CN103079392A - Component mounting device - Google Patents
Component mounting device Download PDFInfo
- Publication number
- CN103079392A CN103079392A CN2012103695499A CN201210369549A CN103079392A CN 103079392 A CN103079392 A CN 103079392A CN 2012103695499 A CN2012103695499 A CN 2012103695499A CN 201210369549 A CN201210369549 A CN 201210369549A CN 103079392 A CN103079392 A CN 103079392A
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- CN
- China
- Prior art keywords
- substrate
- light
- led element
- ultraviolet light
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Abstract
A compound mounting device can accurately identify the position of a light emitting part of an LED component, thereby mounting a light diffusion lens on a substrate with high optical axis precision. A suction nozzle (11) takes out a light diffusion lens (25) from a component supply unit (5). A substrate identification camera (19) is moved to a part above the LED component (21) that is equipped on a printed substrate (P), and a lighting lamp (20) is lightened. Ultraviolet light is irradiated to the LED component on the printed substrate. Thus, visible light is emitted from a phosphor (21A) on the upper surface of the LED component, and the ultraviolet light is reflected from other parts. Therefore, the ultraviolet light which is reflected from other parts is reflected downwards by means of a light filter (24) for shielding the ultraviolet light. Only the visible light from the phosphor is incident into a photographing surface of the substrate identification camera (19). As a result, only the phosphor is clearly photographed, and therefore only the position of the phosphor part is identified by an identification processing device.
Description
Technical field
The present invention relates to a kind of apparatus for mounting component, its utilization is arranged on the part holders on the mounting head, and the light diffusion of the light that diffusion LED element is sent is installed on the substrate with lens, is installed in the described LED element with fluorophor on the described substrate with covering.
Background technology
Disclose a kind of apparatus for mounting component in such as patent document 1 grade, it will be provided with in the upper face center section of body the diffusion of hemispherical light and be installed on the substrate with the LED element of lens.In addition, known a kind of technology after described substrate is installed the LED element, is installed in the light diffusion on the described substrate with lens, to cover the LED element of this installation.Under these circumstances, the diffusion of described light is installed on the described substrate when covering the LED element that has been installed on the described substrate with lens, need to installs take the profile of the wiring pattern that is formed at described substrate or described LED element as benchmark.
Patent document 1:(Japan) JP 2011-165834 communique
But, described light diffusion is being installed with in the situation of lens as benchmark take the profile of described wiring pattern or LED element, because the fluorescence section as the illuminating part of LED element may not be consistent with the profile of described wiring pattern or LED element, therefore exist and the problem of described light diffusion with the optical axis dislocation of lens.
Therefore, the object of the invention is to, accurately identify the position of the illuminating part of LED element, thereby carry out the installation that lens are used in the high light diffusion of plain shaft precision at substrate.
Summary of the invention
The first invention provides a kind of apparatus for mounting component, the light diffusion that its utilization is arranged on the light that the part holders on the mounting head will send for diffusion LED element is installed in substrate with lens, be installed in the described LED element with fluorophor on the described substrate with covering, this first invention is characterised in that, is provided with:
Illuminating lamp, it is to the described LED element irradiating ultraviolet light that is installed on the described substrate;
Camera, it is installed on the described mounting head;
Filter, it is installed in and is used for blocking ultraviolet light on the described mounting head;
When lighting described illuminating lamp and shine described ultraviolet light to the described LED element on the described substrate, send visible light from the described fluorophor of described LED element upper surface, and reflect described ultraviolet light from other parts, utilize described filter to block from the described ultraviolet light of described other part reflections, only make the described visible light from described fluorophor incide described camera.
The second invention is characterised in that on the basis of the first invention, described camera is the substrate identification camera of taking the substrate identification mark that is arranged on the described substrate for the position of identifying described substrate.
The present invention can accurately identify the position of the illuminating part of LED element, thereby carries out the installation that lens are used in the high light diffusion of plain shaft precision at substrate.
Description of drawings
Fig. 1 is the vertical view of electronic component mounting apparatus.
Fig. 2 lights illuminating lamp to the brief description figure of the state that is installed in the LED element irradiating ultraviolet light on the printed base plate.
Fig. 3 is that the adsorption mouth of mounting head is being adsorbed the state diagram that lens are used in the light diffusion.
