CN101799507B - Printed circuit board testing device and testing method - Google Patents
Printed circuit board testing device and testing method Download PDFInfo
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- CN101799507B CN101799507B CN 200910127159 CN200910127159A CN101799507B CN 101799507 B CN101799507 B CN 101799507B CN 200910127159 CN200910127159 CN 200910127159 CN 200910127159 A CN200910127159 A CN 200910127159A CN 101799507 B CN101799507 B CN 101799507B
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Abstract
The invention relates to a printed circuit board testing device and a testing method. The method comprises the following steps: contacting a first probe with a base surface of a to-be-tested printed circuit board, contacting a second probe with the circuits of the printed circuit board, exerting a square-wave voltage on a circuit through the second probe, testing the voltage transition characteristics of the circuit, testing all the circuits of the printed circuit board, storing the tested value in a storage unit, comparing a testing value of a tested non-defective product with the tested value, confirming as a short circuit so long as one comparison value is different, contacting the first probe and the second probe with each confirmed short circuit, testing the resistance value between the short circuits, comparing the tested resistance value with a standard value, and testing the inferior circuit insulation of the printed circuit board which is unconcerned in the capacitance of the circuits of the printed circuit board, therefore easily finding the short circuit.
Description
Technical field
The present invention relates to printed circuit board testing device and inspection method, especially relate to the printed circuit board testing device and the inspection method of the defective insulation that is used for finding printed-wiring board (PWB) circuit (circuit).
Background technology
Usually; Printed-wiring board (PWB); Have the circuit that a plurality of use through holes etc. are electrically connected, whether the printed-wiring board (PWB) circuit that produces correctly forms according to design, promptly; In order to make circuit in the printed-wiring board (PWB) avoid broken string and to produce poor flow or produce defective insulation, need inspection whether form aspect electric according to design with other short circuits.
Electric checking method as insulation inspection (test for short-circuit); Have as everyone knows between the circuit that becomes the inspection object and apply voltage; Obtain the insulation resistance between circuit according to the voltage of this moment and the electric current of measuring; Insulation resistance is reference value when following, judges that this part is the method for the position of defective insulation.
But when using above-mentioned inspection method, online way is in the printed-wiring board (PWB) of n; The number of combinations of insulation inspection is n (n-1)/2, for example, and for the situation of printed-wiring board (PWB) with 1000 circuits; Need carry out the inspection of 499500 minor insulation, have cost such problem of a large amount of supervision time.Therefore, the insulation of all combinations of not checking between circuit is arranged as everyone knows, only to the method (for example patent documentation 1) near the inspection of insulating between circuit of short circuit possibility is arranged.
In addition; Except that above-mentioned technology; Have as everyone knows the circuit measured on the printed-wiring board (PWB), with such circuit of printed wire slab integrals such as covering GND circuit and power circuit or the electric capacity between the printed-wiring board (PWB) outside reference face; The capacitance of itself and non-defective unit is compared, check the method (for example patent documentation 2,3) of insulation.
, in the inspection method of measuring above-mentioned electric capacity, owing to can not between circuit, apply high voltage, so be difficult to find circuit with high resistance shorts.Therefore, proposed circuit is applied rect.p., judged the method (for example patent documentation 4～6) of defective insulation through the transient characteristic of analytical voltage.
Patent documentation 1: japanese kokai publication sho 63-206667 communique
Patent documentation 2: japanese kokai publication sho 52-096358 communique
Patent documentation 3: the special fair 04-017394 communique of Japan
Patent documentation 4: japanese kokai publication hei 06-109796 communique
Patent documentation 5: No. 5438272 instructions of United States Patent (USP)
Patent documentation 6: No. 6573728 instructions of United States Patent (USP)
But; In above-mentioned patent documentation 4～6 described inspection methods, when having the circuit (below, be called " circuit ") of little electric capacity in the printed-wiring board (PWB) and having the line short of big electric capacity; Because having the measured value of the circuit of little electric capacity increases significantly; But the recruitment of measured value of circuit with big electric capacity is very small, can easily judge the circuit with little electric capacity and produce short circuit, is difficult to confirm and the such problem of which short circuit but exist.
