CN102650385A - Light emitting diode lamp and manufacturing method thereof - Google Patents
Light emitting diode lamp and manufacturing method thereof Download PDFInfo
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- CN102650385A CN102650385A CN2012100431215A CN201210043121A CN102650385A CN 102650385 A CN102650385 A CN 102650385A CN 2012100431215 A CN2012100431215 A CN 2012100431215A CN 201210043121 A CN201210043121 A CN 201210043121A CN 102650385 A CN102650385 A CN 102650385A
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- led
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- emitting diode
- heat conduction
- bracing frame
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- 239000011247 coating layer Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
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- 238000010276 construction Methods 0.000 abstract 1
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Abstract
The invention discloses a structure of a Light Emitting Diode (LED) lamp and a manufacturing method thereof. In the construction of a Light Emitting Diode (LED) lamp, a Light Emitting Diode (LED) is designed to be closer to an inner wall of a lamp housing, thereby providing the Light Emitting Diode (LED) lamp with high brightness and high light utilization efficiency. The above-mentioned structures and methods facilitate mass production of Light Emitting Diode (LED) light fixtures.
Description
Technical field
This present invention relates to a kind of light fixture and manufacturing approach thereof, particularly relates to a kind of led lamp (light emitting diode lamp, LED lamp) and manufacturing approach thereof.
Background technology
Invent incandescent lamp (incandescent lamp) from Rob Thomas Edison, the widely-used electric power in the world throws light on, and more develops so far high brightness and durable lighting device, like fluorescent lamp (fluorescent lamp).Compared to incandescent lamp bulb, fluorescent lamp has the advantage of high efficiency and low operating temperature.Yet, contain heavy metal (mercury) in the fluorescent lamp, when discarded, be prone to environment is damaged.
Along with the development of lighting engineering, a kind of light source of more energy-conserving and environment-protective, promptly light-emitting diode light bar (light emitting diode light bar) is developed.Light emitting diode (LED) in light emitting diode (LED) the lamp bar is luminous through connect recombinate in the face electronics and hole at P-N.Compared to incandescent lamp, light emitting diode (LED) lamp bar has low consumpting power (power consumption) and long-life advantage.In addition, light emitting diode (LED) lamp bar need not use mercury and more environmental protection.
For light emitting diode (LED) lamp bar is extended to light source used in everyday (like room lighting utensil or outdoor lighting utensil); The lamp holder (socket) of light emitting diode (LED) light fixture need be designed to identical or compatible with the lamp holder of existing bulb; Make light emitting diode (LED) light fixture can directly be contained in the existing lamp socket, to improve the popular wish of using light emitting diode (LED) light fixture.Yet the performance of existing light emitting diode (LED) light fixture on the luminous uniformity still is not so good as expection and ubiquity has light utilization ratio problem of lower.
Fig. 1 is existing light emitting diode (LED) light fixture.Please with reference to Fig. 1; The existing technology of light emitting diode (LED) light fixture is that light emitting diode (LED) element design is fixed on the same plane by lamp head; Though light fixture has the effect of optically focused; But this kind prior art lighting angle is 180 degree (following) only, during as the room lighting purposes, can't replace incandescent lamp bulb.And this prior art needs the heavy metal material of operating weight, and for example aluminum material except increasing the consumption of materials on the earth, is not inconsistent the carbon reduction purpose of light emitting diode (LED) light fixture, and the too big light fixture of weight also has the safety problem that injures personnel by a crashing object usually.Fig. 2 is another existing light emitting diode (LED) light fixture; Please with reference to Fig. 2, the prior art of another kind of light emitting diode (LED) is to send the light fixture of the lighting angle of 360 degree, but this prior art is with hard base material light emitting diode (LED) to be fixed on the light fixture center; And this light emitting diode (LED) is limited by the light fixture head dimensions; Light-emitting component is away from lampshade, so luminous efficiency is low, and practicality is not good.
Summary of the invention
In view of this, the object of the present invention is to provide the structure and the manufacturing approach thereof of a kind of light emitting diode (LED) light fixture, produced light emitting diode (LED) light fixture of Using such method has the preferable luminous uniformity and higher light utilization efficiency.
A purpose more of the present invention is to provide a kind of light emitting diode (LED) light fixture, and its luminous uniformity is good and brightness is high.
