CN103149793A - Intelligent photolithography and realizing method thereof - Google Patents
Intelligent photolithography and realizing method thereof Download PDFInfo
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- CN103149793A CN103149793A CN2013101153283A CN201310115328A CN103149793A CN 103149793 A CN103149793 A CN 103149793A CN 2013101153283 A CN2013101153283 A CN 2013101153283A CN 201310115328 A CN201310115328 A CN 201310115328A CN 103149793 A CN103149793 A CN 103149793A
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Abstract
The invention discloses an intelligent photolithography and a realizing method thereof. The photolithography (0) is characterized in that an identification (2) capable of reading a characteristic size is arranged in a scribing line (1) which does not occupy the area of a main pipe core (10). The intelligent photolithography has the advantages that a special measurement device is not used, a microscope is used so that the actual size of the characteristic size can be rapidly read out, the working efficiency is increased, and the fund of purchasing the special device and device maintenance can be saved.
Description
Technical field
The present invention is mainly concerned with the reticle that semiconductor core flake products photoetching process uses, its advantage is to have the special measurement equipment that do not use, use microscope just can read fast the physical size of characteristic dimension, increase work efficiency, can save the fund of buying special measurement equipment and plant maintenance thereof.
Background technology
In the semi-conductor chip product processing, monitoring for the characteristic dimension of semiconductor core flake products is necessary work, semiconductor core flake products manufacturing plant all drops into a large amount of funds, be used for the maintenance work of buying special measurement equipment and equipment thereof, production line with the most basic 3 μ m-METAL GATE generally needs the testing apparatus of 2 above resolution below 0.15 μ m, be used for measuring the characteristic dimension of semi-conductor chip process of producing product, and Measuring Time is longer, affects production efficiency; Usually all can use a lot of microscopes that are used for checking surfacial pattern in semi-conductor chip factory, common enlargement factor has 100X, 200X, 500X, 1000X etc.If can read directly, fast the physical size of characteristic dimension in the semi-conductor chip process of producing product in the process of surface inspection, will enhance productivity, and save the fund that is used for buying special measurement equipment and plant maintenance thereof.
Summary of the invention
In the semi-conductor chip process of producing product, dielectric layer of the same race is when time processing, only exist and keep or do not keep two states, and the reserved area and not the reserved area join, has simultaneously the characteristic of equal proportion harmomegathus in the same way, for example, in semiconductor core flake products lithography process process, photoresist is withed a hook at the end and is not kept two kinds of zones, and photoresist reserved area and photoresist do not join in zone, two of reserved areas, and while photoresist reserved area (not reserved area) lines equivalent will occur to both sides rise (contracting) or contract (rising).The present invention utilizes in the semi-conductor chip process of producing product these characteristic exactly, and by the graphic designs of target signature size, formation can with the aid of picturesly be read a kind of intelligent optical of characteristic dimension and be cut blocks for printing.
The invention provides a kind of intelligent optical cuts blocks for printing and its implementation.
1, a kind of intelligent optical is cut blocks for printing and its implementation, it is characterized in that:
A, have the sign (2) of characteristic dimension, can not use special measurement equipment, use microscope just can read the physical size of characteristic dimension, increase work efficiency, reduce and inject capital into;
The sign (2) of the characteristic dimension of B, reticle (0) is arranged in the scribe line (1) of reticle (0);
The sign (2) of the characteristic dimension of C, reticle (0) is formed by one group of unit (31), (32), (33), (34) (can be more);
Each unit of the sign (2) of the characteristic dimension of D, reticle (0), by the reserved area of design intended target size and not the reserved area jointly form;
There is the difference of equivalent in reserved area in each unit of the sign (2) of the characteristic dimension of E, reticle (0) and not between the reserved area with target size, and the difference of the equivalent between each unit is equally spaced stepped change;
F, the actual numerical value of characteristic dimension when each unit internal labeling numerical value (4) is reading.
