CN101156163A - 使用带有高质量外表面的各向同性热固粘合材料制造带有集成电子器件的高级智能卡的方法 - Google Patents

使用带有高质量外表面的各向同性热固粘合材料制造带有集成电子器件的高级智能卡的方法 Download PDF

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CN101156163A
CN101156163A CNA2005800492594A CN200580049259A CN101156163A CN 101156163 A CN101156163 A CN 101156163A CN A2005800492594 A CNA2005800492594 A CN A2005800492594A CN 200580049259 A CN200580049259 A CN 200580049259A CN 101156163 A CN101156163 A CN 101156163A
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polymeric material
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保罗·里德
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Abstract

本发明涉及一种制造高级智能卡或类似设备的方法，通过使用将会成为所述高级智能卡的核心层的热固或热塑材料注塑成型，可以制造带有集成在卡结构底层中的高度复杂电子部件(例如集成电路芯片、电池、微处理器、发光二极管、液晶显示器、聚合物半球形开关、和天线)的高级智能卡以及类似大小的装置(例如证件、标签)，其具有由聚氯乙烯(PVC)、聚碳酸酯(PC)、合成纸或其它合适材料构成的高质量外表面。层压完工处理能提供高质量的下表面，而把电子部件封装在热固或热塑材料中可以提供对层压热量和压力的防护。

