CN101937896A - Lead frame for manufacturing rectifier - Google Patents
Lead frame for manufacturing rectifier Download PDFInfo
- Publication number
- CN101937896A CN101937896A CN2010101612026A CN201010161202A CN101937896A CN 101937896 A CN101937896 A CN 101937896A CN 2010101612026 A CN2010101612026 A CN 2010101612026A CN 201010161202 A CN201010161202 A CN 201010161202A CN 101937896 A CN101937896 A CN 101937896A
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- CN
- China
- Prior art keywords
- support bar
- district
- pad district
- pad
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The invention relates to a lead frame for manufacturing a rectifier, comprising a supporting chip, a plurality of first connecting sheets and a plurality of second connecting sheets, wherein the supporting chip mainly comprises a first positioning pin, a second positioning pin and a plurality of chip welding zones, wherein the plurality of chip welding zones are positioned between the first positioning pin and the second positioning pin in an arrangement way of at least two rows and at least two lines; the first connecting sheets are provided with fifth welding point zones used for corresponding to first welding point zones and sixth welding point zones used for corresponding to fourth welding point zones; and the second connecting sheets are provided with seventh welding point zones used for corresponding to second welding point zones and eighth welding point zones used for corresponding to third welding point zones. The invention solves the problems of strict requirements for smoothness and low copper material utility ratio in the prior art, greatly reduces the probability of crystal grain damage or poor contact and enhances the copper material utility ratio.
Description
Technical field
The present invention relates to a kind of lead frame, relate in particular to a kind of lead frame that is used to make rectifier.
Background technology
The bridge architecture that bridge rectifier is made up of four rectifier diodes, it utilizes the unilateal conduction characteristic of diode that alternating current is carried out rectification, because bridge rectifier doubles than ripple rectification to the utilization ratio of importing positive sine wave, be a kind of remarkable improvement, convert in the galvanic circuit so be widely used in alternating current to the diode halfwave rectifier.
Existing DF diode rectifier product is the biserial laminated structure, and production technology is simple, and is easy to operate.By lead frame and diode chip for backlight unit welding, and use the encapsulation of epoxy packages body.As shown in Figure 1, but existing two-piece type lead frame often is difficult to all diode crystal particles all are in best welded condition, be that the supporting zone evenness at every diode crystal particle place interacts and causes in the procedure for producing product internal stress situation stable inadequately, crystal grain situation impaired or loose contact happens occasionally.Secondly, existing two-piece type lead frame, every all needs independently territory, positioning area hole, causes a large amount of copper material wastes.
Therefore how solving in the existing lead frame because evenness causes the technical problem and the not high technical problem of copper material utilance of the impaired or loose contact of crystal grain, is the problem that the present invention studies.
Summary of the invention
The object of the invention provides a kind of lead frame that is used to make rectifier, and this lead frame has overcome prior art and required and the low problem of copper material utilance planarization is harsh, greatly reduces the probability of the impaired or loose contact of crystal grain and has improved the copper material utilance.
For achieving the above object, the technical solution used in the present invention is: a kind of lead frame that is used to make rectifier, and this lead frame comprises: support chip, some first braces, some second braces;
Support chip mainly is made up of the first location pin, the second location pin, plurality of chips weld zone;
The first location pin is provided with at least one positioning boss, the second location pin is provided with at least one positioning boss;
Locate pin between at described first location pin and second by at least two rows and two row arrangement modes at least this plurality of chips weld zone, is connected by connecting muscle between chips welding district and the chips welding district, locate pin with the first location pin or second and be connected by company's muscle in the chips welding district that is positioned at the edge;
Described chips welding district is made up of first support bar, second support bar, the 3rd support bar, the 4th support bar; First support bar, one end with connect muscle and be connected, first support bar middle part is provided with the first pad district that is used for being connected with the diode cathode end, the first support bar other end is provided with the second pad district that is used for being connected with the diode cathode end, and the second pad district is positioned at inboard, described chips welding district; Second support bar, one end with connect muscle and be connected, second support bar middle part is provided with the 3rd pad district that is used for being connected with the diode cathode end, the second support bar other end is provided with the 4th pad district that is used for being connected with the diode cathode end, and the 4th pad district is positioned at inboard, described chips welding district;
The 3rd support bar one end with connect muscle and be connected, be provided with the boss and the through hole of a pair of mutual embedding between the 3rd support bar other end and described first brace;
The 4th support bar one end with connect muscle and be connected, be provided with the boss and the through hole of a pair of mutual embedding between the 4th support bar other end and described second brace;
Described first brace is provided with and is used for the five pad district corresponding with the described first pad district, is used for the six pad district corresponding with described the 4th pad district;
Described second brace is provided with and is used for the seven pad district corresponding with the described second pad district, is used for the eight pad district corresponding with described the 3rd pad district.