Fig. 4 is installed in the figure that is installed in the state of the LED element on the printed base plate on the printed base plate with covering with the light diffusion with lens, (A) is longitudinal sectional drawing, (B) is vertical view.
Description of reference numerals
1 electronic component mounting apparatus
6 mounting heads
19 substrates identification camera
20 illuminating lamps
21 LED elements
The 21A fluorophor
24,24A filter
25 light diffusion lens
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 1 is the vertical view of electronic component mounting apparatus 1, and a plurality of assembly supply device 3A, 3B, 3C, 3D divide the front and rear on the device body 2 that four area arrangement are arranged on electronic component mounting apparatus 1.The configuration numbering of assembly supply device 3A (the configuration numbering of parts feed unit) is No. 100 platforms, the configuration numbering of assembly supply device 3B is No. 200 platforms, the configuration numbering of assembly supply device 3C is No. 300 platforms, and the configuration numbering of assembly supply device 3D is No. 400 platforms.
Each assembly supply device 3A, 3B, 3C, 3D constitutes: be disposed with a plurality of parts feed units 5 at the feedway pedestal as the transport platform (カ one ト platform) of erecting bed, use connector (not shown) to be configured in removably on the described device body 2, the leading section of parts supply side is towards the transfer path as the printed base plate P of substrate, if pull down this connector and pull handle, then can move by the castor that is arranged on lower surface.
And, each assembly supply device 3A, 3B, 3C, the leading section that 3D is configured to the parts supply side is picked up zone (the taking-up zones of parts) towards mounting head 6, each parts feed unit 5 has tape-feed and cover strip mechanism for stripping, utilize the cover strip mechanism for stripping to peel off cover strip, the parts that are enclosed in the incorporating section of carrier band are supplied with to parts absorption extracting position successively, take out this parts by the adsorption mouth 11 as keeper described later from leading section, described tape-feed utilization is carried and is made the gear teeth be embedded in the conveying that is arranged on the perforation on the containing belt across predetermined distance with motor to rotate with predetermined angular with sprocket wheel, make containing belt be transported to off and on the parts absorption extracting position of parts, the state that described containing belt is equipped on freely to be wrapped in rotation on the supply roll of described transport platform is emitted successively; Described cover strip mechanism for stripping is peeled off cover strip from carrier band by peeling off with the driving of motor in front of the absorption extracting position.
And at the assembly supply device 3B of front side, the assembly supply device 3A of 3D and inboard between the 3C, is provided with two the supply conveyers, the location division 8 that consist of substrate transfer mechanism, and 8(has conveyer) and discharge conveyer.Each printed base plate P that each described supply conveyer will be accepted from the upstream is sent to each described location division 8, each substrate P is positioned by detent mechanism (not shown) in each described location division 8, after each the substrate P upper mounting component that has been positioned, discharge conveyer to each and transmit, then be sent to the downstream device.Need to prove, utilize described detent mechanism, the direction all around (in-plane) and above-below direction (vertical direction) are upper to be positioned printed base plate P.
On each beam 10 that utilizes the Y-axis drive motor to move to Y-direction along guide rail 9, being provided with and utilizing the X-axis drive motor is the mounting head 6 that directions X moves to long side direction, is provided with a plurality of adsorption mouth 11 in this mounting head 6.Be equipped with the upper lower shaft drive motor that described adsorption mouth 11 is moved up and down in described mounting head 6, and be equipped with and make described adsorption mouth 11 around the θ of vertical axis revolving axle drive motor.Thereby the adsorption mouth 11 of mounting head 6 can move to directions X and Y-direction, and can be around vertical axis revolving, and can move up and down.
In Fig. 2, Reference numeral 20 be from oblique upper to being installed in a plurality of illuminating lamps of the LED element 21 irradiating ultraviolet light UV on the described printed base plate P, the length of long part of the configuration space of these a plurality of illuminating lamps when overlooking described LED element 21.A plurality of these illuminating lamps 20 can be configured to two row in described mounting head 6 across described interval, list one that to dispose 20 groups of the illuminating lamps of a plurality of illuminating lamps 20, two row across predetermined distance mutually opposed.In addition, a plurality of these illuminating lamps 20 also can keep predetermined distance to be set to ring-type with the described circumference that is spaced apart diameter.
