CN102955976A - Fragile anti-fake RFID (Radio Frequency Identification) etched electronic tag and manufacturing process thereof - Google Patents
Fragile anti-fake RFID (Radio Frequency Identification) etched electronic tag and manufacturing process thereof Download PDFInfo
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- CN102955976A CN102955976A CN2012100079527A CN201210007952A CN102955976A CN 102955976 A CN102955976 A CN 102955976A CN 2012100079527 A CN2012100079527 A CN 2012100079527A CN 201210007952 A CN201210007952 A CN 201210007952A CN 102955976 A CN102955976 A CN 102955976A
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Abstract
The invention discloses a fragile anti-fake RFID (Radio Frequency Identification) etched electronic tag and a manufacturing process of the fragile anti-fake RFID etched electronic tag. The electronic tag comprises a bearing substrate, a first adhesive layer, an etched layer, an RFID chip, a second adhesive layer and a fragile paper layer, wherein the first adhesive layer is arranged between the bearing substrate and the etched layer; the etched layer is made of copper foil or aluminum foil through an etching process; a chip component is formed by the bearing substrate, the first adhesive layer, the etched layer and the RFID chip; the fragile paper layer is bonded on the etching layer through the second adhesive layer; and the adhesiveness of the second adhesive layer is stronger than the adhesiveness of the first adhesive layer. The manufacturing process comprises the following steps of: forming an etching antenna, wherein the tolerance of the etching precision of the etching antenna is +/-0.02mm and/or the minimum distance between end points is less than or equal to 0.12mm; assembling the etching antenna with the RFID chip so as to be made into the chip component; taking the fragile paper layer and coating the second adhesive layer on the fragile paper layer; and compositing the second adhesive layer on the fragile paper layer with the etching antenna on the chip component so as to form the fragile anti-fake RFID etched electronic tag. The electronic tag disclosed by the invention has the characteristics of being large in damage degree when being torn and high in performance.
Description
Technical field
The present invention relates to the RFID of Internet-of-things field, relate in particular a kind of frangible false proof RFID etching electronic tag and manufacturing process thereof, it is applicable to, and various needs are false proof, the RFID application scenario of tamper, especially become the high-grade products such as vehicle management, drinks, medicine, cosmetics and trace to the source and false proof ideal chose.
Background technology
Common frangible label is take frangible printing material as fabric, and the back side scribbles extraordinary Strong Adhesive, and its fabric fracture strength is far below the tackifier adhesive power; When uncovering after frangible label is sticked base material, the random fracture of material shows that the packing of product was opened, and can't restore again.But common frangible label mainly is to be made of the bar code that prints, and its information storage amount seldom and needs scanner to read one by one.
The RFID label has that volume is little, capacity is large, the life-span is long and the characteristics such as reusable, and it can support fast reading and writing, non-visual recognition, mobile identification, multiple goal identification, location and long-term follow to manage; The RFID technology combines with technology such as internet, communications, can realize item tracking and information sharing in the global range.In recent years, along with the development of the technology such as large scale integrated circuit, network service and information security, the RFID technology has entered the commercial applications stage.Because have the characteristics such as high-speed mobile object identification, multiple goal identification and contactless identification, the RFID technology demonstrates huge development potentiality and application space, is considered to one of the most rising infotech of 21 century.
At present along with country more and more payes attention to property safety, food security, drug safety etc., frangible security RFID electronic tag trace to the source with false proof above more and more important, replace common frangible label in increasing field.
But there is following defective at least the frangible false proof RFID label on the market in it:
One, the common technical scheme that adopts of existing frangible false proof RFID label, be with electrically conductive ink or metallic particles by serigraphy at the fragile paper material and above the PET base material, form printing RFID antenna, but because the printed antenna precision is low, the conductive materials resistive impedance is inconsistent, therefore can't make all the time high-quality RFID electronic tag, the scope of application is narrow;
Two, existing frangible antifalsification label often only is that part is damaged this label, namely be not fundamentally to damage this label, thereby it is inadequate to have damaged condition, and then has the poor shortcoming of antifalsification.
In view of this, the inventor has this case to produce for the defects further investigation of existing frangible security RFID electronic tag then.
