CN104576544A - Bearing part - Google Patents
Bearing part Download PDFInfo
- Publication number
- CN104576544A CN104576544A CN201310548223.7A CN201310548223A CN104576544A CN 104576544 A CN104576544 A CN 104576544A CN 201310548223 A CN201310548223 A CN 201310548223A CN 104576544 A CN104576544 A CN 104576544A
- Authority
- CN
- China
- Prior art keywords
- bearing seat
- load bearing
- bearing part
- support bar
- part according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 11
- 210000002683 foot Anatomy 0.000 description 18
- 238000012545 processing Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
- H01L2224/78705—Mechanical holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A bearing part comprises a bearing seat, a plurality of conductive parts and a plurality of supporting bars which are arranged around the bearing seat, and a low structure which is positioned between the supporting bars and the bearing seat and is in contact connection with the bearing seat, so that the supporting bars and the bearing seat have a height difference, and the low structure and the bearing seat are not coplanar. Therefore, the low structure is connected with the projection area of the bearing seat, and in the fixing operation of the routing process, the low structure and the bearing seat are both positioned in the containing groove of the hot plate of the fixing jig, so the hot plate does not need to additionally form a slot for containing the supporting bar, the fixing operation can be completed without aligning the supporting bar, and the process time can be greatly reduced.
Description
Technical field
The present invention relates to a kind of bearing part, espespecially a kind of bearing part of bearing semiconductor assembly.
Background technology
Flourish along with electronic industry, electronic product is also marched toward multi-functional, high performance trend gradually.Flourish along with electronic industry, many electronic products are all gradually towards past light, thin, short, little contour aggregation degree future development, semiconductor package part also develops the different package module of many kinds, such as, chip package (Flip Chip Package), routing engage (Wire Bond) etc.
Current wire bonding technologies is often using lead frame as the bearing part of carries chips.As shown in Figure 1A, in existing routing type packaging part 9, its lead frame 1 comprise a carries chips 90 load bearing seat (die pad) 10, be positioned at multiple supporting ribs (tie bar) 13(in this load bearing seat 10 corner as shown in Figure 1 C) and be positioned at multiple lead foots 12 at this load bearing seat 10 edge, respectively this lead foot 12 has outer foot (outer leads portion) 120 and interior foot (inner leadsportion) 121, and this outer foot 120 is in order to be electrically connected to an external circuit (not shown).This chip 90 is bonded on this load bearing seat 10 with elargol 90a, and this chip 90 has multiple weld pad 900, with the interior foot 121 utilizing multiple wire (bonding wire) 91 to be electrically connected this lead foot 12.Packing colloid 92 this chip 90 coated of insulating material, load bearing seat 10, the interior foot 121 of lead foot 12 and bonding wire 91 is made again by such as epoxy resin (epoxy).In addition, this supporting rib 13 this load bearing seat 10 relative tilts and is provided with and lowly puts (down set) structure 11, to reduce the position of this load bearing seat 20, makes the position of this load bearing seat 20 lower than the position of this interior foot 121, and balances upper and lower mould fluid space in time encapsulating.
When existing packaging part 9 carries out routing processing procedure, with fixed jig, lead frame and chip need be fixed on wire bonding machine table.As shown in Figure 1B, existing fixed jig 8 comprises hot plate 80, two track 81 and a window-type press board 82.This hot plate 80 has an adsorption plane 80a, in order to support the lead frame space of a whole page 1 ' that carries multiple chip 90, and provides heat energy to this lead frame space of a whole page 1 ', is beneficial to routing processing procedure.The described lead frame space of a whole page 1 ' has multiple lead frame 1 as shown in Figure 1A, after to be packaged, then carries out cutting single processing procedure, to obtain multiple packaging part 9 with this lead frame 1.In addition, those tracks 81 are positioned at two sides of this hot plate 80, and to support two sides of this lead frame space of a whole page 1 ', and this window-type press board 82 is in order to the upside of this lead frame space of a whole page 1 ' of pressing.