In addition; Equally, the circuit that has little electric capacity is with the circuit with big electric capacity during with high resistance shorts (for example, state) relevant with short circuit; Because having the measured value of the circuit of little electric capacity increases; But the recruitment of measured value of circuit with big electric capacity is small, can easily judge the line short with little electric capacity, is difficult to confirm and the such problem of which line short but exist.
Summary of the invention
Therefore, the present invention is in order to address the above problem, and its purpose is to provide a kind of printed circuit board testing device and the inspection method that can find which circuit and which line short.
Above-mentioned and other purposes and new feature of the present invention, next clear and definite through the explanation and the accompanying drawing of this instructions.
In the application's invention disclosed, the summary of the representational embodiment of simple declaration is following.
That is, the printed circuit board testing device among the present invention has: the 1st and the 2nd probe, and it is used for checking that with conduct the circuit of the printed-wiring board (PWB) of object contacts; Measuring unit, it is through the above-mentioned the 1st or the 2nd probe, and the circuit of above-mentioned printed-wiring board (PWB) is applied square-wave voltage, measures the voltage-transition characteristic of above-mentioned circuit and the resistance value between above-mentioned circuit; And storage unit, the value that its storage is measured by above-mentioned measuring unit makes above-mentioned the 1st probe contact with the reference field of above-mentioned printed-wiring board (PWB); Above-mentioned the 2nd probe is contacted with the circuit of above-mentioned printed-wiring board (PWB), above-mentioned circuit is applied square-wave voltage, measure the voltage-transition characteristic of above-mentioned circuit through above-mentioned the 2nd probe; All circuits to above-mentioned printed-wiring board (PWB) carry out above-mentioned measurement; This value is stored in the said memory cells, the measured value and the above-mentioned measured value of measuring of the non-defective unit measured in advance compared above-mentioned comparative result; As long as 1 there are differences and just carries out confirming of short circuit line; Make the above-mentioned the 1st to contact respectively with the above-mentioned short circuit line of determining, measure the resistance value between above-mentioned short circuit line, relatively the above-mentioned resistance value of measuring and reference value with the 2nd probe.
In addition; Printed-wiring board (PWB) inspection method among the present invention; Have: the 1st probe is contacted with the reference field of the printed-wiring board (PWB) of conduct inspection object; The 2nd probe is contacted with the circuit of above-mentioned printed-wiring board (PWB), above-mentioned circuit is applied square-wave voltage, measure the step of the voltage-transition characteristic of above-mentioned circuit through above-mentioned the 2nd probe; All circuits to above-mentioned printed-wiring board (PWB) carry out above-mentioned measurement, store this value in the storage unit step; To the measured value of the non-defective unit of prior measurement and the step that the above-mentioned measured value of measuring compares; Above-mentioned comparative result is as long as 1 there are differences the step of confirming of just carrying out short circuit line; Make the above-mentioned the 1st to contact respectively with the above-mentioned short circuit line of determining, measure the step of the resistance value between above-mentioned short circuit line with the 2nd probe; And the step that the above-mentioned resistance value of measuring and reference value are compared.
Through printed circuit board testing device of the present invention and inspection method, irrelevant with the capacitance that circuit has, can easily find which circuit and which line short.
Description of drawings
Fig. 1 is the figure of the formation example of the printed circuit board testing device in an embodiment of the present invention.
Fig. 2 is illustrated in an embodiment of the present invention, the vertical view of an example of printed-wiring board (PWB).
Fig. 3 is illustrated in an embodiment of the present invention, the figure of the model of circuit on the printed-wiring board (PWB).
Fig. 4 is in the model of expression circuit shown in Figure 3, the circuit diagram of the equivalent circuit when state of insulation is good.
Fig. 5 is illustrated in the circuit model shown in Figure 3 the circuit diagram of the equivalent circuit when state of insulation is bad.