Summary of the invention
The first purpose of the present invention is to provide a kind of frangible false proof RFID etching electronic tag, and electronic tag damaged condition when tearing to pieces has the poor defective of antifalsification not in the prior art to solve.
In order to reach above-mentioned purpose, solution of the present invention is:
A kind of frangible false proof RFID etching electronic tag wherein, comprising: supporting substrate, the first glue-line, etch layer, RFID chip, the second glue-line and frangible ply of paper; This first glue-line is between supporting substrate and etch layer, this etch layer is that Copper Foil or aluminium foil are through etch process and moulding, this supporting substrate, the first glue-line, etch layer and RFID chip consist of the core material assembly, this frangible ply of paper is bonded on the etch layer by the second glue-line, and the viscosity of this second glue-line is better than the viscosity of the first glue-line.
Further, on this etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
Further, this supporting substrate is selected from PI film or PET film.
Further, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
The second purpose of the present invention is to provide a kind of manufacturing process of frangible false proof RFID etching electronic tag, wherein, comprises the steps:
1., select aluminium foil or Copper Foil, and be coated with thereon behind the first glue-line and carry out compoundly with supporting substrate, and form composite base material;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil;
3., will need etched antenna pattern to make film egative film, adopt exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5., etching antenna and RFID chipset are fitted together, and make the core material assembly;
6., get frangible ply of paper, and be better than the second glue-line of the first glue-line in its one side coating viscosity; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form frangible false proof RFID etching electronic tag.
Further, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um, and this frangible ply of paper then is chosen as 30～100um.
Further, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
Further, this supporting substrate is selected from PI film or PET film.
Further, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
Further, this step 2. in moulding between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
Further, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this step etching step 4., and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
After adopting said structure, a kind of frangible false proof RFID etching electronic tag and the manufacturing process thereof that the present invention relates to, it has following beneficial effect at least:
One, because this etch layer one side is bonding with supporting substrate (then identified thing substitutes when the etching electronic tag comes into operation) by the first glue-line, opposite side passes through the second glue-line and bonding with fragile paper; In addition based on the viscosity of the second glue-line greater than the first glue-line, therefore when the illegal tear-off electronic tag of people, this frangible ply of paper can and etch layer together by tear-off, namely allow etch layer be badly deformed, like this so that whole electronic tag is damaged fully;
Two, because it has adopted supporting substrate, the first glue-line and aluminium foil or Copper Foil in making forming process, thereby guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Make thus that the circuit precision improves greatly in the present invention, thereby improved the overall performance of whole etching electronic tag.
Description of drawings
Fig. 1 is the cut-open view of a kind of frangible false proof RFID etching electronic tag that the present invention relates to;
Fig. 2 is the schematic diagram of a kind of specific embodiment of etching antenna in a kind of frangible false proof RFID etching electronic tag that the present invention relates to.
Among the figure:
Etching electronic tag 100
Supporting substrate 1 first glue-line 2
Frangible ply of paper 5.
Embodiment
In order further to explain technical scheme of the present invention, the present invention will be described in detail below by specific embodiment.
As shown in Figure 1, a kind of frangible false proof RFID etching electronic tag 100 that the present invention relates to, comprise supporting substrate 1, the first glue-line 2, etch layer 3, RFID chip (not shown), the second glue-line 4 and frangible ply of paper 5, this first glue-line 2 is between supporting substrate 1 and etch layer 3, concrete, this first glue-line 2 is selected from from polyethers modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, one or more of silica gel, thereby play on the one hand the effect that supporting substrate 1 and etch layer 3 are bonded together, also play on the other hand allowing etch layer can realize good cohesive action from different surperficial objects.
This etch layer 3 for aluminium foil or Copper Foil through the etch process moulding, and on this etch layer 3 circuit the etching accuracy tolerance ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Preferably, this supporting substrate 1 can be selected from PI film or PET film.As shown in Figure 2, it is the schematic diagram of 3 one kinds of embodiment of etch layer in this etching electronic tag 100.
This supporting substrate 1, the first glue-line 2, etch layer 3 consist of the core material assembly with the RFID chip, and this frangible ply of paper 5 is bonded on the etch layer 3 by the second glue-line 4, and the viscosity of this second glue-line 4 is better than the viscosity of the first glue-line 2.Preferably, 4 of this second glue-lines can be selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue.
