CN102734494A - Solenoid valve - Google Patents

Solenoid valve Download PDF

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Publication number
CN102734494A
CN102734494A CN2012101877863A CN201210187786A CN102734494A CN 102734494 A CN102734494 A CN 102734494A CN 2012101877863 A CN2012101877863 A CN 2012101877863A CN 201210187786 A CN201210187786 A CN 201210187786A CN 102734494 A CN102734494 A CN 102734494A
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CN
China
Prior art keywords
pressure admission
mouth
semiconductor layer
high pressure
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101877863A
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Chinese (zh)
Inventor
张胜昌
康志军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Dunan Artificial Environment Co Ltd
Original Assignee
Zhejiang Dunan Artificial Environment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Dunan Artificial Environment Co Ltd filed Critical Zhejiang Dunan Artificial Environment Co Ltd
Priority to CN2012101877863A priority Critical patent/CN102734494A/en
Publication of CN102734494A publication Critical patent/CN102734494A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a solenoid valve, comprising a main valve body and a pilot valve arranged on the main valve body, wherein the pilot valve comprises an enclosure, a micro-computer electric drive part arranged in the enclosure, and a sealing cover for sealing the enclosure; a low pressure air inlet is arranged on the enclosure; an air outlet is arranged at each of two sides of the low pressure air inlet; the low pressure air inlet is communicated with the pipe S of the main valve body through a low pressure air inlet pipe; the air outlets are respectively communicated with two ends of the valve chamber of the main valve body through a switching flow-directing pipe; a high pressure air inlet is arranged on the sealing cover; the high pressure air inlet is communicated with the pipe D of the main valve body through a high pressure air inlet pipe; and the micro-computer electric drive part controls the switching of the air outlets, which are respectively communicated with the high pressure air inlet and the low pressure air inlet. Through the micro-computer drive, the solenoid valve realizes control on the pilot valve, and is low in noise, stable in action, low in power consumption and more precise to control.

