CN1243416A - 制造多层电路板的方法和用该方法制造的多层电路板 - Google Patents

制造多层电路板的方法和用该方法制造的多层电路板 Download PDF

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CN1243416A
CN1243416A CN99110038A CN99110038A CN1243416A CN 1243416 A CN1243416 A CN 1243416A CN 99110038 A CN99110038 A CN 99110038A CN 99110038 A CN99110038 A CN 99110038A CN 1243416 A CN1243416 A CN 1243416A
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electrocondution slurry
circuit board
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畠山秋仁
十河宽
小岛环生
堀尾泰彦
塚本胜秀
福村泰司
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Abstract

一种制造印刷电路有机基板的方法,包括下列步骤:在带有覆盖薄膜(1)并且具有压缩收缩性的多孔原材料基片(2)上钻通孔(3);把导电浆料(4)注满到通孔(3)内;从其通孔(5)注满了导电浆料(4)的多孔原材料基片(2)上除去覆盖薄膜(1);把金属箔(5)敷在已除去覆盖薄膜(1)的多孔原材料基片(2)的表面上;通过热压,将敷有金属箔(5)的多孔原材料基片(2)压缩;从而,通过导电浆料(4)中的导电物质使金属箔(5)之间实现电连接。

Description

制造多层电路板的方法和 用该方法制造的多层电路板
本发明涉及印刷电路板；特别是有关制造印刷电路有机基板的方法，在该有机基板的两面有金属箔；本发明还涉及到用上述方法制造的有机基板。
近来，随着电子设备越来越小型化，并且安装密度越来越高，因而，不仅在产业应用上，而且在一般日常生活中，都非常需要多层印刷电路板。在上述多层印刷电路板中，层与层之间的印刷图形通过内通孔而实现连接，这种连接结构必须有高的可靠性。
参照图10(a)至10(e)，下面将叙述一种制造普通的双面印刷电路板的方法。
首先，如图10(a)所示，通孔83(在图10(a)至10(e)的每一幅图上仅示出了一个通孔83)位于绝缘基板82如玻璃-环氧树脂基板等的预定位置，基板的一面敷有一薄层81，而把第一铜箔84粘覆在其另一面，即基板82的下表面。然后，如图10(b)所示，把薄层81作为印刷掩膜，在通孔83内注满导电浆料85。然后，把薄层81从绝缘基板82上去除，如图10(c)所示，通孔83内填满了导电浆料85。不过，在这种情况下，往往有一定数量的导电浆料85，在绝缘基板82上呈隆起或高出状态地残留在通孔83的上部，其残留量取决于薄层81的厚度。接着如图10(d)所示，把第二铜箔86敷在绝缘基板82的上表面，使所述基板82和铜箔被彼此完全粘结在一起，同时，使导电浆料85凝固。然后，如图10(e)所示，根据需要对第一铜箔84和第二铜箔86作选择性腐蚀，以此形成所示的第一电路图形87a和第二电路图形87b。
在上述方法中，第一、第二电路图形87a和87b利用通孔83内注满的导电浆料85而实现内通孔连接，这样便获得了双面印刷电路板88。
下面参照图11(a)至11(d)，以四层印刷电路板为例，叙述普通的多层印刷电路板的制造方法。