Fig. 6 is a presentation graphs 4 and the voltage of equivalent circuit shown in Figure 5 and the curve of time relationship.
Fig. 7 is the process flow diagram of the printed-wiring board (PWB) inspection method flow process in expression an embodiment of the present invention.
Fig. 8 is that the non-defective unit value is the circuit of 10pF in expression an embodiment of the present invention, the curve of 2 line capacitance relations after the short circuit during with 15M Ω and All other routes short circuit.
Symbol description among the figure: 1: probe; 2: probe support sector; 3: printed-wiring board (PWB); 4a, 4b, 4c, 4d, 4e, 4f, 4g: the circuit on the printed-wiring board (PWB) (circuit); 5: reference field; 6: portion of travel mechanism; 7: measurement section; 8: storage part; 9: control part.
Embodiment
Below, with reference to the accompanying drawings embodiment of the present invention is described in detail.And at all figure that are used for explaining embodiment, same parts is given identical symbol in principle, omits the explanation of its repetition.In addition, only otherwise stated, the symbol double as wiring simultaneously name of expression terminal name, signal name are for its magnitude of voltage of power supply also double as.
Fig. 1 representes that the integral body of the printed circuit board testing device in an embodiment of the present invention constitutes.Printed circuit board testing device in this embodiment for example, is made up of 2 probes 1, probe support sector 2, portion of travel mechanism 6, measurement section 7, storage part 8, control part 9 etc.
Portion of travel mechanism 6 is made up of various motor, the motor drive etc. that drives this motor.In portion of travel mechanism 6, through probe support sector 2 probe 1 is installed, probe 1 can move with printed-wiring board (PWB) 3 parallel directions (XY direction) and vertical direction (Z direction).And, in this embodiment, be to be that 2 situation is that example describes with probe 1, also can be more than 3.
Measurement section 7 is made up of voltage source, current source, meter etc., is connected with probe 1, through between probe, flowing through electric current or applying voltage, can measure the resistance of circuit in the printed-wiring board (PWB) 3.In addition, after can measuring the such circuit of printed wire slab integrals such as the GND circuit that covers in the printed-wiring board (PWB) 3 or power circuit and being examined the potential difference (PD) between the circuit, be transformed to capacitive component.And, when not covering the such circuit of above-mentioned printed wire slab integral, can use to be arranged on the outer electric conductivity reference field 5 of printed-wiring board (PWB).
Control part 9 is made up of CPU, RAM, ROM etc., carries out the drive controlling of portion of travel mechanism 6 or judges the resistance value measured by measurement section 7 or processing that capacitance etc. is whether bad etc.And control part 9 can be realized through the program of built-in realization above-mentioned functions or following actions in common computing machine, and this program also can be stored in the storage medium that floppy disk (registered trademark) or hard disk etc. can be read by computing machine.In addition, this program also can be by reading out in the communication agencies such as internet.
Fig. 2 is the vertical view of expression as an example of the printed-wiring board (PWB) of detected object.As shown in Figure 2, in printed-wiring board (PWB) 3, formed the circuit 4a～4e that forms by conductive materials such as metals of One's name is legion as the inspection object.
Below, the example that the inspection of the insulation in the printed circuit board testing device of present embodiment is moved describes.At first, use printed wire board clamp (not shown) fixing printing wiring board 3.
Then, control part 9 portions of control travel mechanism 6 contact 1 (the 1st probe) reference field 5 interior with printed-wiring board (PWB) or that printed-wiring board (PWB) is outer of probe 1.
Another probe 1 (the 2nd probe) contacts with checkpoint on the circuit, and inspection object circuit is applied square-wave voltage V, to pass (through) the external capacitor C of setting printed-wiring board (PWB) outside
0Signal (voltage V
0) measure.All circuits on the printed-wiring board (PWB) are carried out this process.The non-defective unit value of the measured value of each circuit with each circuit of measurement in advance, registration compared.Wherein, if measured voltage V
0With the non-defective unit value, all be that equal values then is judged as non-defective unit for all circuits, need only when existing 1 to be not equal values, just be judged as defective products.But; Owing to have which circuit to conclude on the printed-wiring board (PWB) and the situation of which line short; Through 1 probe is contacted with checkpoint on the circuit that the short circuit possibility is arranged; Another root probe is measured the resistance value between above-mentioned probe with after All other routes contact, and confirms resistance value than being the circuit of short circuit between the little circuit of the reference value of setting in advance (threshold value).
