CN103760173B - Optical element surface defect screening apparatus and screening method - Google Patents
Optical element surface defect screening apparatus and screening method Download PDFInfo
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- CN103760173B CN103760173B CN201410015005.1A CN201410015005A CN103760173B CN 103760173 B CN103760173 B CN 103760173B CN 201410015005 A CN201410015005 A CN 201410015005A CN 103760173 B CN103760173 B CN 103760173B
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Abstract
A kind of optical element surface defect screening apparatus and screening method, the composition of this device includes: pulsed laser source, electricity driving displacement platform, condenser lens, PIN pipe, data collecting card, computer and fixture, optical element to be measured is fixed on described electricity driving displacement platform by described fixture, it is radiated on described optical element after reflection at described pulsed laser source, set gradually described condenser lens and PIN pipe at this reflection beam direction, described PIN pipe is positioned at the image plane of this described condenser lens; The signal of described PIN pipe output send described computer through described data collecting card collection, the control end of the electricity driving displacement platform described in output termination of described computer. The information such as the position of optical element surface defect and basic size can be carried out real-time record by the present invention, has feature simple and easy, real-time, automatic, reliable.
Description
Technical field
The present invention relates to a kind of optical element surface defect, particularly a kind of optical element surface defect screening apparatus and screening method.
Background technology
Optical element surface defect includes the pit that formed in element manufacturing process and the internal impurity of cut, surface coating, the lenslet that optical element inner refractive index inhomogeneities is formed, and the damage from laser etc. of formation in optical element use procedure. Partial injury point can occur damage to increase under laser irradiation, and the light field modulation that impaired loci causes can destroy the optical element in subsequent optical path.
Existing defect damage detection technique mainly utilizes the various effects that laser and optical element interaction produce to realize. Common are plasma spark method, scattered light method, light full-boiled process etc.
Plasma spark method refers to that defect point can absorb laser when pulsed laser action is in optical element surface, and exposure spots can be brought rapidly up producing gasification, causes atomic ionization, produces plasma, flash of light occurs.
Scattering method is to adopt laser to irradiate optical element, and defect point can produce scattering light after forming loss after laser irradiation, determines that this point is defect point by the Strength Changes of scattering light. At present, conventional defect detecting technique many employings white light source irradiates element under test and produces scattering light, by the information of area array CCD detecting defects. Utilize CCD to gather the image of irradiation zone before and after laser irradiation, adopt image subtraction method to realize defect estimation.To deielectric-coating a bit gathers twice image, think that when difference occur in two width images this point is defect point. System stability is required height by image subtraction method, otherwise there will be the virtual image after difference, thus causing erroneous judgement. Photosensitive area additionally, due to area array CCD is less, and the detection for optical elements of large caliber needs piecemeal to carry out, and one piece of optical element needs to gather multiple image, consuming time more of a specified duration.
As can be seen here, how to realize optical element surface defective locations quickly, in real time, accurate recording become a urgent problem.
Summary of the invention
The present invention is directed to the deficiency that above-mentioned existing detecting device exists, it is proposed to a kind of optical element surface defect screening apparatus and screening method. The information such as the position of optical element surface defect and basic size can be carried out real-time record by this device, has simple and easy, real-time, automatic and reliable feature.
The technical solution of the present invention is as follows:
A kind of optical element surface defect screening apparatus, it is characterized in that its composition includes: pulsed laser source, electricity driving displacement platform, condenser lens, PIN pipe, data collecting card, computer and fixture, optical element to be measured is fixed on described electricity driving displacement platform by described fixture, it is radiated on described optical element after reflection at described pulsed laser source, set gradually described condenser lens and PIN pipe at this reflection beam direction, described PIN pipe is positioned at the image plane of this described condenser lens; The signal of described PIN pipe output send described computer through described data collecting card collection, the control end of the electricity driving displacement platform described in output termination of described computer.
Described computer controls the described movement velocity of electricity driving displacement platform, move distance, controls described data collecting card Tong Bu with the pulse clock of described pulsed laser source simultaneously.