Because the technique scheme utilization, the present invention compared with prior art has following advantage and effect:
The present invention has overcome the strict harsh requirement that be positioned at same horizontal plane of each crystal grain weld zone need in the existing two-piece type lead frame, the mode that adopts brace to cooperate with support chip, avoided the stable inadequately defective of product internal stress situation in the procedure for producing, help the expansion of subsequent technique, greatly reduce the probability of the impaired or loose contact of crystal grain; Secondly, be provided with many row's chips welding district between this patent first location pin, the second location pin, improved the utilance of copper material greatly.
Description of drawings
Accompanying drawing 1 is existing two-piece type lead frame structure schematic diagram;
Accompanying drawing 2 is support chip structural representation in the lead frame of the present invention;
Accompanying drawing 3 is first brace and the second brace structural representation in the lead frame of the present invention.
In the above accompanying drawing: 1, support chip; 2, first brace; 3, second brace; 4, the first location pin; 5, the second location pin; 6, chips welding district; 7, positioning boss; 8, connect muscle; 9, first support bar; 10, second support bar; 11, the 3rd support bar; 12, the 4th support bar; 13, the first pad district; 14, the second pad district; 15, the 3rd pad district; 16, the 4th pad district; 17, the 5th pad district; 18, the 6th pad district; 19, the 7th pad district; 20, the 8th pad district; 21, boss; 22, through hole.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment: a kind of lead frame that is used to make rectifier,
Shown in accompanying drawing 2,3, this lead frame comprises: support chip 1, some first braces 2, some second braces 3;
Support chip mainly is made up of the first location pin 4, the second location pin 5, plurality of chips weld zone 6;
The first location pin 4 is provided with at least one positioning boss 7, the second location pin 5 is provided with at least one positioning boss 7;
Locate pin 5 between at described first location pin 4 and second by at least two rows and two row arrangement modes at least this plurality of chips weld zone 6, is connected by connecting muscle 8 between chips welding district 6 and the chips welding district 6, locate pin with the first location pin or second and be connected by company's muscle 8 in the chips welding district 6 that is positioned at the edge;
Described chips welding district is made up of first support bar 9, second support bar 10, the 3rd support bar 11, the 4th support bar 12; First support bar, 9 one ends with connect muscle 8 and be connected, first support bar, 9 middle parts are provided with the first pad district 13 that is used for being connected with the diode cathode end, first support bar, 9 other ends are provided with the second pad district 14 that is used for being connected with the diode cathode end, and the second pad district 14 is positioned at 6 inboards, described chips welding district; Second support bar, 10 1 ends with connect muscle 8 and be connected, second support bar, 10 middle parts are provided with the 3rd pad district 15 that is used for being connected with the diode cathode end, second support bar, 10 other ends are provided with the 4th pad district 16 that is used for being connected with the diode cathode end, and the 4th pad district 16 is positioned at 6 inboards, described chips welding district;
The 3rd support bar 11 1 ends with connect muscle 8 and be connected, be provided with the boss 21 and the through hole 22 of a pair of mutual embedding between the 3rd support bar 11 other ends and described first brace 2;
The 4th support bar 12 1 ends with connect muscle 8 and be connected, be provided with the boss 21 and the through hole 22 of a pair of mutual embedding between the 4th support bar 12 other ends and described second brace 3;
Described first brace 2 is provided with and is used for the five pad district 17 corresponding with the described first pad district 13, is used for and the 6th corresponding pad district 18 of described the 4th pad district 16;
Described second brace 3 is provided with and is used for the seven pad district 19 corresponding with the described second pad district 14, is used for and the 8th corresponding pad district 20 of described the 3rd pad district 15.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (1)
1. lead frame that is used to make rectifier, it is characterized in that: this lead frame comprises: support chip, some first braces, some second braces;
Support chip mainly is made up of the first location pin, the second location pin, plurality of chips weld zone;
The first location pin is provided with at least one positioning boss, the second location pin is provided with at least one positioning boss;