For reaching above-mentioned purpose, the present invention provides a kind of light emitting diode (LED) light fixture, comprises a lamp main body, a heat conduction bracing frame and a flexible light emitting diode (LED) (LED) light source.Lamp main body comprises a lamp holder and a lampshade, and wherein lamp main body has defined a spatial accommodation.The heat conduction bracing frame is configured in this spatial accommodation and is fixed on the lamp holder.Flexible light emitting diode (LED) (LED) light source is configured in this spatial accommodation and is assembled on the heat conduction bracing frame.Flexible light emitting diode (LED) (LED) light source comprises a single flexible circuit board and a plurality of light emitting diode (LED) encapsulation.Single flexible circuit board comprises that a single bendable carrier and a plurality of conductive wires are on single bendable carrier; Wherein single bendable carrier comprises that a core is fixed on the heat conduction bracing frame top and a plurality of and divides outward extending extension from central division; Each extension bends towards a bottom of heat conduction bracing frame, and light emitting diode (LED) encapsulation is installed on the single bendable carrier and the electrical conductive wires that is connected to.
In one embodiment of this invention, the material of above-mentioned heat conduction bracing frame comprise be metal or nonmetallic.
In one embodiment of this invention, above-mentioned heat conduction bracing frame comprises a pillar and a base, and its B-C post comprises fixed part on, and base is connected to a bottom of pillar, and the core of single bendable carrier is fixed in the last fixed part of pillar.
In one embodiment of this invention, above-mentioned last fixed part is an orbicule, and each extension is along the surface of orbicule and bending.
In one embodiment of this invention; Above-mentioned single bendable carrier has an assembly hole to be positioned at core; Last fixed part is an orbicule that fixing hole is arranged, and each extension is along the surface of orbicule and bending, and retaining element is fixed in fixing hole through assembly hole.
In one embodiment of this invention, above-mentioned retaining element is a screw, and fixing hole is a screwed hole.
In one embodiment of this invention, light emitting diode (LED) light fixture comprises that also a heat conduction coating layer is overlying on the heat conduction bracing frame.
In one embodiment of this invention, light emitting diode (LED) light fixture comprises that also a constraint element ring is around in the heat conduction bracing frame and extension is tied up bundle on the heat conduction bracing frame.
In one embodiment of this invention, the ultimate range between wantonly two extensions is 1 to 3 times of minimal openings radius to lampshade.
In one embodiment of this invention; Above-mentioned single flexible circuit board also comprises a heat-conducting layer; Single bendable carrier has a front surface and a back of the body surface, and heat-conducting layer is configured on the back of the body surface, and conductive wires and light emitting diode (LED) package arrangements is on front surface.
The present invention provides the method for a kind of manufacturing light emitting diode (LED) light fixture, and comprising provides a heat conduction bracing frame; One flexible light emitting diode (LED) (LED) light source is provided; Flexible light emitting diode (LED) (LED) light source comprises a single flexible circuit board and a plurality of light emitting diode (LED) encapsulation; Single flexible circuit board comprises that a single bendable carrier and a plurality of conductive wires are on single bendable carrier; Single bendable carrier comprises that a core is fixed on the heat conduction bracing frame top and a plurality of and divides outward extending extension from central division, and each extension bends towards a bottom of heat conduction bracing frame; A plurality of light emitting diodes (LED) encapsulation is installed on the single bendable carrier and the electrical conductive wires that is connected to; The assembling core on the heat conduction bracing frame and crooked extension to be close to the heat conduction bracing frame; Flexible light emitting diode (LED) (LED) light source and heat conduction bracing frame are inserted lampshade, and after flexible light emitting diode (LED) (LED) light source and heat conduction bracing frame were inserted lampshade, wherein extension was outwardly-bent and near the inwall of lampshade; And assembling heat conductivity bracing frame and lamp are according on lamp holder.
Based on above-mentioned; In the manufacturing approach of light emitting diode of the present invention (LED) light fixture; Through earlier flexible light emitting diode (LED) (LED) light sources being loaded on the heat conduction bracing frame; Again flexible light emitting diode (LED) (LED) light source and heat conduction bracing frame are inserted lampshade, and make flexible light emitting diode (LED) (LED) light source can be comparatively near the inwall of lampshade and crooked along the inwall of lampshade.Therefore, light emitting diode (LED) light fixture made from the manufacturing approach of light emitting diode of the present invention (LED) light fixture has the higher light utilization efficiency and the preferable luminous uniformity.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended accompanying drawing to elaborate as follows.