Utilizing the method that above-mentioned optical element surface defect screening apparatus carries out optical element surface defect examination, it is characterized in that the method comprises the following steps:
1. optical element to be measured is fixed on described electricity driving displacement platform by described fixture, start the electricity driving displacement platform described in described computer drives control and the pulse laser of described pulsed laser source output is moved to the starting point of optical element to be measured scanning, set the pulse spacing of pulse laser of described pulsed laser source output as �� t, if the movement velocity of electricity driving displacement platform is ��;
2. the described pulsed laser source described in computer synchronous control, electricity driving displacement platform and data collecting card synchronous working: while the optical element to be measured described in first pulsed irradiation of described pulsed laser source, described data collecting card is started working, and data collecting card is with time t0For starting point, m effective voltage value u of collection in pulse1,u2,u3��un��umAnd input computer, again through computer, described m data is adopted read group totalThe voltage of first pulse is designated as V1, described optical element to be measured is scanned by described pulsed laser source, is designated as V successively later2,V3��VN;
3. contact potential series V1��V2,V3��VN, a maximum changing value �� V allowed is set, as voltage ViWhen varying more than �� V, be designated as Vk, it is determined that point corresponding on optical element is exactly a defect point, and recording from starting to scan the time that this defect point occurs is k* �� t, then displacement platform operating distance is �� * k* �� t, owing to the size of optical element is it is known that obtain the more specific location information of defect point, meanwhile, according to VkSizes values determine the relative size of defect point.
The technique effect of the present invention is as follows:
The high speed PIN pipe of the present invention is less costly relative to conventional large area array CCD, and conversion speed is fast.
The information such as the position of optical element surface defect and basic size can be carried out real-time record by the present invention, has feature simple and easy, real-time, automatic, reliable.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the recording equipment of optical element surface defect examination process of the present invention.
Pulsed light irradiation position schematic diagram when Fig. 2 is the scanning of this device.
Fig. 3 is the time diagram that data collecting card gathers magnitude of voltage and laser pulse irradiation.
In figure: 1-pulse laser, 2-electricity driving displacement platform, 3-condenser lens, 4-PIN manages, 5-data collecting card, 6-computer, 7-fixture and 8-optical element to be measured.
Fig. 2 pulsed light is from the optical element upper left corner, and computer 6 control bit moving stage 2 drives optical element 8 at the uniform velocity to move by schematic diagram direction, and horizontal direction a line terminates one spot size of shifting on rear element, and horizontal direction is contrary with lastrow, by that analogy.
Fig. 3 is data collecting card 5 Gather and input to magnitude of voltage corresponding to computer 6 exposure spots.
Detailed description of the invention
Below in conjunction with example and accompanying drawing, the present invention will be further described, but should not limit the scope of the invention with this.
Refer to the schematic diagram that Fig. 1, Fig. 1 are the recording equipments of optical element surface defect examination process of the present invention. As seen from the figure, optical element surface defect screening apparatus of the present invention, composition includes: pulsed laser source 1, electricity driving displacement platform 2, condenser lens 3, PIN pipe 4, data collecting card 5, computer 6 and fixture 7, optical element 8 to be measured is fixed on described electricity driving displacement platform 2 by described fixture 7, it is radiated on described optical element 8 after reflection at described pulsed laser source 1, set gradually described condenser lens 3 and PIN pipe 4 at this reflection beam direction, described PIN pipe 4 is positioned at the image plane of this described condenser lens 3; The signal of described PIN pipe 4 output gathers through described data collecting card 5 and send described computer 6, the control end of the electricity driving displacement platform 2 described in output termination of described computer 6.
Described computer 6 controls the described movement velocity of electricity driving displacement platform 2, move distance, controls described data collecting card Tong Bu with the pulse clock of described pulsed laser source 1 simultaneously.
The method utilizing above-mentioned optical element surface defect screening apparatus to carry out optical element surface defect examination, comprises the following steps:
1. optical element 8 to be measured is fixed on described electricity driving displacement platform 2 by described fixture 7, start described computer drives and control described electricity driving displacement platform 2, the pulse laser that described pulsed laser source 1 exports is moved to the starting point that optical element 8 to be measured scans, set the pulse spacing of pulse laser of described pulsed laser source 1 output as �� t, if the movement velocity of electricity driving displacement platform 2 is ��;
2. the described pulsed laser source 1 described in computer synchronous control, electricity driving displacement platform 2 and data collecting card 5 work asynchronously: while the optical element to be measured 8 described in first pulsed irradiation of described pulsed laser source 1, described data collecting card is started working, and data collecting card is with time t0For starting point, m effective voltage value u of collection in pulse1,u2,u3��un��umAnd inputting computer 6, described m data is adopted read group total by described computer 6The voltage of first pulse is designated as V1, described optical element to be measured 8 is scanned by described pulsed laser source 1, is designated as V successively later2,V3��VN;
3. contact potential series V1��V2,V3��VN, a maximum changing value �� V allowed is set, as voltage ViWhen varying more than �� V, be designated as Vk, it is determined that point corresponding on optical element is exactly a defect point, and recording from starting to scan the time that this defect point occurs is k* �� t, then displacement platform operating distance is �� * k* �� t, owing to the size of optical element is it is known that obtain the more specific location information of defect point, meanwhile, according to VkSizes values determine the relative size of defect point.