首先，如图11(a)所示，在绝缘基板92的一面设有薄层91并在其预定位置钻有通孔93，将该绝缘基板92粘附到按图10(a)至10(e)制成的第一双面印刷电路板88上。然后如图11(b)所示，把薄层91作为印刷掩模，在通孔93内注满导电浆料94。再从绝缘基板92上去除薄层91，如图11(c)所示，仅仅在通孔93内填满导电浆料94。接着，按照类似图10(a)至10(e)所示的那些步骤制作电路图形96a与96b，从而制成第二双面印刷电路板95，通过叠合，将该电路板95固定到绝缘基板92上，这样便获得了四层印刷电路板。
然而，到此为止，所述的公知技术存在以下问题。
首先，在上述已知的结构中，利用印刷工艺将导电浆料填充到通孔中，而该导电浆料中，导电物质的含量受到一定的限制。这种情况不利于减小导电浆料的电阻值，也不利用减小导电浆料与金属箔之间的电阻值，更准确地说，为了减小注入通孔内的导电浆料的电阻值，而增加导电浆料中导电物质的含量时，浆料的流动性会降低，从而使印刷性能降低，这样往往导致隆起，产生如注入不合格等缺陷。
因此，为了把导电浆料注满到小直径的通孔内，需要使导电浆料的流动性提高到一定的程度。为了上述目的，可增加浆料的流动性。就改善印刷性能来说，如果降低导电浆料内导电物质的含量，那么在这种情况下，却存在这样的缺点，即，由于减少了导电物质的含量，因而当导电浆料凝固后其电阻便增加了。
其次，在普通的结构中，往往有一定量的导电浆料85以膨胀或隆起高于绝缘基板82表面的状态残留下来，其残留量取决于薄层81的厚度，如图10(c)所示。在上述状态下，如果把第二铜箔86敷到绝缘基板82上，那么就没有使鼓起的导电浆料85排出的空间，并且在某些情况下，所述浆料渗入到第二铜箔86和绝缘基板82之间的空隙中，如图12(a)所示。如果上述绝缘基板82上的第二铜箔86被腐蚀形成第二电路图形87b.，那么渗入到第二铜箔86和绝缘基板82之间的导电浆料85便形成短路线85a，如图12(b)所示，这样会导致邻近的电路图形之间短路连接。
由于上述问题，因而在印刷电路的一般有机基板上，内连接通孔的数量和单位面积内可形成电路图形的密度受到限制，因此，在多层电路板上难以实现所期待的高密度安装。
因此，本发明的主要目的是提供一种用于印刷电路的有机基板的制造方法，该制造方法以高质量实现了高性能的印刷电路板。使得在内连接通孔中，导电浆料以及导电浆料和金属箔之间的连接电阻减小，同时使导电浆料保持一定的印刷性能，邻近内通孔之间存在的短接缺陷被消除，提供了由所说制造方法所制成的印刷电路有机基板，并且还获得了由所述有机基板构成的多层印刷电路板。
本发明的另一个目的是提供印刷电路有机基板的制造方法，以及由上述方法制造的有机基板，其结构简单，可靠性高，性能稳定，并且制造成本低。
为实现上述全部目的，根据本发明的一个最佳实施例，提供了一种制造印刷电路的有机基板的方法。该方法包括下列步骤：在多孔原材料基片上形成通孔，而多孔原材料基片上具有覆盖薄膜，并且具有压缩收缩性，它由非织物纤维和热固性树脂的复合材料构成；把导电浆料注入所述通孔；把覆盖薄膜从所述在其通孔内注满导电浆料的多孔原材料基片上去除；把金属箔粘敷到已去除所述覆盖薄膜的所述多孔原材料基片的表面上；并且通过加热和加压对上述粘敷了金属箔的多孔原材料基片进行热压，使其压缩。
如上所述，根据本发明，通过使用由非织物纤维和热固性树脂的复合材料所制成的多孔原材料基片，可容易地把导电物质含量较少的导电浆料注满通孔，并且印刷性能优良，同时由于在加工过程中导电浆料中部分粘合剂成分渗透到非织物纤维的多孔部位，所以该导电浆料中导电物质的组份比例增加了。
