CN102088834B - Heat dissipation device for electronic circuit module - Google Patents
Heat dissipation device for electronic circuit module Download PDFInfo
- Publication number
- CN102088834B CN102088834B CN2009102469376A CN200910246937A CN102088834B CN 102088834 B CN102088834 B CN 102088834B CN 2009102469376 A CN2009102469376 A CN 2009102469376A CN 200910246937 A CN200910246937 A CN 200910246937A CN 102088834 B CN102088834 B CN 102088834B
- Authority
- CN
- China
- Prior art keywords
- housing
- substrate
- contact pad
- heat
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention relates to a heat dissipation device for an electronic circuit module, comprising a substrate, a heat dissipation assembly and a casing. The casing is of a hollow structure and a runner is formed inside the casing, when a heat source is generated during the running of an electronic component of the substrate, heat is conducted to the heat dissipation assembly by the heat source and then conducted out of the device by generating heat convection in the casing when the heat passes through the runner. By virtue of the heat dissipation device, the electronic circuit module has a better heat dissipation effect.
Description
Technical field
The present invention relates to the heat abstractor of electronic circuit module, be meant a kind of heat abstractor of the electronic circuit module that dispels the heat with heat conduction and thermal convection mode especially.
Background technology
Present electronic circuit module structure is to dispel the heat with heat abstractors such as fan, radiating fin, heat pipe or water-cooling systems haply; Yet for miniaturized electric subset especially Portable data memory device, these heat sink conceptions obviously are that volume is excessive and cost is too high.In addition, because the memory capacity of Portable data memory device or additional function all significantly promote, the heat dissipation problem that the thing followed is produced when each forms the assembly running is unavoidable in recent years.As shown in Figure 1; Be TaiWan, China patent announcement number M314875 number disclosed a kind of heat abstractor; It is the heat dissipation design mode of present Portable data memory device such as carry-on dish; Be to be installed in circuit board 1 between upper casing spare 2 and the lower shell 3, dispel the heat through the louvre 4 that is arranged on lower shell 3.Yet this radiating mode can not reach better heat radiating effect, so the heat dissipation problem of miniaturized electric subset is instant problem really.In addition, skill in the past also can't let the user when using this product, can obtain extra enjoyment, can't let the user that novel experience is arranged when using this product.
Summary of the invention
To the problems referred to above, main purpose of the present invention is to provide a kind of heat abstractor of electronic circuit module, and it can make electronic circuit module have better radiating effect.
Another object of the present invention is to provide a kind of heat abstractor of electronic circuit module, its taste that can distribute fragrance comes out, and lets the user when using product, have the experience of novelty, entertaining, improves the surcharge of product.
For achieving the above object, the present invention adopts following technical scheme to realize: a kind of heat abstractor of electronic circuit module is characterized in that comprising: a substrate 10; It comprises at least one electronic building brick 11; Wherein, said substrate 10 has an inner surface 101 and an outer surface 102, and an end of said outer surface 102 has at least one outer contact pad 1021; The other end has at least one touch contact pad 1022, and said outer contact pad 1021 and said touch contact pad 1022 are for being electrically connected; One radiating subassembly 20; It comprises a plurality of heat carriers 21; Wherein said radiating subassembly 20 is arranged at the end face that said substrate 10 has each said touch contact pad 1022; And each said heat carrier 21 each said touch contact pad 1022 of contact, each said heat carrier 21 has at least one non-flat forms structure 211 in addition; One housing 30; It comprises a protecgulum 31 and a bottom 32; Wherein said housing 30 is a hollow structure; It respectively is formed with an opening 33,34 in two ends, and said protecgulum 31 and said bottom 32 are assembled in the said opening 33,34 of said housing 30 2 ends, the said housing 30 inner runners 35 that form respectively; Wherein said substrate is located in the said housing 30 for 10 groups, and said outer contact pad 1021 penetrates said protecgulum 31 and is revealed in outside the said housing 30; When each said electronic building brick 11 operation of said substrate 10 produced thermal source, said thermal source was conducted heat on each said heat carrier 21 by touch contact pad 1022, made housing 30 interior generation thermal convections that thermal conductance is gone out said device through runner 35 again.
The present invention can also adopt another technical scheme: a kind of heat abstractor of electronic circuit module; It is characterized in that comprising: at least one substrate 10, it comprises at least one electronic building brick 11, wherein; Said substrate 10 has an inner surface 101 and an outer surface 102; One end of said outer surface 102 has at least one outer contact pad 1021, and the other end has at least one touch contact pad 1022, and said outer contact pad 1021 and said touch contact pad 1022 are for being electrically connected; At least one radiating subassembly 20; It comprises a plurality of heat carriers 21; Wherein said radiating subassembly 20 is arranged at the end face that said substrate 10 has each said touch contact pad 1022; And each said heat carrier 21 each said touch contact pad 1022 of contact, each said heat carrier 21 has at least one non-flat forms structure 211 in addition, and it contacts with each said outer contact pad 1021 ' of another substrate 10 '; At least one housing 30; It comprises a protecgulum 31 and a bottom 32; Wherein said housing 30 is a hollow structure; It respectively is formed with an opening 33,34 in two ends, and said protecgulum 31 and said bottom 32 are assembled in the said opening 33,34 of said housing 30 2 ends, the said housing 30 inner runners 35 that form respectively; Wherein said substrate 10 is mounted in the said housing 30, and said outer contact pad 1021 penetrates said protecgulum 31 and be emerging in outside the said housing 30, and said in addition bottom 32 has the groove of wearing 322; The touch contact pad 1022 ' of wearing groove 322 ' and another substrate 10 ' that the outer contact pad 1021 of the said substrate 10 in the housing 30 penetrates another housing 30 ' bottom 32 ' electrically contacts through each said heat carrier 21 ' of said radiating subassembly 20 '; When each said substrate 10, each said electronic building brick 11 of 10 ', when 11 ' operation produces thermal source; Its thermal source can through each said outer contact pad 1021,1021 ' or each said touch contact pad 1022,1022 ' conduct heat on each said heat carrier 21,21 ', make through each said runner 35,35 ' again to produce thermal convection in each said housing 30,30 ' thermal conductance is gone out said assembled component.
