CN103760173A - Surface defect screening device for optical element and screening method thereof - Google Patents
Surface defect screening device for optical element and screening method thereof Download PDFInfo
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- CN103760173A CN103760173A CN201410015005.1A CN201410015005A CN103760173A CN 103760173 A CN103760173 A CN 103760173A CN 201410015005 A CN201410015005 A CN 201410015005A CN 103760173 A CN103760173 A CN 103760173A
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- optical element
- laser source
- displacement platform
- pulsed laser
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Abstract
The invention relates to a surface defect screening device for an optical element and a screening method thereof. The device comprises a pulse laser source, an electric displacement table, a focusing lens, a PIN tube, a data collection card, a computer and a fixing piece, wherein the optical element to be tested is fixed on the electric displacement table through the fixing piece, the pulse laser source irradiates the optical element, then is reflected, the focusing lens and the PIN tube are sequentially arranged in the direction of a reflected light beam, and the PIN tube is positioned on an image plane of the focusing lens; and signals output by the PIN tube are collected via the data collection card and sent to the computer, and the output end of the computer is connected with the control end of the electric displacement table. According to the device and the method, provided by the invention, positions, basic sizes and other information of surface defects of the optical element can be recorded in real time, and the device and the method have the characteristics of simplicity, real-time property, automation and reliability.
Description
Technical field
The present invention relates to a kind of optical element surface defect, particularly a kind of optical element surface defect screening apparatus and screening method.
Background technology
Optical element surface defect comprises the impurity of the pit that forms in element process and cut, surface coating inside, the lenslet that optical element inner refractive index unevenness forms, and the damage from laser forming in optical element use procedure etc.Can there is damage and increase in part impaired loci, and the light field modulation that impaired loci causes can destroy the optical element in subsequent optical path under laser irradiation.
The various effects that existing defect damage detection technique mainly utilizes laser and optical element interaction to produce realize.Common are plasma spark method, scattered light method, photo-thermal method etc.
Plasma spark method refers to when pulsed laser action is in optical element surface, defect point meeting absorbing laser, and exposure spots can heat up rapidly to produce and gasify, and causes atomic ionization, produces plasma, occurs flash of light.
Scattering method is to adopt Ear Mucosa Treated by He Ne Laser Irradiation optical element, and defect point can produce scattered light form loss after laser irradiation after, by the Strength Changes of scattered light, determines that this point is defect point.At present, more conventional defect detecting technique adopts white light source to irradiate element under test and produces scattered light, by the information of area array CCD detecting defects.Utilize CCD to gather the image of laser irradiation front and back irradiation zone, adopt image subtraction method to realize defect estimation.To a bit gathering twice image on deielectric-coating, when appearring in two width images, difference thinks that this point is defect point.Image subtraction method requires high to system stability, otherwise after difference, there will be the virtual image, thereby causes erroneous judgement.Because the photosensitive area of area array CCD is less, for the detection of optical elements of large caliber, need piecemeal to carry out in addition, an optical element need to gather multiple image, consuming time more of a specified duration.
As can be seen here, how to realize optical element surface defective locations fast, in real time, accurate recording becomes a urgent problem.
Summary of the invention
The present invention is directed to the deficiency that above-mentioned existing pick-up unit exists, propose a kind of optical element surface defect screening apparatus and screening method.This device can carry out real-time record to information such as the position of optical element surface defect and basic sizes, has simple and easy, real-time, automatic and reliable feature.
Technical solution of the present invention is as follows:
A kind of optical element surface defect screening apparatus, feature is that its formation comprises: pulsed laser source, electricity driving displacement platform, condenser lens, PIN pipe, data collecting card, computing machine and fixture, optical element to be measured is fixed on described electricity driving displacement platform by described fixture, at described pulsed laser source, be radiated on described optical element after reflection, in this folded light beam direction, set gradually described condenser lens and PIN pipe, described PIN pipe is positioned at the picture plane of this described condenser lens; The signal of described PIN pipe output send described computing machine through described data collecting card collection, the control end of the electricity driving displacement platform described in the output termination of described computing machine.