Below, with reference to Fig. 3～Fig. 7 on one side insulation inspection at length explained on one side.
As shown in Figure 3, in the circuit on printed-wiring board (PWB) 3, the electric capacity that has with respect to reference field 5 is C
1Circuit A (Net A) and be C with respect to the electric capacity of reference field 5
2Circuit B (NetB), consider that the resistance value between circuit A and circuit B is R
12The time model.
When circuit A on printed-wiring board (PWB) 3 and the state of insulation of circuit B are good, resistance value R
12Become very large value (desirable is infinitely great).In addition, because the outer non-essential resistance R of substrate
0Use very large value, when the state of insulation of circuit A and circuit B was good, the equivalent circuit of the model of Fig. 3 became Fig. 4.
Suppose that the electric capacity between circuit A and circuit B is C
12, the voltage V between impressed voltage V, circuit A and circuit B
12Can represent by formula (1).
Wherein, because C
12Compare C
1, C
2Little, formula (1) is approximately formula (2).
In addition, because C
0With C
1, C
2Compare very big because V
12Be roughly impressed voltage V, if impressed voltage V is a high voltage, the voltage V between circuit A and circuit B
12It also is high voltage.
In addition, the equivalent circuit of Fig. 3 model under circuit A on the printed-wiring board (PWB) and the state of insulation condition of poor of circuit B becomes Fig. 5, because C
12Compare C
1, C
2Little, apply voltage V between voltage V and circuit A and circuit B
12Can represent by formula (3) approx.
Formula (1), though time lapse, voltage V
12Do not change yet, but formula (3), after index portion becomes 1, with the passing of time, voltage V
12Reduce gradually.Formula (1) and formula (3) can be expressed as the curve of Fig. 6.And in Fig. 6, transverse axis is represented elapsed time t, and the longitudinal axis is represented the voltage V between circuit A and circuit B
12, non-defective unit expression (1), the situation of short circuit expression (3).
For example, V is 250V, C
1Be 1000pF, C
2Be 1000pF, C
0Be 0.1 μ F, R
12During for 1G Ω, in the formula (3), the V after 1 microsecond
12Become 250V, but the V after 50 milliseconds
12Become 236V, V after 100 milliseconds
12Reduce to 224V.
Therefore, be applied in high voltage between circuit, its characteristic is according to the state of insulation between circuit and difference.
And, although the voltage between clear circuit A and circuit B, but in actual inspection because the potential difference (PD) between measuring circuit not, but according to pass (through) capacitor C
0Signal obtain, consider through capacitor C
0Voltage of signals V
0
As shown in Figure 3, consider that the electric capacity on the printed-wiring board (PWB) is C
1Circuit A and the electric capacity on the printed-wiring board (PWB) be C
2Circuit B, the resistance value between circuit A and circuit B is R
12The time model.Wherein, because R
0Be very large value, the equivalent circuit of the model of Fig. 3 can be by shown in Figure 4.
Here, when circuit A and circuit B dead short, the resistance R between circuit A and circuit B
12, become 0 Ω or near the value of 0 Ω.On the other hand, when circuit A and circuit B are non-defective unit, R
12For tens of～more than the hundred M Ω, desirable situation becomes infinitely-great resistance value.R
12Resistance value when getting infinity, that is, be under the state of non-defective unit at circuit A and circuit B, potential difference (PD) V
0Can be by formula (4) expression, the capacitor C of circuit A
1Can represent by formula (5).
Fig. 7 representes the example of the insulation inspection action in the printed circuit board testing device of present embodiment.
