CN102867891A - Method for coating fluorescent powder and light emitting diode package - Google Patents
Method for coating fluorescent powder and light emitting diode package Download PDFInfo
- Publication number
- CN102867891A CN102867891A CN2011102732528A CN201110273252A CN102867891A CN 102867891 A CN102867891 A CN 102867891A CN 2011102732528 A CN2011102732528 A CN 2011102732528A CN 201110273252 A CN201110273252 A CN 201110273252A CN 102867891 A CN102867891 A CN 102867891A
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- CN
- China
- Prior art keywords
- fluorescent material
- conductive pad
- emitting diode
- light
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000000576 coating method Methods 0.000 title claims abstract description 29
- 239000011248 coating agent Substances 0.000 title claims abstract description 28
- 239000000843 powder Substances 0.000 title claims abstract description 22
- 239000011241 protective layer Substances 0.000 claims abstract description 39
- 125000000524 functional group Chemical group 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 85
- 239000010931 gold Substances 0.000 claims description 16
- 239000003607 modifier Substances 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 239000002223 garnet Substances 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 238000003795 desorption Methods 0.000 claims description 3
- -1 mercaptan compound Chemical class 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 claims description 2
- 238000006460 hydrolysis reaction Methods 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 230000018044 dehydration Effects 0.000 claims 1
- 238000006297 dehydration reaction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000001338 self-assembly Methods 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000010799 Receptor Interactions Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
Images
Abstract
The invention provides a method for coating fluorescent powder and a light-emitting diode package, wherein the method comprises the steps of providing a light-emitting diode, wherein the light-emitting diode is provided with a conducting pad and a protective layer, the protective layer is arranged in a region outside the conducting pad, modifying core fluorescent powder to form modified fluorescent powder, the modified fluorescent powder is decorated on the core fluorescent powder and coated on the light-emitting diode, and the functional group of the modified fluorescent powder is adsorbed on the protective layer and is not adsorbed on the conducting pad to form the light-emitting diode package.
Description
Technical field
The present invention relates to a kind of light-emitting diode, relate in particular to a kind of method at light-emitting diode coating fluorescent material.
Background technology
Light-emitting diode (light-emitting diode, be called for short LED) be a kind of compound semiconductor subassembly, its mode by power conversion is light with current conversion, single light-emitting diode can only send specific photochromic light, therefore usually need to be coated with fluorescent material at light-emitting diode, it is required photochromic that the Color Conversion that by this light-emitting diode is sent becomes, and for example is coated with yellow fluorescent powder at blue light-emitting diode, the light-emitting diode that emits white light with formation.
Tradition is to utilize syringe or nozzle that fluorescent powder colloid is coated on the light-emitting diode in the method for light-emitting diode coating fluorescent material, yet this coating method is difficult to accurately control the zone of fluorescent powder coating and the thickness of fluorescent powder coating, causes not wishing on the light-emitting diode also to be covered by fluorescent material by the zone of fluorescent powder coating.
Another kind of mode then is to utilize micro-photographing process not hidden with photoresist layer by the zone that fluorescent material covers not wishing on the light-emitting diode, treats photoresist layer to be removed after the fluorescent powder coating again.Yet this mode need to increase by one little shadow step and remove to form photoresist layer, so processing procedure is comparatively complicated.
Summary of the invention
One embodiment of the invention provide a kind of method that is coated with fluorescent material, comprising: light-emitting diode is provided, has conductive pad and protective layer and be covered on the light-emitting diode, wherein protective layer is arranged at conductive pad zone in addition; Core fluorescent material is provided, core fluorescent material is carried out upgrading, form the fluorescent material of upgrading, the fluorescent material of upgrading has the functional group and modifies on core fluorescent material; And with the fluorescent powder coating of upgrading on light-emitting diode, wherein the functional group that has of the fluorescent material of upgrading is adsorbed on the protective layer, and can not be adsorbed on the conductive pad.