In time putting this lead frame space of a whole page 1 ', as shown in Fig. 1 C and Fig. 1 C ', this lead frame 1 correspondence is placed in the storage tank 800 of this hot plate 80, and two side contacts of putting structure 11 because this is low link this supporting rib 13, so this hot plate 80 needs extra formation fluting 801, be positioned at above this fluting 801 for the part-structure of this supporting rib 13 and this low structure 11 of putting, make this hot plate 80 avoid this and lowly put structure 11, lowly put structure 11 temperature distortion to avoid this.Only, when changing this lead frame 1 in making different product, this hot plate 80 need be changed, so this supporting rib 13 need be adjusted to accurately the central point of the fluting 801 of this hot plate 80, so that this low structure 11 of putting is placed in this fluting 801, thus often cause whole processing time to increase, cause unfavorable volume production.
In addition, the lead foot 12 ' of this supporting rib 13 adjacent often can be moved in this fluting 801, causes this lead foot 12 ' unsettled, thus can not carry out the operation of welding this wire 91, cause yield to reduce.
In addition, in the making of this lead frame 1 at present, the spacing (Inner LeadPitch, ILP) of this interior foot 121 is designed with more and more less trend, if ILP is 0.148 below ㎜, causes the problems referred to above even more serious.
Therefore, how to overcome the variety of problems of above-mentioned prior art, become the problem of desiring most ardently solution at present in fact.
Summary of the invention
In view of the disadvantages of above-mentioned prior art, main purpose of the present invention, for disclosing a kind of bearing part, significantly can reduce processing time.
Bearing part of the present invention comprises: a load bearing seat; Multiple conductive part, it is located at around this load bearing seat; Multiple support bar, it is located at around this load bearing seat; And at least onely lowly put structure, it is between this support bar with this load bearing seat and contact and link this load bearing seat, makes this support bar and this load bearing seat have a difference in height, and this lowly puts structure and this load bearing seat non-co-planar.
In aforesaid bearing part, this bearing part is lead frame, and this load bearing seat is in order to bearing semiconductor assembly.
In aforesaid bearing part, the edge of this load bearing seat has turning point, and this support bar is positioned at this turning point, and such as, this load bearing seat is polygon.
In aforesaid bearing part, this low structure of putting has the first relative side and the second side, and this first side contacts is in conjunction with this load bearing seat, and this second side contacts is in conjunction with this support bar, and such as, the distance between this first side and second side is 0.15 to 0.3 ㎜.
In addition, in aforesaid bearing part, this low structure of putting is support body, and this load bearing seat tilts relatively, and such as, this is low puts structure with this load bearing seat shape has angle, as degree angle, 30 degree of angles to 50.
As from the foregoing, bearing part of the present invention, this load bearing seat is linked by this low form touch of putting, this low structure of putting is connected with the projected area of this load bearing seat, to make the hot plate of the fixed jig of routing processing procedure without the need to additionally forming fluting, so the conductive part of this support bar adjacent can not produce vacant state, thus can carry out the operation of welding lead smoothly, cause yield to improve.
In addition, when changing this bearing part and this hot plate in volume production, only this lowly need be put structure and this load bearing seat is placed in this storage tank, and do not need the contraposition carrying out this support bar, so compared to prior art, bearing part of the present invention significantly can reduce the time of routing processing procedure, is thus conducive to volume production.
Accompanying drawing explanation
Figure 1A is the generalized section of existing semiconductor package part;
Figure 1B is the schematic perspective view of the fixed operation of existing routing processing procedure;
Fig. 1 C is the local upper schematic diagram of existing lead frame and hot plate; Wherein, Fig. 1 C ' is the generalized section of Fig. 1 C; And
Fig. 2 is the local upper schematic diagram of bearing part of the present invention and hot plate; Wherein, Fig. 2 ' cutaway view that is Fig. 2.
Symbol description
1 lead frame
1 ' the lead frame space of a whole page
10,20 load bearing seats
11,21 lowly put structure
12,12 ' lead foot
120 outer foots
Foot in 121
13 supporting ribs
2 bearing parts
20a turning point
21a first side
21b second side
22,22 ' conductive part
23 support bars
8 fixed jigs
80,70 hot plates
80a adsorption plane
800,700 storage tanks
801 flutings
81 tracks
82 window-type press boards
9 packaging parts
90 chips
90a elargol
900 weld pads
91 wires
92 packing colloids
H difference in height
L distance
θ angle.