Thus and since these etch layer 3 one sides by the first glue-line 2 and supporting substrate 1(when etching electronic tag 100 comes into operation then identified thing substitute) bonding, opposite side passes through the second glue-line 4 and bonding with fragile paper; In addition based on the viscosity of the second glue-line 4 greater than the first glue-line 2, therefore when the illegal tear-off electronic tag of people, this frangible ply of paper 5 can and etch layer 3 together by tear-off, namely allow etch layer 3 be badly deformed, like this so that whole electronic tag is damaged fully;
In order to allow a kind of frangible false proof RFID etching electronic tag 100 that the present invention relates to can be by fully open, the present invention also provides its manufacturing process, and the below is described in detail its first better embodiment first:
Embodiment one:
This manufacturing process comprises the steps:
1., to select thickness be the aluminium foil of 9～38um, and is coated with thereon behind the first glue-line that to be that the supporting substrate of 12～200um carries out compound with thickness, and forms composite base material;
2., on the aluminium foil of composite base material, form the photosensitive type compound substance; In the present embodiment, this photosensitive type composite material by adopting photosensitive type dry film material, it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;
3., will need etched antenna pattern to make film egative film, adopt exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna.Preferably, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this etching step, and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1, thereby provides safeguard for better etching precision;
5., etching antenna and RFID chipset are fitted together, and make the core material assembly, i.e. INLAY; Preferably, this etching antenna adopts the mode of face-down bonding to link to each other with the RFID chip;
6., get the frangible ply of paper that thickness is 30～100um, and at its one side coating the second glue-line; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form frangible false proof RFID etching electronic tag.
Need to prove, in the present embodiment, this supporting substrate can be selected from PI film or PET film; This second glue-line then can be selected one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue, thereby guarantees to have enough cohesive strengths.
Embodiment two:
In the present embodiment, the step of itself and the first embodiment is basic identical, and its difference is aluminium foil is substituted with Copper Foil.
Embodiment three:
In the present embodiment, it can adopt whole schemes of the first embodiment and the second embodiment, but it is in order to reach the purpose of enhancing productivity, 3. 2. it all improve with abovementioned steps abovementioned steps, concrete, this step 2. in moulding between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
As from the foregoing, the manufacturing process of a kind of frangible false proof RFID etching electronic tag that the present invention relates to because it has adopted supporting substrate, the first glue-line and aluminium foil or Copper Foil in making forming process, thereby has been guaranteed the implementation condition of etch process; Simultaneously owing to having adopted the mode that forms photosensitive type compound substance and exposure to realize line transitions, then again by etched technique, the like this so that etching accuracy tolerance that is formed on circuit on the etch layer on supporting substrate and the first glue-line ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.Thus the present invention compared with prior art, it also has the circuit precision and greatly improves, and has improved the overall performance of whole etching electronic tag.
Above-described embodiment and graphic and non-limiting product form of the present invention and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present invention to its suitable variation or modification of doing.
Claims (10)
1. a frangible false proof RFID etching electronic tag is characterized in that, comprising: supporting substrate, the first glue-line, etch layer, RFID chip, the second glue-line and frangible ply of paper; This first glue-line is between supporting substrate and etch layer, this etch layer is that Copper Foil or aluminium foil are through etch process and moulding, this supporting substrate, the first glue-line, etch layer and RFID chip consist of the core material assembly, this frangible ply of paper is bonded on the etch layer by the second glue-line, and the viscosity of this second glue-line is better than the viscosity of the first glue-line.
2. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1 is characterized in that, on this etch layer the etching accuracy tolerance of circuit ± 0.02mm and/or circuit end points minimum spacing≤0.12mm.
3. a kind of frangible false proof RFID etching electronic tag as claimed in claim 1 is characterized in that, this supporting substrate is selected from PI film or PET film; This second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
4. the manufacturing process of a frangible false proof RFID etching electronic tag is characterized in that, comprises the steps:
1., select aluminium foil or Copper Foil, and be coated with thereon behind the first glue-line and carry out compoundly with supporting substrate, and form composite base material;
2., form the photosensitive type compound substance at the aluminium foil of composite base material or above the Copper Foil;
3., will need etched antenna pattern to make film egative film, adopt exposure method, with the wire portion line transitions to the photosensitive type compound substance;
4., will expose that composite base material good and that post the photosensitive type compound substance develops, etching and stripping, so form the etching accuracy tolerance ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5., etching antenna and RFID chipset are fitted together, and make the core material assembly;
6., get frangible ply of paper, and be better than the second glue-line of the first glue-line in its one side coating viscosity; With etching antenna place surface recombination on the surface at the second glue-line place on the frangible ply of paper and the core material assembly and form frangible false proof RFID etching electronic tag.