Description of drawings
Fig. 1 is the sketch map of existing a kind of light emitting diode (LED) light fixture;
Fig. 2 is the sketch map of existing another kind of light emitting diode (LED) light fixture;
Fig. 3 is the manufacturing approach flow chart of light emitting diode (LED) light fixture of one embodiment of the invention;
Fig. 4 a-Fig. 4 c is light emitting diode (LED) the light fixture sketch map according to one embodiment of the invention;
Fig. 5 is the heat conduction bracing frame sketch map in light emitting diode (LED) light fixture according to one embodiment of the invention;
Fig. 6 is the sketch map in light emitting diode (LED) assembling according to one embodiment of the invention.
The main element symbol description
100: light emitting diode (LED) light fixture
110: lamp main body
112: lamp holder
114: lampshade
120: the heat conduction bracing frame
122: pillar
124: base
130: flexible light emitting diode (LED) (LED) light source
132: single flexible circuit board
134: light emitting diode (LED) encapsulation
140: the constraint element
110a: spatial accommodation
122a: go up fixed part
132a: single bendable carrier
132b: conductive wires
H1: assembly hole
H2: fixing hole
S100, S110, S120, S130, S140: step
C: core
D: the ultimate range between two extensions
F: retaining element
E: extension
D: the minimal openings radius of lampshade
The specific embodiment
Fig. 3 is the manufacturing approach flow chart of light emitting diode (LED) light fixture of one embodiment of the invention.Please with reference to Fig. 3, the manufacturing approach of the light emitting diode of present embodiment (LED) light fixture comprises: a heat conduction bracing frame (step S100) is provided; One flexible light emitting diode (LED) (LED) light source is provided; Flexible light emitting diode (LED) (LED) light source comprises that a single flexible circuit board and a plurality of light emitting diode (LED) encapsulation are installed on the single flexible circuit board; Wherein single flexible circuit board comprises that a single bendable carrier and a plurality of conductive wires are on single bendable carrier; Single bendable carrier comprises that a core is fixed on the heat conduction bracing frame top and a plurality of and divides outward extending extension from central division; Each extension bends towards a bottom of heat conduction bracing frame, and a plurality of light emitting diode (LED) encapsulation is installed on the single bendable carrier and the electrical conductive wires (step S110) that is connected to; Combination center part on the heat conduction bracing frame with crooked extension with near heat conduction bracing frame (step S120); Flexible light emitting diode (LED) (LED) light source and heat conduction bracing frame are inserted lampshade, and after flexible light emitting diode (LED) (LED) light source and heat conduction bracing frame were inserted lampshade, wherein extension was outwardly-bent and be close to lampshade inwall (step S130); And combination heat conduction bracing frame and lampshade (step S140) on a lamp holder.
Afterwards, light emitting diode (LED) 100 light fixtures are just accomplished to carry out the above-mentioned step of mentioning (step 100 is to step 140), and the structure of light emitting diode (LED) light fixture 100 is illustrated among Fig. 4 a-Fig. 4 c.
Refer to Fig. 4 a-Fig. 4 c, the light emitting diode of present embodiment (LED) light fixture 100 comprises a lamp main body 110, a heat conduction bracing frame 120 and a flexible light emitting diode (LED) (LED) light source 130.Lamp main body 110 comprises a lamp holder 112 and a lampshade 114, and wherein lamp main body 110 has defined a spatial accommodation 110a.The heat conduction bracing frame is joined 120 and is put in this spatial accommodation 110a and be fixed on the lamp holder 112.Flexible light emitting diode (LED) (LED) light source 130 is configured in this spatial accommodation 110a and is assembled on the heat conduction bracing frame 120.Flexible light emitting diode (LED) (LED) light source 130 comprises a single flexible circuit board 132 and a plurality of light emitting diodes (LED) encapsulation 134.Single flexible circuit board 132 comprises that a single bendable carrier 132a and a plurality of conductive wires 132b are on single bendable carrier 312a; Wherein single bendable carrier 132a comprises that a core C is fixed on the heat conduction bracing frame 120 top and a plurality ofly divides C outward extending extension E from central division; Each extension E bends towards the bottom of heat conduction bracing frame 120, and light emitting diode (LED) encapsulation 134 is installed in that single bendable carrier 132a goes up and the electrical conductive wires 132b that is connected to.