Description

使用带有高质量外表面的各向同性热固粘合材料制造带有集成电子器件的高级智能卡的方法
技术领域
本发明一般地涉及高级智能卡，其包含电池、LED、LCD、聚合物半球形开关、指纹传感器、以及其它未曾出现在常规智能卡内的电子部件。常规智能卡具有传统信用卡的大小，它们通常包含集成电路(IC)芯片，并且当该卡必须通过射频(RF)传输来传送数据时还可以包含天线。高级智能卡可以包含诸如电池、显示器件、和键盘等未曾出现在常规智能卡中的部件。因此高级智能卡能够提供很多复杂的功能，比如显示数据、让用户能够输入个人识别号(PIN)和密码、以及检测安全威胁。
背景技术
智能卡如今广泛用于访问控制系统、生物统计数据存储、国界控制、以及很多其它的应用。智能卡典型地包含用户相关的信息。例如，美国国防部(DoD)通用卡(CAC)计划需要非接触式芯片来包含有关于一个市民的生物统计数据，其包含数字化的肖像和指纹数据。这些高级智能卡典型地由多层结构组成，该结构具有一个或多个塑料层，该塑料层包围着存储数据的集成电路。通过射频(RF)传输来把数据传送到该卡和从该卡传出。仅通过RF传输来传送数据的卡即所谓的“非接触式”卡。非接触式高级智能卡包含用于把数据传输出入该集成电路的天线，以进行RF传输。出于在后9.11环境下的日益增加的安全考虑，非接触式RFID芯片被并入护照等证件以及其它证件或函件形式中。
现有技术的智能卡构造中存在一些问题，即现有技术智能卡利用PVC的硬度来保护天线和集成电路免受弯曲破坏。PVC的每层都必须具有预定厚度，以包围并保护所述部件。为了维持所需的硬度并容纳必需的部件，这些PVC卡与其它类型的卡比如信用卡相比倾向于较厚。一般来说，所得的这些多层结构厚约0.060英寸。另外，PVC会随着时间推移以及紫外线的照射而倾向于变脆。这会使其随时间而失效。此外，还需要专门的打印设备来在该PVC材料的外表面上打印信息。
许多其它的问题会随着热层压所需的高温高压而频繁出现，包括对易碎的集成电路(IC)芯片、天线(通常是细绕组、细薄的蚀刻铜或者细薄的淀积银)、以及其它电子部件的损坏。用在塑料卡层压生成工艺中的通常约为300的高热等级、以及通常约为从1,000至30,000PSI或更高的压力范围，是对智能卡部件造成严重的热量及物理压力的原因。
需要一种改进的制造高级智能卡(包含集成电路、天线、电池、聚合物半球形开关、液晶显示器、发光二极管阵列、指纹传感器)的方法，该方法能够把敏感的部件安全可靠地并入既薄且柔的卡结构中，并且使用低温(例如低于150)和低压(例如小于100PSI)。
由于材料科学和电子学方面的进步，新一代高度复杂的智能卡在技术上已变得可行。微型电池、数据显示器、键盘、甚至指纹传感器都已获得发展，可以并入形状为智能卡大小的装置中。这些进步正在刺激新的智能卡能力和应用。例如，装备有电池、数据显示器、和键盘的智能卡能够让用户查看与下述有关的数据：1)电子钱包应用的收支平衡，2)最近的信用卡交易信息，或3)银行账户结余信息。这些能力也可用于提高启用密码的信用卡功能的安全性。尽管这些扩展的智能卡能力提供着新型应用的极大潜力，但使用基于层压的制造技术来大规模生产高级卡却是非常困难，因为在层压时所用的高温高压会对电子部件造成破坏。需要一种使用低温低压的新的卡生产工艺来把脆弱的电子部件有效地并入卡体中。
发明内容
因此本发明的目的之一是提供一种厚度不超过0.80mm(传统信用卡的厚度)的高级智能卡，其包含安全封装的高级智能卡电子部件，所述电子部件可以包括：集成电路、天线、电池、聚合物半球形开关、液晶显示器、发光二极管阵列、指纹传感器。
通过提供一种多层卡结构来实现此目的以及其它目的，该多层卡结构具有：由诸如合成纸、PVC、PC、或其它合适材料构成的顶层，包括集成电子组件(可以包括集成电路、天线、电池、聚合物半球形开关、液晶显示器、发光二极管阵列、和指纹传感器)的底层，其中带有由注塑聚合材料构成的核心层，其中所述注塑聚合材料对形成底层的电子部件进行安全的封装，并且与合成纸或其它合适材料构成的顶层安全地结合。
顶层和底层之间的空隙有利于形成匀流以及通过注塑聚合材料来完全封装电子部件。约为0.1至0.25mm的空隙允许注塑聚合物充满其中，覆盖电子部件和顶层的底表面，其中不带有任何气孔、气囊，并且聚合材料均匀且完全地分布在所述空隙中。
所述形成了底层的集成电子组件在单个连续的板上制成，然后通过机械工具将其切割成能够允许该高级智能卡的周边被注塑聚合物覆盖的形状。
附图说明
图1是根据本专利公开的指导制造的高级智能卡的剖视侧视图。
图2和图3是安装来制造本专利公开中高级智能卡的第一优选实施例的模具的剖视侧视图，其中示出了在把液态聚合材料注入高级智能卡的顶层和底层之间以前的特定高级智能卡部件(见图2)、以及在把聚合材料注入顶层和底层之间的空隙并因此用聚合材料填充该空隙以及把高级智能卡的顶层冷成型为顶模的证件成型腔的轮廓以后的特定的高级智能卡部件(见图3)(例如集成电路芯片和天线绕组)。
图4是示出正从高级智能卡前体上移除的模具的剖视图，其中所述前体是通过图3所概述的系统形成的。
图5描述了一种能够同时制造6个高级智能卡(尺寸约为54mm×85mm)的模具系统。
图6说明了根据此专利公开的指导制造的接触式高级智能卡的剖视图。
图7说明了根据此专利公开的指导制造的非接触式高级智能卡的剖视图。
图8说明了根据此专利公开的指导制造的双接口高级智能卡的剖视图。
图9说明了根据此专利公开的指导制造的带有指纹传感器30的双接口高级智能卡的剖视图。
图10说明一种带有传感器条37的化学敏感高级智能卡的剖视