Another embodiment of the present invention provides a kind of method that is coated with fluorescent material, comprising: light-emitting diode is provided, and it is formed thereon to have a conductive pad; Provide surface modifier at light-emitting diode, wherein surface modifier is adsorbed on the conductive pad, and can not be adsorbed on the zone beyond the conductive pad; Painting core fluorescent material on light-emitting diode; And apply current potential to conductive pad, so that surface modifier desorption from the conductive pad.
One embodiment of the invention also provide a kind of LED package, comprising: light-emitting diode, and have conductive pad and protective layer and be covered on the light-emitting diode, wherein protective layer is arranged at conductive pad zone in addition; And the fluorescent material of upgrading is covered on the protective layer, and is not covered on the conductive pad, and wherein the fluorescent material of upgrading has the functional group and modifies on core fluorescent material.
For allow above-mentioned purpose of the present invention, feature, and advantage can become apparent, below cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A to 1C shows according to one embodiment of the invention, the generalized section of each process stage of the method for coating fluorescent material.
Fig. 1 D shows the enlarged diagram at the frame line 1D place among Figure 1B.
Fig. 2 A to 2E shows according to another embodiment of the present invention, the generalized section of each process stage of the method for coating fluorescent material.
Reference numeral:
10: substrate;
12: light-emitting diode;
14: conductive pad;
16: protective layer;
17: core fluorescent material;
18: the fluorescent material of upgrading;
19: the functional group of modification;
20: surface modifier.
Embodiment
Embodiments of the invention are to utilize the mode of molecular self-assembling (self-assembly) in the zone of light-emitting diode regulation and control fluorescent powder coating, it need to not form the photoresist layer covering at light-emitting diode and not wish by the zone of fluorescent powder coating, the conductive pad on the light-emitting diode (conductive pad) zone for example, can be so that fluorescent material can skip over the zone of not wishing by fluorescent powder coating voluntarily when coating, therefore, compared to the method for tradition at light-emitting diode coating fluorescent material, the method of embodiments of the invention can be saved the step of one micro-photographing process, effectively simplifies the coating process program of fluorescent material.
Consult Figure 1A to 1C, it shows according to one embodiment of the invention, the generalized section of each process stage of the method for coating fluorescent material.Consult Figure 1A, light-emitting diode 12 at first is provided, for example for being formed on a plurality of light-emitting diodes 12 in the substrate 10, substrate 10 can be sapphire substrates, Silicon Wafer or other semiconductor crystal wafer, and light-emitting diode 12 for example is blue light diode.Have conductive pad 14 on the surface of light-emitting diode 12, in one embodiment, conductive pad 14 can be used as N-shaped contact (contact), in addition, also has another conductive pad (not shown) at light-emitting diode 12, and it can be used as the p-type contact.The material of conductive pad 14 comprises metal, for example is gold (Au).In addition, also have protective layer 16 on light-emitting diode 12, protective layer 16 covers on conductive pad 14 zone in addition, and the material of protective layer 16 for example is silicon dioxide (SiO
2), usually can form by the long-pending mode of thermal oxidation method or Shen, protect by this light-emitting diode 12.
Then, consult Figure 1B and 1D, Figure 1B shows the fluorescent material 18 of upgrading is coated generalized section on the light-emitting diode 12 that Fig. 1 D then shows the enlarged diagram at the frame line 1D place among Figure 1B.At first, to core fluorescent material 17, for example be yellow fluorescent powder (Y
3Al
5O
12: Ce; Yttrium-aluminium-garnet is called for short YAG) or redgreenblue (RGB) fluorescent material carry out upgrading, functional group 19 is modified on core fluorescent material 17, form the fluorescent material 18 of upgrading.Then, utilize spraying process (spray coating), some glue rubbing method (dispensing) or spin-coating method (spin coating) that the fluorescent material 18 of upgrading is coated on light-emitting diode 12 chips.
