CN1302930C - Ink jetting head assembly and production method thereof - Google Patents
Ink jetting head assembly and production method thereof Download PDFInfo
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- CN1302930C CN1302930C CNB03156769XA CN03156769A CN1302930C CN 1302930 C CN1302930 C CN 1302930C CN B03156769X A CNB03156769X A CN B03156769XA CN 03156769 A CN03156769 A CN 03156769A CN 1302930 C CN1302930 C CN 1302930C
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- gun assembly
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- metallic conduction
- ink gun
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Abstract
The present invention discloses an ink gun assembly and a manufacturing method thereof. Photosensitive polymers are used as base materials of the ink gun assembly, fluid structures of jet holes, an ink storage chamber, etc. are manufactured in a photoetching mode, and then, modes of exposing, developing or electroforming, etc. are in mixed utilization in order that the ink storage chamber, the jet holes and electric connecting leading legs of a chip are conformed to a single ink gun assembly. The manufacture of the ink gun assembly is completed through an integral manufacturing process.
Description
Technical field
The present invention relates to a kind of ink gun assembly and manufacture method thereof, relate in particular to a kind of ink gun assembly and manufacture method thereof that reduces manufacturing cost.
Background technology
The ink gun assembly is the key part and component of ink-jet printer, encapsulating structure with present ink gun, its assembling process completes spray nozzle sheet and chip of ink-jet head earlier mostly in advance, then the solid with photosensitive type is tiled on the chip, mode with photoetching forms ink storing chamber and the runner of supplying ink on this solid, again spray nozzle sheet and chip are carried out the contraposition applying with solid, at last the mode of the pin of the automatic case chip of coil type (Lead) with high temperature and impressed pressure, aligning is fitted on the electrical signal contact (Pads) of chip, to provide chip external electric connection.
Wherein, the signal contact of chip of ink-jet head is with interior pin mode contraposition hot pressing, and it is combined with the lead pin of substrate.Need to use the interior pin of semiconductor technology to engage (ILB, Inner Lead Bonding) equipment, when encapsulation, make the signal contact of ink-jet chip and the lead pin of substrate do accurate contraposition earlier; With the hot melt pressuring method lead pin is fused to the signal contact again, and fills primer to increase reliability in the welding zone.Because the precision of this technology is quite high and quite difficult, its process conditions have influence on the quality of the encapsulating structure of assembly easily.In addition, the employed spray nozzle sheet of prior art, be to make, before making, need the prescription of accurate adjustment electroplate liquid in the mode of electroforming, proofread and correct through adjusting for a long time, just can obtain electroforming quality preferably, therefore, be obtained the spray nozzle sheet of manufacturing in batches with the method, the thickness evenness of the size of its spray orifice and circularity, spray nozzle sheet all is difficult to control accurately.The bond strength of metal spray nozzle sheet and ink-jet chip can corrode because of the ink that is subjected in the ink storing chamber simultaneously, and adhesive force continues to reduce in time, and then causes local disengaging (delamination) phenomenon.
In addition, mode that also can laser beam perforation is made spray orifice on the automatic case chip of coil type, please refer to No. 5305015 patent of the U.S., its process for integrally manufacturing is to form driving hole on the base material of the automatic case chip of coil type earlier, produce the lead of signal transmission again in the mode of electroforming or copper-surfaced paper tinsel, afterwards again laser focusing to etch spray orifice.Program through cleaning combines with the mode of chip with hot pressing at last again, finishes the encapsulation of chip of ink-jet head.Yet this patented method must be made spray orifice one by one with laser, makes manufacture process speed slow, and can easily cause producing distortion around the spray orifice by the generation high heat capacity in manufacture process.Produce the spray orifice of different size in addition as desire, need to use different lens to come laser focusing, can cause the increase of manufacturing time and cost, and the chip that is produced is not easy also to remove in the laser processing procedure around its spray orifice.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of ink gun assembly and manufacture method thereof, directly is integrated into single component with ink storing chamber, spray orifice and to the electric connection pin of chip, and is finished by manufacturing process make of globality.
To achieve these goals, the invention provides a kind of manufacture method of ink gun assembly, its step comprises:
One base material (substrate) is provided;
Form a sacrifice layer (sacrificial layer) at described substrate surface;
Form a metallic conduction circuit in described sacrificial layer surface;
Form one first photosensitive polymer layer at described metal conductive wire road surfaces;
Form more than one spray orifice and more than one through hole with photoetching process (photolithography) at the described first photosensitive polymer layer, described spray orifice provides fluid to pass through, and described through hole is in order to expose a leads ends of this metallic conduction circuit;
Step with fluidic structures of an above ink storing chamber, described ink storing chamber correspondence also is connected in described spray orifice; And
Remove described sacrifice layer, make the described photosensitive polymer layer described metallic conduction circuit accompanying break away from described base material with it.