此外，通过使用具有压缩收缩性并且由非织物纤维和热固性树脂构成的多孔原材料基片，在热压多孔原材料基片的步骤中，也同时热压了导电浆料。这时，粘合剂成分被从导电物质之间挤出。因此，增强了导电物质之间以及导电物质和金属箔之间的粘结，有利于压实导电浆料内的导电物质。
进一步地，由于在通孔内注满导电浆料的粘合剂成分渗透到具有压缩性的多孔原材料基片中，所述可减少注入的量，并由此可消除这样的不利情况，即导电浆料进入多孔原材料和粘附到该多孔原材料基片两面的金属箔之间。从而防止了邻近电路图形之间的短接疵病。
下面参照附图，对最佳实施例进行描述，由此，本发明的所有目的和特征将会更加清楚。在附图中：
图1(a)至1(e)是截面剖视图，说明本发明的一个最佳实施例的印刷电路有机基板的制造方法；
图2是由图1(a)至1(e)的方法制成的印刷电路有机基板的局剖透视图；
图3(a)至3(f)是截面剖视图，说明本发明的第二实施例的印刷电路有机基板的制造方法；
图4(a)至4(f)是截面剖视图，说明本发明的第三实施例的印刷电路有机基板的制造方法；
图5是曲线图，表示多孔原材料基片所承受的压强、压缩率和厚度之间的关系；
图6也是曲线图，表示压缩率与填满在通孔内的导电浆料电阻之间的关系；
图7是本发明的印刷电路有机基板的局部剖视图；
图8(a)至8(i)是说明本发明的一个实施例的多层印刷电路板制造方法的局部截面剖视图；
图9是由图8(a)至8(i)的方法制成的多层印刷电路板的分解透视图；
图10(a)至10(e)是说明一般双面印刷电路板(已描述过)的制造方法的局部截面剖视图；
图11(a)至11(d)是说明一般多层印刷电路板的制造方法的局部截面剖视图；
图12(a)至12(b)是说明一般双面印刷电路板制造方法中存在问题的局部截面剖视图。
在叙述本发明前，要说明的是在全部附图中，用同一个参考数字标号表示同一个部分。
实施例1
现在参照附图，图1(a)至1(e)所示的是根据本发明的一个最佳实施例而制造刷电路有机基板的方法。该有机基板的结构如图2所示。
首先，如图1(a)所示，制备一个多孔基体或原材料基片2，其厚度为t1，在相对的两个表面上敷设由聚酯或类似材料制成的覆盖薄膜1。为了获得这样的多孔原材料基片2，例如把热固性环氧树脂渗透到由芳香聚酰胺纤维制成的非织物纤维中并且使其中具有小孔或空隙2a，这样制成复合材料的基本部件(以下称为芳酰胺环氧树脂片)。这里就芳酰胺环氧树脂片2来说，空隙2a的体积比为10～60％。然后如图1(6)所示，利用激光加工等工艺手段在芳酰胺环氧树脂片2的预定位置钻通孔3。然后象图1(c)所示的那样，在通孔3内注满导电浆料4。应该注意的是，导电浆料4由作为导电物质的银粉末和不溶于粘合剂的环氧树脂组成，并且将银粉末和粘合剂混合、搅拌而制成，银粉末的含量设定为85％(重量)。为了填注导电浆料4，把具有通孔3的芳酰胺环氧树脂片2放置在印刷机的工作台上(未示出)，直接在覆盖薄膜1的上面印刷导电浆料4。在这种情况下，上表面的覆盖薄膜1起印刷掩模的作用，并且防止芳酰胺环氧树脂片2表面被弄脏。在这个过程中，导电浆料4中的部分粘合剂已经渗入到所述的芳酰胺环氧树脂片2内。并且在导电浆料4中，相对于粘合剂，导电物质的组份比例逐渐增加。接着，把芳酰胺环氧树脂片2两面的覆盖薄膜1去除。下一步如图1(d)所示，金属箔5如铜箔等被粘敷到芳酰胺环氧树脂片2的两面。在这种状态下，通过加热和加压来压缩芳酰胺环氧树脂片2，同时使芳酰胺环氧树脂片2和金属箔5相互粘合。这时，加热和加压的条件是：在30分钟内温度从室温升至200℃，同时在真空状态下施加压强为60kgf/cm2的压力，然后保温200℃，保温时间60分钟。然后在30分钟内使温度降至室温。经过上述步骤，导电浆料也被压紧。在该工艺过程中，粘合剂被从导电物质间压出，这样，使导电物质之间以及导电物质与金属箔之间的粘合得到加强，压实了导电浆料内的导电物质。同时芳酰胺环氧树脂片2的厚度被压缩至t2，并且使作为芳酰胺环氧树脂片2一种成分的环氧树脂和导电浆料4被固化或凝固。在上述情况下，导电浆料内的导电物质含量升至92.5％(重量)。