The functional group 19 who modifies on core fluorescent material 17 for example is-SiCl
3,-Si (OCH
3)
3,-Si (OCH
2CH
3)
3,-CH
3,-COOH or-NH
2 Functional group 19 can with light-emitting diode 12 on protective layer 16 produce the self assembly active forces; the self assembly active force comprises hydrogen bond; π-π storehouse effect (π-π stacking interaction); co-ordinate covalent bond (coordinate covalent bond) or provider/recipient interact (adaptor/receptor interaction); the self assembly active force so that functional group 19 can be adsorbed on the protective layer 16; but functional group 19 can not produce the self assembly active force with conductive pad 14, so functional group 19 can not be adsorbed on the conductive pad 14.By modifying functional groups 19 at core fluorescent material 17, can so that the fluorescent material 18 of upgrading is arranged on the protective layer 16 voluntarily, and can not amass on conductive pad 14 in Shen.
In one embodiment, the functional group 19 who modifies on the core fluorescent material 17 is trichlorosilane base (SiCl
3), when-SiCl
3Be adsorbed in and have hydrophilic SiO
2On the protective layer 16, at first-SiCl
3Meeting and SiO
2 Protective layer 16 lip-deep aqueous vapors produce hydrolysis formation-Si (OH)
3,-Si (OH)
3Be adsorbed in SiO
2On the protective layer 16, and these-the OH key can by hydrogen bond action with on every side-the OH key produces bond, then sloughs hydrone and produces polymerization reaction, form network structure and be binding between core fluorescent material 17 and the protective layer 16.Therefore, utilization-SiCl
3 Functional group 19 modifies fluorescent material 18 in formed upgrading on the core fluorescent material 17 except being arranged in voluntarily on the protective layer 16, can also form cancellated stable monofilm, so that the fluorescent material 18 of upgrading stably is coated on SiO
2On the protective layer 16, and avoid the zone of conductive pad 14.
Consult Figure 1B to 1C; each light-emitting diode 12 of line of cut SC cutting and separating along Figure 1B; form the LED encapsulation body such as Fig. 1 C; it comprises light-emitting diode 12; conductive pad 14 and protective layer 16 are covered on the light-emitting diode 12; wherein protective layer 16 is arranged on conductive pad 14 zone in addition, and the fluorescent material 18 of upgrading is covered in protective layer 16 and the substrate 10, but can not be covered on the conductive pad 14.
Consult Fig. 2 A to 2E, it shows according to another embodiment of the present invention, the generalized section of each process stage of the method for coating fluorescent material.Consult Fig. 2 A, light-emitting diode 12 at first is provided, for example for being formed on a plurality of light-emitting diodes 12 in the substrate 10, substrate 10 can be sapphire substrates, Silicon Wafer or other semiconductor crystal wafer, and light-emitting diode 12 for example is blue light diode.Has conductive pad 14 on the surface of light-emitting diode 12, in one embodiment, conductive pad 14 can be used as N-shaped contact (contact), in addition, also has another conductive pad (not shown) in the bottom of light-emitting diode 12, it can be used as the p-type contact, and the material of conductive pad 14 comprises metal, for example is gold (Au).
Consult Fig. 2 B, provide surface modifier 20 to coat on the light-emitting diode 12, surface modifier 20 for example is mercaptan compound, and it can be adsorbed on the conductive pad 14 that is made of gold by the self assembly effect, and can not be adsorbed on conductive pad 14 zone in addition.When mercaptan compound was adsorbed on conductive pad 14 surfaces that gold makes when upper, the gold of conductive pad 14 can become the gold (Au (I)) with monovalence.
Consult Fig. 2 C, utilize spraying process (spray coating), some glue rubbing method (dispensing) or spin-coating method (spin coating) that core fluorescent material 17 is coated on the light-emitting diode 12, core fluorescent material 17 for example is yellow fluorescent powder (Y
3Al
5O
12: Ce; Yttrium-aluminium-garnet is called for short YAG) or redgreenblue (RGB) fluorescent material.Because conductive pad 14 is covered by surface modifier 20, so 17 in core fluorescent material can be coated on conductive pad 14 zone in addition the surface of covering light-emitting diode 12 chips and substrate 10.