Movement velocity, the move distance of the electricity driving displacement platform described in described computer control, the data collecting card described in simultaneously controlling is synchronizeed with the pulse clock of described pulsed laser source.
The method of utilizing above-mentioned optical element surface defect screening apparatus to carry out the examination of optical element surface defect, its feature is that the method comprises the following steps:
1. optical element to be measured is fixed on described electricity driving displacement platform by described fixture, start described computer drives and control described electricity driving displacement platform the starting point that the pulse laser of described pulsed laser source output is moved to optical element scanning to be measured, the recurrent interval of setting the pulse laser of described pulsed laser source output is Δ t, and the movement velocity of establishing electricity driving displacement platform is υ;
2. pulsed laser source, electricity driving displacement platform and the data collecting card synchronous working described in described computer synchronous control: in the time of optical element to be measured described in first pulsed irradiation of described pulsed laser source, described data collecting card is started working, and data collecting card is with time t
0for starting point, in monopulse, gather m effective voltage value u
1, u
2, u
3u
nu
mand input computing machine, then by computing machine, described m data are adopted to read group total
the voltage of first pulse is designated as V
1, described pulsed laser source scans described optical element to be measured, is designated as successively V later
2, V
3v
n;
3. contact potential series V
1, V
2, V
3v
n, the maximum changing value Δ V of a permission is set, as voltage V
ivariation while being greater than Δ V, be designated as V
k, determine on optical element that corresponding point is exactly a defect point, record from the time that starts to scan this defect point and occur be k* Δ t, displacement platform operating distance is υ * k* Δ t, because the size of optical element is known, obtains the more specific location information of defect point, meanwhile, according to V
ksizes values determine the relative size of defect point.
Technique effect of the present invention is as follows:
High speed PIN pipe of the present invention is lower with respect to conventional large area array CCD cost, and slewing rate is fast.
The present invention can carry out real-time record to information such as the position of optical element surface defect and basic sizes, has simple and easy, real-time, automatic, reliable feature.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the pen recorder of optical element surface defect examination process of the present invention.
Pulsed light irradiation position view when Fig. 2 is the scanning of this device.
Fig. 3 is the sequential schematic diagram that data collecting card gathers magnitude of voltage and laser pulse irradiation.
In figure: 1-pulse laser, 2-electricity driving displacement platform, 3-condenser lens, 4-PIN pipe, 5-data collecting card, 6-computing machine, 7-fixture and 8-optical element to be measured.
Fig. 2 pulsed light is from the optical element upper left corner, and computing machine 6 is controlled displacement platform 2 and driven optical element 8 at the uniform velocity to move by schematic diagram direction, and horizontal direction a line finishes to move a spot size on rear element, and horizontal direction is contrary with lastrow, by that analogy.
Fig. 3 is that data collecting card 5 Gather and inputs are to magnitude of voltage corresponding to computing machine 6 exposure spots.
Embodiment
Below in conjunction with example and accompanying drawing, the present invention will be further described, but should not limit the scope of the invention with this.
Refer to Fig. 1, Fig. 1 is the schematic diagram of the pen recorder of optical element surface defect examination process of the present invention.As seen from the figure, optical element surface defect screening apparatus of the present invention, formation comprises: pulsed laser source 1, electricity driving displacement platform 2, condenser lens 3, PIN pipe 4, data collecting card 5, computing machine 6 and fixture 7, optical element 8 to be measured is fixed on described electricity driving displacement platform 2 by described fixture 7, at described pulsed laser source 1, be radiated on described optical element 8 after reflection, in this folded light beam direction, set gradually described condenser lens 3 and PIN pipe 4, described PIN pipe 4 is positioned at the picture plane of this described condenser lens 3; The signals of described PIN pipe 4 outputs gather and send described computing machine 6 through described data collecting card 5, the control end of the electricity driving displacement platform 2 described in the output termination of described computing machine 6.