Locate pin between at described first location pin and second by at least two rows and two row arrangement modes at least this plurality of chips weld zone, is connected by connecting muscle between chips welding district and the chips welding district, locate pin with the first location pin or second and be connected by company's muscle in the chips welding district that is positioned at the edge;
Described chips welding district is made up of first support bar, second support bar, the 3rd support bar, the 4th support bar; First support bar, one end with connect muscle and be connected, first support bar middle part is provided with the first pad district that is used for being connected with the diode cathode end, the first support bar other end is provided with the second pad district that is used for being connected with the diode cathode end, and the second pad district is positioned at inboard, described chips welding district; Second support bar, one end with connect muscle and be connected, second support bar middle part is provided with the 3rd pad district that is used for being connected with the diode cathode end, the second support bar other end is provided with the 4th pad district that is used for being connected with the diode cathode end, and the 4th pad district is positioned at inboard, described chips welding district;
The 3rd support bar one end with connect muscle and be connected, be provided with the boss and the through hole of a pair of mutual embedding between the 3rd support bar other end and described first brace;
The 4th support bar one end with connect muscle and be connected, be provided with the boss and the through hole of a pair of mutual embedding between the 4th support bar other end and described second brace;
Described first brace is provided with and is used for the five pad district corresponding with the described first pad district, is used for the six pad district corresponding with described the 4th pad district;
Described second brace is provided with and is used for the seven pad district corresponding with the described second pad district, is used for the eight pad district corresponding with described the 3rd pad district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101612026A CN101937896A (en) | 2010-04-22 | 2010-04-22 | Lead frame for manufacturing rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101612026A CN101937896A (en) | 2010-04-22 | 2010-04-22 | Lead frame for manufacturing rectifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101937896A true CN101937896A (en) | 2011-01-05 |
Family
ID=43391126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101612026A Pending CN101937896A (en) | 2010-04-22 | 2010-04-22 | Lead frame for manufacturing rectifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101937896A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103023001A (en) * | 2011-09-28 | 2013-04-03 | 江苏锦丰电子有限公司 | Strip for surge protector |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125646A (en) * | 1983-01-07 | 1984-07-20 | Fuji Electric Co Ltd | Manufacture of semiconductor single phase full-wave rectifier element |
| US6072228A (en) * | 1996-10-25 | 2000-06-06 | Micron Technology, Inc. | Multi-part lead frame with dissimilar materials and method of manufacturing |
| CN1451180A (en) * | 1999-11-01 | 2003-10-22 | 通用半导体公司 | Planar hybrid diode rectifier bridge |
| CN1694233A (en) * | 2004-04-30 | 2005-11-09 | 新光电气工业株式会社 | Manufacturing method of lead frame |
| CN101373932A (en) * | 2007-08-25 | 2009-02-25 | 绍兴旭昌科技企业有限公司 | Miniature surface-pasted single-phase full wave bridge rectifier and manufacturing method thereof |
| CN101593746A (en) * | 2009-07-06 | 2009-12-02 | 晶诚（郑州）科技有限公司 | Novel chip packaging structure |
| CN201369681Y (en) * | 2009-03-16 | 2009-12-23 | 常州银河电器有限公司 | Paster bridge rectifier |
-
2010
- 2010-04-22 CN CN2010101612026A patent/CN101937896A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125646A (en) * | 1983-01-07 | 1984-07-20 | Fuji Electric Co Ltd | Manufacture of semiconductor single phase full-wave rectifier element |
| US6072228A (en) * | 1996-10-25 | 2000-06-06 | Micron Technology, Inc. | Multi-part lead frame with dissimilar materials and method of manufacturing |
| CN1451180A (en) * | 1999-11-01 | 2003-10-22 | 通用半导体公司 | Planar hybrid diode rectifier bridge |
| CN1694233A (en) * | 2004-04-30 | 2005-11-09 | 新光电气工业株式会社 | Manufacturing method of lead frame |
| CN101373932A (en) * | 2007-08-25 | 2009-02-25 | 绍兴旭昌科技企业有限公司 | Miniature surface-pasted single-phase full wave bridge rectifier and manufacturing method thereof |
| CN201369681Y (en) * | 2009-03-16 | 2009-12-23 | 常州银河电器有限公司 | Paster bridge rectifier |
| CN101593746A (en) * | 2009-07-06 | 2009-12-02 | 晶诚（郑州）科技有限公司 | Novel chip packaging structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103023001A (en) * | 2011-09-28 | 2013-04-03 | 江苏锦丰电子有限公司 | Strip for surge protector |
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Open date: 20110105 |