CN105277574A - Multi-exposure image mixing detection method applying repeated exposure - Google Patents
Multi-exposure image mixing detection method applying repeated exposure Download PDFInfo
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- CN105277574A CN105277574A CN201410406034.0A CN201410406034A CN105277574A CN 105277574 A CN105277574 A CN 105277574A CN 201410406034 A CN201410406034 A CN 201410406034A CN 105277574 A CN105277574 A CN 105277574A
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- 238000001514 detection method Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000012360 testing method Methods 0.000 claims description 34
- 239000003973 paint Substances 0.000 claims description 14
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 14
- 238000005286 illumination Methods 0.000 abstract description 10
- 238000004458 analytical method Methods 0.000 abstract description 5
- 238000007689 inspection Methods 0.000 abstract description 4
- 238000004904 shortening Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 24
- 230000003287 optical effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention discloses a multi-exposure image mixing detection method applying repeated exposure, which comprises the following steps: step S100: setting respective exposure time values of a plurality of light source devices with at least one of different wavelength bands and illumination angles in a first configuration; step S200: repeatedly exposing to sequentially turn on and turn off the light source devices after corresponding exposure time values are turned on so that the light source devices sequentially irradiate the circuit substrate to be detected and the image capturing equipment generates detection images mixed in the exposure time values; and step S300: outputting the detection image for analysis and inspection. Therefore, the invention records the image information mixed under different irradiation light rays in one detection image, can avoid each light source device from respectively capturing images, and can obtain a plurality of images in the same time, thereby simplifying the process and effectively shortening the detection time.
Description
Technical field
The present invention relates to a kind of optical detecting method for testing circuit, particularly relate to a kind of detection method applying many exposed image mixing of repeated exposure.
Background technology
Optical identification system is as automatic optical detector (AutomatedOpticalInspection, AOI) and outward appearance eventually examine machine (AutomaticFinalInspection, etc. AFI) board is detected, nowadays be generally applied in the testing process of circuit board group assembling production lines of electronics industry, inspect operation in order to replace artificial visually examine in the past, it utilizes image technology comparison determinand and whether standard video is variant judges that determinand whether meets standard.
Therefore, the detection of optical identification system on circuit plays very important role, and this also makes the testing cost in the manufacturing cost of electronic product depend on quality and the speed of optical identification system.Optical identification system, except wanting accurate basic demand, the more important thing is the rigorous examination wanting to reach required circuit specification with the shortest time.Therefore, even if optical identification system has the screening ability of high precision, once detection speed cannot effectively promote will increase testing cost, and then the turnout that impact is overall.
Prior art is as U.S. Publication US7355692 patent of invention, it discloses a kind of optical detection program being divided into two measuring stations, the analysis result of the image (reflection image) captured by first stop, another image (fluoroscopic image) is captured in the second station again for this analysis result, so, the two width images captured under foundation two different operating stations are to carry out the analysis of circuit defect.Such detection mode is testing process complicated (must operate on the first workstation and the second workstation respectively) not only, also make the time needed for detecting significantly increase (because capturing two width images at different operating station respectively with different time intervals), namely such configuration and method can produce and cause because promoting detection speed the shortcoming that turnout cannot effectively improve.
Summary of the invention
One object of the present invention is the flow process simplifying optical detection and the time shortened needed for detection.
Another object of the present invention is to provide a kind of detection method of carrying out multiple configuration and setting for detection board.
For reaching above-mentioned purpose and other objects, the present invention proposes a kind of detection method applying many exposed image mixing of repeated exposure, comprise: step S100: set tool different wave length section under the first configuration and irradiating angle at least one of them the multiple light supply apparatuses exposure time values separately both this, these exposure time values composition total exposure time; Step S200: carry out repeated exposure and close after sequentially making these light supply apparatuses open corresponding exposure time values, sequentially to expose on circuit under test substrate to make these light supply apparatuses and produces the detection image in these exposure time values mixed by least one of them light both this of different wave length section and irradiating angle by image capturing device; And step S300: export this detection image for analytical review.
In one embodiment of the invention, also step S210 is comprised: the light supply apparatus determining whether other configurations after this step S200, when "No", enter step S300, when "Yes", enter step S220 and the setting of carrying out the multiple light supply apparatuses exposure time values separately under another configuration returns step S200 and detects image for analytical review to produce another.
In one embodiment of the invention, the light supply apparatus of this first configuration comprises visible light wave range light-emitting device and invisible light wave band light-emitting device.