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, the personage being familiar with this skill can understand other advantage of the present invention and effect easily by content disclosed in the present specification.
Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, for the understanding of personage and the reading of being familiar with this skill, and be not used to limit the enforceable qualifications of the present invention, so the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", " first ", the term such as " second " and " ", be also only be convenient to describe understand, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Fig. 2 and Fig. 2 ' is bearing part 2 of the present invention and the schematic diagram being applied to routing processing procedure thereof.
As shown in Figure 2, described bearing part 2 is lead frame, and it comprises: a load bearing seat 20, be located at multiple conductive parts 22 around this load bearing seat 20 and multiple support bar 23 and contact and link at least one low of this load bearing seat 20 and put structure 21.
Described load bearing seat 20 is in order to the semiconductor subassembly (figure slightly) of carrying as chip.In the present embodiment, the edge of this load bearing seat 20 has turning point 20a, and such as, this load bearing seat 20 is rectangle, and this turning point 20a is corner.
Described conductive part 22 is positioned at outside the edge of this load bearing seat 20 for lead foot, and described support bar 23 is the supporting rib that comparatively this lead foot is wide, and this support bar 23 is positioned at the turning point 20a of this load bearing seat 20.
Described low structure 21 of putting is for net slice shape support body, it is between this support bar 23 and this load bearing seat 20, and this load bearing seat 20 tilts relatively, makes this support bar 23 have a difference in height h with this load bearing seat 20, as shown in Fig. 2 ', present non-co-planar to make this low structure 21 of putting with this load bearing seat 20.
In the present embodiment, this low structure 21 of putting has the first relative side 21a and the second side 21b, and this first side 21a contacts the turning point 20a in conjunction with this load bearing seat 20, and this second side 21b contacts in conjunction with this support bar 23.
In addition, the distance L between this first side 21a and the second side 21b is 0.15 to 0.3 ㎜, as shown in Fig. 2 '.
Again, this low structure 21 this load bearing seat 20 relative of putting tilts, and thus this lowly puts structure 21 and this load bearing seat 20(or hot plate 70) form an angle theta, as shown in Fig. 2 ', and this angle theta is 30 ° to 50 °.
In addition, when this load bearing seat 20 be rectangle or other geometry time, this low quantity of putting structure 21 can design on demand, lowly puts structure 21 in the design of this load bearing seat 20 surrounding is at least one, such as, be provided with this at least one turning point 20a of rectangle load bearing seat 20 and lowly put structure 21; If this turning point 20a is not designed with this lowly put structure 21, then the contact of this support bar 23 is in conjunction with the turning point 20a of this load bearing seat 20.
Low structure 21 of putting of the present invention contacts this load bearing seat 20 of link, this low structure 21 of putting is connected with the projected area of this load bearing seat 20, so in the fixed operation of routing processing procedure, this is low puts structure 21 is all arranged in a hot plate 70 of fixed jig (scheme summary) storage tank 700 with this load bearing seat 20, as shown in Figure 2, thus on this hot plate 70 without the need to forming the fluting in order to receive this support bar 23 as prior art.
Therefore, in time changing this bearing part 2 and this hot plate 70, only need this low structure 21 of putting be placed in this storage tank 700 with this load bearing seat 20, and do not need this support bar 23 to carry out contraposition, can fixed operation be completed, so significantly processing time can be reduced, thus be beneficial to volume production.
In addition, because this hot plate 70 there is no fluting, even if so the conductive part 22 ' of this support bar 23 adjacent produces displacement, still can not vacant state be presented, thus can carry out the operation of welding lead smoothly, effectively to improve yield.
In sum, bearing part of the present invention, mainly links this load bearing seat by this low form touch of putting, this low structure of putting is connected with the projected area of this load bearing seat, to make the hot plate of the fixed jig of routing processing procedure without the need to additionally forming fluting, so be not only beneficial to volume production, and yield can be improved.