更具体地说，在本实施例中，当应用厚度t1为150至220μm，孔隙率(即所有孔隙2a的体积与多孔原材料体积之比)为10至60％的芳酰胺环氧树脂片作为芳酰胺环氧树脂片2时，通过热压工序后的厚度t2如图1(e)所示变成60至200μm，孔隙率减少至0～5％，孔隙2a的尺寸也变得更小。若芳酰胺环氧树脂片2的孔隙率低于10％，则导电浆料4的部分粘合剂渗入芳酰胺环氧树脂片2中的效果不明显，如果高于60％，则在有机基板内仍留有空隙。
实施例2
下面参照图3(a)至3(f)，描述本发明的第二实施例的印刷电路有机基板的制造方法。
首先，如图3(a)所示，制备与第一实施例一样的芳酰胺环氧树脂片2，将其厚度设定为t3。然后如图3(b)所示，在100℃、12.5kgf/cm2的条件下热压3分钟，使芳酰胺环氧树脂片2预先被压编。这时芳酰胺环氧树脂片2被压缩至厚度t4，空隙2a的大小和孔隙率均减小。这样预压的目的是防止在下面工序中导电浆料4进入芳酰胺环氧树脂片2和金属箔5之间的界面，改善薄膜1和芳酰胺环氧树脂片2之间的粘合性，还为了控制导电浆料4中的粘合剂渗入芳酰胺环氧树脂片2中的量。然后如图3(c)所示，在芳酰胺环氧树脂片上的预定位置，用激光加工等工艺来钻通孔3′。再如图3(d)所示，把导电浆料4注满通孔3。为了填注导电浆料4，把具有通孔3的芳酰胺环氧树脂片2放置在印刷机的工作台上(未示出)，直接在覆盖薄膜1上面印刷导电浆料。这时，上表面的覆盖薄膜1起印刷掩模作用。并且防止弄脏芳酰胺环氧树脂片2的表面。在该步骤中，导电浆料4中的部分粘合剂已经渗入到所述芳酰胺环氧树脂片2中，在导电浆料4内，相对于粘合剂来说，导电物质的组份比例逐渐增加。接着从芳酰胺环氧树脂片2的两面除去覆盖薄膜1。再如图3(e)所示，把金属箔5如铜箔等粘贴到芳酰胺环氧树脂片2的两面。在这种状态下，通过加热加压使芳酰胺环氧树脂片2被压缩，同时使芳酰胺环氧树脂片2和金属箔5互相粘合，如图3(f)所示。在上述情况下，加热和加压条件是：在30分钟内使温度从室温上升至200℃，同时在真空中加压，其压强为60kgf/cm2，然后在200℃的温度上保温60分钟，接着在30分钟内使温度降至室温。通过上述步骤，导电浆料也被压实，在这个过程中，粘合剂成分被从导电物质间挤出。这样，使导电物质之间以及导电物质与金属箔之间的粘结得到加强，压实了导电浆料内的导电物质。同时芳酰胺环氧树脂片2的厚度被压缩至t5，并且作为芳酰环氧树脂片2一种成分的环氧树脂和导电浆料4被固化或凝固。
更具体地说，在上述实施例中，当使用厚度t3为150至220μm、孔隙率为40至60％的芳酰胺环氧树脂片作为芳酰胺环氧树脂片2时，通过加热加压的预压缩步骤后的厚度t4变为100至150μm，如图3(b)所示。并且孔隙率减少至10～30％，空隙2a也变得较小。进而压缩工序后的厚度t5如图3(f)所示变成90至100μm，而且孔隙率减至0～5％，空隙2a的尺寸也变得更小。
实施例3
再参照图4(a)至4(f)，下面将叙述本发明第三实施例的印刷电路有机基板的制造方法。