The present invention also provides the third technical scheme: a kind of heat abstractor of electronic circuit module; It is characterized in that comprising: at least one substrate 10, it comprises at least one electronic building brick 11, wherein; Said substrate 10 has an inner surface 101 and an outer surface 102; One end of said outer surface 102 has at least one outer contact pad 1021, and the other end has at least one touch contact pad 1022, and said outer contact pad 1021 and said touch contact pad 1022 are for being electrically connected; At least one radiating subassembly 20; It comprises a plurality of heat carriers 21; Wherein said radiating subassembly 20 is arranged at the end face that said substrate 10 has each said touch contact pad 1022; And each said heat carrier 21 is contacted with each said touch contact pad 1022, and each said heat carrier 21 has at least one non-flat forms structure 211 in addition, and it contacts with each said outer contact pad 1021 ' of another substrate 10 '; At least one housing 30; It comprises a protecgulum 31 and a bottom 32; Wherein said housing 30 is a hollow structure; It respectively is formed with an opening 33,34 in two ends, and said protecgulum 31 and said bottom 32 are assembled in the said opening 33,34 of said housing 30 2 ends, the said housing 30 inner runners 35 that form respectively; Wherein said substrate 10 is mounted in the said housing 30, and said outer contact pad 1021 penetrates said protecgulum 31 and be revealed in outside the said housing 30, and said in addition bottom 32 has the groove of wearing 322; One terminal substrate 40, it comprises at least one electronic building brick 41, and wherein, said terminal substrate 40 has an inner surface 401 and an outer surface 402, and an end of said outer surface 402 has at least one outer contact pad 4021; One heat abstractor 50, it is electrically connected on said terminal substrate 40; One terminal housing 60; It comprises a protecgulum 61 and a bottom 62; Wherein said terminal housing 60 is a hollow structure; It respectively is formed with an opening 63,64 in two ends, and said protecgulum 61 and said bottom 62 are assembled in the said opening 63,64 of said terminal housing 60 2 ends, the said terminal housing 60 inner runners 65 that form respectively; Wherein said heat abstractor 50 is mounted in the said terminal housing 60 with said terminal substrate 40; And said outer contact pad 4021 penetrates said protecgulum 61 and is revealed in outside the said terminal housing 60; When above-mentioned assembled component moves; Each said substrate 10,10 ' or said terminal substrate 40 with thermal source through each said outer contact pad 1021,1021 ', 4021 or each said touch contact pad 1022,1022 ' conduct heat on each said heat carrier 21,21 ', and through each said runner 35,35 ', 65 and the blast that produced during 50 actions of said heat abstractor form thermal convection and quicken thermal conductance is gone out said assembled component.
In the technical scheme of the invention described above, each said touch contact pad 1022 ' of the said outer contact pad 1021 of each of said substrate 10 and another said substrate 10 ' is the reverse interleaved stack architecture that electrically contacts through each said heat carrier 21 ' of said radiating subassembly 20 '.
Each said touch contact pad 1022 ' of the said outer contact pad 1021 of each of said substrate 10 and another substrate 10 ' is the electric contact structure of same horizontal plane through each said heat carrier 21 ' of said radiating subassembly 20 '.
Each said touch contact pad 1022 of the said outer contact pad 4021 of each of said terminal substrate 40 and another substrate 10 is the reverse interleaved stack architecture that electrically contacts through each said heat carrier 21 of said radiating subassembly 20.
Each said touch contact pad 1022 of the said outer contact pad 4021 of each of said terminal substrate 40 and another substrate 10 is the electric contact structure of same horizontal plane through each said heat carrier 21 of said radiating subassembly 20.
The said electronic building brick 11 of said substrate 10 comprises at least one IC chip 111, at least one passive component 112, at least one control unit 113, and said IC chip 111 is arranged at the said inner surface 101 of said substrate 10.
Said passive component 112 and said control unit 113 are arranged at the said outer surface 102 of said substrate 10.
The said electronic building brick 41 of said terminal substrate 40 comprises at least one IC chip 411, at least one passive component 412, at least one control unit 413, and said IC chip 411 is arranged at the said inner surface 401 of said terminal substrate 40.
Said passive component 412 and said control unit 413 are arranged at the said outer surface 402 of said terminal substrate 40.
The said runner 35 of said housing 30 is space kenel wide outside and narrow inside, and narrow place forms a fluid accelerating region 351 in said.
The inner surface 101 of said substrate 10 forms an adhesive body 12, and said adhesive body 12 has an outer surface 121, and said outer surface 121 is provided with a heat-conducting layer 122, and wherein said heat-conducting layer 122 is processed for any one material at least of copper, aluminium or silver.