The lamp holder 112 of the lamp main body 110 of present embodiment can have different appearance and yardstick, is familiar with this technological personage usually and can selects suitable lamp holder according to the demand in the design.In addition, lampshade 114 can be any appearance forrns and yardstick.
Fig. 5 has illustrated the heat conduction bracing frame of light emitting diode (LED) light fixture in one embodiment of the invention.Refer to Fig. 4 a-Fig. 4 c and Fig. 5, heat conduction bracing frame 120 comprises a pillar 122 and a base 124, and its B-C post 122 comprises fixed part 122a on, a bottom that is connected to pillar 122 of base 124 physical properties.In the present embodiment, the last fixed part 122a of pillar 122 for example is an orbicule.Shown in Fig. 4 a-Fig. 4 c, the core C of single bendable carrier 132a is the last fixed part 122a that is fixed in pillar 122, and each extension E is along the surface of orbicule and bending.In other words, each extension E is decurved and bends towards the base 124 of heat conduction bracing frame 120.
In another embodiment of the present invention; Single bendable carrier 132a has an assembly hole H1 to be positioned at core C; The last fixed part 122a of pillar 122 is orbicules that a fixing hole H2 is arranged; Each extension E is the surface curvature along orbicule (122a), and a retaining element F is through assembly hole H1 and be fixed among the fixing hole H2.For example, retaining element F is a screw and fixing hole H2 is a screwed hole.
Outward appearance and the yardstick of noticing fixed part 122a can be familiar with this technological personage usually and be revised so that meet the inner complexion of lampshade 114 and yardstick (as Fig. 4 a-Fig. 4 c demonstration).In the present embodiment, the material of heat conduction bracing frame 120 for example is metal or nonmetallic.The material of heat conduction bracing frame 120 can be any material that thermal conductive resin is arranged.
In a preferred embodiment of the present invention, light emitting diode (LED) light fixture 100 can comprise optionally that a heat conduction coating layer (not illustrating) is overlying on the outer surface of heat conduction bracing frame 120 so that strengthen the thermal conductivity of heat conduction bracing frame 120.The above-mentioned heat conduction coating layer of mentioning can be any material that thermal conductive resin is arranged.
Refer to Fig. 4 a-Fig. 4 c, according to present embodiment, one be electrically connected to flexible light emitting diode (LED) (LED) light source 130 drive current control circuit (not illustrating) can be assemblied in other positions in 120 li of heat conduction bracing frames or the spatial accommodation 110.In addition, the drive current control circuit can through lead or other electrically conducting manners electrical be connected to flexible light emitting diode (LED) (LED) light source 130 so that control is sent to the electric current of flexible light emitting diode (LED) (LED) light source 130.More particularly, conductive wires 132b can be distributed in the end of each extension E, so flexible light emitting diode (LED) (LED) light source 130 can through the above-mentioned lead of mentioning and conductive wires 132b electrical be connected to the drive current control circuit.
Refer again to the c to Fig. 4 a-Fig. 4, the light emitting diode of present embodiment (LED) light fixture 100 can comprise optionally that a constraint element 140 is surrounded on heat conduction bracing frame 120 and extension E is tied up bundle on heat conduction bracing frame 120.More particularly, extension E is bound on the base 124 of heat conduction bracing frame 120, and constraint element 140 can be a flexible member.
Extension E tie up Shu Chengdu can mat adjustment heat conduction bracing frame 120 make better controlling with the relative position of constraint element 140.When heat conduction bracing frame 120 and flexible light emitting diode (LED) (LED) light source 130 prepared to insert lampshade 114, through with extension E to drop-down (showing) like Fig. 6, force flexible light emitting diode (LED) (LED) light source 130 near heat conduction bracing frame 120.After heat conduction bracing frame 120 and flexible light emitting diode (LED) (LED) light source 130 machines were inserted lampshade 114, through extension E is up pushed away, flexible light emitting diode (LED) (LED) light source 130 was outwardly-bent and near the inwall of lampshade 114.
In the present embodiment, after heat conduction bracing frame 120 and flexible light emitting diode (LED) (LED) light source 130 were assembled into lampshade 114, the ultimate range D between any two extension E was 1 to 3 times of minimal openings radius d to lampshade 114.
