CN103149793B - Intelligent photolithography and realizing method thereof - Google Patents
Intelligent photolithography and realizing method thereof Download PDFInfo
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- CN103149793B CN103149793B CN201310115328.3A CN201310115328A CN103149793B CN 103149793 B CN103149793 B CN 103149793B CN 201310115328 A CN201310115328 A CN 201310115328A CN 103149793 B CN103149793 B CN 103149793B
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Abstract
The invention discloses an intelligent photolithography and a realizing method thereof. The photolithography (0) is characterized in that an identification (2) capable of reading a characteristic size is arranged in a scribing line (1) which does not occupy the area of a main pipe core (10). The intelligent photolithography has the advantages that a special measurement device is not used, a microscope is used so that the actual size of the characteristic size can be rapidly read out, the working efficiency is increased, and the fund of purchasing the special device and device maintenance can be saved.
Description
Technical field
The present invention is mainly concerned with the reticle that semiconductor core flake products photoetching process uses, its advantage is to have and does not use special measurement equipment, use microscope just can read the physical size of characteristic dimension fast, increase work efficiency, the fund buying special measurement equipment and plant maintenance thereof can be saved.
Background technology
In semi-conductor chip product processing, monitoring for the characteristic dimension of semiconductor core flake products is necessary work, semi-conductor chip product manufacturing factory all drops into a large amount of funds, for purchasing the maintenance work of special measurement equipment and equipment thereof, the testing apparatus of more than 2 resolution below 0.15 μm is generally needed with the production line of the most basic 3 μm of-METAL GATE, for measuring the characteristic dimension in semi-conductor chip process of producing product, and Measuring Time is longer, affect production efficiency; Usually all can use a lot for checking the microscope of surfacial pattern in semi-conductor chip factory, common enlargement factor has 100X, 200X, 500X, 1000X etc.If can in the process of surface inspection directly, read the physical size of characteristic dimension in semi-conductor chip process of producing product fast, will to enhance productivity, and the fund of saving for buying special measurement equipment and plant maintenance thereof.
Summary of the invention
In semi-conductor chip process of producing product, same media layer is when time processing, only exist and retain or do not retain two states, and reserved area connects with not reserved area, there is the characteristic of equal proportion harmomegathus in the same way simultaneously, such as, in semiconductor core flake products lithography process process, photoresist is withed a hook at the end and is not retained two kinds of regions, and photoresist reserved area and photoresist do not connect in Liang Ge region in reserved area, simultaneously will there is equivalent and rise (contracting) or contract (rising) in photoresist reserved area (not reserved area) lines to both sides.The present invention, to utilize in semi-conductor chip process of producing product these characteristic exactly, by the graphic designs of feature dimension of interest, is formed and can see that a kind of intelligent optical that figure reads characteristic dimension is cut blocks for printing.
The invention provides a kind of intelligent optical to cut blocks for printing and its implementation.
1, a kind of intelligent optical is cut blocks for printing, and it is characterized in that:
A, there is the mark (2) of characteristic dimension, special measurement equipment can not be used, use microscope just can read the physical size of characteristic dimension, increase work efficiency, reduce and inject capital into;
The mark (2) of the characteristic dimension of B, reticle (0), is arranged in the scribe line (1) of reticle (0);
The mark (2) of the characteristic dimension of C, reticle (0), formed by one group of unit (31), (32), (33), (34), one group of unit is not limited to 4, can be more;
Each unit of the mark (2) of the characteristic dimension of D, reticle (0), by design intended target size reserved area and not reserved area jointly formed;
Reserved area in each unit of the mark (2) of the characteristic dimension of E, reticle (0) and not between reserved area, there is the difference of equivalent with target size, the difference of the equivalent between each unit is equally spaced stepped change;
The actual numerical value that F, each unit internal labeling numerical value (4) are characteristic dimension during reading.