2, a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, and it is characterized in that: use microscope can directly read the physical size of characteristic dimension from the sign (2) on reticle.
3, a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, and it is characterized in that: after reticle figure image was to the silicon chip, the sign (2) on from the image to the silicon chip can directly be read the physical size that is produced the characteristic dimension after harmomegathus by the transmitting image process.
4, a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, it is characterized in that: in other technological processs of silicon chip process, as cure, after corrosion or etching, the sign (2) after baking, corrosion or the etching can directly be read the physical size that is produced characteristic dimension after harmomegathus by process.
A kind of intelligent optical of the present invention is cut blocks for printing, and can realize not using special test equipment, the physical size of characteristic dimension in microscopically just can be read process.
Description of drawings
Fig. 1 is a kind of intelligent optical of the present invention schematic diagram (reticle partial schematic diagram) of cutting blocks for printing.
Fig. 2 is the characteristic dimension sign schematic diagram of reticle.
Fig. 3 is that the characteristic dimension of reticle is the sign schematic diagram of 1 μ m.
Fig. 4 is that the characteristic dimension of reticle is the sign of the 1 μ m rear schematic diagram that occurs rising.
Fig. 5 is that the characteristic dimension of reticle is the rear schematic diagram of sign appearance contracting of 1 μ m.
Fig. 6 is other forms of characteristic dimension sign schematic diagram.
Embodiment
Fig. 1 shows a kind of intelligent optical of the present invention schematic diagram of cutting blocks for printing, and describes reticle of the present invention in detail below in conjunction with Fig. 1.
This reticle (0) is provided with the sign (2) that can read characteristic dimension in the scribe line (1) that does not take supervisor's core (10) area, has the special measurement equipment that do not use, use microscope just can read fast the physical size of characteristic dimension, increase work efficiency, can save the fund of buying specialized equipment and plant maintenance thereof.
The sign (2) of this reticle (0) characteristic dimension forms (can be more during actual design, multiple-unit forms) jointly by unit (31), (32), (33), (34).
Fig. 2 shows sign (2) schematic diagram of the characteristic dimension that a kind of intelligent optical of the present invention cuts blocks for printing, and describes reticle of the present invention in detail below in conjunction with Fig. 2.
the sign of the characteristic dimension of this reticle (2) is formed by a series of unit, and each unit is made of five zones, and (31) are example take the unit, and unit (31) are by (310) zone and other four zones (311) of centre, (312), (313), (314) form, wherein, the size in the zone (310) in the middle of each unit is designed to the target size of characteristic dimension, a zone, the centre of each unit (310) and all the other four same area (311), (312), (313), (314) in vertical direction distance presents the difference of equivalent, and unit (31), (32), (33), the difference of the equivalent (34) is different, present uniformly-spaced poor stepped change, be that the difference result that the difference of the equivalent of unit (32) deducts the equivalent of unit (31) equates with the difference result that the difference of the equivalent of unit (33) deducts the equivalent of unit (32), for example the difference of unit (31) equivalent is 1, the difference of unit (32) equivalent is 0, and the difference of unit (33) equivalent is-1, the difference of unit (34) equivalent is-2, the difference of routine unit (31) equivalent is 3 again, the difference of unit (32) equivalent is 2, and the difference of unit (33) equivalent is 1, the difference of unit (34) equivalent is 0, and namely the equivalent difference of each unit is uniformly-spaced poor stepped change.