In one embodiment of the invention, under the judgement whether metallic circuit on this circuit under test substrate disconnects, the light supply apparatus of this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is less than this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.Further, the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is 30%, and the ratio that the exposure time values of this ultraviolet light wave band light-emitting device accounts for this total exposure time is 70%.
In one embodiment of the invention, under whether the metallic circuit on this circuit under test substrate has the judgement of protrusion, the light supply apparatus of this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time equals this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.
In one embodiment of the invention, under the whether defective judgement in green paint surface on this circuit under test substrate, the light supply apparatus of this first configuration is side-view light emitting device and positive light light-emitting device, and the exposure time values that the ratio that the exposure time values of this side-view light emitting device accounts for this total exposure time equals this positive light light-emitting device accounts for the ratio of this total exposure time.
Whereby, the present invention is by the repeated exposure of camera head to circuit under test substrate, the image allowing this circuit under test substrate present under different irradiation light is together recorded in a width and is detected on image, make the defect follow-up analytical review directly can being judged rapidly circuit under test substrate by this detection image, and need not looking for and location again via the fault location in the comparison between image and several images, the flow process that can simplify optical detection and the time effectively shortened needed for detection.
Accompanying drawing explanation
Fig. 1 is the configuration schematic diagram of detection system in one embodiment of the invention.
Fig. 2 is the process flow diagram of detection method in one embodiment of the invention.
Fig. 3 a, Fig. 3 b, Fig. 3 c are the image the schematic diagram whether metallic circuit in the present invention one Surface scan embodiment disconnects.
Fig. 4 a, Fig. 4 b, Fig. 4 c are the image schematic diagram whether metallic circuit in the present invention one Surface scan embodiment has protrusion.
Fig. 5 a, Fig. 5 b, Fig. 5 c are the whether defective image schematic diagram in circuit board green paint surface in the present invention one line sweep embodiment.
Critical piece Reference numeral:
100 detection platform
110 circuit under test substrates
The light supply apparatus of 210 first configurations
The light supply apparatus of 220 other configurations
310 image capturing devices
330 computing host
S100 ~ S300 step
Embodiment
For fully understanding object of the present invention, feature and technique effect, hereby by following specific embodiment, and by reference to the accompanying drawings, the present invention being elaborated, being described as follows:
First please refer to Fig. 1, it is the configuration schematic diagram of detection system in one embodiment of the invention.Systems for optical inspection comprises: multiple light supply apparatus 210,220, detection platform 100, circuit under test substrate 110, image capturing device 310 and computing host 330.Wherein the group number of these light supply apparatuses does corresponding setting according to actual demand.This circuit under test substrate 110 can be the plate body of flexible circuitry plate, rigid circuit board or other tool circuit structures.The visual the best of this image capturing device 310 is inspected angle and is given corresponding adjustment, not to be limited directly over the circuit under test substrate 110 shown in Fig. 1.This computing host 330 is in order to come running and the On/Off time of these light supply apparatuses 210,220 of corresponding manipulation according to setting.
In optical detection, by the light source irradiation of the light supply apparatus 210 of the first configuration or the light supply apparatus 220 of other configurations, reflected light, scattered light or exciting light can be generated on this circuit under test substrate 110, the each light source operated in test item needed for circuit under test substrate 110 is recorded in same width image by the present invention, and its How It Works flow process will be described below.
Please refer to Fig. 2, it is the process flow diagram of detection method in one embodiment of the invention.The detection method of many exposed image mixing of application repeated exposure of the present invention, comprises:
Step S100: set tool different wave length section different wave length section under the first configuration and irradiating angle at least one of them the multiple light supply apparatuses exposure time values separately both this, these exposure time values composition total exposure time;
Step S200: carry out repeated exposure and close after sequentially making these light supply apparatuses open corresponding exposure time values, sequentially to expose on circuit under test substrate to make these light supply apparatuses and produces the detection image in these exposure time values mixed by least one of them light both this of different wave length section and irradiating angle by image capturing device; And
Step S300: export this detection image for analytical review.