2, a kind of intelligent optical as claimed in claim 1 implementation method of cutting blocks for printing, is characterized in that: use microscope directly to read the physical size of characteristic dimension, implementation method is as follows:
A, the mark (2) of according to target size setting characteristic dimension, each reserved area of one group of unit and target size are equally spaced ladder difference, reserved area and target size are not equally spaced ladder difference equally, and mark out harmomegathus on each unit after, the numerical value (4) of reserved area and characteristic dimension when do not align in sideline, reserved area, according to said method manufacture the reticle comprising characteristic dimension mark, use the mark (2) in microexamination reticle, find the unit alignd in sideline, the numerical value (4) that this unit of direct reading marks out, be the physical size of characteristic dimension,
When B, use, pass through photoetching technique, cut blocks for printing adopting a kind of intelligent optical of the art of this patent after on figure and picture to silicon chip, use microexamination image to the mark (2) on silicon chip, find the unit alignd in sideline, namely the numerical value (4) that this unit of direct reading marks out be the physical size of the characteristic dimension after transmitting image process generation harmomegathus;
C, a kind of intelligent optical of the art of this patent is used to cut blocks for printing the silicon chip of photoetching, pass through other technological processs again, after curing, corrode or etching, use the mark (2) after microexamination baking, corrosion or etching, find the unit alignd in sideline, namely the numerical value (4) that this unit of direct reading marks out be the physical size being produced the characteristic dimension after harmomegathus by process.
Use a kind of intelligent optical of the present invention to cut blocks for printing, can realize not using special test equipment, just can read the physical size in process after characteristic dimension harmomegathus under the microscope.
Accompanying drawing explanation
Fig. 1 is that a kind of intelligent optical of the present invention is cut blocks for printing schematic diagram (reticle partial schematic diagram).
Fig. 2 is the characteristic dimension mark schematic diagram of reticle.
Fig. 3 to be the characteristic dimension of reticle be mark schematic diagram of 1 μm.
Fig. 4 to be the characteristic dimension of reticle be the mark of 1 μm occurs rise after schematic diagram.
Fig. 5 is the characteristic dimension of reticle is schematic diagram after the mark appearance contracting of 1 μm.
Fig. 6 is other forms of characteristic dimension mark schematic diagram.
Embodiment
Fig. 1 shows a kind of intelligent optical of the present invention and to cut blocks for printing schematic diagram, describes reticle of the present invention in detail below in conjunction with Fig. 1.
This reticle (0) is provided with the mark (2) can reading characteristic dimension in the scribe line (1) not taking supervisor's core (10) area, have and do not use special measurement equipment, use microscope just can read the physical size of characteristic dimension fast, increase work efficiency, the fund buying specialized equipment and plant maintenance thereof can be saved.
The mark (2) of this reticle (0) characteristic dimension, is made up of (can be more multiple-unit during actual design to form) jointly unit (31), (32), (33), (34).
Fig. 2 shows mark (2) schematic diagram of the characteristic dimension that a kind of intelligent optical of the present invention is cut blocks for printing, and describes reticle of the present invention in detail below in conjunction with Fig. 2.
The mark (2) of the characteristic dimension of this reticle is formed by a series of unit, and each unit is made up of five regions, and for unit (31), unit (31) is by (310) region of centre and other four regions (311), (312), (313), (314) form, wherein, the size in the region (310) in the middle of each unit, is designed to the target size of characteristic dimension, one, centre region (310) and all the other four same area (311) of each unit, (312), (313), (314) distance in vertical direction presents the difference of equivalent, and unit (31), (32), (33), (34) difference of the equivalent between is different, present stepped change poor at equal intervals, namely to deduct the difference result of the equivalent of unit (31) equal with the difference result that the difference of the equivalent of unit (33) deducts the equivalent of unit (32) for the difference of the equivalent of unit (32), and such as the difference of unit (31) equivalent is 1, the difference of unit (32) equivalent is 0, then the difference of unit (33) equivalent is-1, the difference of unit (34) equivalent is-2, the difference of routine unit (31) equivalent is 3 again, the difference of unit (32) equivalent is 2, then the difference of unit (33) equivalent is 1, the difference of unit (34) equivalent is 0, and namely the equivalent difference of each unit is in stepped change poor at equal intervals.
The characteristic dimension that Fig. 3 shows reticle of the present invention is the mark schematic diagram of 1 μm, describes reticle of the present invention in detail below in conjunction with Fig. 3.