The manufacture method of above-mentioned ink gun assembly, its characteristics be, forms the step of a metallic conduction circuit above described sacrifice layer, is that the method with electroforming (electroforming) forms described metallic conduction circuit.
The manufacture method of above-mentioned ink gun assembly, its characteristics are, described sacrifice layer is formed by nonmetallic materials, and before the step that forms a metallic conduction circuit above the described sacrifice layer, also comprises one and forms the step of an electroforming Seed Layer (seed layer) in described sacrificial layer surface.
The manufacture method of above-mentioned ink gun assembly, its characteristics are, forming the step of a metallic conduction circuit above described sacrifice layer, is to form a metal level earlier above described sacrifice layer, cooperates the described metal level of photoetching process etching to form described metallic conduction circuit again.
The manufacture method of above-mentioned ink gun assembly, its characteristics are, described formation has the step of a fluidic structures of an above ink storing chamber, is to form one second photosensitive polymer layer at the described first photosensitive polymer laminar surface, and forms described fluidic structures with photoetching process.
The manufacture method of above-mentioned ink gun assembly, its characteristics be, also comprises one and form the step of a protective layer at described metal conductive wire road surfaces.
The manufacture method of above-mentioned ink gun assembly, its characteristics are that described sacrifice layer is formed by metal material.
The present invention also provides a kind of ink gun assembly, and it comprises:
One photosensitive polymer layer base material, it has more than one spray orifice and passes through so that fluid to be provided, and described spray orifice forms with photoetching process;
One metallic conduction circuit, be located at described photosensitive polymer layer substrate surface, described metallic conduction circuit has a front end and a leads ends, described front end is used for receiving outside signal, then in order to the electric connection with a chip to be provided, described leads ends exposes to described photosensitive polymer layer base material to described leads ends; And
One fluidic structures, it is incorporated into described photosensitive polymer layer base material, and described fluidic structures has more than one ink storing chamber, and described ink storing chamber correspondence also is connected in described spray orifice.
Above-mentioned ink gun assembly, its characteristics are that described fluidic structures also comprises more than one runner, and described runner is in order to provide ink to described ink storing chamber.
Above-mentioned ink gun assembly, its characteristics be, also comprises one and form a protective layer at described metal conductive wire road surfaces
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1～Fig. 7 is the making flow chart of first embodiment of the invention; And
Fig. 8～Figure 11 is the making flow chart of second embodiment of the invention.
The specific embodiment
Disclosed ink gun assembly of the present invention and manufacture method thereof can be mixed modes such as utilizing exposure, development and electroforming, produce the ink gun assembly of conformability.
Please refer to Fig. 1 to Fig. 7, it is the making flow chart of first embodiment of the invention.
As shown in Figure 1, at first, in the surface deposition sacrificial metal layer 110 of base material 100.The material that so-called sacrifice layer separates other layers when being structure fabrication.
As shown in Figure 2, make photoresist layer (photoresist) 120 on sacrifice layer 110 surfaces then.
As shown in Figure 3, to form metallic conduction circuit 130 in the gap of the photoresist layer 120 of electroforming mode above sacrificial metal layer 110.
As shown in Figure 4, coating one photosensitive polymer layer 140 above metallic conduction circuit 130, and make spray orifice and expose the through hole of metal conductive wire pass foot with photoetching process is with as external electric connection place of metallic conduction circuit 130.Light shield 200 is divided into printing opacity and light tight zone, and light tight zone can intercept light to be passed through, and transmission region then provides light to pass through, and shines in the subregion of sensing optical activity polymeric layer 140 to make it produce link., promptly made spray orifice and expose the through hole of metal conductive wire pass foot by after 200 pairs of sensing optical activity polymeric layers 140 of light shield expose with suitable light source.
Then, as shown in Figure 5, the exposing patterns of development photosensitive polymer layer 140 is to form spray orifice and to expose the through hole of metal conductive wire pass foot.