The characteristic dimension that Fig. 3 shows reticle of the present invention is the sign schematic diagram of 1 μ m, describes reticle of the present invention in detail below in conjunction with Fig. 3.
this figure is that the characteristic dimension of reticle is the sign (2) of 1 μ m, the zone line design size of each unit is 1 μ m, make marks 1.2 in unit (31), represent 1.2 μ m, zone (310) is identical with distance on other four zones (311), (312), (313), (314) vertical direction in the middle of it, and the difference of equivalent is 0.2 μ m, make marks 1.1 in unit (32), represent 1.1 μ m, zone (320) is identical with distance on other four zones (321), (322), (323), (324) vertical direction in the middle of it, and the difference of equivalent is 0.1 μ m, similar units makes marks 1 in (33), and the difference of its equivalent is 0 μ m, the unit makes marks 0.9 in (34), and the difference of its equivalent is-0.1 μ m, the unit makes marks 0.8 in (35), and the difference of its equivalent is-0.2 μ m, microscopically is if there is shown in this figure, the upper edge of the central area (330) of unit (33) and top two zones (331), (332) lower edge is straight line, the lower edge and following two zones (333) of the central area (330) of while unit (33), (334) upper edge is straight line, the characteristic dimension reading is 1 μ m, figure does not have harmomegathus, be that the characteristic dimension design load is 1 μ m, the characteristic dimension actual value is also that 1 μ m(number reading method is, each unit relatively, if the upper edge of the central area of which unit is point-blank the most approaching with the lower edge in top two zones, or the lower edge of central area is point-blank the most approaching with the upper edge in following two zones, attend school the size shown in which unit).
The characteristic dimension that Fig. 4 shows reticle of the present invention is the sign of the 1 μ m rear schematic diagram that occurs rising, and describes reticle of the present invention in detail below in conjunction with Fig. 4.
the central area (320) of the unit of characteristic dimension shown in this figure (32) upper (under) along and all the other zones (321), (322), (323), (324) (on) along point-blank the most approaching, the mark 1.1 of unit (32), the characteristic dimension reading is 1.1 μ m, rising appears in figure, be that the characteristic dimension design load is 1 μ m, the characteristic dimension actual value is 1.1 μ m(reading notes, when rising, rising of equivalent appears in same area simultaneously, the upper edge and top two zones (321) of central area (320) appears in unit (32) figure, (322) lower edge is straight line, and the difference of unit (32) equivalent is 0.1 known μ m, the central area phenomenon that rises is described, when this diagram occurring, that the upper edge of central area is to the 0.05 μ m that goes up, above the central area 0.05 μ m rises downwards on the lower edge in two zones, lower edge in like manner, so the time central area figure on edge and the lower edge 0.05 μ m that respectively rises, be the whole figure 0.1 μ m that occurs rising, the eigenwert design load is 1 μ m, the characteristic dimension actual value is only 1.1 μ m).
The characteristic dimension that Fig. 5 shows reticle of the present invention is the rear schematic diagram of sign appearance contracting of 1 μ m, describes reticle of the present invention in detail below in conjunction with Fig. 5.
the central area (340) of the unit of characteristic dimension shown in this figure (34) upper (under) along and all the other zones (341), (342) under ((343), (344) upper) along point-blank the most approaching, the mark 0.9 of unit (34), the characteristic dimension reading is 0.9 μ m, contracting appears in figure, be that the characteristic dimension design load is 1 μ m, the characteristic dimension actual value is 0.9 μ m(reading note, when contracting occurs when, the contracting of equivalent appears in same area simultaneously, the upper edge and top two zones (341) of central area (340) appears in unit (34) figure, (342) lower edge forms straight line, and the difference of unit (34) equivalent is known-0.1 μ m, illustrate that the contracting phenomenon occurs in the central area, when this diagram occurring, the downward contracting in the upper edge 0.05 μ m of central area (340), two zones (341) above the central area, (342) 0.05 μ m upwards contracts on lower edge, lower edge in like manner, so the time central area figure on edge and the lower edge 0.05 μ m that respectively contracts, be that contracting 0.1 μ m appears in whole figure, the eigenwert design load is 1 μ m, the characteristic dimension actual value is 0.9 μ m).
Fig. 6 shows the schematic diagram of the other forms of characteristic dimension sign (2) of reticle of the present invention, describes reticle of the present invention in detail below in conjunction with Fig. 6.