Above-mentioned steps is the flow process when a kind of light source configuration, then after next light source configuration of switching, can carry out above-mentioned steps flow process equally when detection system has the light source configuration of many group configurations.The illumination of Different Light configuration of the present invention refer to for for testing circuit defect kind corresponding to the light supply apparatus that configures, such as: some defect vertical light is irradiated, some is then the lit sideways with there being angle of inclination, so two kinds of illumination configurations just can be divided in the angle of illumination, moreover, some defect needs to use special wavelength illumination, such as: be generally use ultraviolet light to carry out fluorescence excitation, the reflection of reinforcement metal copper face is carried out with ruddiness, the reflection of green paint is strengthened with green glow, the wireline inspection etc. under green paint is strengthened with near infrared light, so two or more illumination configurations can be divided into again on the wavelength of illumination.Therefore, for Different Light configuration of the present invention, its defect analysis does not need to take the different images captured between Different Light configuration, the present invention can complete the detection of corresponding defect kind under single irradiation configuration, and the switching between different configuration provided by the invention is used for using when detecting different defects.
As shown in Fig. 3 a, Fig. 3 b, Fig. 3 c, it is the image the schematic diagram whether metallic circuit in the present invention one Surface scan embodiment disconnects.Fig. 3 a is the result that illumination configuration list uses visible ray; Fig. 3 b is the result that illumination configuration list uses ultraviolet light; Fig. 3 c throws light on configuration based on the result using visible ray and ultraviolet light under repeated exposure of the present invention simultaneously, and just the ratio of two kinds of light sources is different.It is worth mentioning that, Fig. 3 a and Fig. 3 b also can adopt the illumination configuration of repeated exposure of the present invention to implement, and such as Fig. 3 a can be revised as the combination using the visible ray (99%) of more ratio and the ultraviolet light (1%) of less ratio; Fig. 3 b then can be revised as the combination using the visible ray (1%) of less ratio and the ultraviolet light (99%) of more ratio.More than illustrating it is for multiwave mode, if illustrate with follow-up Fig. 5 of the present invention, is exactly the mode for multi-angle.Accordingly, as long as multiband is combined with multi-angle, single piece image with multi information can be obtained under scanning interval at one time, judge for detection.
Also step S210 is comprised: the light supply apparatus determining whether other configurations after this step S200, when "No", enter step S300, when "Yes", enter step S220 and the setting of carrying out multiple light supply apparatuses exposure time values separately of the tool different wave length section under another configuration returns step S200 and detects image for analytical review to produce another.
Wherein, the light supply apparatus of this first configuration comprises visible light wave range light-emitting device and invisible light wave band light-emitting device.Please refer to accompanying drawing of the present invention, in Fig. 3 a, single have with doubtful seen by radiation of visible light circuit under test substrate the grayscale image that metallic circuit disconnects defect (dashed circle place), the mono-irradiation seen by circuit under test substrate with this invisible light of ultraviolet light of Fig. 3 b has the grayscale image that metallic circuit disconnects defect (dashed circle place), determined whether defect by operator again after needing to obtain two images respectively in the past, image acquired after mode of operation of the present invention as shown in Figure 3 c, by in accompanying drawing can directly depending on dashed circle " do not have " metallic circuit disconnect defect, this is because the base part branch of nonmetallic line absorbs ultraviolet light and produces exciting light, therefore the image of this part can be made to brighten, and under operation of the present invention, because the doubtful metallic circuit disconnection gray-scale value of fault location of Fig. 3 c and the gray-scale value of base material are not similar to, therefore can directly can judge that dashed circle " does not have " defect of metallic circuit disconnection by single this width detection image.
Please refer to Fig. 3 a, Fig. 3 b, Fig. 3 c, it is worth mentioning that, based on the judgement whether above-mentioned metallic circuit disconnects, under advantageous configurations, light supply apparatus except this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, further, the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is less than this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.For example, the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is 30%, and the ratio that the exposure time values of this ultraviolet light wave band light-emitting device accounts for this total exposure time is 70%.But the present invention is not as limit, under the exposure time values that the ratio accounting for this total exposure time in the exposure time values of this visible light wave range light-emitting device is less than this ultraviolet light wave band light-emitting device accounts for the condition of the ratio of this total exposure time, all preferably display effect can be had.
Then please refer to Fig. 4 a, Fig. 4 b, Fig. 4 c, for whether the metallic circuit in the present invention one Surface scan embodiment has the image schematic diagram of protrusion.In Fig. 4 a, single have with doubtful seen by radiation of visible light circuit under test substrate the grayscale image that metallic circuit has protrusion defect (arrow place), the mono-irradiation seen by circuit under test substrate with this invisible light of ultraviolet light of Fig. 4 b has the grayscale image that metallic circuit protrudes defect (arrow place), determined whether defect by operator again after needing to obtain two images respectively in the past, image acquired after mode of operation of the present invention as illustrated in fig. 4 c, by in accompanying drawing can directly depending on arrow " does not have " metallic circuit and protrudes the defect of (it presents indent), this is because the base part branch of nonmetallic line absorbs ultraviolet light and produces exciting light, therefore the image of this part can be made to brighten, and under operation of the present invention, because the doubtful metallic circuit protrusion gray-scale value of fault location of Fig. 4 c and the gray-scale value of metal are not similar to, therefore can directly can judge that arrow " does not have " defect of metallic circuit protrusion by single this width detection image.