首先，如图4(a)所示，制备芳酰胺环氧树脂片2，其厚度为t6，该片2的至少一面有用聚酯或类似材料制成的覆盖薄膜1。就该芳酰胺环氧树脂片2来说，与第一实施例一样，采用具有空隙或小孔2a的芳酰胺环氧树脂片。接着如图4(b)所示，在芳酰胺环氧树脂片2的预定位置上用激光等加工工艺来钻通孔3。然后如图4(c)所示，将铜箔之类的第一金属箔5a敷盖到芳酰胺环氧树脂片2的下表面。应该注意的是，在多孔原材料基片的两面都有覆盖薄膜1的情况下，在除去下表面上的覆盖薄膜后才粘贴第一金属箔5a。接着如图4(d)所示，把导电浆料4注满到通孔3中。为了注入导电浆料4，把具有通孔3的芳酰胺环氧树脂片2放置在印刷机的工作台上(未示出)，并且直接在覆盖薄膜1上面印刷导电浆料4。在这种情况下，上表面上的覆盖薄膜1起印刷掩模的作用，并且防止弄脏芳酰胺环氧树脂片的表面。在这个步骤中，导电浆料4中的部分粘合剂已渗入到所述芳酰胺环氧树脂片2中。并且在导电浆料4中，相对于粘合剂来说，导电物质的组份比例逐渐增加。接着将覆盖薄膜1从芳酰胺环氧树脂片2的上表面除去。然后如图4(e)所示，把第二金属箔5b如铜箔等粘贴到芳酰胺环氧树脂片2的上表面。在这种情况下，通过加热和加压使芳酰胺环氧树脂片2被压缩，同时使第一金属箔5a粘合到芳酰胺环氧树脂片2的下表面，使第二金属箔5b粘合到所述片2的上表面。在上述情况下，加热和加压的条件是：温度在30分钟内从室温上升至200℃，同时在真空条件下加压，其压强为60kgf/cm2，再在200℃中保温60分钟，然后在30分钟内降至室温。
通过上述步骤，导电浆料也被压实，在此期间，粘合剂成分被从导电物质间挤出。这样，加强了导电物质之间以及导电物质与金属箔之间的粘合，压实了导电浆料中的导电物质，同时芳酰胺环氧树脂片2的厚度被压缩成t7。并且作为芳酰胺环氧树脂片2一种成份的环氧树脂和导电浆料4被固化。
更具体地说，在上述实施例中，当使用厚度t6为150至220μm、孔隙率为10至60％的芳酰胺环氧树脂片作为芳酰胺环氧树脂片2时，在热压工序后，其厚度t7，如图4(f)所示，变为60至200μm，并且孔隙率减至0～5％，空隙2a的尺寸也变小。
应该注意的是，如图4(a)所示，芳酰胺环氧树脂片可以象前面所述的第二实施例一样，进行预压，使厚度和孔隙率减小。
就导电浆料4中的导电物质而言，在上面所述的第一、第二、和第三实施例中可以使用银、金、银钯合金、铜和一种以上的上述物质所组成的合金中选出的物质。另外导电物质颗粒的形状最好是球形，更准确地说，利用导电材料的球形金属颗粒，当导电浆料4受到压力时，粘合剂可容易地从金属颗粒的接触部分挤出。同时还由于金属颗粒的接触部分彼此容易产生塑性形变，所以金属颗粒之间以及金属颗粒与金属箔之间彼此容易紧密地结合。从而，使内通孔的连接电阻可大大降低。
同样，在第一、第二或第三实施例中，通过热压而使两层金属箔5之间的芳酰胺环氧树脂片2压缩的步骤可作如下改进，例如该步骤可分两步进行：第一步是提高导电浆料4的粘性，第二步是把金属箔5和芳酰胺环氧树脂片2粘合起来。在这种情况下，由于在第一步首先提高了导电浆料4的粘性，因而可有效地防止导电浆料4进入芳酰胺环氧树脂片2和金属箔5之间的界面。这将会产生良好的效果，特别是在布线密度高的印刷电路板内，通孔3之间的相互距离很短的情况下，这种潜在的效果会更加显著。
同时，在第一、第二或第三实施例中，设置导电浆料4的胶凝点，该点低于芳酰胺环氧树脂片成分之一的环氧树脂的软化温度。由于导电浆料4的凝结首先开始于热压在金属箔5之间的芳酰胺环氧树脂片2的步骤，并在粘性提高到一定程度后，引起作为片2的成份之一的环氧树脂变软，可阻止导电浆料4进入片2和金属箔5之间的界面这个不希望出现的现象产生。这将会产生良好的效果，特别是在布线密度高的印刷电路板内，通孔3之间的相互间距很短的情况下，这种潜在的效果会更加显著。
接着，下面将说明在第一、第二或第三实施例中至关重要的热压多孔原材料基片的情况。通过下面的公式来定义压缩率：