Description

A kind of solenoid valve
Technical field
The present invention relates to the air-conditioning system accessory, particularly a kind of solenoid valve.
Background technique
The existing solenoid valve employing pilot valve control mode that is used for the air-conditioning system refrigeration, heats switching; The inner core iron parts of pilot valve drive small slide bowl through trailing frame and realize the action control to main valve at the connected state that moves three pores arranged side by side on the little valve seat of change on the little valve seat, have shortcomings such as noise is big, action is unstable, power consumption is big.
Summary of the invention
Problem to be solved by this invention just provides a kind of solenoid valve, and noise is little, and action is stable, and power consumption is low, controls more accurate.
In order to solve the problems of the technologies described above; The present invention adopts following technological scheme: a kind of solenoid valve; Comprise main valve body and be located at the pilot valve on the main valve body, it is characterized in that: the sealing cover that said pilot valve comprises shell, is located at the micro electronmechanical driver part in the shell and seals shell, said shell are provided with a low-pressure admission mouth; Be respectively equipped with an air outlet in low-pressure admission mouth both sides; Said low-pressure admission mouth is communicated with through the S pipe of low-pressure inlet pipe and main valve body, and said air outlet is communicated to the two ends of main valve body valve pocket respectively through the switching honeycomb duct, and said sealing cover is provided with the high pressure admission mouth; Said high pressure admission mouth is communicated with through the D pipe of high-pressure pipe and main valve body, and said micro electronmechanical driver part is controlled realization the air outlet that high pressure admission mouth and low-pressure admission mouth are communicated with is respectively switched.
Further; Said micro electronmechanical driver part comprises range upon range of preceding semiconductor layer, middle semiconductor layer and back semiconductor layer; Semiconductor layer, middle semiconductor layer and back semiconductor layer all cooperate with body seal before said; Semiconductor layer is provided with the preceding high pressure admission flow-guiding mouth of corresponding connection with said high pressure admission mouth before said; Said middle semiconductor layer is provided with the back high pressure admission flow-guiding mouth with the said preceding corresponding connection of high pressure admission flow-guiding mouth; Said back semiconductor layer be provided with the low-pressure admission flow-guiding mouth of corresponding connections of said low-pressure admission mouth and with the corresponding switching flow-guiding mouth that is communicated with in air outlet, be provided with in the high pressure admission flow-guiding mouth of said back with low-pressure admission mouth and one of them switch flow-guiding mouth connection and with after the action piece that is communicated with another one switching flow-guiding mouth of high pressure admission flow-guiding mouth.
Further; Said action piece is that semiconductor is led moving plate; Said semiconductor is led moving plate and is provided with the runner that low-pressure admission flow-guiding mouth and one of them switching flow-guiding mouth are communicated with, and said semiconductor is led moving plate and after back high pressure admission flow-guiding mouth moves laterally to the position, low-pressure admission flow-guiding mouth and another one switching flow-guiding mouth is communicated with.
Further; Said semiconductor is led moving plate and is comprised transverse sheet, montant and herring-bone form structure; The laterally slippage in the high pressure admission flow-guiding mouth of back of said transverse sheet; Said runner is located on the transverse sheet, and the part that is positioned at high pressure admission flow-guiding mouth below, back in said on the semiconductor layer is provided with the groove that supplies the montant swing, and said herring-bone form structure gets the swing of electric distortion traction montant and makes the horizontal slippage of transverse sheet.
Further, said preceding semiconductor layer, middle semiconductor layer and back semiconductor layer are carborundum plate.
Further, said micro electronmechanical driver part also comprises the power connector end that is electrically connected with preceding semiconductor layer, and said power connector end passes said sealing cover.
Further, said power connector end is conducting plate or lead-in wire.
After adopting technique scheme, the present invention has following advantage: realize pilot valve control through micom drives, noise is little, and action is stable, and power consumption is low, controls more accurate.
Description of drawings
Below in conjunction with accompanying drawing the present invention is described further:
Fig. 1 is the structural representation of an embodiment of the present invention;
Fig. 2 is the explosive view of middle pilot valve embodiment illustrated in fig. 1;
Fig. 3 is the pilot valve schematic appearance;
Fig. 4 is the structural representation of shell;
Fig. 5 is the structural representation of middle semiconductor layer;
The path situation schematic representation of solenoid valve when Fig. 6 does not switch on for pilot valve;