Please refer to Fig. 4 a, Fig. 4 b, Fig. 4 c, it is worth mentioning that, whether there is based on above-mentioned metallic circuit the judgement of protrusion, under advantageous configurations, light supply apparatus except this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, further, the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time equals this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.For example, the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is 50%, and the ratio that the exposure time values of this ultraviolet light wave band light-emitting device accounts for this total exposure time is 50%, to reach preferably display effect.
Then please refer to Fig. 5 a, Fig. 5 b, Fig. 5 c, is the whether defective image schematic diagram in circuit board green paint surface in the present invention one line sweep embodiment.Line sweep and Surface scan difference operationally is only that the aobvious image scanned is more clear, accurate, but existing scanning needs mobile whole optical system to carry out the inspection of line sweep formula one by one.
In Fig. 5 a, single with the doubtful grayscale image with circuit substrate defect (arrow place) seen by the radiation of visible light circuit under test base board green paint surface of white sidelight, Fig. 5 b is mono-with the grayscale image seen by the positive light of white (forward entrance) radiation of visible light circuit under test base board green paint surface with circuit substrate defect (arrow place).Determined whether defect by operator again after needing to obtain two images respectively in the past, image acquired after mode of operation of the present invention as shown in Figure 5 c, by in accompanying drawing can directly depending on arrow " have " circuit substrate green paint surface defect, and the contrast degree of overall image be also better than single with image seen by white lit sideways circuit under test substrate (as Fig. 5 a), under operation of the present invention, because the gray-scale value of the fault location on the doubtful circuit substrate of Fig. 5 c green paint surface is not similar to the just evergreen gray-scale value painting surface, therefore can directly can judge that arrow " has " defect on the green paint surface of circuit substrate by single this width detection image.
Please refer to Fig. 5 a, Fig. 5 b, Fig. 5 c, it is worth mentioning that, based on the whether defective judgement of tool of foregoing circuit substrate, under advantageous configurations, light supply apparatus except this first configuration is side-view light emitting device and positive light light-emitting device, further, the exposure time values that the ratio that the exposure time values of this side-view light emitting device accounts for this total exposure time equals this positive light light-emitting device accounts for the ratio of this total exposure time.For example, the ratio that the exposure time values of this side-view light emitting device accounts for this total exposure time is 50%, and the ratio that the exposure time values of this positive light light-emitting device accounts for this total exposure time is 50%, to reach preferably display effect.In other words, Fig. 5 a illustrates under the condition not having repeated exposure, only with after white sidelight (incident with about 45 degree) irradiation, although for district of windowing metal detect defect and be easier to, for the scratch on green paint surface cannot be clear and definite detect; Fig. 5 b illustrates under the condition not having repeated exposure, after only irradiating with the positive light (~ 90 degree) of white, although for district of windowing metal contrast do not have to come well shown in Fig. 5 a, for the scratch on green paint surface can be clear and definite detect; Fig. 5 c that is to say bright under the condition of repeated exposure of the present invention, as long as the scale parameter carrying out positive light and sidelight adjusts, namely can obtain single width image in interval in same detection time.In this width image, though for district of windowing metal contrast do not have Fig. 5 a good, but be better than Fig. 5 b; For the scratch on green paint surface, though contrast does not have Fig. 5 b good, but be better than Fig. 5 a, one of advantage of this that is repeated exposure technology of the present invention.
Comprehensively above-mentioned, the present invention is by the repeated exposure of camera head to circuit under test substrate, the image allowing this circuit under test substrate present under different irradiation light is together recorded in a width and is detected on image, can simplify the flow process of optical detection and effectively shorten the time needed for detecting.
The present invention discloses with preferred embodiment hereinbefore, but it will be understood by those skilled in the art that this embodiment only for describing the present invention, and should not be read as and limit the scope of the invention.It should be noted, every change with this embodiment equivalence and displacement, all should be considered as being covered by category of the present invention.Therefore, the content that protection scope of the present invention ought limit with claims is as the criterion.