Above-described embodiment only in order to illustrative principle of the present invention and effect thereof, but not for limiting the present invention.Any personage haveing the knack of this skill all without prejudice under spirit of the present invention and category, can modify to above-described embodiment.Therefore the scope of the present invention, should listed by claims.
Claims (10)
1. a bearing part, it comprises:
One load bearing seat;
Multiple conductive part, it is located at around this load bearing seat;
Multiple support bar, it is located at around this load bearing seat; And
At least onely lowly put structure, it is between this support bar with this load bearing seat and contact and link this load bearing seat, makes this support bar and this load bearing seat have a difference in height, and this lowly puts structure and this load bearing seat non-co-planar.
2. bearing part according to claim 1, is characterized in that, this bearing part is lead frame.
3. bearing part according to claim 1, is characterized in that, this load bearing seat is in order to bearing semiconductor assembly.
4. bearing part according to claim 1, is characterized in that, the edge of this load bearing seat has turning point, and this support bar is positioned at this turning point.
5. bearing part according to claim 4, is characterized in that, this load bearing seat is polygon.
6. bearing part according to claim 1, is characterized in that, this low structure of putting has the first relative side and the second side, and this first side contacts is in conjunction with this load bearing seat, and this second side contacts is in conjunction with this support bar.
7. bearing part according to claim 6, is characterized in that, the distance between this first side and second side is 0.15 to 0.3 ㎜.
8. bearing part according to claim 1, is characterized in that, this low structure of putting is support body, and this load bearing seat tilts relatively.
9. bearing part according to claim 1, is characterized in that, this is low puts structure and this load bearing seat shape has angle.
10. bearing part according to claim 9, is characterized in that, this angle is that angle is spent at 30 degree of angles to 50.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102138629A TWI512928B (en) | 2013-10-25 | 2013-10-25 | Carrier member |
| TW102138629 | 2013-10-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104576544A true CN104576544A (en) | 2015-04-29 |
| CN104576544B CN104576544B (en) | 2017-07-04 |
Family
ID=53092265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310548223.7A Active CN104576544B (en) | 2013-10-25 | 2013-11-07 | Bearing part |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104576544B (en) |
| TW (1) | TWI512928B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4672418A (en) * | 1984-04-11 | 1987-06-09 | Peter Moran | Integrated circuit packages |
| US5986333A (en) * | 1997-02-27 | 1999-11-16 | Oki Electric Industry Co., Ltd. | Semiconductor apparatus and method for fabricating the same |
| CN101459154A (en) * | 2007-12-11 | 2009-06-17 | 晶致半导体股份有限公司 | Conductive wire rack and encapsulation construction applying the conductive wire rack |
| CN202003989U (en) * | 2011-03-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Semiconductor packaging framework |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM375297U (en) * | 2009-08-04 | 2010-03-01 | Fu Sheng Ind Co Ltd | Frame structure for light emitting diodes |
| TW201203627A (en) * | 2010-07-15 | 2012-01-16 | Lextar Electronics Corp | Light emitting diode and method for forming supporting frame thereof and improved structure of the supporting frame |
-
2013
- 2013-10-25 TW TW102138629A patent/TWI512928B/en active
- 2013-11-07 CN CN201310548223.7A patent/CN104576544B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4672418A (en) * | 1984-04-11 | 1987-06-09 | Peter Moran | Integrated circuit packages |
| US5986333A (en) * | 1997-02-27 | 1999-11-16 | Oki Electric Industry Co., Ltd. | Semiconductor apparatus and method for fabricating the same |
| CN101459154A (en) * | 2007-12-11 | 2009-06-17 | 晶致半导体股份有限公司 | Conductive wire rack and encapsulation construction applying the conductive wire rack |
| CN202003989U (en) * | 2011-03-23 | 2011-10-05 | 南通富士通微电子股份有限公司 | Semiconductor packaging framework |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI512928B (en) | 2015-12-11 |
| CN104576544B (en) | 2017-07-04 |
| TW201517232A (en) | 2015-05-01 |
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