As shown in Figure 6, employed photoresist layer when removing sacrificial metal layer 110 and electroforming metal, make metallic conduction circuit 130 and photosensitive polymer layer 140 break away from base material 100 and form flexible circuit board with spray orifice, with above-mentioned method, can promptly produce the assembly of the required encapsulation of chip of ink-jet head, this assembly comprises several spray orifices and metallic conduction circuit, can replace the automatic case chip of original spray nozzle sheet and coil type.
And; as shown in Figure 7, also can when removing electroforming metal before the employed photoresist layer, flexible circuit board be turned; utilize photoetching process to form protective layer 150, employed photoresist layer when in development protective layer 150 patterns, removing electroforming metal again on the surface of metallic conduction circuit 130.
Wherein, the sacrificial metal layer of first embodiment of the invention also can use the sacrifice layer of other material to replace, but when forming the metallic conduction circuit, need to form metal seed layer (seed layer) on the surface of sacrifice layer in advance, be beneficial to follow-up electroforming processing procedure in the electroforming mode.Perhaps also can directly use photoetching process to make the metallic conduction circuit, first depositing metal layers carries out steps such as photoresistance coating, exposure, development and etching again and forms the metallic conduction circuit in sacrificial layer surface.
In addition, the present invention also comprises ink storing chamber and runner is integrated in the flexible circuit board structure with spray orifice.
Please refer to Fig. 8 to Figure 11, it is the making flow chart of second embodiment of the invention.
At first its step is as Fig. 1 to Fig. 4 of first embodiment, at first, and after the surface deposition sacrificial metal layer of base material; Produce photoresist layer in sacrificial layer surface; Above sacrificial metal layer, form the metallic conduction circuit in the electroforming mode again.And above the metallic conduction circuit coating one first photosensitive polymer layer, after the first sensing optical activity polymeric layer being exposed by light shield with suitable light source, promptly produce spray orifice and expose the through hole of metal conductive wire pass foot.
Then, as shown in Figure 8, form the second photosensitive polymer layer 141 on the first sensing optical activity polymeric layer, 140 surfaces that manufacturing is finished again, and utilize suitable light shield 200 exposure second layer photosensitive polymer layers 141 to produce fluidic structures such as ink storing chamber and runner.
Then, as shown in Figure 9, the exposing patterns of the develop second photosensitive polymer layer 141 and the first photosensitive polymer layer 140 is to form fluidic structures such as spray orifice, the through hole that exposes metal conductive wire pass foot, ink storing chamber and runner.
As shown in figure 10, employed photoresist layer when removing sacrificial metal layer 110 and electroforming metal makes metallic conduction circuit 130, the first photosensitive polymer layer 140 and the second photosensitive polymer layer 141 all break away from base material 100 has spray orifice, ink storing chamber and runner with formation flexible circuit board.
And; as shown in figure 11; also can be when removing electroforming metal before the employed photoresist layer; flexible circuit board is turned; utilize photoetching process to form protective layer 151 on the surface of metallic conduction circuit 130; again when development protective layer 151 patterns, employed photoresist layer when coming along except that electroforming metal, protective layer 151 are formed at metallic conduction circuit 130 and adhere to another surface outside the surface of the first photosensitive polymer layer 140.
The present invention makes spray orifice by photoetching technique, and its circularity and thickness all can arbitrarily be controlled, and the quality of circularity and thickness all is much better than conventional art, only need change light shield and just can make irregular spray orifice.Spray orifice and ink storing chamber are incorporated into flexible circuit board to form single component, can effectively reduce cost, do not need additionally to make spray nozzle sheet and on chip, form ink storing chamber, simultaneously, the base material of flexible circuit board, spray orifice, ink storing chamber can be on same making platform, use same manufacture method, finish fast and accurately.
Certainly, the present invention also can have other various embodiments, and under the situation that does not deviate from spirit of the present invention and essence thereof, the structure of device can be improved through further, but these corresponding changes all should belong to the protection domain of the appended claim of the present invention.
Claims (10)
1, a kind of manufacture method of ink gun assembly is characterized in that, comprises following steps:
One base material is provided;
Form a sacrifice layer at described substrate surface;
Form a metallic conduction circuit in described sacrificial layer surface;
Form one first photosensitive polymer layer at described metal conductive wire road surfaces;
Form more than one spray orifice and more than one through hole with photoetching process at the described first photosensitive polymer layer, described spray orifice provides fluid to pass through, and described through hole is in order to expose a leads ends of this metallic conduction circuit;
Fluidic structures with an above ink storing chamber, described ink storing chamber correspondence also is connected in described spray orifice; And
Remove described sacrifice layer, make the described photosensitive polymer layer described metallic conduction circuit accompanying break away from described base material with it.