Fig. 7 is the path situation schematic representation of pilot valve energising rear electromagnetic valve.
Embodiment
An embodiment of the present invention shown in Fig. 1 to 5; A kind of solenoid valve; Comprise main valve body 1 and be located at the pilot valve 2 on the main valve body, the sealing cover 23 that said pilot valve comprises shell 21, is located at the micro electronmechanical driver part in the shell and seals shell, said shell are provided with a low-pressure admission mouth 211; Be respectively equipped with an air outlet 212 in low-pressure admission mouth both sides; Said low-pressure admission mouth is communicated with through the S pipe 11 of low-pressure inlet pipe 3 and main valve body, and said air outlet is communicated to the two ends of main valve body valve pocket respectively through switching honeycomb duct 4, and said sealing cover is provided with high pressure admission mouth 231; Said high pressure admission mouth is communicated with through the D pipe 12 of high-pressure pipe 5 and main valve body, and said micro electronmechanical driver part is controlled realization the air outlet that high pressure admission mouth and low-pressure admission mouth are communicated with is respectively switched.
Said micro electronmechanical driver part comprises range upon range of preceding semiconductor layer 24, middle semiconductor layer 25 and back semiconductor layer 26; Semiconductor layer, middle semiconductor layer and back semiconductor layer all cooperate with body seal before said; Semiconductor layer is provided with the preceding high pressure admission flow-guiding mouth 241 of corresponding connection with said high pressure admission mouth before said; Said middle semiconductor layer is provided with the back high pressure admission flow-guiding mouth 251 with the said preceding corresponding connection of high pressure admission flow-guiding mouth; Said back semiconductor layer be provided with the low-pressure admission flow-guiding mouth 261 of corresponding connections of said low-pressure admission mouth and with the corresponding switching flow-guiding mouth 262 that is communicated with in air outlet, be provided with in the high pressure admission flow-guiding mouth of said back with low-pressure admission mouth and one of them switch flow-guiding mouth connection and with after the action piece 27 that is communicated with another one switching flow-guiding mouth of high pressure admission flow-guiding mouth.Said action piece is that semiconductor is led moving plate; Said semiconductor is led moving plate and is provided with the runner 271 that low-pressure admission flow-guiding mouth and one of them switching flow-guiding mouth are communicated with, and said semiconductor is led moving plate and after back high pressure admission flow-guiding mouth moves laterally to the position, low-pressure admission flow-guiding mouth and another one switching flow-guiding mouth is communicated with.Said semiconductor is led moving plate and is comprised transverse sheet 272, montant 273 and herring-bone form structure 274; The laterally slippage in the high pressure admission flow-guiding mouth of back of said transverse sheet; Said runner is located on the transverse sheet; The part that is positioned at high pressure admission flow-guiding mouth below, back in said on the semiconductor layer is provided with the groove 252 that supplies the montant swing, and said herring-bone form structure gets the swing of electric distortion traction montant and makes the horizontal slippage of transverse sheet.Said micro electronmechanical driver part also comprises the power connector end 28 that is electrically connected with preceding semiconductor layer, and said power connector end passes said sealing cover.In the present embodiment, said power connector end is a conducting plate, also can adopt lead-in wire or other conductive structures.
In the foregoing description, semi-conducting material is preferably selected silicon carbide for use.Semiconductor layer, middle semiconductor layer and back semiconductor layer are carborundum plate before said.Working principle of the present invention is following: when pilot valve is not switched on; As shown in Figure 6; Fluid gets into shell from the high pressure admission mouth; And switch flow-guiding mouth and switch the end that honeycomb duct flow to the main valve body valve pocket through one of them, and this moment, the low-pressure admission flow-guiding mouth is communicated with another one switching flow-guiding mouth through runner; When pilot valve get electric after; As shown in Figure 7; Semiconductor is led the moving plate action, and the herring-bone form structure gets the swing of electric distortion traction montant and makes the horizontal slippage of transverse sheet, and the switching flow-guiding mouth that is communicated with the high pressure admission mouth before making it is communicated with the low-pressure admission flow-guiding mouth; The switching flow-guiding mouth that before is communicated with the low-pressure admission flow-guiding mouth then is communicated with the high pressure admission mouth, thereby realizes that path switches.
Except that above-mentioned preferred embodiment, the present invention also has other mode of execution, and those skilled in the art can make various changes and distortion according to the present invention, only otherwise break away from spirit of the present invention, all should belong to the defined scope of accompanying claims of the present invention.

