Export-oriented heat radiating LED lamp
Technical field
The present invention relates to LED lighting field, particularly a kind of export-oriented heat radiating LED lamp.
Background technology
At present, LED lamp is widely used at lighting field, yet the heating of LED lamp directly has influence on the life-span of LED lamp.Existing LED lamp adopts light source connection metal or ceramic heat sink to dispel the heat conventionally, in order to improve radiating effect, often needs to arrange the radiator that volume is larger; For to realize the luminous of wide-angle, conventionally LED light source need be arranged on a stereoscopic column simultaneously.For example Granted publication day is on October 31st, 2012, and the Chinese utility model patent that the patent No. is 201220060615.X has disclosed a kind of high light efficiency large-angle LED bulb.This high light efficiency large-angle LED bulb comprises base shell, lamp holder, constant-current supply, cover plate, heat radiation column, diffuser, this heat radiation column is fixed on this cover plate top and is cube, the bottom surface of this heat radiation column is installed on this cover plate, its lap all posts pcb board, on every pcb board, distributes and is welded with several LED chips.Because this high light efficiency large-angle LED bulb pcb board dispels the heat by heat radiation column is set, the heat that these LED chips produce is only distributed by the one side transmission being affixed, easily cause heat radiation phenomenon not in time, reduce the service life of these LED chips, and need to set up larger heat radiation column and pcb board, increase weight and the cost of this high light efficiency large-angle LED bulb.
Summary of the invention
In view of this, be necessary to provide a kind of timely, light export-oriented heat radiating LED lamp that dispels the heat.
The technical solution adopted for the present invention to solve the technical problems is: a kind of export-oriented heat radiating LED lamp, comprise body, bulb housing, illuminating part and luminous intensity distribution part, this bulb housing is located at the top of this body, this illuminating part comprises substrate and is arranged on the LED light source on substrate, this luminous intensity distribution part comprise luminous intensity distribution portion and with the hot linked heat transfer part of luminous intensity distribution portion, this heat transfer part is arranged at this body top, this luminous intensity distribution portion and this heat transfer part are made by the material with good heat conductive or heat-sinking capability, this luminous intensity distribution portion is made by transparent or semitransparent material, this luminous intensity distribution portion comprises installed surface and exiting surface, this installed surface is provided with accepting groove, the LED light source that this substrate is fixed on this installed surface and on it is housed in described accepting groove, the installed surface of this illuminating part and this luminous intensity distribution part is thermally coupled, this exiting surface arranges towards this bulb housing.
Further, in described accepting groove, be provided with Heat Conduction Material, the heat that described LED light source sends is delivered on this accepting groove by this Heat Conduction Material, and this Heat Conduction Material is liquid or solid-state heat-conducting glue.
Compared with prior art, this extroversion heat radiating LED lamp is provided with luminous intensity distribution part, the LED light source of this illuminating part is arranged in the substrate of this illuminating part and the accepting groove of the thermally coupled formation of this luminous intensity distribution part, in this accepting groove, be filled with Heat Conduction Material the appearance of these LED light sources is carried out to omnibearing heat radiation, and these LED light sources are produced to heat to be delivered on this luminous intensity distribution part in time, in time dissipation of heat is gone out, thereby avoid the accumulation of heat; Another part heat is delivered on luminous intensity distribution part hot linked with it by this substrate, and the heat on this luminous intensity distribution part is delivered on this body heat is fallen apart to space outerpace by this heat transfer part.Like this, because this extroversion heat radiating LED lamp is without arranging larger heat radiation column and pcb board, the heat that just can produce these LED light sources carries out omnibearing heat radiation, makes this extroversion heat radiating LED lamp have advantages of that heat radiation is timely, light.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the export-oriented heat radiating LED lamp of first embodiment of the invention;
Fig. 2 is the generalized section after export-oriented heat radiating LED lamp assembling shown in Fig. 1;
Fig. 3 is the partial enlarged drawing of the part of A shown in Fig. 2.
Fig. 4 be shown in Fig. 1 in export-oriented heat radiating LED lamp after the assembling of luminous intensity distribution part and illuminating part along the schematic perspective view of other direction.
Description of reference numerals:
100 export-oriented heat radiating LED lamp 10 body 20 bulb housings
30 luminous intensity distribution part 40 illuminating part 31 luminous intensity distribution portions
32 heat transfer part 311 installed surface 312 exiting surfaces
313 accepting groove 35 Heat Conduction Materials
41 substrate 42 LED light sources
The specific embodiment
Below in conjunction with accompanying drawing and the specific embodiment, the present invention is described in further detail.
Fig. 1 is the three-dimensional exploded view of the export-oriented heat radiating LED lamp 100 of first embodiment of the invention, this extroversion heat radiating LED lamp 100 comprises body 10, bulb housing 20, illuminating part 40 and luminous intensity distribution part 30, this bulb housing 20 is located at the top of this body 10, in this luminous intensity distribution part 30 and this illuminating part 40 are contained in.
Please refer to Fig. 1 to Fig. 4, this illuminating part 40 comprises substrate 41 and is arranged on LED light source 42(on this substrate 41 as shown in Figure 3).This substrate 41 is loop configuration, comprises a plurality of LED light sources 42, and these LED light sources 42 are disposed on this substrate 41 and around these substrate 41 centers and arrange in the form of a ring.This substrate 41 is made by transparent material, and this substrate 41 is made by Heat Conduction Material.