Each said heat carrier 21 is processed for any one material at least of copper, aluminium or silver.
Said housing 30 and another housing 30 ' be can each said housing of the smooth and easy derivation of heat 30,30 ' is outer the fluid-tight engagement state.
Said protecgulum 31 has at least one air-vent 311, and said bottom 32 has at least one air-vent 321.
The said protecgulum 61 of said terminal housing 60 has at least one air-vent 611, and said bottom 62 has at least one air-vent 621.
One ventilative body 36 is set between the said protecgulum 31 of said housing 30 and the said opening 33 of said housing 30, and a ventilative body 37 also is set between the said opening 34 of the said bottom 32 of said housing 30 and said housing 30.
One ventilative body 66 is set between the said protecgulum 61 of said terminal housing 60 and the said opening 63 of said terminal housing 60, and a ventilative body 67 also is set between the said opening 64 of the said bottom 62 of said terminal housing 60 and said terminal housing 60.
Card is established a press component 38 in the said housing 30; Said press component 38 can move up and down in said housing 30; Said press component 38 is for being surrounded on the form of said substrate 10; Wherein said press component 38 comprises a push jack 381, a press section 382, an elastomer 383, and said press section 382 and said elastomer 382 are corresponding two ends that are arranged at said push jack 381, and said press section 382 is revealed in outside the said housing 30 for part.
Said elastomer 383 is at least a for compression spring, rubber, metal clips.
The design that is formed in one of said elastomer 383 and said push jack 381.
Said housing 30 fastens with a lid 70 in addition, and said outer contact pad 1021 is placed in the said lid.
Said heat abstractor 50 is a radiator fan.
Said heat abstractor 50 is for being electrically connected on said terminal substrate 40 with bus, heart yearn 51, metal salient point or shell fragment at least a.
The said outer contact pad 1021 of each of said substrate 10 is for being compatible with universal serial bus coffret, mini universal serial bus coffret, micro universal serial bus coffret, perhaps any one of the advanced supplementary technology coffret of sequence.
Adopt technique scheme, effect of the present invention mainly is to be when IC chip moves, and the thermal source that is produced can conduct to thermal source on the heat carrier through outer contact pad or touch contact pad, and through the runner in the housing thermal conductance is gone out this device again.Also a terminal housing can be set again; And in the housing heat abstractor is set endways; When this heat abstractor action, can produce blast formation thermal convection and quicken thermal conductance is gone out this assembled component, can make these electronic circuit modules have heat radiation function preferably, the fragrance prescription also can be set at adjacent thermal conductive body place in addition; When producing thermal convection in the housing, also can the taste of fragrance prescription be come out, improve the surcharge of product.
Description of drawings
Fig. 1 is the parts explosion of existing carry-on disc structure;
Fig. 2 a is the stereogram of first embodiment of the invention;
Fig. 2 b is the stereogram of second embodiment of the invention;
Fig. 2 c is the stereogram of third embodiment of the invention;
Fig. 3 a is the parts explosion of first embodiment of the invention;
Fig. 3 b is the parts explosion of third embodiment of the invention;
Fig. 4 a is the runner top plan view of first embodiment of the invention;
Fig. 4 b is the runner top plan view of second embodiment of the invention;
Fig. 4 c is the runner top plan view of third embodiment of the invention;
Fig. 5 a is the profile of first embodiment of the invention;
Fig. 5 b is the profile of second embodiment of the invention;
Fig. 5 c is another profile of second embodiment of the invention;
Fig. 6 a is the profile of third embodiment of the invention;
Fig. 6 b is another profile of third embodiment of the invention;
Fig. 7 a is the profile of fourth embodiment of the invention;
Fig. 7 b is another profile of fourth embodiment of the invention.
Embodiment
Lift following examples at present and combine accompanying drawing that structure of the present invention and effect are elaborated.