Consult Fig. 2 D, apply the current potential of about 0.05V to conductive pad 14, so that conductive pad 14 is reduced into the gold (Au (0)) of 0 valency with the gold (Au (I)) of monovalence, this moment, surface modifier 20 can be from desorption on the conductive pad 14.
Then, consult Fig. 2 D to 2E, each light-emitting diode 12 of line of cut SC cutting and separating along Fig. 2 D, form the LED encapsulation body such as Fig. 2 E, it comprises light-emitting diode 12, conductive pad 14 is arranged on the light-emitting diode 12, and core fluorescent material 17 is covered in light-emitting diode 12 and the substrate 10, but can not be covered on the conductive pad 14.
In sum, embodiments of the invention allow the fluorescent material of upgrading be adsorbed on the protective layer, and can not be adsorbed on the conductive pad of light-emitting diode chip for backlight unit by the self assembly effect between the molecule; Perhaps allow surface modifier be adsorbed on the conductive pad, and can not be adsorbed on the zone beyond the conductive pad, so that fluorescent material can not be coated on the conductive pad, reach to save and form photoresist layer and be covered in micro-photographing process on the conductive pad, reduce the fabrication steps of LED package.
Although the present invention has disclosed preferred embodiment as above, so it is not to limit the present invention, and any those of ordinary skill in the field when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.
Claims (15)
1. method that is coated with fluorescent material comprises:
One light-emitting diode is provided, has a conductive pad and a protective layer and be covered on this light-emitting diode, wherein this protective layer is arranged at this conductive pad zone in addition;
One core fluorescent material is provided, this core fluorescent material is carried out upgrading, form the fluorescent material of a upgrading, the fluorescent material of this upgrading has a functional group and modifies on this core fluorescent material; And
On this light-emitting diode, wherein this functional group of having of the fluorescent material of this upgrading is adsorbed on this protective layer, and can not be adsorbed on this conductive pad with the fluorescent powder coating of this upgrading.
2. the method for coating fluorescent material according to claim 1, wherein this functional group of having of the fluorescent material of this upgrading comprises-SiCl
3,-Si (OCH
3)
3,-Si (OCH
2CH
3)
3,-CH
3,-COOH or-NH
2
3. the method for coating fluorescent material according to claim 2, wherein this functional group of having of the fluorescent material of this upgrading is-SiCl
3, should-SiCl
3The aqueous vapor of functional group and this protective layer produces hydrolysis, formation-Si (OH)
3The functional group also is adsorbed on this protective layer, and should-Si (OH)
3The functional group also further produces the dehydration polymerization reaction, forms a network structure and is binding between this core fluorescent material and this protective layer.
4. the method for coating fluorescent material according to claim 1, wherein this core fluorescent material comprises yellow fluorescent powder (Y
3Al
5O
12: Ce; Yttrium-aluminium-garnet is called for short YAG) or redgreenblue (RGB) fluorescent material.
5. the method for coating fluorescent material according to claim 1, wherein the material of this protective layer comprises silicon dioxide.
6. the method for coating fluorescent material according to claim 1, wherein the material of this conductive pad comprises metal, and this metal comprises gold.
7. method that is coated with fluorescent material comprises:
One light-emitting diode is provided, and it is formed thereon to have a conductive pad;
Provide a surface modifier at this light-emitting diode, wherein this surface modifier is adsorbed on this conductive pad, and can not be adsorbed on the zone beyond this conductive pad;
At this light-emitting diode coating one core fluorescent material; And
Apply a current potential to this conductive pad, so that this surface modifier desorption from this conductive pad.