As shown in Figure 7, at first, in step 101, detect the printed-wiring board (PWB) of non-defective unit, obtain all route survey values.The measured value of each circuit is converted into capacitance, and registration is as non-defective unit value (step 102).
Then, in step 103, measure all circuits as the printed-wiring board (PWB) of inspection object, the value of measurement is converted into capacitance.
Then, in step 104, by each line capacitance value of measuring in the non-defective unit value (capacitance) of each circuit of registration in each circuit comparison step 102 and the step 103.
Wherein, there is not the measured value of the circuit of short circuit to become identical with the non-defective unit value.In addition, during short circuit, measured value (capacitance) increases, and becomes same capacitance between the circuit of short circuit.
In addition, during with high resistance shorts, the model equivalent circuit of Fig. 3 can be represented by formula (6) between circuit.
Wherein, if consider circuit A and circuit B with resistance value 15M Ω high resistance shorts, when the non-defective unit value of circuit A was 10pF, the relation of circuit A and circuit B measured value can be obtained by formula (6), the curve representation of Fig. 6 above-mentioned relation.Know by Fig. 6, can not become same capacitance with 2 circuits of high resistance shorts.
In addition, in the circuit of short circuit, the capacitance of at least 1 circuit increases.For example, when the non-defective unit value is the circuit A of 1pF electric capacity and circuit B short circuit that the non-defective unit value is 1pF, circuit A, the capacitor C of circuit B
1And C
2All become 2pF, circuit A, circuit B have increased by 100% (measured value of 2 circuits increases)., when the non-defective unit value is the circuit A of 100pF electric capacity and circuit B short circuit that the non-defective unit value is 1pF, the capacitor C of circuit A, circuit B
1And C
2All become 101pF.With C
2Increment rate increase by 10000% significantly, opposite C
1Increment rate only 1%.Because make the upper deviation, electric capacity self error also is the degree of several %, can not be judged as increase (having only 1 route survey value to increase) by the increase of 1% degree.
According to foregoing, if measured value is all identical for all circuits with the non-defective unit value, just judge that printed-wiring board (PWB) is a non-defective unit, finish inspection (step 105).
On the other hand, as long as when having 1 place's measured value circuit different, just judge there is short circuit between circuit entering step 106 with the non-defective unit value.
In step 106, when having short circuit between circuit, because the circuit that measured value increases has 1 at least, the circuit that measured value is increased is judged as short circuit line.In addition, owing to all become same capacitance between the circuit of short circuit, the circuit that the circuit that extracting increases with measured value has same capacitance is as short circuit candidate (イ).Even when having high resistance shorts, owing to there is situation, extracts the circuit that has increased with measured value and have the candidate (ロ) of the circuit of same capacitance as high resistance shorts with identical capacitance values.
In addition; Although the circuit that exists electric capacity to increase; But when not having the circuit of same capacitance; Can judge the situation that exists high resistance shorts such, but since can not clear and definite which circuit with which circuit with high resistance shorts, so carry out the screening (step 107) (Ha) of the circuit candidate of high resistance shorts.The circuit candidate of screening high resistance shorts is carried out as follows.
Consider the model of Fig. 3; For the convenience of explaining, suppose that the electric capacity of capacity ratio circuit B of circuit A is big, measure the little circuit of capacity ratio circuit B; Because it is little to give the changes in capacitance of circuit B, from the candidate of high resistance shorts, gets rid of (A) so will measure the little circuit of capacity ratio circuit B.In addition, if having and the circuit of circuit B non-defective unit value,, from the candidate of high resistance shorts, get rid of (B) so will have with the circuit of circuit B non-defective unit value equal values because the electric capacity of this circuit also becomes greatly with equivalence.And, know that by Fig. 6 because the line capacitance of high resistance shorts is big more, the rate of change of circuit B is big more, uses prior preset threshold and formula (3) to screen candidate (C).