Shown in Fig. 2 a, Fig. 3 a and Fig. 5 a, be first embodiment of the heat abstractor of electronic circuit module provided by the present invention, mainly comprise a substrate 10, a radiating subassembly 20 and a housing 30, substrate 10 comprises at least one electronic building brick 11.Substrate 10 has an inner surface 101 and an outer surface 102, and substrate 10 can be the multilayer board of a kind of high density two sides conducting, and inside is formed with the circuit (not shown).One end of outer surface 102 has at least one outer contact pad 1021, and the other end has at least one touch contact pad 1022, and outer contact pad 1021 and touch contact pad 1022 are that circuit (not shown) through substrate 10 is electrically connected with touch contact pad 1022.Wherein, These outer contact pads 1021 can be to be compatible with universal serial bus (USB) coffret, mini universal serial bus (Mini USB) coffret, micro universal serial bus (Micro USB) coffret, perhaps any one of advanced supplementary technology (e-SATA) coffret of sequence.In addition; The electronic building brick 11 of substrate 10 comprises at least one IC chip 111, at least one passive component 112, at least one control unit 113; And IC chip 111 is arranged at the inner surface 101 of substrate 10; And passive component 112 and control unit 113 can be arranged at the outer surface 102 of substrate 10, also can be arranged at the inner surface 101 of substrate 10.In the present embodiment, IC chip 111 is arranged at the outer surface 102 of substrate 10.Wherein, the bonding wire or the chip bonding technology of routing formation capable of using make IC chip 111 be electrically connected to substrate 10.Usually IC chip 111 can be flash memory (FLASH), static random access memory (Static-Random-Access-Memory; SRAM), special purpose integrated circuit (Application-Specific-Integrated-Circuit; ASIC), memory chip or SDRAM (Synchronous-Dynamic-Random-Access-Memory, SDRAM).Preferred implementation is, the inner surface 101 of substrate 10 forms an adhesive body 12, and adhesive body 12 has an outer surface 121, and outer surface 121 has been provided with a heat-conducting layer 122, and heat-conducting layer 122 is processed for any one material at least of copper, aluminium or silver.In addition, radiating subassembly 20 comprises a plurality of heat carriers 21, and is arranged at the end face that substrate 10 has a plurality of touch contact pads 1022; Wherein each heat carrier 21 is contacted with each touch contact pad 1022; In addition, each heat carrier 21 has at least one non-flat forms structure 211, and is that copper, aluminium or silver-colored any one material are at least processed; Preferred implementation is; Heat carrier 21 is with any one kenel or its combination in any such as salient point, shell fragment or fins, but is not limited to this, and any other heat radiation kenel all can.In addition, fragrance prescription (not shown) can also be set in the adjacent to of each heat carrier 21.In addition, housing 30 comprises a protecgulum 31 and a bottom 32, and housing 30 is a hollow structure; Respectively be formed with an opening 33,34 at its two end, and protecgulum 31 and bottom 32 be assembled in opening 33,34 places of housing 30 2 ends respectively, implement preferably be; Protecgulum 31 has at least one air-vent 311, and bottom 32 has at least one air-vent 321, in addition; The housing 30 inner runners 35 that form, shown in Fig. 4 a, runner 35 is space kenel wide outside and narrow inside; Therefore narrow place promptly forms a fluid accelerating region 351 in, when fluid during through fluid accelerating region 351, can because of flow channel space by outer wide in narrow variation; Make flow channel space produce pressure reduction and the flowing of accelerating fluid, and then accelerate thermal conductance is gone out.Moreover runner is kenel wide outside and narrow inside and is not limited to the kenel shown in Fig. 4 a, other spatial shape such as arc or irregular shape ... Not limited etc. kenel.Shown in Fig. 2 a, Fig. 3 a and Fig. 5 a, substrate is located in the housing 30 for 10 groups for another example, and the outer contact pad 1021 of substrate 10 penetrates protecgulum 31 and is emerging in outside the housing 30.In addition; One ventilative body 36 also can be set between the opening 33 of housing 30 protecgulums 31 and housing 30; One ventilative body 37 also is set between the opening 34 of housing 30 bottoms 32 and housing 30, can prevents that microparticles such as powder or dust from falling in the housing 30 and hinder operation of the present invention.In addition, housing 30 also can fasten with a lid 70 in addition, and outer contact pad 1021 is contained in the lid 70, reduces outer contact pad 1021 because of collision or other former thereby cause infringement.The heat abstractor of electronic circuit module provided by the present invention can be used as the heat abstractor of Portable Data Holding Equipment, and like carry-on dish (being commonly called as thumb drive) or carry-on hard disk etc., and present embodiment is the heat abstractor of carry-on dish.Therefore pass through said apparatus; When these electronic building bricks of substrate 10 11 produce thermal source because of operation; Its thermal source can conduct heat on each heat carrier 21 through touch contact pad 1022 and perhaps conduct on the heat-conducting layer 122, and make housing 30 interior generation thermal convections that thermal conductance is gone out this device through runner 35 structures this moment again.In addition fragrance prescription (not shown) is set, also can the taste of fragrance prescription be come out in the time of can in housing, producing thermal convection, with the surcharge of raising product.
Shown in Fig. 2 b, Fig. 5 b; Be the second embodiment of the present invention, be a kind of heat abstractor of electronic circuit module, the similar parts of in first embodiment and Fig. 2 a, Fig. 3 a and Fig. 5 a, having explained; In Fig. 2 b, Fig. 5 b, indicate, will omit no longer narration with next with identical element numbers.
The main difference of second embodiment and first embodiment is that substrate 10, radiating subassembly 20 and housing 30 are at least more than one all, makes the present invention have the function that memory capacity expands, and also can add other pluralistic function module.In addition; The bottom 32 of housing 30 has the groove of wearing 322; Therefore through above-mentioned assembled component; The touch contact pad 1022 ' of wearing groove 322 ' and another substrate 10 ' of outer contact pad 1021 penetrable another housing 30 ' bottoms 32 ' of one substrate 10, each heat carrier 21 ' through radiating subassembly 20 ' electrically contacts, and wherein a housing 30 is the fluid-tight engagement state with another housing 30 '.Wherein the outer contact pad 1021 of a substrate 10 can be reverse interleaved electrically contact (shown in Fig. 5 c) that electrically contacts or also can be same horizontal plane through each heat carrier 21 ' of radiating subassembly 20 ' with the touch contact pad 1022 ' of another substrate 10 '; Therefore when each substrate 10, each electronic building brick of 10 ' 11,11 ' produce thermal source because of operation; Its thermal source can by each outer contact pad 1021,1021 ' and each touch contact pad 1022,1022 ' conduct heat to each heat carrier 21,21 ' or heat-conducting layer 122,122 ' on; Make in the housing 30,30 ' through runner 35,35 ' fluid accelerating region 351,351 ' design (shown in Fig. 4 b) again to produce thermal convection and thermal conductance is gone out assembled component, to reach the assembled component heat radiation and to increase the effect of product surcharge.