If optical element dimension is long L0, wide d, pulsed light spot diameter is D. When a�ܦ� * k* �� t < during a+1, defect point coordinate is:
When a is odd number, coordinate is (L0-��*k*��t+a*L0, aD+D/2):
When a is even number, coordinate is (�� * k* �� t-a*L0, aD+D/2).
Experiments show that, the information such as the position of optical element surface defect and basic size can be carried out real-time record by the present invention, has feature simple and easy, real-time, automatic, reliable.
Claims (1)
1. one kind utilizes the method that optical element surface defect screening apparatus carries out optical element surface defect examination, this optical element surface defect screening apparatus, including: pulsed laser source (1), electricity driving displacement platform (2), condenser lens (3), PIN manages (4), data collecting card (5), computer (6) and fixture (7), optical element (8) to be measured is fixed on described electricity driving displacement platform (2) by described fixture (7), after described pulsed laser source (1) is radiated at the upper reflection of described optical element (8), described condenser lens (3) and PIN pipe (4) is set gradually at this reflection beam direction, described PIN pipe (4) is positioned at the image plane of described this condenser lens (3), the signal that described PIN pipe (4) exports gathers through described data collecting card (5) and delivers to described computer (6), the control end of the electricity driving displacement platform (2) described in output termination of described computer (6), it is characterised in that the method comprises the following steps:
1. optical element (8) to be measured is fixed on described electricity driving displacement platform (2) by described fixture (7), start the electricity driving displacement platform (2) described in described computer drives control and the pulse laser that described pulsed laser source (1) exports is moved to the starting point that optical element to be measured (8) scans, set pulse spacing of the pulse laser that described pulsed laser source (1) exports as �� t, if the movement velocity of electricity driving displacement platform (2) is ��;
2. the described pulsed laser source (1) described in computer synchronous control, electricity driving displacement platform (2) and data collecting card (5) work asynchronously: while the optical element to be measured (8) described in first pulsed irradiation of described pulsed laser source (1), described data collecting card is started working, and data collecting card is with time t0For starting point, m effective voltage value u of collection in pulse1,u2,u3��un��umAnd input computer (6), again through computer (6), described m data is adopted read group totalThe voltage of first pulse is designated as V1, described optical element to be measured (8) is scanned by described pulsed laser source (1), is designated as V successively later2,V3��VN;
3. contact potential series V1��V2,V3��VN, a maximum changing value �� V allowed is set, as voltage ViWhen varying more than �� V, be designated as Vk, it is determined that point corresponding on optical element is exactly a defect point, and recording from starting to scan the time that this defect point occurs is k* �� t, then displacement platform operating distance is �� * k* �� t, owing to the size of optical element is it is known that obtain the more specific location information of defect point, meanwhile, according to VkSizes values determine the relative size of defect point.
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| CN105738379B (en) * | 2014-12-12 | 2018-10-19 | 上海和辉光电有限公司 | A kind of detection device and detection method of polysilicon membrane |
| CN104990930B (en) * | 2015-07-09 | 2017-10-20 | 中国科学院上海光学精密机械研究所 | Optical element defect laser near-field modulation detection device and induced damage Forecasting Methodology |
| WO2020073347A1 (en) * | 2018-10-11 | 2020-04-16 | 广州博冠光电科技股份有限公司 | Surface defect detection apparatus and method for spherical optical element |
Citations (2)
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| CN1662808A (en) * | 2002-05-06 | 2005-08-31 | 应用材料股份有限公司 | Optical technique for detecting buried defects in opaque films |
| CN103748454A (en) * | 2011-07-12 | 2014-04-23 | 科磊股份有限公司 | Wafer inspection |
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| JP4988223B2 (en) * | 2005-06-22 | 2012-08-01 | 株式会社日立ハイテクノロジーズ | Defect inspection apparatus and method |
| JP2012132791A (en) * | 2010-12-22 | 2012-07-12 | Hitachi High-Technologies Corp | Defect inspection method and defect inspection device |
| JP5430614B2 (en) * | 2011-06-27 | 2014-03-05 | 株式会社日立ハイテクノロジーズ | Optical device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662808A (en) * | 2002-05-06 | 2005-08-31 | 应用材料股份有限公司 | Optical technique for detecting buried defects in opaque films |
| CN103748454A (en) * | 2011-07-12 | 2014-04-23 | 科磊股份有限公司 | Wafer inspection |
Non-Patent Citations (1)
| Title |
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| 光盘盘基缺陷自动测试仪;李锡善等;《仪器仪表学报》;19920531;第13卷(第2期);全文 * |
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