Reference numeral 22 is mounted in the lens barrel of the lower surface of described substrate identification camera 19, and internal configurations is useful on the lens 23 that reflection image carried out imaging.Reference numeral 24 is filters, and its light reflection ultraviolet UV and ultraviolet light UV is seen through blocks thus ultraviolet light UV and avoids this ultraviolet light to incide the shooting face of described substrate identification camera 19, and this filter 24 is installed on the described mounting head 6.
This filter 24 is configured on the described mounting head 6, and when on the described LED element 21 that will be radiated at from the ultraviolet light UV of described illuminating lamp 20 on the described printed base plate P, this filter 24 is between this LED element 21 and described substrate identification camera 19.Shown in dotted line, described lens 23 and described substrate that this filter 24 also can be configured in the described lens barrel are identified between the camera 19.
When the ultraviolet light UV from described illuminating lamp 20 shines described LED element 21 on the described printed base plate P, send the light that visible light VL(people's naked eyes can be seen from the fluorophor 21A as luminous element of described LED element 21 upper surfaces, wavelength is from 330nm to 780nm), and from other part light reflection ultraviolets UV except fluorophor 21A.Need to prove that in the present embodiment, described fluorophor 21A is circular, but also can be rectangle or other shapes when overlooking.
Thereby the described filter 24 between described substrate identification camera 19 and printed base plate P blocks ultraviolet light, only incides the shooting face of described substrate identification camera 19 via described lens 23 from the visible light of described fluorophor 21A.Consequently, only have fluorophor (light-emitting area) 21A of described LED element 21 clearly to be photographed, thereby only have the position of this fluorophor 21A part to be identified by described recognition process unit.
At this, the installation action of simple declaration parts (electronic unit).Described printed base plate P is sent to location division 8 and is positioned and fixes via supplying with conveyer from upstream device, mounting head 6 moves according to the installation data corresponding to erection sequence, and the adsorption mouth 11 corresponding with the variety of components of electronic unit taken out the electronic unit that will install from parts feed unit 5 absorption of regulation.
Be described in detail as follows.If parts are described LED element 21, then the adsorption mouth 11 of mounting head 6 moves to the position of parts feed unit 5 tops of taking in the electronic unit that will install according to erection sequence, the Y-axis drive motor drives and makes beam 10 mobile in Y-direction, the X-axis drive motor drives and makes mounting head 6 mobile at directions X, because being in by carrying with motor and peeling off with the motor driving, the parts feed unit 5 of regulation make described LED element 21 adsorb the state that extracting position is removed from parts, the described adsorption mouth 11 of regulation is descended therefore upper lower shaft drive motor and described LED element 21 is taken out in absorption, and mounting head 6 is risen.
Then, to take out other electronic units with other adsorption mouth 11 of mounting head 6 from parts feed unit 5 with above-mentioned same mode.
Then, described adsorption mouth 11 moves, assigned position on the printed base plate P that is positioned in location division 8 is installed described LED element 21 and other electronic units, in the moving process of this mounting head 6, when mounting head 6 moves and during through the top position of component identification camera 12, takes described LED element 21 grades (flight is identified) that absorption remains in adsorption mouth 11 with component identification camera 12.
Then, recognition process unit carries out identifying processing based on this shooting results in XY direction and the anglec of rotation, identification is adsorbed the degree of misalignment of relative this adsorption mouth 11 such as described LED element 21 grades of mouth 11 absorption maintenances, then drive Y-axis drive motor and X-axis drive motor, will keep the adsorption mouth 11 of described LED element 21 grades to move to printed base plate P.Before described LED element 21 grades were installed to printed base plate P, substrate identification camera 19 was taken the identification mark that is arranged on the printed base plate P, and carries out identifying processing by recognition process unit, thereby grasps the position of printed base plate P.
Thereby, on the basis of the installation coordinate of installation data in conjunction with the position recognition result of printed base plate P and the location recognition result of described LED element 21, by control device Correction and Control Y-axis drive motor, X-axis drive motor and θ axle drive motor, on one side the adsorption mouth 11 of each mounting head 6 is revised dislocation, on one side each described LED element 21 grade is installed on the assigned position on the printed base plate P.
Printed base plate P install comprise LED element 21 all parts (electronic unit) afterwards, discharge conveyer from each location division 8 to each and transmit, then the side device transmits downstream.