Described computing machine 6 is controlled movement velocity, the move distance of described electricity driving displacement platform 2, and the data collecting card described in simultaneously controlling is synchronizeed with the pulse clock of described pulsed laser source 1.
The method of utilizing above-mentioned optical element surface defect screening apparatus to carry out the examination of optical element surface defect, comprises the following steps:
1. optical element to be measured 8 is fixed on described electricity driving displacement platform 2 by described fixture 7, start described computer drives and control described electricity driving displacement platform 2, the pulse laser that described pulsed laser source 1 is exported moves to the starting point that optical element 8 to be measured scans, the recurrent interval of the pulse laser that the pulsed laser source 1 described in setting is exported is Δ t, and the movement velocity of establishing electricity driving displacement platform 2 is υ;
2. pulsed laser source 1, electricity driving displacement platform 2 and data collecting card 5 synchronous workings described in described computer synchronous control: in the time of optical element to be measured 8 described in first pulsed irradiation of described pulsed laser source 1, described data collecting card is started working, and data collecting card is with time t
0for starting point, in monopulse, gather m effective voltage value u
1, u
2, u
3u
nu
mand input computing machine 6, described computing machine 6 adopts read group total to described m data
the voltage of first pulse is designated as V
1, described pulsed laser source 1 scans described optical element to be measured 8, is designated as successively V later
2, V
3v
n;
3. contact potential series V
1, V
2, V
3v
n, the maximum changing value Δ V of a permission is set, as voltage V
ivariation while being greater than Δ V, be designated as V
k, determine on optical element that corresponding point is exactly a defect point, record from the time that starts to scan this defect point and occur be k* Δ t, displacement platform operating distance is υ * k* Δ t, because the size of optical element is known, obtains the more specific location information of defect point, meanwhile, according to V
ksizes values determine the relative size of defect point.
If optical element dimension is long L
0, wide d, pulsed light spot diameter is D.When a<=υ * k* Δ t<a+1, defect point coordinate is:
When a is odd number, coordinate is (L
0-υ * k* Δ t+a*L
0, aD+D/2):
When a is even number, coordinate is (υ * k* Δ t-a*L
0, aD+D/2).
Experiment shows, the present invention can carry out real-time record to information such as the position of optical element surface defect and basic sizes, has simple and easy, real-time, automatic, reliable feature.
Claims (3)
1. an optical element surface defect screening apparatus, be characterised in that its formation comprises: pulsed laser source (1), electricity driving displacement platform (2), condenser lens (3), PIN manages (4), data collecting card (5), computing machine (6) and fixture (7), optical element (8) to be measured is fixed on described electricity driving displacement platform (2) by described fixture (7), at described pulsed laser source (1), be radiated at after the upper reflection of described optical element (8), in this folded light beam direction, set gradually described condenser lens (3) and PIN pipe (4), described PIN pipe (4) is positioned at the picture plane of described this condenser lens (3), the signal of described PIN pipe (4) output send described computing machine (6) through described data collecting card (5) collection, the control end of the electricity driving displacement platform (2) described in the output termination of described computing machine (6).
2. the pen recorder of optical element surface defect examination process according to claim 1, it is characterized in that movement velocity, the move distance of the described electricity driving displacement platform (2) of described computing machine (6) control, the data collecting card described in simultaneously controlling is synchronizeed with the pulse clock of described pulsed laser source (1).
