CN1230662C - 膜厚度测量设备与膜厚度测量方法 - Google Patents
膜厚度测量设备与膜厚度测量方法 Download PDFInfo
- Publication number
- CN1230662C CN1230662C CNB03101481XA CN03101481A CN1230662C CN 1230662 C CN1230662 C CN 1230662C CN B03101481X A CNB03101481X A CN B03101481XA CN 03101481 A CN03101481 A CN 03101481A CN 1230662 C CN1230662 C CN 1230662C
- Authority
- CN
- China
- Prior art keywords
- film
- current value
- electron beam
- substrate
- substrate current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B15/00—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
- G01B15/02—Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons for measuring thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP009305/2002 | 2002-01-17 | ||
JP2002009305A JP3913555B2 (ja) | 2002-01-17 | 2002-01-17 | 膜厚測定方法および膜厚測定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1432791A CN1432791A (zh) | 2003-07-30 |
CN1230662C true CN1230662C (zh) | 2005-12-07 |
Family
ID=19191507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03101481XA Expired - Fee Related CN1230662C (zh) | 2002-01-17 | 2003-01-17 | 膜厚度测量设备与膜厚度测量方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6850079B2 (zh) |
JP (1) | JP3913555B2 (zh) |
KR (1) | KR100526669B1 (zh) |
CN (1) | CN1230662C (zh) |
TW (1) | TW583390B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3874996B2 (ja) * | 2000-05-30 | 2007-01-31 | ファブソリューション株式会社 | デバイス検査方法および装置 |
JP3913555B2 (ja) * | 2002-01-17 | 2007-05-09 | ファブソリューション株式会社 | 膜厚測定方法および膜厚測定装置 |
JP3953821B2 (ja) * | 2002-01-17 | 2007-08-08 | ファブソリューション株式会社 | 膜厚測定方法および膜厚測定装置 |
JP2004253749A (ja) * | 2002-12-27 | 2004-09-09 | Tokyo Electron Ltd | 薄膜処理方法及び薄膜処理システム |
TWI247096B (en) * | 2004-12-17 | 2006-01-11 | Hon Hai Prec Ind Co Ltd | Optical fiber interference device used for thickness measuring and the method of the same |
WO2006073063A1 (ja) * | 2005-01-07 | 2006-07-13 | Sii Nanotechnology Inc. | 薄膜試料測定方法および装置ならびに薄膜試料作製方法および装置 |
US7420163B2 (en) * | 2005-04-29 | 2008-09-02 | Revera Incorporated | Determining layer thickness using photoelectron spectroscopy |
US7231324B2 (en) * | 2005-04-29 | 2007-06-12 | Revera Incorporated | Techniques for analyzing data generated by instruments |
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US20120222464A1 (en) * | 2011-03-04 | 2012-09-06 | Shenzhen China Star Optoelectronics Technology Co. Ltd | Film-thickness measuring device and calibration method thereof |
JP2013104671A (ja) * | 2011-11-10 | 2013-05-30 | Fujitsu Ltd | 試料作製装置及び試料作製方法 |
CN103234449B (zh) * | 2013-05-09 | 2015-12-09 | 清华大学 | 减小提离波动影响的导体膜厚度测量方法及装置 |
US10203202B2 (en) * | 2014-04-07 | 2019-02-12 | John Weber Schultz | Non-contact determination of coating thickness |
WO2019238373A1 (en) * | 2018-06-12 | 2019-12-19 | Asml Netherlands B.V. | Wafer inspection based on electron beam induced current |
US11410830B1 (en) | 2019-03-23 | 2022-08-09 | Kla Corporation | Defect inspection and review using transmissive current image of charged particle beam system |
JP2021190498A (ja) * | 2020-05-27 | 2021-12-13 | 東京エレクトロン株式会社 | プラズマ処理方法およびプラズマ処理装置 |
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JP3913555B2 (ja) | 2002-01-17 | 2007-05-09 | ファブソリューション株式会社 | 膜厚測定方法および膜厚測定装置 |
-
2002
- 2002-01-17 JP JP2002009305A patent/JP3913555B2/ja not_active Expired - Fee Related
-
2003
- 2003-01-15 TW TW092100763A patent/TW583390B/zh active
- 2003-01-15 US US10/342,242 patent/US6850079B2/en not_active Expired - Fee Related
- 2003-01-17 KR KR10-2003-0003340A patent/KR100526669B1/ko not_active IP Right Cessation
- 2003-01-17 CN CNB03101481XA patent/CN1230662C/zh not_active Expired - Fee Related
-
2004
- 2004-12-06 US US11/005,339 patent/US7002361B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7002361B2 (en) | 2006-02-21 |
JP2003214832A (ja) | 2003-07-30 |
KR20030063191A (ko) | 2003-07-28 |
JP3913555B2 (ja) | 2007-05-09 |
TW583390B (en) | 2004-04-11 |
US20050116726A1 (en) | 2005-06-02 |
CN1432791A (zh) | 2003-07-30 |
KR100526669B1 (ko) | 2005-11-08 |
TW200302342A (en) | 2003-08-01 |
US6850079B2 (en) | 2005-02-01 |
US20030132765A1 (en) | 2003-07-17 |
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Owner name: FARSUR SEMICONDUCTOR Free format text: FORMER OWNER: NEC ELECTRONICS TAIWAN LTD. Effective date: 20031104 |
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Effective date of registration: 20080118 Address after: Tokyo, Japan Patentee after: Kabushiki Kaisha Topcon Address before: Kanagawa, Japan Patentee before: Onmasuki Electronics Co., Ltd. |
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Granted publication date: 20051207 Termination date: 20100220 |