For example, the threshold value of setting defective insulation is 15M Ω, i.e. R
12=15M Ω, the non-defective unit value of circuit B is 10pF, when the measured value of circuit B is 22.5pF, can from the candidate of high resistance shorts, get rid of according to condition (A) circuit that measurement capacitance is littler than 10pF.In addition, can from the candidate of high resistance shorts, get rid of measurement capacitance according to condition B is the circuit of 10pF.And the circuit that can from the candidate of high resistance shorts, get rid of not enough about 150pF according to condition (C).Know by Fig. 8, can read C
1C during=22.5pF
2Value be about 150pF.And Fig. 8 is that expression non-defective unit value is the curve of the circuit of the 10pF capacitance relation of 2 circuits after the short circuit during with 15M Ω and All other routes short circuit.
Therefore, can from the candidate of high resistance shorts, remove the circuit of eligible (A) or condition (B) or condition (C), can electric capacity be had circuit more than the 150pF as the candidate of high resistance shorts circuit.
Therefore, finally can extract meet (イ) perhaps (ロ) perhaps the circuit of the condition of (Ha) as the candidate of the circuit of short circuit or high resistance shorts.After finishing the extraction of circuit candidate of short circuit or high resistance shorts, 1 probe is contacted with checkpoint on the circuit that the short circuit possibility is arranged, another root probe is measured the resistance value (step 108) between above-mentioned probe with after All other routes contact.Behind the circuit as short circuit between the circuit of confirming the resistance value that expression is littler than prior preset threshold fully, be judged as defective products (step 109), finish inspection.
And above-mentioned each step can be implemented by the printed circuit board testing device in the present embodiment shown in Figure 1 automatically.That is, comprise the control part 9 of CPU, RAM etc., possess software or the hardware of carrying out above-mentioned each step, portion of control travel mechanism 6, measurement section 7 etc. are carried out above-mentioned each step.Data such as the non-defective unit value in each step, measured value, threshold value, setting value are stored in the storage part 8.And the software that control part 9 is carried out also can be stored in the storage part 8.
Therefore, by printed circuit board testing device in the present embodiment and inspection method, big or small irrelevant with line capacitance, can carry out short circuit line discovery, confirm.In addition, even for the high resistance shorts between circuit, also can find, confirm.
More than, the invention that according to the embodiment of the present invention present inventor is proposed has been carried out bright specifically, and still, the present invention is not limited to above-mentioned embodiment, certainly carries out various changes in the scope that does not break away from its purport.
(application possibility on the industry)
The present invention can be used in the inspection of printed-wiring board (PWB).
Claims (10)
1. printed circuit board testing device is characterized in that having:
The the 1st and the 2nd probe, it is used for checking that with conduct the circuit of the printed-wiring board (PWB) of object contacts;
Measuring unit, it is through the above-mentioned the 1st or the 2nd probe, and the circuit of above-mentioned printed-wiring board (PWB) is applied square-wave voltage, measures the voltage-transition characteristic of above-mentioned circuit and the resistance value between above-mentioned circuit; And
Storage unit, the value that its storage is measured by above-mentioned measuring unit,
Above-mentioned the 1st probe is contacted with the reference field of above-mentioned printed-wiring board (PWB), above-mentioned the 2nd probe is contacted with the circuit of above-mentioned printed-wiring board (PWB), above-mentioned circuit is applied square-wave voltage, measure the voltage-transition characteristic of above-mentioned circuit through above-mentioned the 2nd probe,
All circuits to above-mentioned printed-wiring board (PWB) carry out above-mentioned measurement, this value stored in the said memory cells,
Measured value and the above-mentioned measured value of measuring to the non-defective unit measured in advance compare,
Above-mentioned comparative result, as long as 1 there are differences and just carries out confirming of short circuit line,
Make the above-mentioned the 1st to contact respectively with the above-mentioned short circuit line of determining, measure the resistance value between above-mentioned short circuit line with the 2nd probe,
Above-mentioned resistance value of measuring and reference value are compared.
2. printed circuit board testing device according to claim 1 is characterized in that,
In the confirming of above-mentioned short circuit line, the circuit that the above-mentioned measured value of measuring is increased is judged as short circuit line.