For thermal conductivity and the transmission of the heat between heat conduction bracing frame 120 and flexible light emitting diode (LED) (LED) light source 130 of strengthening flexible light emitting diode (LED) (LED) light source 130, a heat-conducting layer (not illustrating) can use in flexible light emitting diode (LED) (LED) light source 130.Particularly; Single bendable carrier 132a has a front surface and back of the body surface; Wherein heat-conducting layer can be configured on the back of the body surface of single bendable carrier 132a, and conductive wires 132b and light emitting diode (LED) encapsulation 134 is disposed on the front surface of single bendable carrier 132a.
Though disclosed the present invention in conjunction with above embodiment; Yet it is not in order to limit the present invention; Be familiar with this operator in the technical field under any; Do not breaking away from the spirit and scope of the present invention, can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (12)
1. a light emitting diode (LED) light fixture comprises:
Lamp main body comprises lamp holder and lampshade, and wherein lamp main body has defined a spatial accommodation;
The heat conduction bracing frame is configured in this spatial accommodation and is fixed on this lamp holder; And
Flexible light emitting diode (LED) (LED) light source is configured in this spatial accommodation and is assembled on this heat conduction bracing frame, and this flexible light emitting diode (LED) (LED) light source comprises:
Single flexible circuit board; It comprises that single bendable carrier and a plurality of conductive wires are on this single bendable carrier; This single bendable carrier comprises a core; Be fixed in a top and a plurality of on this heat conduction bracing frame, and this each extension bends towards a bottom of heat conduction bracing frame from the outward extending extension of this core; And
A plurality of light emitting diodes (LED) encapsulation is installed on this single bendable carrier and electrical this conductive wires that is connected to.
2. light emitting diode as claimed in claim 1 (LED) light fixture, wherein a material of this heat conduction bracing frame comprise be metal or nonmetallic.
3. light emitting diode as claimed in claim 1 (LED) light fixture, wherein this heat conduction bracing frame comprises:
Pillar comprises fixed part on; And
Base is connected to a bottom of this pillar, and what this core of this single bendable carrier was fixed in this pillar should go up fixed part.
4. light emitting diode as claimed in claim 3 (LED) light fixture, wherein should go up fixed part be an orbicule, and this each extension is along the surface of this orbicule and bending.
5. light emitting diode as claimed in claim 3 (LED) light fixture; Also comprise retaining element; Wherein this single bendable carrier has an assembly hole, is positioned at this core, and fixed part is an orbicule that fixing hole is arranged on this; This each extension is along the surface of this orbicule and bending, and this retaining element is fixed in this fixing hole through this assembly hole.
6. light emitting diode as claimed in claim 5 (LED) light fixture, wherein this retaining element is a screw, and this fixing hole is a screwed hole.
7. light emitting diode as claimed in claim 1 (LED) light fixture also comprises the heat conduction coating layer, is overlying on this heat conduction bracing frame.
8. light emitting diode as claimed in claim 1 (LED) light fixture also comprises the constraint element, is surrounded on this heat conduction bracing frame and this extension is tied up bundle on this heat conduction bracing frame.
9. light emitting diode as claimed in claim 1 (LED) light fixture, the ultimate range between wherein wantonly two extensions are 1 to 3 times of minimal openings radiuses to this lampshade.
10. light emitting diode as claimed in claim 1 (LED) light fixture; Wherein this single flexible circuit board also comprises heat-conducting layer; This single bendable carrier has front surface and back of the body surface; This heat-conducting layer is configured on this back of the body surface, and this conductive wires and this light emitting diode (LED) package arrangements are on this front surface.
11. a method of making light emitting diode (LED) light fixture comprises:
One heat conduction bracing frame is provided;
One flexible light emitting diode (LED) (LED) light source is provided, and this flexible light emitting diode (LED) (LED) light source comprises:
Single flexible circuit board; Comprise that single bendable carrier and a plurality of conductive wires are on this single bendable carrier; This single bendable carrier comprises that a core is fixed in a top and a plurality of from the outward extending extension of this core on this heat conduction bracing frame, and this each extension bends towards a bottom of heat conduction bracing frame; And
A plurality of light emitting diodes (LED) encapsulation is installed on this single bendable carrier and is electrically connected to this conductive wires;
Assemble this core on this heat conduction bracing frame and crooked this extension be close to this heat conduction bracing frame;
This flexible light emitting diode (LED) (LED) light source and this heat conduction bracing frame are inserted this lampshade, and after this flexible light emitting diode (LED) (LED) light source and this heat conduction bracing frame were inserted this lampshade, wherein this extension was outwardly-bent and near the inwall of this lampshade; And
Assembling this heat conduction bracing frame shines on this lamp holder with this lamp.