Shown in Fig. 2 c, Fig. 3 b; Be the third embodiment of the present invention; Heat abstractor for a kind of electronic circuit module; The similar parts of in first embodiment, Fig. 2 a, Fig. 3 a, Fig. 5 a and second embodiment, Fig. 2 b, Fig. 5 b, having explained indicate or omit in Fig. 2 c, Fig. 3 b or with identical element numbers, and following explanation then will be omitted no longer narration.
The main difference of the 3rd embodiment and first embodiment, second embodiment is; Set up a terminal substrate 40, a heat abstractor 50 and a terminal housing 60; Terminal substrate 40 comprises at least one electronic building brick 41; And terminal substrate 40 has an inner surface 401 and an outer surface 402, and shown in Fig. 6 a, an end of outer surface 402 has at least one outer contact pad 4021 for another example; Wherein each outer contact pad 4021 can be the reverse interleaved electrical stack architecture that contacts with each touch contact pad 1022 of another substrate 10 heat carrier 21 through radiating subassembly 20; The electric contact structure (shown in Fig. 6 b) that also can be same horizontal plane in addition makes the present invention have the function that memory capacity expands, and also can add other pluralistic function module.The electronic building brick 41 of wherein terminal substrate 40 comprises at least one IC chip 411, at least one passive component 412, at least one control unit 413 (shown in Fig. 3 b); And IC chip 411 is arranged at the inner surface 401 of terminal substrate 40; And passive component 412 and control unit 413 can be arranged on the outer surface 402 of terminal substrate 40; Also can be arranged on the inner surface 401 of terminal substrate 40, in the present embodiment, passive component 412 and control unit 413 are arranged on the outer surface 402 of terminal substrate 40.In addition, heat abstractor 50 can pass through the terminal substrate 40 of at least a electrical connection of bus (not shown), heart yearn 51, metal salient point (not shown) or shell fragment (not shown).Heat abstractor 50 is a radiator fan.For another example shown in Fig. 3 b, Fig. 6 a; Terminal housing 60 comprises a protecgulum 61 and a bottom 62; And be a hollow structure, terminal housing 60 2 ends respectively are formed with an opening 63,64, and protecgulum 61 is assembled in respectively on the opening 63,64 of terminal housing 60 2 ends with bottom 62; Execution mode is preferably; The protecgulum 61 of terminal housing 60 has at least one air-vent 611, and bottom 62 has at least one air-vent 621, and the body 66 of breathing freely is set between the opening 63 of housing 60 protecgulums 61 and terminal housing 60 endways; Simultaneously between the opening 64 of housing 60 bottoms 62 and terminal housing 60 a ventilative body 67 is set endways, it is interior and hinder operation of the present invention to prevent that microparticles such as powder or dust from falling into terminal housing 60.Shown in Fig. 2 c, Fig. 3 b, Fig. 4 c and Fig. 6 a, terminal housing 60 inside form runners 65 for another example.Wherein heat abstractor 50 is mounted in the terminal housing 60 with terminal substrate 40, and outer contact pad 4021 penetrates protecgulum 61 and is emerging in outside the terminal housing 60.Therefore when above-mentioned assembled component moves; Substrate 10 or terminal substrate 40 can conduct heat to thermal source on each heat carrier 21 through outer contact pad 1021,4021 or touch contact pad 1022; And the blast that is produced during through 50 actions of runner 35,65 and heat abstractor forms thermal convection and quickens thermal conductance is gone out this assembled component, reaches the effect that makes this assembled component heat radiation and increase the product surcharge.
Shown in Fig. 7 a, Fig. 7 b; Be the fourth embodiment of the present invention; Heat abstractor for a kind of electronic circuit module; The similar parts of in second embodiment, Fig. 2 b, Fig. 5 b and the 3rd embodiment, Fig. 2 c, Fig. 3 b, having explained indicate or omit in Fig. 7 a, Fig. 7 b or with identical element numbers, and following explanation then will be omitted no longer narration.
The main difference of the 4th embodiment and second embodiment, the 3rd embodiment is; Housing 30 can block establishes a press component 38 in it; Press component 38 can be moved up and down in housing 30; And press component 38 can be the form that is surrounded on substrate 10, and press component 38 comprises a push jack 381, a press section 382, an elastomer 383 in addition, and wherein press section 382 and elastomer 382 are corresponding two ends that are arranged at push jack 381; And press section 382 parts are revealed in outside the housing 30; For another example shown in Fig. 7 a, Fig. 7 b, when a plurality of housings 10, when 10 ' group is made as one, the touch contact pad 1022 of substrate 10 is closely contacted through heat carrier 21 with the outer contact pad 1021 ' of another substrate 10 '.In addition, elastomer 383 can be at least a of compression spring, rubber, metal clips, is preferably the design that is formed in one of elastomer 383 and push jack 381.The described press component of present embodiment also can be set up in the second embodiment of the present invention and the 3rd embodiment, and its effect is to let has immobilization efficiencies preferably between a plurality of housings.