3. printed circuit board testing device according to claim 2 is characterized in that,
In the confirming of above-mentioned short circuit line, extract have the identical electric capacity of the circuit that increases with the above-mentioned measured value of measuring circuit as the short circuit candidate.
4. printed circuit board testing device according to claim 2 is characterized in that,
In the confirming of above-mentioned short circuit line, extract circuit with the identical measured value of the circuit that increases with the above-mentioned measured value of measuring candidate as high resistance shorts.
5. printed circuit board testing device according to claim 2 is characterized in that,
In the confirming of above-mentioned short circuit line; When the circuit with the identical measured value of the circuit that increases with the above-mentioned measured value measured does not exist; Get rid of the measured value measure than the little circuit of the measured value of above-mentioned circuit and the circuit with value identical, the candidate of screening the high resistance shorts circuit with the measured value of the non-defective unit of above-mentioned circuit.
6. printed-wiring board (PWB) inspection method is characterized in that having:
The 1st probe is contacted with the reference field of the printed-wiring board (PWB) of conduct inspection object; The 2nd probe is contacted with the circuit of above-mentioned printed-wiring board (PWB); Through above-mentioned the 2nd probe above-mentioned circuit is applied square-wave voltage, measure the step of the voltage-transition characteristic of above-mentioned circuit;
All circuits to above-mentioned printed-wiring board (PWB) carry out above-mentioned measurement, store this value in the storage unit step;
To the measured value of the non-defective unit of prior measurement and the step that the above-mentioned measured value of measuring compares;
Above-mentioned comparative result is as long as 1 there are differences the step of confirming of just carrying out short circuit line;
Make the above-mentioned the 1st to contact respectively with the above-mentioned short circuit line of determining, measure the step of the resistance value between above-mentioned short circuit line with the 2nd probe; And
The step that the above-mentioned resistance value of measuring and reference value are compared.
7. printed-wiring board (PWB) inspection method according to claim 6 is characterized in that,
In the confirming of above-mentioned short circuit line, the circuit that the above-mentioned measured value of measuring is increased is judged as short circuit line.
8. printed-wiring board (PWB) inspection method according to claim 7 is characterized in that,
In the confirming of above-mentioned short circuit line, extract have the identical electric capacity of the circuit that increases with the above-mentioned measured value of measuring circuit as the short circuit candidate.
9. printed-wiring board (PWB) inspection method according to claim 7 is characterized in that,
In the confirming of above-mentioned short circuit line, extract circuit with the identical measured value of the circuit that increases with the above-mentioned measured value of measuring candidate as high resistance shorts.
10. printed-wiring board (PWB) inspection method according to claim 7 is characterized in that,
In the confirming of above-mentioned short circuit line; When the circuit with the identical measured value of circuit that increases with the above-mentioned measured value measured does not exist; Get rid of the measured value measure than the little circuit of the measured value of above-mentioned circuit and the circuit with value identical, the candidate of screening the high resistance shorts circuit with the measured value of the non-defective unit of above-mentioned circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-028560 | 2009-02-10 | ||
| JP2009028560A JP5060499B2 (en) | 2009-02-10 | 2009-02-10 | Inspection apparatus and inspection method for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101799507A CN101799507A (en) | 2010-08-11 |
| CN101799507B true CN101799507B (en) | 2012-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910127159 Active CN101799507B (en) | 2009-02-10 | 2009-03-16 | Printed circuit board testing device and testing method |
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|---|---|
| JP (1) | JP5060499B2 (en) |
| CN (1) | CN101799507B (en) |
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| JP6069884B2 (en) * | 2012-05-08 | 2017-02-01 | 日本電産リード株式会社 | Insulation inspection method and insulation inspection apparatus |
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| CN110554301A (en) * | 2019-09-06 | 2019-12-10 | 依利安达(广州)电子有限公司 | Method for detecting machine resistance of electric measuring machine and printed circuit board electric measuring machine |
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| CN101799507A (en) | 2010-08-11 |
| JP2010185697A (en) | 2010-08-26 |
| JP5060499B2 (en) | 2012-10-31 |
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