12. the method for manufacturing light emitting diode as claimed in claim 11 (LED) light fixture is wherein outwardly-bent at this extension and behind the inwall near this lampshade, the ultimate range between wantonly two extensions is 1 to 3 times of minimal openings radius to this lampshade.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100106503 | 2011-02-25 | ||
| TW100106503 | 2011-02-25 | ||
| TW100149596 | 2011-12-29 | ||
| TW100149596A TW201241352A (en) | 2010-12-31 | 2011-12-29 | Light emitting diode lamp and method for fabricating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102650385A true CN102650385A (en) | 2012-08-29 |
Family
ID=46692463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100431215A Pending CN102650385A (en) | 2011-02-25 | 2012-02-23 | Light emitting diode lamp and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN102650385A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103032734A (en) * | 2012-12-06 | 2013-04-10 | 中山市美耐特光电有限公司 | LED (Light-Emitting Diode) lamp bulb |
| CN104295945A (en) * | 2013-07-18 | 2015-01-21 | 王芳 | An omnidirectional light bulb and manufacture method thereof |
| CN105371140A (en) * | 2014-08-29 | 2016-03-02 | 欧普照明股份有限公司 | LED light source module and LED lamp with same |
| CN105465635A (en) * | 2016-01-07 | 2016-04-06 | 莆田康布斯光电科技有限公司 | LED (Light Emitting Diode) lamp |
| CN111640736A (en) * | 2013-09-11 | 2020-09-08 | 晶元光电股份有限公司 | Flexible light emitting diode assembly and light emitting diode bulb |
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| US20030031015A1 (en) * | 2001-08-13 | 2003-02-13 | Atex Co. Ltd. | LED bulb |
| US20060193130A1 (en) * | 2005-02-28 | 2006-08-31 | Kazuo Ishibashi | LED lighting system |
| CN200940796Y (en) * | 2006-08-25 | 2007-08-29 | 黄正朝 | LED bulb |
| JP2010282986A (en) * | 2010-09-30 | 2010-12-16 | Toshiba Lighting & Technology Corp | Light emitting element lamp, and luminaire |
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2012
- 2012-02-23 CN CN2012100431215A patent/CN102650385A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030031015A1 (en) * | 2001-08-13 | 2003-02-13 | Atex Co. Ltd. | LED bulb |
| US20060193130A1 (en) * | 2005-02-28 | 2006-08-31 | Kazuo Ishibashi | LED lighting system |
| CN200940796Y (en) * | 2006-08-25 | 2007-08-29 | 黄正朝 | LED bulb |
| JP2010282986A (en) * | 2010-09-30 | 2010-12-16 | Toshiba Lighting & Technology Corp | Light emitting element lamp, and luminaire |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103032734A (en) * | 2012-12-06 | 2013-04-10 | 中山市美耐特光电有限公司 | LED (Light-Emitting Diode) lamp bulb |
| CN104295945A (en) * | 2013-07-18 | 2015-01-21 | 王芳 | An omnidirectional light bulb and manufacture method thereof |
| CN111640736A (en) * | 2013-09-11 | 2020-09-08 | 晶元光电股份有限公司 | Flexible light emitting diode assembly and light emitting diode bulb |
| CN111640736B (en) * | 2013-09-11 | 2022-07-15 | 晶元光电股份有限公司 | Flexible light emitting diode assembly and light emitting diode bulb |
| CN105371140A (en) * | 2014-08-29 | 2016-03-02 | 欧普照明股份有限公司 | LED light source module and LED lamp with same |
| CN105371140B (en) * | 2014-08-29 | 2018-06-22 | 欧普照明股份有限公司 | A kind of LED light source module and the LED light with the LED light source module |
| CN105465635A (en) * | 2016-01-07 | 2016-04-06 | 莆田康布斯光电科技有限公司 | LED (Light Emitting Diode) lamp |
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Application publication date: 20120829 |