This figure to be the characteristic dimension of reticle be mark (2) of 1 μm, the zone line design size of each unit is 1 μm, 1.2 are made marks in unit (31), represent 1.2 μm, distance in its zone line (310) and other four regions (311), (312), (313), (314) vertical direction is identical, and the difference of equivalent is 0.2 μm; In unit (32), make marks 1.1, represent 1.1 μm, the distance in its zone line (320) and other four regions (321), (322), (323), (324) vertical direction is identical, and the difference of equivalent is 0.1 μm; Similar units makes marks 1 in (33), and the difference of its equivalent is 0 μm; Unit makes marks 0.9 in (34), and the difference of its equivalent is-0.1 μm; Unit makes marks 0.8 in (35), and the difference of its equivalent is-0.2 μm; If there is shown in this figure under microscope, the upper edge of the central area (330) of unit (33) is straight line with the lower edge of two regions (331), (332) above, simultaneously the lower edge of the central area (330) of unit (33) is straight line with the upper edge of two regions (333), (334) below, then characteristic dimension reading is 1 μm, figure does not have harmomegathus, namely characteristic dimension design load is 1 μm, and characteristic dimension actual value is also 1 μm.(number reading method is, more each unit, if the lower edge in the upper edge of the central area of which unit and two regions is above closest to point-blank, or the upper edge in the lower edge of central area and two regions is below closest to point-blank, attends school the size shown in which unit.）
The characteristic dimension that Fig. 4 shows reticle of the present invention is schematic diagram after rising appears in the mark of 1 μm, describes reticle of the present invention in detail below in conjunction with Fig. 4.
The upper (lower) edge of the central area (320) of the unit (32) of characteristic dimension shown in this figure with under all the other regions (321), (322), (323), (324) (on) along closest to point-blank, the mark 1.1 of unit (32), then characteristic dimension reading is 1.1 μm, rising appears in figure, namely characteristic dimension design load is 1 μm, and characteristic dimension actual value is 1.1 μm.(reading annotates, when rising, there is rising of equivalent in same area simultaneously, there are the upper edge of central area (320) and two regions (321) above in unit (32) figure, (322) lower edge is straight line, and the difference of unit (32) equivalent is known 0.1 μm, illustrate to rise phenomenon in central area, when there is this diagram, that the upper edge of central area is to rise 0.05 μm, above central area, the lower edge in two regions rises 0.05 μm downwards, lower edge in like manner, so time central area figure on edge and lower edge respectively rise 0.05 μm, namely whole figure occurs rising 0.1 μm, eigenwert design load is 1 μm, characteristic dimension actual value is only 1.1 μm.）
The characteristic dimension that Fig. 5 shows reticle of the present invention is schematic diagram after the mark appearance contracting of 1 μm, describes reticle of the present invention in detail below in conjunction with Fig. 5.
The upper (lower) edge of the central area (340) of the unit (34) of characteristic dimension shown in this figure is closest point-blank with ((343), (344) upper) edge under all the other regions (341), (342), the mark 0.9 of unit (34), then characteristic dimension reading is 0.9 μm, there is contracting in figure, namely characteristic dimension design load is 1 μm, and characteristic dimension actual value is 0.9 μm.(reading annotates, when there is contracting, there is the contracting of equivalent in same area simultaneously, there are the upper edge of central area (340) and two regions (341) above in unit (34) figure, (342) lower edge forms straight line, and the difference of unit (34) equivalent is known-0.1 μm, illustrate that contracting phenomenon occurs in central area, when there is this diagram, that the upper edge of central area (340) contracts 0.05 μm downwards, two regions (341) above central area, (342) lower edge upwards contracts 0.05 μm, lower edge in like manner, so time central area figure on edge and lower to each contracting 0.05 μm, namely there is contracting 0.1 μm in whole figure, eigenwert design load is 1 μm, characteristic dimension actual value is 0.9 μm.）
Fig. 6 shows the schematic diagram of other forms of characteristic dimension mark (2) of reticle of the present invention, describes reticle of the present invention in detail below in conjunction with Fig. 6.
The mark (2) of the characteristic dimension of this reticle is formed by a series of unit, each unit is made up of four regions, unit (31), (32), between (33) and unit (30), there is the difference of equivalent, the difference of equivalent presents stepped change poor at equal intervals, this mark, can compare that equivalent difference " to be eaten up " when reading, the actual value of characteristic dimension is just the value of mark (4).