2, the manufacture method of ink gun assembly according to claim 1 is characterized in that, forms the step of a metallic conduction circuit above described sacrifice layer, is that the method with electroforming forms described metallic conduction circuit.
3, the manufacture method of ink gun assembly according to claim 2, it is characterized in that, described sacrifice layer is formed by nonmetallic materials, and before the step that forms a metallic conduction circuit above the described sacrifice layer, also comprises one and forms the step of an electroforming Seed Layer in described sacrificial layer surface.
4, the manufacture method of ink gun assembly according to claim 1, it is characterized in that, forming the step of a metallic conduction circuit above described sacrifice layer, is to form a metal level earlier above described sacrifice layer, cooperates the described metal level of photoetching process etching to form described metallic conduction circuit again.
5, the manufacture method of ink gun assembly according to claim 1, it is characterized in that, described formation has the step of a fluidic structures of an above ink storing chamber, be to form one second photosensitive polymer layer, and form described fluidic structures with photoetching process at the described first photosensitive polymer laminar surface.
6, the manufacture method of ink gun assembly according to claim 1 is characterized in that, also comprises one and forms the step of a protective layer at described metal conductive wire road surfaces.
7, the manufacture method of ink gun assembly according to claim 1 is characterized in that, described sacrifice layer is formed by metal material.
8, a kind of ink gun assembly is characterized in that, comprises:
One photosensitive polymer layer base material, it has more than one spray orifice and passes through so that fluid to be provided, and described spray orifice forms with photoetching process;
One metallic conduction circuit, be located at described photosensitive polymer layer substrate surface, described metallic conduction circuit has a front end and a leads ends, described front end is used for receiving outside signal, then in order to the electric connection with a chip to be provided, described leads ends exposes to described photosensitive polymer layer base material to described leads ends; And
One fluidic structures, it is incorporated into described photosensitive polymer layer base material, and described fluidic structures has more than one ink storing chamber, and described ink storing chamber correspondence also is connected in described spray orifice.
9, ink gun assembly according to claim 8 is characterized in that, described fluidic structures also comprises more than one runner, and described runner is in order to provide ink to described ink storing chamber.
10, ink gun assembly according to claim 8 is characterized in that, also comprises one and forms a protective layer at described metal conductive wire road surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03156769XA CN1302930C (en) | 2003-09-10 | 2003-09-10 | Ink jetting head assembly and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03156769XA CN1302930C (en) | 2003-09-10 | 2003-09-10 | Ink jetting head assembly and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1593924A CN1593924A (en) | 2005-03-16 |
| CN1302930C true CN1302930C (en) | 2007-03-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB03156769XA Expired - Fee Related CN1302930C (en) | 2003-09-10 | 2003-09-10 | Ink jetting head assembly and production method thereof |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
| ES2747823T3 (en) | 2013-02-28 | 2020-03-11 | Hewlett Packard Development Co | Molded print bar |
| US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
| CN105189122B (en) | 2013-03-20 | 2017-05-10 | 惠普发展公司，有限责任合伙企业 | Molded die slivers with exposed front and back surfaces |
| TWI572494B (en) * | 2013-07-29 | 2017-03-01 | 惠普發展公司有限責任合夥企業 | Fluid flow structure and method of making fluid channel in a fluid structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04120791A (en) * | 1990-09-12 | 1992-04-21 | Hitachi Chem Co Ltd | Manufacture of multilayer printer circuit board |
| JPH0537128A (en) * | 1991-07-30 | 1993-02-12 | Casio Comput Co Ltd | Manufacture of wiring substrate |
| US5305015A (en) * | 1990-08-16 | 1994-04-19 | Hewlett-Packard Company | Laser ablated nozzle member for inkjet printhead |
-
2003
- 2003-09-10 CN CNB03156769XA patent/CN1302930C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5305015A (en) * | 1990-08-16 | 1994-04-19 | Hewlett-Packard Company | Laser ablated nozzle member for inkjet printhead |
| JPH04120791A (en) * | 1990-09-12 | 1992-04-21 | Hitachi Chem Co Ltd | Manufacture of multilayer printer circuit board |
| JPH0537128A (en) * | 1991-07-30 | 1993-02-12 | Casio Comput Co Ltd | Manufacture of wiring substrate |
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| Publication number | Publication date |
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| CN1593924A (en) | 2005-03-16 |
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