Claims (7)
1. apply a detection method for many exposed image mixing of repeated exposure, it is characterized in that, comprise:
Step S100: set tool different wave length section under the first configuration and irradiating angle at least one of them the multiple light supply apparatuses exposure time values separately both this, these exposure time values composition total exposure time;
Step S200: carry out repeated exposure and close after sequentially making these light supply apparatuses open corresponding exposure time values, sequentially to expose on circuit under test substrate to make these light supply apparatuses and produces the detection image in these exposure time values mixed by least one of them light both this of different wave length section and irradiating angle by image capturing device; And
Step S300: export this detection image for analytical review.
2. detection method as claimed in claim 1, it is characterized in that, also step S210 is comprised: the light supply apparatus determining whether other configurations after this step S200, when "No", enter step S300, when "Yes", enter step S220 and the setting of carrying out the multiple light supply apparatuses exposure time values separately under another configuration returns step S200 and detects image for analytical review to produce another.
3. detection method as claimed in claim 1, it is characterized in that, the light supply apparatus of this first configuration comprises visible light wave range light-emitting device and invisible light wave band light-emitting device.
4. detection method as claimed in claim 1, it is characterized in that, under the judgement whether metallic circuit on this circuit under test substrate disconnects, the light supply apparatus of this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is less than this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.
5. detection method as claimed in claim 4, is characterized in that, the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time is 30%, and the ratio that the exposure time values of this ultraviolet light wave band light-emitting device accounts for this total exposure time is 70%.
6. detection method as claimed in claim 1, it is characterized in that, under whether the metallic circuit on this circuit under test substrate has the judgement of protrusion, the light supply apparatus of this first configuration is visible light wave range light-emitting device and ultraviolet light wave band light-emitting device, and the exposure time values that the ratio that the exposure time values of this visible light wave range light-emitting device accounts for this total exposure time equals this ultraviolet light wave band light-emitting device accounts for the ratio of this total exposure time.
7. detection method as claimed in claim 1, it is characterized in that, under the whether defective judgement in green paint surface on this circuit under test substrate, the light supply apparatus of this first configuration is side-view light emitting device and positive light light-emitting device, and the exposure time values that the ratio that the exposure time values of this side-view light emitting device accounts for this total exposure time equals this positive light light-emitting device accounts for the ratio of this total exposure time.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103125041 | 2014-07-22 | ||
| TW103125041A TWI495867B (en) | 2014-07-22 | 2014-07-22 | Application of repeated exposure to multiple exposure image blending detection method |
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| Publication Number | Publication Date |
|---|---|
| CN105277574A true CN105277574A (en) | 2016-01-27 |
| CN105277574B CN105277574B (en) | 2018-04-03 |
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| CN201410406034.0A Active CN105277574B (en) | 2014-07-22 | 2014-08-18 | Multi-exposure image mixing detection method applying repeated exposure |
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| JP (1) | JP6034343B2 (en) |
| KR (1) | KR101679314B1 (en) |
| CN (1) | CN105277574B (en) |
| TW (1) | TWI495867B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108414530A (en) * | 2018-03-13 | 2018-08-17 | 昆山国显光电有限公司 | Automated optical detection equipment |
| CN110006919A (en) * | 2018-12-10 | 2019-07-12 | 浙江大学台州研究院 | A kind of apparatus and method polishing the shallow scratch detection of quartz wafer |
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| EP3418726A4 (en) | 2016-02-19 | 2019-03-20 | SCREEN Holdings Co., Ltd. | Defect detection apparatus, defect detection method, and program |
| CN110146519A (en) * | 2018-02-12 | 2019-08-20 | 志圣工业股份有限公司 | Circuit board detecting method and circuit board exposure method |
| CN110702031B (en) * | 2019-11-19 | 2021-08-27 | 四川长虹电器股份有限公司 | Three-dimensional scanning device and method suitable for dark surface |
| CN111542218B (en) * | 2020-04-23 | 2021-07-20 | 国网浙江省电力有限公司营销服务中心 | Electric energy meter credible production patch link acquisition verification method and system |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101679314B1 (en) | 2016-11-24 |
| JP6034343B2 (en) | 2016-11-30 |
| CN105277574B (en) | 2018-04-03 |
| TW201604536A (en) | 2016-02-01 |
| TWI495867B (en) | 2015-08-11 |
| JP2016024185A (en) | 2016-02-08 |
| KR20160011556A (en) | 2016-02-01 |
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