In sum, the present invention is heat conduction to the heat-conducting layer that is produced when IC chip is moved, and utilizes outer contact pad and touch contact pad to conduct on the heat carrier again; By the runner that is provided with in the housing thermal conductance is gone out this device then; Perhaps a terminal housing can be set again, and in the housing heat abstractor be set endways, when heat abstractor moves, can produce blast formation thermal convection and quicken thermal conductance is gone out this assembled component; Can make each electronic circuit module have preferable heat radiation function; The fragrance prescription can be set at adjacent thermal conductive body place in addition, when producing thermal convection in the housing, then can the taste of fragrance prescription be come out, improve the surcharge of product.
The above is merely preferable enforcement kenel of the present invention, uses the equivalent structure variation that specification of the present invention, claims or accompanying drawing are done such as, all should be included in the scope of patent protection of the present invention.
Claims (26)
1. the heat abstractor of an electronic circuit module is characterized in that comprising:
One substrate (10); It comprises at least one electronic building brick (11); Wherein, said substrate (10) has an inner surface (101) and an outer surface (102), and an end of said outer surface (102) has at least one outer contact pad (1021); The other end has at least one touch contact pad (1022), and said outer contact pad (1021) and said touch contact pad (1022) are for being electrically connected;
One radiating subassembly (20); It comprises a plurality of heat carriers (21); Wherein said radiating subassembly (20) is arranged at the end face that said substrate (10) has each said touch contact pad (1022); And each said heat carrier (21) contacts each said touch contact pad (1022), and each said heat carrier (21) has at least one non-flat forms structure (211) in addition;
One housing (30); It comprises a protecgulum (31) and a bottom (32); Wherein said housing (30) is a hollow structure; It respectively is formed with an opening (33,34) in two ends, and said protecgulum (31) and said bottom (32) are assembled in the said opening (33,34) of said housing (30) two ends respectively, the inner runner (35) that forms of said housing (30); Wherein said substrate (10) group is located in the said housing (30), and said outer contact pad (1021) penetrates said protecgulum (31) and is revealed in outside the said housing (30); When each said electronic building brick (11) operation of said substrate (10) produced thermal source, said thermal source was conducted heat on each said heat carrier (21) by touch contact pad (1022), made the interior generation of housing (30) thermal convection that thermal conductance is gone out said device through runner (35) again.
2. the heat abstractor of an electronic circuit module is characterized in that comprising:
At least one substrate (10); Each substrate (10) comprises at least one electronic building brick (11); Wherein, said substrate (10) has an inner surface (101) and an outer surface (102), and an end of said outer surface (102) has at least one outer contact pad (1021); The other end has at least one touch contact pad (1022), and said outer contact pad (1021) and said touch contact pad (1022) are for being electrically connected;
At least one radiating subassembly (20); Each radiating subassembly (20) comprises a plurality of heat carriers (21); Wherein said radiating subassembly (20) is arranged at the end face that said substrate (10) has each said touch contact pad (1022); And each said heat carrier (21) contacts each said touch contact pad (1022), and each said heat carrier (21) has at least one non-flat forms structure (211) in addition, and it contacts with each said outer contact pad (1021 ') of another substrate (10 ');
At least one housing (30); Each housing (30) comprises a protecgulum (31) and a bottom (32); Wherein said housing (30) is a hollow structure; It respectively is formed with an opening (33,34) in two ends, and said protecgulum (31) and said bottom (32) are assembled in the said opening (33,34) of said housing (30) two ends respectively, the inner runner (35) that forms of said housing (30); Wherein said substrate (10) is mounted in the said housing (30), and said outer contact pad (1021) penetrates said protecgulum (31) and be emerging in outside the said housing (30), and said in addition bottom (32) has the groove of wearing (322); The touch contact pad (1022 ') of wearing groove (322 ') and another substrate (10 ') that the outer contact pad (1021) of the said substrate (10) in the housing (30) penetrates another housing (30 ') bottom (32 ') electrically contacts through each said heat carrier (21 ') of said radiating subassembly (20 '); When each said electronic building brick (11,11 ') operation of each said substrate (10,10 ') produces thermal source; Its thermal source can conduct heat on each said heat carrier (21,21 ') through each said outer contact pad (1021,1021 ') or each said touch contact pad (1022,1022 '), through each said runner (35,35 ') the interior generation of each said housing (30,30 ') thermal convection is gone out thermal conductance again.