3. the method for utilizing the optical element surface defect screening apparatus described in claim 1 to carry out the examination of optical element surface defect, is characterized in that the method comprises the following steps:
1. optical element to be measured (8) is fixed on described electricity driving displacement platform (2) by described fixture (7), start described computer drives and control described electricity driving displacement platform (2) starting point that the pulse laser of described pulsed laser source (1) output is moved to optical element to be measured (8) scanning, the recurrent interval of setting the pulse laser of described pulsed laser source (1) output is Δ t, and the movement velocity of establishing electricity driving displacement platform (2) is υ;
2. pulsed laser source (1), electricity driving displacement platform (2) and data collecting card (5) synchronous working described in described computer synchronous control: in the time of optical element to be measured (8) described in first pulsed irradiation of described pulsed laser source (1), described data collecting card is started working, and data collecting card is with time t
0for starting point, in monopulse, gather m effective voltage value u
1, u
2, u
3u
nu
mand input computing machine (6), then by computing machine (6), described m data are adopted to read group total
the voltage of first pulse is designated as V
1, described pulsed laser source (1) scans described optical element to be measured (8), is designated as successively V later
2, V
3v
n;
3. contact potential series V
1, V
2, V
3v
n, the maximum changing value Δ V of a permission is set, as voltage V
ivariation while being greater than Δ V, be designated as V
k, determine on optical element that corresponding point is exactly a defect point, record from the time that starts to scan this defect point and occur be k* Δ t, displacement platform operating distance is υ * k* Δ t, because the size of optical element is known, obtains the more specific location information of defect point, meanwhile, according to V
ksizes values determine the relative size of defect point.
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| CN201410015005.1A CN103760173B (en) | 2014-01-14 | 2014-01-14 | Optical element surface defect screening apparatus and screening method |
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| CN201410015005.1A CN103760173B (en) | 2014-01-14 | 2014-01-14 | Optical element surface defect screening apparatus and screening method |
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| CN103760173B CN103760173B (en) | 2016-06-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104990930A (en) * | 2015-07-09 | 2015-10-21 | 中国科学院上海光学精密机械研究所 | Optical element defect laser near field modulating and detecting device and induced damage prediction method |
| CN105738379A (en) * | 2014-12-12 | 2016-07-06 | 上海和辉光电有限公司 | Detection apparatus and detection method for polysilicon thin film |
| WO2020073347A1 (en) * | 2018-10-11 | 2020-04-16 | 广州博冠光电科技股份有限公司 | Surface defect detection apparatus and method for spherical optical element |
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| CN1662808A (en) * | 2002-05-06 | 2005-08-31 | 应用材料股份有限公司 | Optical technique for detecting buried defects in opaque films |
| US20060290923A1 (en) * | 2005-06-22 | 2006-12-28 | Hiroyuki Nakano | Method and apparatus for detecting defects |
| JP2011197012A (en) * | 2011-06-27 | 2011-10-06 | Hitachi High-Technologies Corp | Optical device |
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2014
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| CN1662808A (en) * | 2002-05-06 | 2005-08-31 | 应用材料股份有限公司 | Optical technique for detecting buried defects in opaque films |
| US20060290923A1 (en) * | 2005-06-22 | 2006-12-28 | Hiroyuki Nakano | Method and apparatus for detecting defects |
| US20130286387A1 (en) * | 2010-12-22 | 2013-10-31 | Hitachi High-Technologies Corporation | Defect inspection method and defect inspection device |
| JP2011197012A (en) * | 2011-06-27 | 2011-10-06 | Hitachi High-Technologies Corp | Optical device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105738379A (en) * | 2014-12-12 | 2016-07-06 | 上海和辉光电有限公司 | Detection apparatus and detection method for polysilicon thin film |
| CN105738379B (en) * | 2014-12-12 | 2018-10-19 | 上海和辉光电有限公司 | A kind of detection device and detection method of polysilicon membrane |
| CN104990930A (en) * | 2015-07-09 | 2015-10-21 | 中国科学院上海光学精密机械研究所 | Optical element defect laser near field modulating and detecting device and induced damage prediction method |
| CN104990930B (en) * | 2015-07-09 | 2017-10-20 | 中国科学院上海光学精密机械研究所 | Optical element defect laser near-field modulation detection device and induced damage Forecasting Methodology |
| WO2020073347A1 (en) * | 2018-10-11 | 2020-04-16 | 广州博冠光电科技股份有限公司 | Surface defect detection apparatus and method for spherical optical element |
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| CN103760173B (en) | 2016-06-08 |
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