In addition, downstream at this electronic component mounting apparatus 1, consisting of has the parts hookup wire that has disposed identical electronic component mounting apparatus 1, the following describes the diffusion of described light is installed on the described printed base plate P with lens 25, be installed in the action of the LED element 21 on the described printed base plate P with covering as above-mentioned.
That is, 11 absorption of described adsorption mouth take out the parts absorption extracting position that supplies to described parts feed unit 5 described light diffusion with lens 25(with reference to Fig. 3).Then, make described substrate identification camera 19 move to the top that is installed in the LED element 21 on the described printed base plate P, light described illuminating lamp 20, ultraviolet light UV is radiated on the described LED element 21 on the described printed base plate P.
Like this, send visible light from the fluorophor 21A of described LED element 21 upper surfaces, and from other part light reflection ultraviolets UV.Thereby, utilize described filter 24 to reflect from the ultraviolet light UV of described other part reflections downwards, so that this ultraviolet light UV is blocked, only incide the shooting face (with reference to Fig. 2) of described substrate identification camera 19 via described lens 23 from the visible light of described fluorophor 21A.Consequently, only have fluorophor (light-emitting area) 21A of described LED element 21 clearly to be photographed, thereby only have the position of this fluorophor 21A part to be identified by described recognition process unit.
Thereby, based on this recognition result, described mounting head 6 and described adsorption mouth 11 are moved, such as Fig. 4 (A) with (B), described light diffusion can be installed as at described printed base plate P with lens 25: so that as optical axis CL with the center of the described fluorophor 25A consistent state of described light diffusion with the central axis of lens 25, cover described LED element 21 so that described LED element 21 is accommodated in the 25A of incorporating section from the top.
Embodiments of the present invention have been described more than, to those skilled in the art, can have obtained multiple alternative or revise or be out of shape based on above-mentioned explanation that the present invention comprises described multiple alternative, correction or distortion in the scope that does not break away from purport.
Claims (2)
1. apparatus for mounting component, utilization is arranged on the part holders on the mounting head, the light diffusion of the light that will send for diffusion LED element is installed in substrate with lens, be installed in the described LED element with fluorophor on the described substrate with covering, this apparatus for mounting component is characterised in that, is provided with:
Illuminating lamp, it is to the described LED element irradiating ultraviolet light that is installed on the described substrate;
Camera, it is installed on the described mounting head;
Filter, it is installed in and is used for blocking ultraviolet light on the described mounting head;
When lighting described illuminating lamp and shine described ultraviolet light to the described LED element on the described substrate, send visible light from the described fluorophor of described LED element upper surface, and reflect described ultraviolet light from other parts, utilize described filter to block from the described ultraviolet light of described other part reflections, only make the described visible light from described fluorophor incide described camera.
2. apparatus for mounting component as claimed in claim 1 is characterized in that, described camera is the substrate identification camera of taking the substrate identification mark that is arranged on the described substrate for the position of identifying described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011215557A JP5566359B2 (en) | 2011-09-29 | 2011-09-29 | Component mounting device |
| JP2011-215557 | 2011-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103079392A true CN103079392A (en) | 2013-05-01 |
| CN103079392B CN103079392B (en) | 2016-05-11 |
Family
ID=48155757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210369549.9A Active CN103079392B (en) | 2011-09-29 | 2012-09-27 | Apparatus for mounting component |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5566359B2 (en) |
| KR (1) | KR101562692B1 (en) |
| CN (1) | CN103079392B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104488366A (en) * | 2013-02-28 | 2015-04-01 | Ab微电子有限公司 | Placement method for circuit carrier and circuit carrier |