3. the heat abstractor of an electronic circuit module is characterized in that comprising:
At least one substrate (10); Each substrate (10) comprises at least one electronic building brick (11); Wherein, said substrate (10) has an inner surface (101) and an outer surface (102), and an end of said outer surface (102) has at least one outer contact pad (1021); The other end has at least one touch contact pad (1022), and said outer contact pad (1021) and said touch contact pad (1022) are for being electrically connected;
At least one radiating subassembly (20); Each radiating subassembly (20) comprises a plurality of heat carriers (21); Wherein said radiating subassembly (20) is arranged at the end face that said substrate (10) has each said touch contact pad (1022); And each said heat carrier (21) is contacted with each said touch contact pad (1022), and each said heat carrier (21) has at least one non-flat forms structure (211) in addition, and it contacts with each said outer contact pad (1021 ') of another substrate (10 ');
At least one housing (30); Each housing (30) comprises a protecgulum (31) and a bottom (32); Wherein said housing (30) is a hollow structure; It respectively is formed with an opening (33,34) in two ends, and said protecgulum (31) and said bottom (32) are assembled in the said opening (33,34) of said housing (30) two ends respectively, the inner runner (35) that forms of said housing (30); Wherein said substrate (10) is mounted in the said housing (30), and said outer contact pad (1021) penetrates said protecgulum (31) and be revealed in outside the said housing (30), and said in addition bottom (32) has the groove of wearing (322);
One terminal substrate (40), it comprises at least one electronic building brick (41), and wherein, said terminal substrate (40) has an inner surface (401) and an outer surface (402), and an end of said outer surface (402) has at least one outer contact pad (4021);
One heat abstractor (50), it is electrically connected on said terminal substrate (40);
One terminal housing (60); It comprises a protecgulum (61) and a bottom (62); Wherein said terminal housing (60) is a hollow structure; It respectively is formed with an opening (63,64) in two ends, and said protecgulum (61) and said bottom (62) are assembled in the said opening (63,64) of said terminal housing (60) two ends respectively, the inner runner (65) that forms of said terminal housing (60); Wherein said heat abstractor (50) is mounted in the said terminal housing (60) with said terminal substrate (40); And said outer contact pad (4021) penetrates said protecgulum (61) and is revealed in outside the said terminal housing (60); When above-mentioned assembled component moves; Each said substrate (10,10 ') or said terminal substrate (40) conduct heat to thermal source on each said heat carrier (21,21 ') through each said outer contact pad (1021,1021 ', 4021) or each said touch contact pad (1022,1022 '), and the blast that is produced during through the action of each said runner (35,35 ', 65) and said heat abstractor (50) forms thermal convection and quickens thermal conductance is gone out.
4. like the heat abstractor of claim 2 or 3 described a kind of electronic circuit modules, it is characterized in that: each said outer contact pad (1021) of said substrate (10) and each said touch contact pad (1022 ') of another said substrate (10 ') are the reverse interleaved stack architecture that electrically contacts through each said heat carrier (21 ') of said radiating subassembly (20 ').
5. like the heat abstractor of claim 2 or 3 described a kind of electronic circuit modules, it is characterized in that: each said outer contact pad (1021) of said substrate (10) and each said touch contact pad (1022 ') of another substrate (10 ') are the electric contact structure of same horizontal plane through each said heat carrier (21 ') of said radiating subassembly (20 ').
6. the heat abstractor of a kind of electronic circuit module as claimed in claim 3 is characterized in that: each said outer contact pad (4021) of said terminal substrate (40) and each said touch contact pad (1022) of another substrate (10) are the reverse interleaved stack architecture that electrically contacts through each said heat carrier (21) of said radiating subassembly (20).
7. the heat abstractor of a kind of electronic circuit module as claimed in claim 3 is characterized in that: each said outer contact pad (4021) of said terminal substrate (40) and each said touch contact pad (1022) of another substrate (10) are the electric contact structure of same horizontal plane through each said heat carrier (21) of said radiating subassembly (20).
8. like the heat abstractor of claim 1 or 2 or 3 described a kind of electronic circuit modules; It is characterized in that: the said electronic building brick (11) of said substrate (10) comprises at least one IC chip (111), at least one passive component (112), at least one control unit (113), and said IC chip (111) is arranged at the said inner surface (101) of said substrate (10).
9. the heat abstractor of a kind of electronic circuit module as claimed in claim 8, it is characterized in that: said passive component (112) and said control unit (113) are arranged at the said outer surface (102) of said substrate (10).
10. the heat abstractor of a kind of electronic circuit module as claimed in claim 3; It is characterized in that: the said electronic building brick (41) of said terminal substrate (40) comprises at least one IC chip (411), at least one passive component (412), at least one control unit (413), and said IC chip (411) is arranged at the said inner surface (401) of said terminal substrate (40).
11. the heat abstractor of a kind of electronic circuit module as claimed in claim 10 is characterized in that: said passive component (412) and said control unit (413) are arranged at the said outer surface (402) of said terminal substrate (40).
12. the heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules is characterized in that: the said runner (35) of said housing (30) is space kenel wide outside and narrow inside, and forms a fluid accelerating region (351) in interior narrow place.
13. heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules; It is characterized in that: the inner surface (101) of said substrate (10) forms an adhesive body (12); And said adhesive body (12) has an outer surface (121); Said outer surface (121) is provided with a heat-conducting layer (122), and wherein said heat-conducting layer (122) is that any one material at least of copper, aluminium or silver is processed.
14. the heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules is characterized in that: each said heat carrier (21) is that any one material at least of copper, aluminium or silver is processed.
15. the heat abstractor like claim 2 or 3 described a kind of electronic circuit modules is characterized in that: said housing (30) is with another housing (30 ') can be with the fluid-tight engagement state outside each said housing (30,30 ') of the smooth and easy derivation of heat.
16. the heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules is characterized in that: said protecgulum (31) has at least one air-vent (311), and said bottom (32) has at least one air-vent (321).
17. the heat abstractor of a kind of electronic circuit module as claimed in claim 3 is characterized in that: the said protecgulum (61) of said terminal housing (60) has at least one air-vent (611), and said bottom (62) has at least one air-vent (621).
18. heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules; It is characterized in that: a ventilative body (36) is set between the said opening (33) of the said protecgulum (31) of said housing (30) and said housing (30) one ends, and a ventilative body (37) also is set between the said opening (34) of the said bottom (32) of said housing (30) and said housing (30) other end.