The sign of the characteristic dimension of this reticle (2) is formed by a series of unit, each unit is made of four zones, have the difference of equivalent between unit (31), (32), (33) and unit (30), the difference of equivalent presents uniformly-spaced poor stepped change, this sign, can compare that equivalent difference and " be eaten up " when reading, the actual value of characteristic dimension is just for identifying the value of (4).
Set forth the present invention by above-described embodiment, also can adopt other embodiment to realize the present invention simultaneously.The present invention is not limited to above-mentioned specific embodiment, so the present invention is by the claims circumscription.
Claims (4)
1. an intelligent optical is cut blocks for printing and its implementation, it is characterized in that:
A, have the sign (2) of characteristic dimension, can not use special measurement equipment, use microscope just can read the physical size of characteristic dimension, increase work efficiency, reduce and inject capital into;
The sign (2) of the characteristic dimension of B, reticle (0) is arranged in the scribe line (1) of reticle (0);
The sign (2) of the characteristic dimension of C, reticle (0) is formed by one group of unit (31), (32), (33), (34) (can be more);
Each unit of the sign (2) of the characteristic dimension of D, reticle (0), by the reserved area of design intended target size and not the reserved area jointly form;
There is the difference of equivalent in reserved area in each unit of the sign (2) of the characteristic dimension of E, reticle (0) and not between the reserved area with target size, and the difference of the equivalent between each unit is equally spaced stepped change;
F, the actual numerical value of characteristic dimension when each unit internal labeling numerical value (4) is reading.
2. a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, and it is characterized in that: use microscope can directly read the physical size of characteristic dimension from the sign (2) on reticle.
3. a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, and it is characterized in that: after reticle figure image was to the silicon chip, the sign (2) on from the image to the silicon chip can directly be read the physical size that is produced the characteristic dimension after harmomegathus by the transmitting image process.
4. a kind of intelligent optical as claimed in claim 1 is cut blocks for printing, it is characterized in that: in other technological processs of silicon chip process, as cure, after corrosion or etching, the sign (2) after baking, corrosion or the etching can directly be read the physical size that is produced characteristic dimension after harmomegathus by process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115328.3A CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115328.3A CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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| CN103149793A true CN103149793A (en) | 2013-06-12 |
| CN103149793B CN103149793B (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310115328.3A Expired - Fee Related CN103149793B (en) | 2013-04-03 | 2013-04-03 | Intelligent photolithography and realizing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007520082A (en) * | 2004-01-30 | 2007-07-19 | 東京エレクトロン株式会社 | Real-time control of reticle / mask system |
| CN102683165A (en) * | 2011-03-18 | 2012-09-19 | 敖翔科技股份有限公司 | Intelligent defect screening and sampling method |
| US20120303151A1 (en) * | 2011-05-25 | 2012-11-29 | Asml Netherlands B.V. | Computational Process Control |
| US20120327383A1 (en) * | 2011-06-22 | 2012-12-27 | Asml Netherlands B.V. | System and Method to Ensure Source and Image Stability |
-
2013
- 2013-04-03 CN CN201310115328.3A patent/CN103149793B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007520082A (en) * | 2004-01-30 | 2007-07-19 | 東京エレクトロン株式会社 | Real-time control of reticle / mask system |
| CN102683165A (en) * | 2011-03-18 | 2012-09-19 | 敖翔科技股份有限公司 | Intelligent defect screening and sampling method |
| US20120303151A1 (en) * | 2011-05-25 | 2012-11-29 | Asml Netherlands B.V. | Computational Process Control |
| US20120327383A1 (en) * | 2011-06-22 | 2012-12-27 | Asml Netherlands B.V. | System and Method to Ensure Source and Image Stability |
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| CN103149793B (en) | 2015-01-28 |
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Granted publication date: 20150128 Termination date: 20170403 |