| CN105283064A (en) * | 2014-07-04 | 2016-01-27 | 韩华泰科株式会社 | Strip mounting equipment |
| CN109287110A (en) * | 2017-07-20 | 2019-01-29 | 日本梅克特隆株式会社 | Substrate position identification device, position identification processing unit (plant) and manufacture of substrates |
| US10634325B2 (en) | 2014-08-04 | 2020-04-28 | Fuji Corporation | Mounting device |
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| JP6259274B2 (en) * | 2012-12-11 | 2018-01-10 | ヤマハ発動機株式会社 | Component mounting device |
| JP6190172B2 (en) * | 2013-06-12 | 2017-08-30 | ヤマハ発動機株式会社 | Component mounting device |
| KR101497919B1 (en) * | 2013-07-16 | 2015-03-11 | 미래산업 주식회사 | Apparatus for Obtaining Mounting Coordinate, Mounter, and Method for Mounting Lens |
| JP5903563B2 (en) * | 2013-08-19 | 2016-04-13 | パナソニックＩｐマネジメント株式会社 | Component mounting equipment |
| JP6450923B2 (en) * | 2013-12-20 | 2019-01-16 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting system, electronic component mounting method, and electronic component mounting apparatus |
| JP6263028B2 (en) * | 2013-12-27 | 2018-01-17 | ヤマハ発動機株式会社 | Component mounting device |
| DE102014101901B4 (en) * | 2014-02-14 | 2015-10-15 | Asm Assembly Systems Gmbh & Co. Kg | Optical measurement of a component with structural features present on opposite sides |
| DE102014210654B4 (en) | 2014-06-04 | 2023-08-31 | Automotive Lighting Reutlingen Gmbh | Motor vehicle headlamp comprising an SMD semiconductor light source device on a circuit board |
| AT516638A1 (en) * | 2014-12-17 | 2016-07-15 | A B Mikroelektronik Ges Mit Beschränkter Haftung | Method for producing a circuit carrier and circuit carrier |
| AT517259B1 (en) | 2015-06-09 | 2020-01-15 | Zkw Group Gmbh | Process for the exact placement of a circuit carrier |
| WO2020070809A1 (en) * | 2018-10-02 | 2020-04-09 | 株式会社Ｆｕｊｉ | Work machine |
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| JP4797081B2 (en) * | 2009-04-10 | 2011-10-19 | シークス株式会社 | Mounting method of lens parts |
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- 2011-09-29 JP JP2011215557A patent/JP5566359B2/en active Active
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- 2012-09-28 KR KR1020120109039A patent/KR101562692B1/en active IP Right Grant
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| US5608642A (en) * | 1993-12-29 | 1997-03-04 | Yamaha Hatsudoki Kabushiki Kaisha | Component recognition method and device |
| CN1332843A (en) * | 1998-12-29 | 2002-01-23 | 美国拜尔公司 | In-line process for monitoring binder dosage and distribution on surface and apparatus useful therefor |
| CN201903509U (en) * | 2010-12-08 | 2011-07-20 | 昆山琉明光电有限公司 | LED (light emitting diode) inspecting device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104488366A (en) * | 2013-02-28 | 2015-04-01 | Ab微电子有限公司 | Placement method for circuit carrier and circuit carrier |
| US10217675B2 (en) | 2013-02-28 | 2019-02-26 | A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Placement method for circuit carrier and circuit carrier |
| US10672672B2 (en) | 2013-02-28 | 2020-06-02 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Placement method for circuit carrier and circuit carrier |
| US10991632B2 (en) | 2013-02-28 | 2021-04-27 | Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung | Assembly process for circuit carrier and circuit carrier |
| CN105283064A (en) * | 2014-07-04 | 2016-01-27 | 韩华泰科株式会社 | Strip mounting equipment |
| CN105283064B (en) * | 2014-07-04 | 2018-03-27 | 韩华泰科株式会社 | Band mounting device |
| US10634325B2 (en) | 2014-08-04 | 2020-04-28 | Fuji Corporation | Mounting device |
| CN109287110A (en) * | 2017-07-20 | 2019-01-29 | 日本梅克特隆株式会社 | Substrate position identification device, position identification processing unit (plant) and manufacture of substrates |
| CN109287110B (en) * | 2017-07-20 | 2021-05-11 | 日本梅克特隆株式会社 | Substrate position recognition device, position recognition processing device, and substrate manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5566359B2 (en) | 2014-08-06 |
| CN103079392B (en) | 2016-05-11 |
| JP2013077648A (en) | 2013-04-25 |
| KR20130035235A (en) | 2013-04-08 |
| KR101562692B1 (en) | 2015-10-22 |
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Owner name: YAMAHA MOTOR CO. LTD. Free format text: FORMER OWNER: HITACHI HIGH TECH INSTR CO., LTD. Effective date: 20150402 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20150402 Address after: Shizuoka Applicant after: Yamaha Motor Co., Ltd. Address before: Saitama Prefecture, Japan Applicant before: Hitachi High Tech Instr Co., Ltd. |
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