Please refer to Fig. 1 to Fig. 3, this luminous intensity distribution part 30 comprise luminous intensity distribution portion 31 and with the hot linked heat transfer part 32 of this luminous intensity distribution portion 31, this heat transfer part 32 is arranged at the top of this body 10, for the heat that supports this luminous intensity distribution part 30 and this illuminating part 40 is produced, is delivered to this body 10.One end of this heat transfer part 32 is provided with the support being connected with this luminous intensity distribution portion 31, and this luminous intensity distribution portion 31 is lens arrangement, and this luminous intensity distribution portion 31 is made by transparent or semitransparent material.This luminous intensity distribution portion 31 is loop configuration, and the cross section of this luminous intensity distribution portion 31 is the sector structure (as shown in Figure 3) that central angle is greater than 180 degree, to the light being irradiated on it is reflected, makes the bottom of more this bulb housing 20 of light directive.This luminous intensity distribution portion 31 makes by the material with good heat conductive or heat-sinking capability with this heat transfer part 32.This luminous intensity distribution portion 31 comprises that installed surface 311 and exiting surface 312(are as shown in Figure 3).This installed surface 311 is positioned at the bottom surface of this luminous intensity distribution portion 31, and the base area of this luminous intensity distribution portion 31 is greater than the area of the substrate 41 of this illuminating part 40.This installed surface 311 is positioned at this luminous intensity distribution portion 31 on the side of this body 10, and this exiting surface 312 arranges towards this bulb housing 20.The light that this luminous intensity distribution portion 31 sends this illuminating part 40 is more towards the refraction of the bottom of this bulb housing 20, to illuminate the bottom of this bulb housing 20.This illuminating part 40 is thermally coupled with the installed surface 311 of this luminous intensity distribution portion 31, this installed surface 311 is provided with accepting groove 313, this substrate 41 is fixed on this installed surface 311, thermally coupled by heat-conducting medium between this substrate 41 and this installed surface 311, and the LED light source on it 42 is housed in these accepting grooves 313.In these accepting grooves 313, be provided with Heat Conduction Material 35, the heat that these LED light sources 42 send is delivered on this accepting groove 313 by this Heat Conduction Material 35, and this Heat Conduction Material 35 is liquid or solid-state transparent or semitransparent material.Be preferably liquid material, because the heat conductivility of liquid is fabulous, the heat on these LED light source 42 surfaces can be delivered in this luminous intensity distribution portion 31 fast.This luminous intensity distribution part 30 is provided with printing opacity scattering material, and the light that these LED light sources 42 send, through scattering, is more evenly distributed the luminosity curve of this LED lamp 100.
During work, the light that these LED light sources 42 send is through the disperse function of this luminous intensity distribution portion 31 and illuminate this bulb housing 20, a part of heat that these LED light sources 42 produce is delivered in this luminous intensity distribution portion 31 in time by the Heat Conduction Material 35 in this accepting groove 313, another part heat is via being delivered in this luminous intensity distribution portion 31 with the hot linked installed surface 311 of this substrate 41, the heat of this luminous intensity distribution portion 31 is delivered on this body 10 via heat transfer part 32 hot linked with it, thereby heat is dispersed into space outerpace in time.
In sum, this extroversion heat radiating LED lamp 100 is provided with luminous intensity distribution part 30, the LED light source 42 of this illuminating part 40 is arranged in the substrate 41 of this illuminating part 40 and the accepting groove 313 of these luminous intensity distribution part 30 thermally coupled formation, in this accepting groove 313, be filled with Heat Conduction Material 35 appearance of these LED light sources 42 is carried out to omnibearing heat radiation, and these LED light sources 42 are produced to heat to be delivered on this luminous intensity distribution part 30 in time, in time dissipation of heat is gone out, thereby avoid the accumulation of heat; Another part heat is delivered on luminous intensity distribution part 30 hot linked with it by this substrate 41, and the heat on this luminous intensity distribution part 30 is delivered on this body 10 heat is fallen apart to space outerpace by the heat transfer part 32 of this luminous intensity distribution part 30.Like this, because this extroversion heat radiating LED lamp 100 is without arranging larger heat radiation column and pcb board, the heat that just can produce these LED light sources 42 carries out omnibearing heat radiation, makes this extroversion heat radiating LED lamp 100 have advantages of that heat radiation is timely, light.
Because this installed surface 312 is positioned at the bottom surface of this luminous intensity distribution portion 31, and the area of this installed surface 312 is greater than the area of this substrate 41, and this installed surface 312 can not blocked by this substrate 41, and light can penetrate from this installed surface 312, according to the bottom to this bulb housing 20.In addition, because this substrate 41 is made by transparent material, the light that this LED light source 42 sends is the bottom emission to this bulb housing 20 through this substrate 41 directly.The light that these LED light sources 42 send is dispersed through these luminous intensity distribution part 30 luminous intensity distribution portions 31, luminous thereby wide-angle is realized in top, sidewall and the bottom of illuminating this bulb housing 20.Why the cross section of this luminous intensity distribution portion 31 is set to the sector structure that central angle is greater than 180 degree, and this installed surface is arranged on to this luminous intensity distribution portion 31 on the side of this body 10, be because we find, the light that LED light source 42 sends will more be reflected towards the thicker position of lens.Compared with prior art, because just to realize wide-angle luminous without a plurality of pcb boards being set in heat radiation on column and welding LED chip on each pcb board, make this extroversion heat radiating LED lamp 100 also have advantages of easy to assembly.
Further, can also design the cross section of these different luminous intensity distribution part 30 luminous intensity distribution portions 31, as long as the light that can send these LED light sources 42 carries out secondary light-distribution, reach the luminous object of wide-angle.
These are only preferred embodiment of the present invention above, and not in order to limit the present invention, any those skilled in the art are not within departing from this programme technical scope, and that utilize that the technology contents of above-mentioned exposure does a little change is the equal equivalent embodiment changing.In every case depart from technical solution of the present invention content, according to the technology of the present invention essence to any modification made for any of the above embodiments, be equal to replacement, improvement etc., within all should being included in the scope of protection of the invention.