Claims (7)

1. solenoid valve; Comprise main valve body (1) and be located at the pilot valve (2) on the main valve body; It is characterized in that: the sealing cover (23) that said pilot valve comprises shell (21), is located at the micro electronmechanical driver part in the shell and seals shell; Said shell is provided with a low-pressure admission mouth (211); Be respectively equipped with an air outlet (212) in low-pressure admission mouth both sides; Said low-pressure admission mouth is communicated with through the S pipe (11) of low-pressure inlet pipe (3) and main valve body, and said air outlet is communicated to the two ends of main valve body valve pocket respectively through switching honeycomb duct (4), and said sealing cover is provided with high pressure admission mouth (231); Said high pressure admission mouth is communicated with through the D pipe (12) of high-pressure pipe (5) and main valve body, and said micro electronmechanical driver part is controlled realization the air outlet that high pressure admission mouth and low-pressure admission mouth are communicated with is respectively switched.
2. a kind of solenoid valve according to claim 1; It is characterized in that: said micro electronmechanical driver part comprises range upon range of preceding semiconductor layer (24), middle semiconductor layer (25) and back semiconductor layer (26); Semiconductor layer, middle semiconductor layer and back semiconductor layer all cooperate with body seal before said; Semiconductor layer is provided with the preceding high pressure admission flow-guiding mouth (241) of corresponding connection with said high pressure admission mouth before said; Said middle semiconductor layer is provided with the back high pressure admission flow-guiding mouth (251) with the said preceding corresponding connection of high pressure admission flow-guiding mouth; Said back semiconductor layer be provided with the low-pressure admission flow-guiding mouth (261) of corresponding connections of said low-pressure admission mouth and with the corresponding switching flow-guiding mouth (262) that is communicated with in air outlet, be provided with in the high pressure admission flow-guiding mouth of said back with low-pressure admission mouth and one of them switch flow-guiding mouth connection and with after the action piece (27) that is communicated with another one switching flow-guiding mouth of high pressure admission flow-guiding mouth.
3. a kind of solenoid valve according to claim 2; It is characterized in that: said action piece is that semiconductor is led moving plate; Said semiconductor is led moving plate and is provided with the runner (271) that low-pressure admission flow-guiding mouth and one of them switching flow-guiding mouth are communicated with, and said semiconductor is led moving plate and after back high pressure admission flow-guiding mouth moves laterally to the position, low-pressure admission flow-guiding mouth and another one switching flow-guiding mouth is communicated with.
4. a kind of solenoid valve according to claim 3; It is characterized in that: said semiconductor is led moving plate and is comprised transverse sheet (272), montant (273) and herring-bone form structure (274); The laterally slippage in the high pressure admission flow-guiding mouth of back of said transverse sheet; Said runner is located on the transverse sheet, and the part that is positioned at high pressure admission flow-guiding mouth below, back on the said middle semiconductor layer is provided with the groove (252) that supplies the montant swing, and said herring-bone form structure receives the swing of electric distortion traction montant to make the horizontal slippage of transverse sheet.
5. according to claim 2 or 3 or 4 described a kind of solenoid valves, it is characterized in that: semiconductor layer, middle semiconductor layer and back semiconductor layer are carborundum plate before said.
6. according to claim 2 or 3 or 4 described a kind of solenoid valves, it is characterized in that: said micro electronmechanical driver part also comprises the power connector end (28) that is electrically connected with preceding semiconductor layer, and said power connector end passes said sealing cover.
7. a kind of solenoid valve according to claim 6 is characterized in that: said power connector end is conducting plate or lead-in wire.
CN2012101877863A 2012-06-05 2012-06-05 Solenoid valve Pending CN102734494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101877863A CN102734494A (en) 2012-06-05 2012-06-05 Solenoid valve

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101877863A CN102734494A (en) 2012-06-05 2012-06-05 Solenoid valve

Publications (1)

Publication Number Publication Date
CN102734494A true CN102734494A (en) 2012-10-17

Family

ID=46990527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101877863A Pending CN102734494A (en) 2012-06-05 2012-06-05 Solenoid valve

Country Status (1)

Country Link
CN (1) CN102734494A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523560B1 (en) * 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
US6761420B2 (en) * 1998-09-03 2004-07-13 Ge Novasensor Proportional micromechanical device
CN2654975Y (en) * 2003-09-27 2004-11-10 浙江三花集团有限公司 Electromagnetic flour-way reversing valve for heat pump air conditioner

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523560B1 (en) * 1998-09-03 2003-02-25 General Electric Corporation Microvalve with pressure equalization
US6761420B2 (en) * 1998-09-03 2004-07-13 Ge Novasensor Proportional micromechanical device
CN2654975Y (en) * 2003-09-27 2004-11-10 浙江三花集团有限公司 Electromagnetic flour-way reversing valve for heat pump air conditioner

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Application publication date: 20121017