8. the method for coating fluorescent material according to claim 7, wherein this surface modifier comprises mercaptan compound.
9. the method for coating fluorescent material according to claim 7, wherein the material of this conductive pad comprises metal, and this metal comprises gold.
10. LED package comprises:
One light-emitting diode has a conductive pad and a protective layer and is arranged on this light-emitting diode, and wherein this protective layer is covered in this conductive pad zone in addition; And
The fluorescent material of one upgrading is covered on this protective layer, and is not covered on this conductive pad, and wherein the fluorescent material of this upgrading has a functional group and modifies on a core fluorescent material.
11. LED package according to claim 10, wherein this functional group of having of the fluorescent material of this upgrading comprises-SiCl
3,-Si (O CH
3)
3,-Si (O CH
2CH
3)
3,-CH
3,-COOH or-NH
2
12. LED package according to claim 11, wherein this functional group of having of the fluorescent material of this upgrading is-SiCl
3, should-SiCl
3The functional group is adsorbed on this protective layer, and also produces a network structure and be binding between this core fluorescent material and this protective layer.
13. LED package according to claim 10, wherein this core fluorescent material comprises yellow fluorescent powder (Y
3Al
5O
12: Ce; Yttrium-aluminium-garnet is called for short YAG) or redgreenblue (RGB) fluorescent material.
14. LED package according to claim 10, wherein this protective layer comprises silicon dioxide layer.
15. LED package according to claim 10, wherein the material of this conductive pad comprises metal, and this metal comprises gold.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100124001A TWI506820B (en) | 2011-07-07 | 2011-07-07 | Method of coating phosphor and light emitting diode package |
| TW100124001 | 2011-07-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102867891A true CN102867891A (en) | 2013-01-09 |
| CN102867891B CN102867891B (en) | 2015-04-22 |
Family
ID=47446616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110273252.8A Active CN102867891B (en) | 2011-07-07 | 2011-09-15 | method for coating fluorescent powder and light emitting diode package |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102867891B (en) |
| TW (1) | TWI506820B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6504180B1 (en) * | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
| CN1393940A (en) * | 2001-06-27 | 2003-01-29 | 台湾光宝电子股份有限公司 | LED and its preparing process |
| US6744196B1 (en) * | 2002-12-11 | 2004-06-01 | Oriol, Inc. | Thin film LED |
| US20070215837A1 (en) * | 2006-03-16 | 2007-09-20 | Shivkumar Chiruvolu | Highly crystalline nanoscale phosphor particles and composite materials incorporating the particles |
| TW200936717A (en) * | 2008-01-22 | 2009-09-01 | Jsr Corp | Metal coat material, protecting method for metal and luminescent device |
| CN101958373A (en) * | 2009-07-14 | 2011-01-26 | 璨圆光电股份有限公司 | Light emitting diode and manufacturing method thereof |
-
2011
- 2011-07-07 TW TW100124001A patent/TWI506820B/en active
- 2011-09-15 CN CN201110273252.8A patent/CN102867891B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6504180B1 (en) * | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
| CN1393940A (en) * | 2001-06-27 | 2003-01-29 | 台湾光宝电子股份有限公司 | LED and its preparing process |
| US6744196B1 (en) * | 2002-12-11 | 2004-06-01 | Oriol, Inc. | Thin film LED |
| US20070215837A1 (en) * | 2006-03-16 | 2007-09-20 | Shivkumar Chiruvolu | Highly crystalline nanoscale phosphor particles and composite materials incorporating the particles |
| TW200936717A (en) * | 2008-01-22 | 2009-09-01 | Jsr Corp | Metal coat material, protecting method for metal and luminescent device |
| CN101958373A (en) * | 2009-07-14 | 2011-01-26 | 璨圆光电股份有限公司 | Light emitting diode and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102867891B (en) | 2015-04-22 |
| TW201304197A (en) | 2013-01-16 |
| TWI506820B (en) | 2015-11-01 |
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