压缩率＝(T-t)/T    ……(1)
其中T是热压前多孔原材料基片的厚度；t是热压后芳酰胺环氧树脂片2的厚度。
在图5中示出了当芳酰胺环氧树脂片2的厚度为200μm，多孔原材料基片的孔隙率为40％时，并且在100℃的条件下热压3分钟的情况下，多孔原材料基片所承受的压强、压缩率和厚度之间的关系曲线。
如图5所示，虽然多孔原材料的厚度随着所承受的压强的增加而减小，但当承受的压强超过压缩率临界点P时，厚度的变化量则会减小。把厚度的变化量代入公式(1)中便可求得压缩率。
因此，最好是在图5所示的压缩率临界点P之前的范围内，进行第二实施例中的图3(b)所示的预压步骤，并且在压缩率临界点P之后的范围内，进行图3(f)、1(c)和4(f)所示的热压步骤。
图6的曲线表示压缩率和注满通的导电浆料的电阻之间的关系，纵座标表示每一个通孔的电阻值。
图6所示曲线的测试试样的制作过程如下：
首先，把厚度为200μm的芳酰胺环氧树脂片作为多孔原材料基片，并且100℃、25kgf/cm2的条件下预压3分钟，用激光工艺在片上钻出直径为0.2mm的通孔；然后，把银粉作为金属颗粒，把非溶剂型环氧树脂作为粘合剂，把上述银粉分散到上述非溶剂型环氧树脂中，由此制成导电浆料，把该导电浆料注满每个通孔，把铜箔粘贴到芳酰胺环氧树脂片的两面，然后进行热压，其热压条件是；在30分钟内把温度从室温升至200℃，同时，在真空条件下施加压强为60kgf/cm2的压力，再以200℃的温度保温60分钟，接着在30分钟内降至室温。此后，腐蚀该片两面的铜箔，形成具有500个通孔串联连接的图形，通过测量电路图形的总电阻，计算出每个通孔的电阻值。
如图6所示，随着压缩率增加，电阻值急剧减少，当压缩率超过电阻值的临界点R时，电阻值的变化量很小，获得了稳定的电连接。
实施例4
下面再参照图7，叙述本发明的一个实施例的印刷电路有机基板。
如图7所示，在该实施例的印刷电路有机基板中，利用所述片2的通孔3中所填满的导电浆料，使芳酰胺环氧树脂片2的两面所粘贴的金属箔进行电连接。在所述的导电浆料4注入通孔3中以后，该导电浆料4中的导电物质的组份比例将逐渐增加。并且在粘结金属箔5后的热压步骤中，粘合剂成分被从导电物质之间挤出。这样，导电物质之间以及导电物质和金属箔之间的粘结得到加强。从而，在本实施例的导电浆料4中，其导电物质与通常的内通孔连接所使用的导电物质相比更加密实。
实施例5
下面参照图8(a)至8(i)叙述本发明的又一个实施例的多层印刷电路板的制造方法。
这里应该注意的是，图8(a)和8(b)表示制作第一电路层压片的工艺过程；图8(c)和8(d)表示制作第二电路层压片的工艺过程；图8(e)和8(g)表示制作中间连接片的工艺过程，该部分用于在第一和第二电路层压片叠合后实现第一和第二电路层压片之间相互连接；图8(h)和8(i)表示将第一和第二电路层压片叠合形成预定多层电路板的工艺过程，中间连接片夹在这两层电路层压片之间。图9表示由上述工艺过程制作的多层印刷电路板的分解透视图。
首先，如图8(a)所示，利用上述参照图1(a)至1(e)、图3(a)至3(f)或图4(a)至4(f)所描述的方法，制备第一印刷电路有机基板21。然后如图8(b)所示，利用普通的图形制作方法，腐蚀基板21两面的金属箔5，例如铜箔或其它金属箔、由此制成具有电路图形22的第一印刷电路层压片23。同样，如图8(c)和8(d)所示，加工第二印刷电路有机基板24制成具有电路图形25的第二印刷电路层压片26。应该注意的是，这里的印刷电路层压片23和26的每一片都可作为双面印刷电路板。
除了第一印刷电路层压片23和第二印刷电路层压片26的制造工序外，还要按图8(e)至8(g)所示的步骤制造中间连接片31。
