CN104219875A - Manufacturing method of circuit metal base plate and circuit metal base plate - Google Patents
Manufacturing method of circuit metal base plate and circuit metal base plate Download PDFInfo
- Publication number
- CN104219875A CN104219875A CN201410467585.8A CN201410467585A CN104219875A CN 104219875 A CN104219875 A CN 104219875A CN 201410467585 A CN201410467585 A CN 201410467585A CN 104219875 A CN104219875 A CN 104219875A
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- China
- Prior art keywords
- foil substrate
- line layer
- circuit
- wired foil
- manufacture
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Abstract
The invention provides a manufacturing method of a circuit metal base plate and the circuit metal base plate. According to the manufacturing method, the front surface and the back surface of a circuit layer are respectively etched to manufacture a super-thick circuit metal base plate; in addition, the shortage that the line width and space are excessively small and compensatory manufacturing cannot be carried out can be avoided; the mode of etching to reduce more than half of the circuit layer is also adopted in the film compensation; moreover, the etching process can be controlled well, and the more dense circuit metal base plate can be conveniently manufactured as customer requirement.
Description
Technical field
The present invention relates to PCB and manufacture field, in particular a kind of manufacture method of superthick wired foil substrate and wired foil substrate.
Background technology
Along with the development of electron trade, the PCB of super thick circuit is obtained and applies more and more widely, and super thick wired foil substrate is because of its good thermal diffusivity, dimensional stability, good machining characteristics etc., is widely applied to power module, big-power transducer, high-power illumination etc. field.
The difficult point of super thick wired foil Substrate manufacture is mainly in circuit and anti-welding manufacture, general this kind of plate line thicknesses can reach 10 more than mm, for circuit the film compensate and etching control very difficult, do not have the countermeasure that this problem is solved in prior art.
Therefore, prior art awaits further improvement.
Summary of the invention
In view of above-mentioned weak point of the prior art, the object of the invention is to, for user provides a kind of manufacture method and wired foil substrate of wired foil substrate, be not easy the problem manufactured with the wired foil substrate solving superthick in prior art.
The technical scheme that technical solution problem of the present invention adopts is as follows:
A manufacture method for wired foil substrate, wherein, described wired foil substrate comprises line layer and metal level, and described method comprises:
A, etch the latter half of circuit at line layer upper surface;
B, the described upper surface and metal level that etch the latter half circuit are carried out pressing;
C, from the lower surface of line layer, the first half circuit etching described line layer to be completed.
The manufacture method of described wired foil substrate, wherein, also comprises before described steps A:
A01, on line layer, be provided with two groups of registration holes.
The manufacture method of described wired foil substrate, wherein, also comprised before above-mentioned steps A:
A02, line layer upper surface manufacture line film, carry out film compensation, and use registration holes to carry out circuit contraposition.
The manufacture method of described wired foil substrate, wherein, also comprises at described C:
C1, manufacture line layer lower surface line film, and the circuit using registration holes to be etched by upper surface is to going out.
The manufacture method of described wired foil substrate, wherein, described wired foil substrate also comprises insulating barrier, also comprises at described B:
B1, pressing filler amount between computational scheme layer and metal level;
The glue that described insulating barrier is inserted by pressing forms.
A kind of wired foil substrate, wherein, adopts described manufacture method manufacture to form.
Beneficial effect, the manufacture method of a kind of wired foil substrate provided by the present invention and wired foil substrate, it avoids because live width line-spacing is too small by adopting to wiring board twice, positive aspect etching method, the drawback of manufacture cannot be compensated, and etching process also can obtain better control, thus the line design requirement of client's more crypto set can be met.
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Accompanying drawing explanation
Fig. 1 is the flow chart of steps of the manufacture method of a kind of wired foil substrate of the present invention.
Fig. 2 is the wired foil board structure schematic diagram that the method for the invention produces.
Embodiment
For making object of the present invention, technical scheme and advantage clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein only for explaining the present invention, being not intended to limit the present invention.
A manufacture method for wired foil substrate, wherein, described wired foil substrate comprises line layer and metal level, and described method comprises:
S1, etch the latter half of circuit at line layer upper surface.
First take out line layer separately, surface etching goes out the half circuit of line layer thereon.
It is envisioned that need the circuit on line layer to be divided equally into the first half and the latter half before this, the circuit that will etch in this step is the latter half, is namely line layer and the region of insulating barrier and the pressing of metal level phase.
S2, the described upper surface and metal level that etch the latter half circuit are carried out pressing.
The upper surface of the line layer etched in described step and metal level are carried out pressing.
S3, from the lower surface of line layer, the first half circuit etching described line layer to be completed.
The lower surface of the line layer of the half-etching wired foil substrate that pressing in above-mentioned steps completes is carried out to the etching of its first half circuit, after the circuit etching of the first half completes, just complete the circuit etching on whole line layer.
In order to produce better to wired foil substrate, based on the above method, following improvement can also be had:
Also comprise before described step S1:
S01, on line layer, be provided with two groups of registration holes.