5. manufacturing process as claimed in claim 4 is characterized in that, the thickness of this aluminium foil or Copper Foil is selected 9～38um, and the thickness of this supporting substrate then is chosen as 12～200um, and this frangible ply of paper then is chosen as 30～100um.
6. manufacturing process as claimed in claim 4 is characterized in that, this photosensitive type compound substance is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
7. manufacturing process as claimed in claim 4 is characterized in that, this supporting substrate is selected from PI film or PET film.
8. manufacturing process as claimed in claim 4 is characterized in that, this second glue-line is selected from one or more of Polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, dimer acid epoxy resin glue; This first glue-line is selected from one or more of polyether modified epoxy resin glue, acrylic acid modified epoxy resin glue, acrylate pressure sensitive adhesive, silica gel.
9. manufacturing process as claimed in claim 4 is characterized in that, this step 2. in moulding between photosensitive type compound substance and aluminium foil or the Copper Foil adopt volume to volume to fit, this step 3. in exposure then be that employing volume to volume exposure machine exposes.
10. manufacturing process as claimed in claim 4 is characterized in that, etching solution is 30%～35% hydrochloric acid and the water mixed liquid of hydrogen peroxide in this step etching step 4., and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210007952.7A CN102955976B (en) | 2012-01-12 | 2012-01-12 | A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210007952.7A CN102955976B (en) | 2012-01-12 | 2012-01-12 | A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof |
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| CN102955976A true CN102955976A (en) | 2013-03-06 |
| CN102955976B CN102955976B (en) | 2016-06-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676558A (en) * | 2019-11-04 | 2020-01-10 | 江苏科睿坦电子科技有限公司 | RFID local fragile tag antenna and production process thereof |
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| US6265977B1 (en) * | 1998-09-11 | 2001-07-24 | Motorola, Inc. | Radio frequency identification tag apparatus and related method |
| CN101408950A (en) * | 2007-10-11 | 2009-04-15 | 株式会社日立制作所 | RFID tag |
| CN101799882A (en) * | 2009-02-06 | 2010-08-11 | 上海中京电子标签集成技术有限公司 | High-frequency small-size radio frequency identification and manufacturing method of etching antenna thereof |
| CN202067300U (en) * | 2011-05-27 | 2011-12-07 | 温州格洛博电子有限公司 | Second-use-prevented RFID anti-counterfeiting label |
| CN202632328U (en) * | 2012-01-12 | 2012-12-26 | 厦门英诺尔电子科技股份有限公司 | Frangible anti-fake RFID etching electronic label |
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2012
- 2012-01-12 CN CN201210007952.7A patent/CN102955976B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265977B1 (en) * | 1998-09-11 | 2001-07-24 | Motorola, Inc. | Radio frequency identification tag apparatus and related method |
| CN101408950A (en) * | 2007-10-11 | 2009-04-15 | 株式会社日立制作所 | RFID tag |
| CN101799882A (en) * | 2009-02-06 | 2010-08-11 | 上海中京电子标签集成技术有限公司 | High-frequency small-size radio frequency identification and manufacturing method of etching antenna thereof |
| CN202067300U (en) * | 2011-05-27 | 2011-12-07 | 温州格洛博电子有限公司 | Second-use-prevented RFID anti-counterfeiting label |
| CN202632328U (en) * | 2012-01-12 | 2012-12-26 | 厦门英诺尔电子科技股份有限公司 | Frangible anti-fake RFID etching electronic label |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110676558A (en) * | 2019-11-04 | 2020-01-10 | 江苏科睿坦电子科技有限公司 | RFID local fragile tag antenna and production process thereof |
| CN110676558B (en) * | 2019-11-04 | 2023-08-29 | 江苏科睿坦电子科技有限公司 | RFID local fragile tag antenna and production process thereof |
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| CN102955976B (en) | 2016-06-15 |
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