首先，如图8(e)所示，制备带有覆盖薄膜27的芳酰胺环氧树脂片28，其厚度为T8，然后如图8(f)所示，用激光等加工工艺在芳酰胺环氧树脂片28上的预定位置钻出通孔29。然后如图8(g)所示，将导电浆料30注满通孔29内。为了注满导电浆料30，把具有通孔29的芳酰胺环氧树脂片28放置在印刷机的工作台上(未示出)，直接在覆盖薄膜27上印刷导电浆料30。这时，上表面的覆盖薄膜27起印刷掩模的作用，而且防止弄脏芳酰胺环氧树脂片28的表面。在印刷导电浆料30后，除去覆盖薄膜27，从而制成了中间连接片31。应该在此注意的是，在图8(f)和8(g)的工序中，所形成的通孔29的数量应该与相互连接的两层电路图形所要求的数量相对应。
接着，在下面将描述利用中间连接片31叠合第一电路层压片23和第二电路层压片26的工序。
首先，如图8(h)所示，将带有第二电路层压片26的中间连接片31放置在第一电路层压片23上。然后，如图8(i)所示，通过加热和加压把第一电路层压片23和第二电路层压片26彼此叠压在一起。同时利用导电浆料4和30给电路图形22和25提供内通孔连接。在这个过程中，中间连接片31被压缩和固化，其厚度变为t9，同时，导电浆料也被固化。
更具体地说，在本实施例的中间连接片的制造工艺中，当使用厚度t8为150至220μm、孔隙率为10至60％的芳酰胺环氧树脂片作为芳酰胺环氧树脂片28时，通过热压工序后，其厚度t9，如图8(h)所示，变成60至200μm，并且孔隙率降至0至5％。
同时，为了制造层数更多的多层电路板，可以按照预定的要求制备预定数量的电路层压片和用于电路层压片之间内连接的中间连接片，在这些印刷电路层压片之间夹进中间连接片，然后加热加压使它们叠合。或通过重复图8(h)所示的工序，并重复热压步骤，把中间连接片和电路层压片一组接一组地叠压起来。
这里应该注意的是，多层电路板也可用通常的方法制造，即在电路层压片上叠合中间连接片，再在中间连接片上叠合其他金属箔，通过加热和加压把电路层压片、中间连接片和上述其他金属箔粘结起来，再腐蚀所说的上述其他金属箔以形成电路图形，或重复上述通常的方法。
到此为止所描述的多层印刷电路板的制造方法中，由于在中间连接片31的每个通孔29的下表面敞开的状态下，充分地注入导电浆料30，因此，可以在图8(g)所示的步骤后，把中间连接片31作为一个单独的部件，利用光学装置等，对该中间连接片31进行检查。所以，在图8(h)所示的步骤中，第一电路层压片23、第二电路层压片26和中间连接片31是在被检验过的情况下而叠合在一起的，从而可保持产品的高质量，遏止成本增加。反之，在多层电路板的一般制造工艺中，由于在电路层压片88上直接叠合形成相当于本实施例的中间连接片31的部分，如图11(a)至11(d)所示，如果在某个步骤中产生某些缺陷，那么合格的电路层压片88也必须一起废弃，这将会导致成本的增加。
此外，利用目前所述的本发明的制造方法所产生的多层电路板中，由于第一和第二电路层压片23、26之间利用通过热压形成的中间连接片31而彼此连接，并且导电浆料30中的导电物质被压实，同时导电物质和电路图形22、25之间的接触得到改善，所以内通孔连接的电阻明显减少。而把它应用到高密度或多层电路板中，并且该电路板的内连接孔很多时，上述作用将会更加显著。
通过上面的描述已经清楚，根据本发明，制造用于印刷电路板的有机基板的方法包括以下步骤；在带有覆盖薄膜和具有压缩收缩性的多孔原材料基片上钻通孔；将导电浆料注入到所述通孔内；把金属箔敷在已除去所述覆盖薄膜的所述多孔原材料基片的表面上；并且利用加热和加压，将敷有所述金属箔的所述多孔原材料基片压缩。用该方法制成的印刷电路有机基板具有高可靠性、低电阻的内连接通孔，本发明还涉及按上述方法制成的有机基板。