By embodiments described above illustrating the present invention, other embodiment also can be adopted to realize the present invention simultaneously.The present invention is not limited to above-mentioned specific embodiment, and therefore the present invention is limited by claims scope.
Claims (2)
1. an intelligent optical is cut blocks for printing, and it is characterized in that:
A, there is the mark (2) of characteristic dimension, special measurement equipment can not be used, use microscope just can read the physical size of characteristic dimension, increase work efficiency, reduce and inject capital into;
The mark (2) of the characteristic dimension of B, reticle (0), is arranged in the scribe line (1) of reticle (0);
The mark (2) of the characteristic dimension of C, reticle (0), formed by one group of unit (31), (32), (33), (34), one group of unit is not limited to 4, can be more;
Each unit of the mark (2) of the characteristic dimension of D, reticle (0), by design intended target size reserved area and not reserved area jointly formed;
Reserved area in each unit of the mark (2) of the characteristic dimension of E, reticle (0) and not between reserved area, there is the difference of equivalent with target size, the difference of the equivalent between each unit is equally spaced stepped change;
The actual numerical value that F, each unit internal labeling numerical value (4) are characteristic dimension during reading.
2. a kind of intelligent optical as claimed in claim 1 implementation method of cutting blocks for printing, is characterized in that: use microscope directly to read the physical size of characteristic dimension, implementation method is as follows:
A, the mark (2) of according to target size setting characteristic dimension, each reserved area of one group of unit and target size are equally spaced ladder difference, reserved area and target size are not equally spaced ladder difference equally, and mark out harmomegathus on each unit after, the numerical value (4) of reserved area and characteristic dimension when do not align in sideline, reserved area, according to said method manufacture the reticle comprising characteristic dimension mark, use the mark (2) in microexamination reticle, find the unit alignd in sideline, the numerical value (4) that this unit of direct reading marks out, be the physical size of characteristic dimension,
B, pass through photoetching technique, the figure that intelligent optical is cut blocks for printing, after on image to silicon chip, use microexamination image to the mark (2) on silicon chip, find the unit alignd in sideline, namely the numerical value (4) that this unit of direct reading marks out be the physical size of the characteristic dimension after transmitting image process generation harmomegathus;
C, intelligent optical is used to cut blocks for printing the silicon chip of photoetching, pass through other technological processs again, after curing, corrode or etching, use the mark (2) after microexamination baking, corrosion or etching, find the unit alignd in sideline, namely the numerical value (4) that this unit of direct reading marks out be the physical size being produced the characteristic dimension after harmomegathus by process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115328.3A CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115328.3A CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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| Publication Number | Publication Date |
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| CN103149793A CN103149793A (en) | 2013-06-12 |
| CN103149793B true CN103149793B (en) | 2015-01-28 |
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| CN201310115328.3A Expired - Fee Related CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007520082A (en) * | 2004-01-30 | 2007-07-19 | 東京エレクトロン株式会社 | Real-time control of reticle / mask system |
| CN102683165A (en) * | 2011-03-18 | 2012-09-19 | 敖翔科技股份有限公司 | Intelligent defect screening and sampling method |
| US20120303151A1 (en) * | 2011-05-25 | 2012-11-29 | Asml Netherlands B.V. | Computational Process Control |
| US20120327383A1 (en) * | 2011-06-22 | 2012-12-27 | Asml Netherlands B.V. | System and Method to Ensure Source and Image Stability |
-
2013
- 2013-04-03 CN CN201310115328.3A patent/CN103149793B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007520082A (en) * | 2004-01-30 | 2007-07-19 | 東京エレクトロン株式会社 | Real-time control of reticle / mask system |
| CN102683165A (en) * | 2011-03-18 | 2012-09-19 | 敖翔科技股份有限公司 | Intelligent defect screening and sampling method |
| US20120303151A1 (en) * | 2011-05-25 | 2012-11-29 | Asml Netherlands B.V. | Computational Process Control |
| US20120327383A1 (en) * | 2011-06-22 | 2012-12-27 | Asml Netherlands B.V. | System and Method to Ensure Source and Image Stability |
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| CN103149793A (en) | 2013-06-12 |
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Granted publication date: 20150128 Termination date: 20170403 |