Also comprised before above-mentioned steps S1:
S02, line layer upper surface manufacture line film, carry out film compensation, and use registration holes to carry out circuit contraposition.
Also comprise at described S3:
S31, manufacture line layer lower surface line film, and the circuit using registration holes to be etched by upper surface is to going out.
By being previously provided with two groups of registration holes on line layer, being convenient to whether correct position is in line film and circuit and judging, thus avoid occurring positional fault when line film and circuit etching.
Also comprise at described S2: the pressing filler amount between computational scheme layer and metal level, the glue that described insulating barrier is inserted by pressing forms.
Pressure between the first half of the circuit etched according to the upper surface of the line layer calculated and metal level and filler amount, thus accurately the glue amount of adding between line layer and metal level is controlled, guarantee that insulating barrier can fill up the blank between metal level and line layer the latter half.
Based on the above method, present invention also offers a kind of wired foil substrate, adopt described manufacture method manufacture to form.Be illustrated in figure 2 the structural representation of described wired foil substrate, described wired foil substrate comprises line layer 1, insulating barrier 2 and metal level.
When manufacturing above-mentioned wired foil substrate, first the circuit on described line layer is divided into the first half and the latter half.Independent taking-up line layer, first etch the circuit of its latter half, pressing is carried out by etching the line layer of the latter half circuit and the glue be filled between line layer and metal level and metal level, obtain etching the wired foil substrate under half-etching state, the first half circuit of line layer is being etched, thus is realizing the manufacture of superthick wired foil substrate.
A kind of wired foil substrate provided by the present invention, adopt and the positive and negative of line layer is etched respectively, thus the wired foil substrate manufacturing super thick can be realized, and avoid because live width line-spacing is too small, the drawback of manufacture cannot be compensated, also than employing, on line layer, once property etching minimizing is over half for the compensation of its film, and etching process also can obtain better control, can produce the wired foil substrate of the more crypto set meeting customer requirement easily.
Be understandable that, for those of ordinary skills, can be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, and all these change or replace the protection range that all should belong to the claim appended by the present invention.
Claims (6)
1. a manufacture method for wired foil substrate, is characterized in that, described wired foil substrate comprises line layer and metal level, and described method comprises:
A, etch the latter half of circuit at line layer upper surface;
B, the described upper surface and metal level that etch the latter half circuit are carried out pressing;
C, from the lower surface of line layer, the first half circuit etching described line layer to be completed.
2. the manufacture method of wired foil substrate according to claim 1, is characterized in that, also comprise before described steps A:
A01, on line layer, be provided with two groups of registration holes.
3. the manufacture method of wired foil substrate according to claim 2, is characterized in that, also comprised before above-mentioned steps A:
A02, line layer upper surface manufacture line film, carry out film compensation, and use registration holes to carry out circuit contraposition.
4. the manufacture method of wired foil substrate according to claim 2, is characterized in that, also comprise at described C:
C1, manufacture line layer lower surface line film, and the circuit using registration holes to be etched by upper surface is to going out.
5. the manufacture method of wired foil substrate according to claim 2, it is characterized in that, described wired foil substrate also comprises insulating barrier, also comprises at described B:
B1, pressing filler amount between computational scheme layer and metal level;
The glue that described insulating barrier is inserted by pressing forms.
6. a wired foil substrate, is characterized in that, adopts manufacture method manufacture as claimed in claim 1 to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467585.8A CN104219875A (en) | 2014-09-15 | 2014-09-15 | Manufacturing method of circuit metal base plate and circuit metal base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467585.8A CN104219875A (en) | 2014-09-15 | 2014-09-15 | Manufacturing method of circuit metal base plate and circuit metal base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104219875A true CN104219875A (en) | 2014-12-17 |
Family
ID=52100893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410467585.8A Pending CN104219875A (en) | 2014-09-15 | 2014-09-15 | Manufacturing method of circuit metal base plate and circuit metal base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104219875A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4404059A (en) * | 1982-05-26 | 1983-09-13 | Livshits Vladimir I | Process for manufacturing panels to be used in microelectronic systems |
| US4521476A (en) * | 1982-08-19 | 1985-06-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Hybrid integrated circuit and preparation thereof |
| JP2002141637A (en) * | 2000-11-02 | 2002-05-17 | Multi:Kk | Printed-wiring board and its manufacturing method |
| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
-
2014
- 2014-09-15 CN CN201410467585.8A patent/CN104219875A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4404059A (en) * | 1982-05-26 | 1983-09-13 | Livshits Vladimir I | Process for manufacturing panels to be used in microelectronic systems |
| US4521476A (en) * | 1982-08-19 | 1985-06-04 | Denki Kagaku Kogyo Kabushiki Kaisha | Hybrid integrated circuit and preparation thereof |
| JP2002141637A (en) * | 2000-11-02 | 2002-05-17 | Multi:Kk | Printed-wiring board and its manufacturing method |
| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141217 |
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| RJ01 | Rejection of invention patent application after publication |