19. the heat abstractor of a kind of electronic circuit module as claimed in claim 3; It is characterized in that: a ventilative body (66) is set between the said opening (63) of the said protecgulum (61) of said terminal housing (60) and said terminal housing (60) one ends, and a ventilative body (67) also is set between the said opening (64) of the said bottom (62) of said terminal housing (60) and said terminal housing (60) other end.
20. heat abstractor like claim 2 or 3 described a kind of electronic circuit modules; It is characterized in that: said housing (30) Nei Ka establishes a press component (38); Said press component (38) can move up and down in said housing (30); Said press component (38) is for being surrounded on the form of said substrate (10); Wherein said press component (38) comprises a push jack (381), a press section (382), an elastomer (383), and said press section (382) and said elastomer (382) are corresponding two ends that are arranged at said push jack (381), and said press section (382) are revealed in outside the said housing (30) for part.
21. the heat abstractor of a kind of electronic circuit module as claimed in claim 20 is characterized in that: said elastomer (383) is at least a for compression spring, rubber, metal clips.
22. the heat abstractor of a kind of electronic circuit module as claimed in claim 20 is characterized in that: the design that is formed in one of said elastomer (383) and said push jack (381).
23. the heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules is characterized in that: said housing (30) fastens with a lid (70) in addition, and said outer contact pad (1021) is placed in the said lid.
24. the heat abstractor of a kind of electronic circuit module as claimed in claim 3 is characterized in that: said heat abstractor (50) is a radiator fan.
25. the heat abstractor of a kind of electronic circuit module as claimed in claim 3 is characterized in that: said heat abstractor (50) is at least a said terminal substrate (40) that is electrically connected on bus, heart yearn (51), metal salient point or shell fragment.
26. heat abstractor like claim 1 or 2 or 3 described a kind of electronic circuit modules; It is characterized in that: each said outer contact pad (1021) of said substrate (10) is for being compatible with universal serial bus coffret, mini universal serial bus coffret, micro universal serial bus coffret, perhaps any one of the advanced supplementary technology coffret of sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102469376A CN102088834B (en) | 2009-12-03 | 2009-12-03 | Heat dissipation device for electronic circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102469376A CN102088834B (en) | 2009-12-03 | 2009-12-03 | Heat dissipation device for electronic circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102088834A CN102088834A (en) | 2011-06-08 |
| CN102088834B true CN102088834B (en) | 2012-11-07 |
Family
ID=44100372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102469376A Active CN102088834B (en) | 2009-12-03 | 2009-12-03 | Heat dissipation device for electronic circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102088834B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7297024B2 (en) * | 2003-09-11 | 2007-11-20 | Super Talent Electronics, Inc. | Universal-serial-bus (USB) flash-memory device with metal wrap formed over plastic housing |
| CN101364694A (en) * | 2007-08-10 | 2009-02-11 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| US7524198B2 (en) * | 1999-08-04 | 2009-04-28 | Super Talent Electronics, Inc. | Press/push flash drive |
-
2009
- 2009-12-03 CN CN2009102469376A patent/CN102088834B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7524198B2 (en) * | 1999-08-04 | 2009-04-28 | Super Talent Electronics, Inc. | Press/push flash drive |
| US7297024B2 (en) * | 2003-09-11 | 2007-11-20 | Super Talent Electronics, Inc. | Universal-serial-bus (USB) flash-memory device with metal wrap formed over plastic housing |
| CN101364694A (en) * | 2007-08-10 | 2009-02-11 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102088834A (en) | 2011-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11562986B2 (en) | Stacked semiconductor die assemblies with partitioned logic and associated systems and methods | |
| TWI444129B (en) | Radiator of electronic circuit module | |
| TW546872B (en) | Heat spreading connector and method | |
| CN101431068B (en) | Semiconductor package module | |
| JP5883119B2 (en) | Multilayer chip-on-board module with edge connector | |
| CN110168718A (en) | Semiconductor device assemblies with Electricity Functional heat transfer structure | |
| CN103782381A (en) | Electronic assembly including die on substrate with heat spreader having an open window on the die | |
| CN102456645B (en) | Heat management system and method | |
| CN100550360C (en) | Equipment and system and manufacture method thereof with bottom heat radiation | |
| US9349671B2 (en) | Integrated circuit chip comprising electronic device and electronic system | |
| WO2012002294A1 (en) | Stacked semiconductor device with heat dissipating member | |
| US20230307309A1 (en) | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | |
| CN109983572B (en) | Semiconductor die assemblies having heat spreaders extending through an underlying interposer and related techniques | |
| CN103814627A (en) | Method and apparatus for connecting inlaid chip into printed circuit board | |
| CN102088834B (en) | Heat dissipation device for electronic circuit module | |
| JP2000252419A (en) | Three-dimensional module structure | |
| CN108304048B (en) | Server and solid-state storage device thereof | |
| US3259804A (en) | Electrical module with means for dissipating heat | |
| CN107343376A (en) | Electronic equipment with electronic chip and radiator | |
| JP2007109938A (en) | Semiconductor device | |
| KR102304909B1 (en) | Power module and manufacturing method thereof | |
| US20040160742A1 (en) | Three-dimensional electrical device packaging employing low profile elastomeric interconnection | |
| CN201270305Y (en) | Connector apparatus | |
| CN109950250B (en) | Data center 3D solid state drive with matrix cooling | |
| JP2007043011A (en) | Heat dissipation structure of electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |