having a film insert molded RFID tag
US20050099301A1 (en) * 2003-11-06 2005-05-12 Werner Bloch Method for fitting a transponder to a metal body, and a transponder module for carrying out the method
AU2003261498B2 (en) * 2003-11-07 2009-07-02 Aeg Identifikationssysteme Gmbh Method for fitting a transponder to a metal body, and a transponder module for carrying out the method
US8196589B2 (en) * 2003-12-24 2012-06-12 Calypso Medical Technologies, Inc. Implantable marker with wireless signal transmitter
US7755484B2 (en) * 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
US7323990B2 (en) * 2004-04-27 2008-01-29 Sencorp Inc. Method and apparatus for placing ID tags in molded articles
US7307535B2 (en) * 2004-07-27 2007-12-11 Datamars S.A. Air coil RF transponder and method of making same
US20060084934A1 (en) * 2004-10-18 2006-04-20 Milton Frank Transponder assembly and method for making same
BE1016247A5 (nl) * 2004-10-25 2006-06-06 Wijk Anton Van Identificatie-inrichting en werkwijze voor het vervaardigen daarvan.
US20070229350A1 (en) * 2005-02-01 2007-10-04 Scalisi Joseph F Apparatus and Method for Providing Location Information on Individuals and Objects using Tracking Devices
US7598855B2 (en) 2005-02-01 2009-10-06 Location Based Technologies, Inc. Apparatus and method for locating individuals and objects using tracking devices
US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
JP2006231604A (ja) * 2005-02-23 2006-09-07 Tdk Corp 成形方法
WO2006102673A1 (en) * 2005-03-24 2006-09-28 E. I. Du Pont De Nemours And Company Transponder overmolded with ethylene copolymers
US7760104B2 (en) * 2005-04-08 2010-07-20 Entegris, Inc. Identification tag for fluid containment drum
DE102005025371A1 (de) * 2005-05-31 2006-12-07 Seaquist Perfect Dispensing Gmbh Vorrichtung zur Ausgabe eines vorzugsweise kosmetischen Fluids
CN101194296B (zh) * 2005-06-10 2011-07-27 米其林研究和技术股份有限公司 压电器件脉冲的电感耦合
US8408403B2 (en) * 2005-06-22 2013-04-02 Whirlpool Corporation Molded plastic dishwasher rack tine members including elastomeric bumpers
EP1736675B1 (de) * 2005-06-23 2008-03-19 Bosch Rexroth Mechatronics GmbH Linearbewegungsvorrichtung mit RFID-Tag
US7345635B2 (en) * 2005-10-04 2008-03-18 Lockheed Martin Corporation Apparatus for encapsulating radio frequency identification (RFID) antennae
US7503491B2 (en) * 2005-10-29 2009-03-17 Magnex Corporation RFID chip and antenna with improved range
EP1793395A1 (en) * 2005-11-11 2007-06-06 Sokymat Automotive GmbH Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly
EP1786004B1 (en) 2005-11-11 2015-05-20 SMARTRAC TECHNOLOGY GERMANY GmbH Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly
KR100674820B1 (ko) * 2005-11-14 2007-01-25 엘지이노텍 주식회사 무선태그용 안테나 및 이의 제조방법
US8753097B2 (en) 2005-11-21 2014-06-17 Entegris, Inc. Method and system for high viscosity pump
US20070139202A1 (en) * 2005-12-21 2007-06-21 Symbol Technologies, Inc. Radio frequency identification (RFID) solution to lost time spent on instrument inventory
DE102006012302A1 (de) * 2006-03-15 2007-09-27 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
DE102006030741A1 (de) * 2006-04-04 2007-10-11 Seaquist Perfect Dispensing Gmbh Dosierventil und Vorrichtung zur Abgabe einer vorzugsweise kosmetischen Flüssigkeit
DE102006030829B4 (de) * 2006-05-12 2019-10-24 Aptar Dortmund Gmbh Abgabevorrichtung und Verfahren zu dessen Herstellung
DE102006023663B4 (de) * 2006-05-16 2020-07-02 Aptar Dortmund Gmbh Abgabevorrichtung
WO2007131790A2 (de) * 2006-05-16 2007-11-22 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
DE102006027042A1 (de) * 2006-06-08 2007-12-13 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
JP4767765B2 (ja) 2006-06-19 2011-09-07 愛三工業株式会社 回転角センサと回転角センサの回転体の成形方法とスロットル開度制御装置
EP2099572B1 (de) * 2006-09-07 2014-07-23 Aptar Dortmund GmbH Abgabevorrichtung
US8710957B2 (en) 2007-02-28 2014-04-29 Rf Surgical Systems, Inc. Method, apparatus and article for detection of transponder tagged objects, for example during surgery
DE102007049614B4 (de) * 2007-03-15 2015-03-05 Aptar Dortmund Gmbh Abgabevorrichtung
US8774827B2 (en) 2007-04-05 2014-07-08 Location Based Technologies, Inc. Apparatus and method for generating position fix of a tracking device in accordance with a subscriber service usage profile to conserve tracking device power
US8102256B2 (en) 2008-01-06 2012-01-24 Location Based Technologies Inc. Apparatus and method for determining location and tracking coordinates of a tracking device
US8244468B2 (en) * 2007-11-06 2012-08-14 Location Based Technology Inc. System and method for creating and managing a personalized web interface for monitoring location information on individuals and objects using tracking devices
US8224355B2 (en) 2007-11-06 2012-07-17 Location Based Technologies Inc. System and method for improved communication bandwidth utilization when monitoring location information
US9111189B2 (en) 2007-10-31 2015-08-18 Location Based Technologies, Inc. Apparatus and method for manufacturing an electronic package
US8497774B2 (en) 2007-04-05 2013-07-30 Location Based Technologies Inc. Apparatus and method for adjusting refresh rate of location coordinates of a tracking device
US20080308518A1 (en) * 2007-06-14 2008-12-18 Drug Plastics & Glass Company, Inc. Container having an automatic identification device for identifying the contents therein
US20080314900A1 (en) * 2007-06-14 2008-12-25 Drug Plastics & Glass Company, Inc. Enclosure having an automatic identification device
US20090004557A1 (en) * 2007-06-26 2009-01-01 Nokia Corporation Protecting a functional component and a protected functional component
US8330579B2 (en) * 2007-07-05 2012-12-11 Baxter International Inc. Radio-frequency auto-identification system for dialysis systems
DE102007051980A1 (de) * 2007-08-29 2009-03-05 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
DE102007051982A1 (de) * 2007-08-29 2009-03-05 Seaquist Perfect Dispensing Gmbh Abgabevorrichtung
WO2009034497A2 (en) * 2007-09-13 2009-03-19 Tramirloc Invest (Pty) Ltd. Monitoring tag
US8654974B2 (en) * 2007-10-18 2014-02-18 Location Based Technologies, Inc. Apparatus and method to provide secure communication over an insecure communication channel for location information using tracking devices
WO2009108702A1 (en) * 2008-02-25 2009-09-03 Mu-Gahat Holdings, Inc Extending the read range of passive rfid tags
US8395507B2 (en) * 2008-04-21 2013-03-12 Magnet Consulting, Inc. H-field shaping using a shorting loop
US20090266736A1 (en) * 2008-04-25 2009-10-29 Drug Plastics & Glass Company, Inc. Container having an identification device molded therein and method of making same
JP5008201B2 (ja) * 2008-05-21 2012-08-22 三智商事株式会社 無線ｉｃタグ
US8514060B2 (en) * 2008-05-21 2013-08-20 Mitomo Corporation Wireless identification tag
US8358212B2 (en) 2008-05-27 2013-01-22 Rf Surgical Systems, Inc. Multi-modal transponder and method and apparatus to detect same
ES2436002T3 (es) 2008-06-20 2013-12-26 Aptar Dortmund Gmbh Dispositivo de distribución
US8354931B2 (en) * 2008-08-06 2013-01-15 Rf Surgical Systems, Inc. Transponder device to mark implements, such as surgical implements, and method of manufacturing and using same
US8286839B2 (en) * 2008-08-12 2012-10-16 Aptar Dortmund Gmbh Dispensing device
DE102008038654B4 (de) 2008-08-12 2019-09-19 Aptar Dortmund Gmbh Abgabekopf mit schwenkbarem Ventilelement
DE102008048961A1 (de) * 2008-09-25 2010-04-01 Contitech Luftfedersysteme Gmbh Identifikationseinrichtung für eine Luftfeder
US8264342B2 (en) 2008-10-28 2012-09-11 RF Surgical Systems, Inc Method and apparatus to detect transponder tagged objects, for example during medical procedures
US8726911B2 (en) 2008-10-28 2014-05-20 Rf Surgical Systems, Inc. Wirelessly detectable objects for use in medical procedures and methods of making same
US20100176924A1 (en) * 2009-01-09 2010-07-15 Mu-Gahat Holdings Inc. RFID System with Improved Tracking Position Accuracy
DE102009026977A1 (de) * 2009-06-16 2010-12-30 Albert Handtmann Elteka Gmbh & Co Kg Verbundwerkstoff und Verfahren zur Herstellung eines Verbundwerkstoffs
DE102009030627B4 (de) 2009-06-25 2020-03-12 Aptar Dortmund Gmbh Ventil und Abgabevorrichtung
US9226686B2 (en) 2009-11-23 2016-01-05 Rf Surgical Systems, Inc. Method and apparatus to account for transponder tagged objects used during medical procedures
US20110181399A1 (en) * 2010-01-28 2011-07-28 Dvm Systems, Llc Energy harvesting with rfid tags
US8684705B2 (en) 2010-02-26 2014-04-01 Entegris, Inc. Method and system for controlling operation of a pump based on filter information in a filter information tag
US8727744B2 (en) * 2010-02-26 2014-05-20 Entegris, Inc. Method and system for optimizing operation of a pump
EP2563471A4 (en) 2010-04-29 2013-09-18 Donatelle Plastics Inc EMBASE FOR IMPLANTABLE PULSE GENERATOR AND METHOD FOR MANUFACTURING THE SAME
US9855413B2 (en) 2010-04-29 2018-01-02 Donatelle Plastics, Inc. Header for implantable pulse generator and method of making same
US8761887B2 (en) 2010-04-29 2014-06-24 Donatelle Plastics, Inc. Header for implantable pulse generator and method of making same
TWI563351B (en) 2010-10-20 2016-12-21 Entegris Inc Method and system for pump priming
CN104603852A (zh) * 2012-05-22 2015-05-06 关卡系统股份有限公司 固体外壳标签
US10076609B2 (en) 2012-08-17 2018-09-18 Parker-Hannifin Corporation Syringe having a piston with embedded RFID chip
US9856865B2 (en) 2012-11-21 2018-01-02 White Knight Fluid Handling Inc. Pneumatic reciprocating fluid pump with reinforced shaft
US9626620B2 (en) 2013-06-05 2017-04-18 Haemonetics Corporation Frangible RFID tag and method of producing same
EP3010816B1 (en) 2013-06-18 2019-05-08 Haemonetics Corporation Rfid tag and method of securing same to object
JP2014112443A (ja) * 2014-03-13 2014-06-19 Mitomo Shoji Kk 無線ｉｃタグの製造方法並びに無線ｉｃタグの成形用金型
WO2016118749A1 (en) 2015-01-21 2016-07-28 Covidien Lp Detectable sponges for use in medical procedures and methods of making, packaging, and accounting for same
WO2016118755A1 (en) 2015-01-21 2016-07-28 Covidien Lp Sterilizable wirelessly detectable objects for use in medical procedures and methods of making same
AU2016200113B2 (en) 2015-01-21 2019-10-31 Covidien Lp Wirelessly detectable objects for use in medical procedures and methods of making same
AU2016200928B2 (en) 2015-02-26 2020-11-12 Covidien Lp Apparatuses to physically couple transponder to objects, such as surgical objects, and methods of using same
WO2017187881A1 (ja) * 2016-04-28 2017-11-02 愛知製鋼株式会社 運転支援システム
CN106182584A (zh) * 2016-08-18 2016-12-07 中国人民解放军海军医学研究所 用于封装水下设备的注塑方法
US10184710B2 (en) * 2016-09-07 2019-01-22 Bsh Hausgeraete Gmbh Ice maker tray with integrated flow channel for a fluid, ice maker and household refrigeration apparatus
US10479007B2 (en) 2017-03-17 2019-11-19 Rehrig Pacific Company Injection molded component and method of injection molding
JP7134600B2 (ja) * 2017-06-06 2022-09-12 大日本印刷株式会社 コイン型ｉｃタグ
US20200094456A1 (en) 2018-09-21 2020-03-26 Dentsply Sirona Inc. Method and apparatus for overmolding gutta-percha onto carriers
DE102019209141A1 (de) * 2019-06-25 2020-12-31 Mahle International Gmbh Verfahren zur Herstellung einer induktiven Ladeeinrichtung
SG10201906867RA (en) 2019-07-25 2021-02-25 Pci Private Ltd Method for manufacturing electronic device
DE102019130175A1 (de) 2019-11-08 2021-05-12 Hellermanntyton Gmbh Spritzgussverfahren eines Bauteils, wie beispielsweise eines Kabelhalters, mit einer integrierten Drahtlos-Kennungs-Folie
CN117321713A (zh) 2021-04-07 2023-12-29 基美电子公司 二次注塑薄膜电容器
US11630964B1 (en) 2021-11-24 2023-04-18 Fortiss, Llc De-tuned multiple RFID antenna arrangement for gaming
AT526013A1 (de) * 2022-03-22 2023-10-15 Smaxtec Animal Care Gmbh Sondenvorrichtung zur Messung zumindest einer Zustandsgröße des Organismus eines Nutztieres

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE662987A (zh) * 1964-04-24
US3577136A (en) * 1967-08-04 1971-05-04 Security Systems Inc Short-range signaling system
US4262632A (en) 1974-01-03 1981-04-21 Hanton John P Electronic livestock identification system
US4065753A (en) * 1974-09-09 1977-12-27 Minnesota Mining & Manufacturing Company Electromagnetically responsive projectile and system for detecting same
US4314562A (en) * 1977-05-04 1982-02-09 Medtronic, Inc. Enclosure system for body implantable electrical systems
US5211129A (en) 1986-02-25 1993-05-18 Destron/Idi, Inc. Syringe-implantable identification transponder
DE8909783U1 (zh) * 1989-08-16 1990-09-13 Pepperl & Fuchs Gmbh, 6800 Mannheim, De
US5149734A (en) * 1989-10-20 1992-09-22 General Electric Company Highly filled thermoplastic polyester molding compositions
US5147657A (en) * 1989-10-31 1992-09-15 John Giza Retractable pin for an injection mold
US5025550A (en) 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
US5223851A (en) 1991-06-05 1993-06-29 Trovan Limited Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device
US5281855A (en) 1991-06-05 1994-01-25 Trovan Limited Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
ATE137912T1 (de) 1991-09-13 1996-06-15 Rodney Arthur Stafford Elektronisches identifizierungssystem für tieren
US5256047A (en) * 1991-12-03 1993-10-26 Nitrojection Corporation Gas assisted injection molding apparatus utilizing sleeve and pin arrangement
US5589587A (en) * 1992-05-12 1996-12-31 Merrell Pharmaceuticals Inc. Process for the preparation of ribonucleotide reductase inhibitors
US5322697A (en) 1992-05-28 1994-06-21 Meyer James H Composition and method for inducing satiety
NL9300289A (nl) * 1992-09-21 1994-04-18 Nedap Nv Verlies-, vlam- en fraudewerende electronische identificatielabel.
JP3199494B2 (ja) * 1992-11-06 2001-08-20 ジェイエスアール株式会社 熱可塑性エラストマー組成物
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
EP0718347A1 (en) * 1994-12-24 1996-06-26 Advanced Elastomer Systems, L.P. Method to adhere thermoplastic elastomer blends to polyester substrates
FR2736622B1 (fr) * 1995-07-12 1997-08-29 Oreal Dispositif de conditionnement et de distribution d'un produit liquide ou pateux avec applicateur en forme de dome
US5643620A (en) * 1995-08-09 1997-07-01 Electra Form, Inc. Continuous injection molding system
US5847650A (en) * 1996-10-04 1998-12-08 Knogo North America Inc. Theft resistant circuit assembly
US5859587A (en) * 1996-09-26 1999-01-12 Sensormatic Electronics Corporation Data communication and electronic article surveillance tag
US5842118A (en) 1996-12-18 1998-11-24 Micron Communications, Inc. Communication system including diversity antenna queuing
US5731380A (en) * 1997-04-11 1998-03-24 Hoechst Celanese Corporation Elastomeric compositions
US6012415A (en) 1997-04-18 2000-01-11 Magtronic Id, Inc. Bolus with animal ID and temperature transponder
EP0977478A4 (en) * 1997-04-18 2002-01-30 Norman J Hayes LIVESTOCK BREEDING SYSTEM
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
JPH1145317A (ja) * 1997-07-25 1999-02-16 Toshiba Chem Corp 非接触データキャリアパッケージ
US6071446A (en) * 1997-08-29 2000-06-06 Lear Automotive Dearborn, Inc Method for centering wire harness in mold
US5986562A (en) * 1998-09-11 1999-11-16 Brady Worldwide, Inc. RFID tag holder for non-RFID tag
US6441741B1 (en) * 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
US6400338B1 (en) 2000-01-11 2002-06-04 Destron-Fearing Corporation Passive integrated transponder tag with unitary antenna core
US20040018749A1 (en) * 2002-07-08 2004-01-29 Dorfman Benjamin F. Method of decreasing brittleness of single crystals, semiconductor wafers, and solid-state devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101919110A (zh) * 2008-01-11 2010-12-15 木加哈特控股公司 使用铁氧体芯增强去往/来自无源id电路的能量传递效率
US8432283B2 (en) 2008-01-11 2013-04-30 Magnet Consulting, Inc. Enhancing the efficiency of energy transfer to/from passive ID circuits using ferrite cores
US8988224B2 (en) 2008-01-11 2015-03-24 Magnet Consulting, Inc. Enhancing the efficiency of energy transfer to/from passive ID circuits using ferrite cores
CN105698838A (zh) * 2014-12-11 2016-06-22 埃内沃公司 无线测量装置及其制造方法
CN105698838B (zh) * 2014-12-11 2018-04-24 埃内沃公司 无线测量装置及其制造方法

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DE60036294D1 (de) 2007-10-18
EP1210698B1 (en) 2007-09-05
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AU5125500A (en) 2000-12-05
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