更具体地说，根据本发明，由于使用导电物质含量较少、并且印刷性能优良的浆料，因而能容易地把导电浆料注入通孔内。而且在制造过程中，导电浆料中的部分粘合剂成分渗入多孔原材料基片的孔隙内，使导电浆料中的导电物质组份比例增加，实现了低电阻的内通孔连接。
此外，在敷加金属箔后，对多孔原材料基片进行加热和加压的工序中，也把导电浆料和金属箔压实了。在这种情况下，导电物质之间的粘合剂成分被挤出，并且导电物质之间以及导电物质与金属箔之间的粘结被增强。借此，使导电浆料内的导电物质密实。
因此，根据本发明，可容易地制造其内连接通孔直径很小的高密度电路板；可容易地制造具有大量内连接通孔的多层电路板；可容易地制造有低电路阻抗要求的低噪声的电路板或高频电路板等。
虽然参照附图通过实施例对本发明作了充分地描述，但应该指出的是，在本发明基础上的各种变化和改型对本领域的普通技术人员来说将是显而易见的，因此，除非这种变化和改型脱离了本发明的范围，否则都应视为落在本发明的范围内。

Claims (4)

1.一种制造多层电路板的方法，其特征在于包括以下步骤：
通过在一基板相对两面上制作电路图形而制出电路板(23，26)；
在一多孔原材料基片(28)上做出通孔(29)并将导电浆料(30)注入所述通孔(29)，以此制出中间连接片(31)；以及，
在所述中间连接片(31)上加上另外的金属箔之后将所述中间连接片(31)夹持在至少一对所述电路板(23，26)之间随后对其热压，或者将所述中间连接片(31)放在所述电路板(23，26)之一上随后对其热压，并对该另外的金属箔进行处理以形成电路图形，以此获得所需的多层电路板。
2.一种多层电路板，包括：
(a)多个绝缘层(2；28)，各层都有一个或多个通孔(3)，并有电路图形；
(b)固化的导电浆料(4)，填充在所述通孔(3)中，所述绝缘层(2；28)相对两面上的电路图形电连接；其特征在于，
(c)所述绝缘层(2；28)由一多孔有机原材料基片通过与已填充在所述通孔(3)中的未固化导电浆料(4)一起加压和固化而制成。
3.根据权利要求2所述的多层电路板，其特征在于，所述多孔原材料基片由非织物纤维和热固性树脂构成。
4.根据权利要求3所述的多层电路板，其特征在于，所述非织物纤维为芳香聚酰胺系材料。
CNB991100387A 1992-05-06 1999-06-25 制造多层电路板的方法和用该方法制造的多层电路板 Expired - Lifetime CN1203731C (zh)

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US5346750A (en) 1994-09-13
CN1203731C (zh) 2005-05-25
CN1092240A (zh) 1994-09-14
KR930024548A (ko) 1993-12-22
DE69317145T2 (de) 1998-07-02
US5481795A (en) 1996-01-09
KR970005002B1 (ko) 1997-04-10
EP0568930A2 (en) 1993-11-10
EP0568930A3 (zh) 1994-04-06
JPH06268345A (ja) 1994-09-22
EP0568930B1 (en) 1998-03-04
CN1056490C (zh) 2000-09-13
DE69317145D1 (de) 1998-04-09

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