图，其中该高级智能卡是化学反应性的，并且在检测到特定的化学物质或辐射时提供可见信号。通过本公开中卡制造方法所用的低温低压处理可以保护该热敏传感器条不会高温劣化。
图11说明一种根据本专利公开的指导制造的带有声学扬声器73的非接触式智能卡的剖视图。
具体实施方式
图1描述一种根据此专利公开的指导制造的高级智能卡22的剖视侧视图。按照其最终的形态，这样的高级智能卡将会包括顶层24、底层26、和中间层或核心层28。顶层24是合成纸(例如TeslinTM)、PVC、聚碳酸酯、或其它合适材料的薄膜或板。底层26是基片电路板上的电子组件(例如柔性印刷电路板的聚酰亚胺或传统印刷电路板的工业标准FR4)，其包含许多集成电子部件，比如发光二极管(LED)30、电池32、聚合物半球形开关33、微处理器35、天线31、液晶显示器34。中间层或核心层由热固聚合材料34组成(例如，初始为液态或半液态的热固树脂)，其在凝固时构成最终高级智能卡的中间层或核心层28。该中间层或核心层28对底层26顶表面上所有暴露的电子部件进行完全封装。最终会变成该高级智能卡的中间层28的热固材料34被注入顶层24和底层26之间的空隙36中。所注入的聚合材料34应当能够在申请者的处理中所采用的相对低温低压的形成条件下注入。
无论如何，此热固聚合材料将会被注入并填充由顶层24的内表面38和底层26的内表面40所限定的空隙36。在凝固时，中间层28的聚合材料34应当与顶层24的内表面38和底层26的内表面40都相结合或粘合，以制成统一的高级智能卡体。可以通过用数种方法的任一种分别对顶层的内表面38和底层的内表面40进行处理来辅助所述粘合。例如，可以采用本技术领域公知的粘合增强剂(例如氯代聚烯烃)来增强核心层成型热固材料与制成顶层和底层的材料(例如Teslin、PVC、聚酰亚胺)之间的粘合。仅作示例，明尼苏达矿业及制造公司的基础初级产品4475.RTM可以用于此粘合增强目的，尤其是在顶层或底层材料为PVC时。其它的可用于顶层和/或底层内表面的处理包括等离子电晕处理和酸蚀。
高级智能卡的厚度39由热固材料注入空隙36(作为此专利公开的低温低压成型处理的一部分)时模面(图1中未示出)的放置来限定。实际上，把热固材料注入顶层和底层之间的空隙36中会填充空隙36中任何未被从底层26凸出的电子部件占据的部分。
电子部件按照图2中所建议的方式在底层顶表面上进行的布局使引入的液态或半液态聚合材料能够流入覆盖并包围暴露的电子部件的所有侧面。
凝固后的热固聚合物的弹性属性能够保护底层中的电子部件以免受物理应力和热应力。封装了所有暴露电子部件的该弹性体的减震属性使得该组件能够抵御弯曲和/或扭曲和/或冲击力，该高级智能卡会在其主外表面或者四个外侧边缘表面的任何一个上遭受到该弯曲和/或扭曲和/或冲击力。该弹性体的隔热属性还能够减少在最终热层压处理期间采用PVC薄层来在底层的底面上生成高质量外表面时电子部件可能受到的热量。
图2和图3对比说明该申请者用于制造高级智能卡的方法的第一优选实施例。也即，图2描述了本发明的一个特别优选的实施例，其中示出了由比如TeslinTM的合成纸或比如PVC的塑性材料构成的平整顶层或板24在根据此专利公开的技术以低温低压来形成之前的状态。换句话说，图2描述了在注入聚合材料之前安装的模具，其中示出了初始时位于顶模44的高级智能卡成型腔下面的平整的顶层24(例如PVC的平片)，并且示出了位于底模46上面的底层26(例如基片上的集成电子组件)。然而在该申请者的一些较次优选但仍然可行的处理实施例中，顶层24可以优选地被预制模或者至少部分地预制模成顶模中高级智能卡成型腔64的一般轮廓。相比之下，底模46不具有与顶模44中的型腔相当的型腔。示出了插入腔口49的用于注入液体或半液体热塑或热固聚合材料34的喷嘴48，其中腔口49通向限定在顶层24的内表面38和底层26的内表面40之间的空隙36。高级智能卡顶层的顶表面与底层的底表面之间的距离由距离39表示。空隙36被示出从并列的顶层24和底层26的左端向右端扩展。换句话说，在图2中，顶层24的外表面55未与顶模44的高级智能卡成型腔64的内表面56相接触。以对比的方式，底层26的外表面58被示出与底模46的内表面60形成大致平整的毗邻接触。图3描述了把热固聚合材料注入顶层24和底层26之间的空隙36的效果。因而，图3示出了在顶模44中把顶层24模制成高级智能卡成型腔64之后的状态。
在图2和图3中，包含在高级智能卡的底层26中的电子部件(如天线31、电池32、IC芯片35)都被示为置于包括底层的集成电子组件中。用来制造高级智能卡的本发明能够兼容并可用于很大范围的卡设计，该设计在底层上并入各种部件和器件。对底层26中电子部件的详细设计将取决于该高级智能卡所打算进行的特定应用。这些应用可以包括：建筑物入口的访问控制、银行卡或ATM卡的数据显示、识别卡的密码输入、以及安全相关应用的指纹鉴定(使用指纹传感器)。
出于本发明的目的，除了必须满足尺寸约束以外，对底层26中电路和电子部件的具体设计不作严格要求。对于按照此方法制造的符合ISO 7810的高级智能卡来说，底层中的电子元件必须适配在81mm(长度)×49mm(宽度)并且最大高度为0.55mm(含底层基片)的形状因数(form factor)范围内。图3中的距离43约为0.15mm，其表示从顶层24的内表面38到安装在底层26上的最高电子部件30的顶表面之间的最小间距。要求该最小距离43允许注入足够的聚合材料来封装安装在底层上的电子部件并且提供适当的减震和隔热属性。
在图2中，顶模44被示出具有型腔64，其定义将在注入处理期间形成的高级智能卡的顶表面轮廓。为此，液体或半液体的热固聚合材料34的注入都应当处在使顶层24于低温低压中形成在顶模44的型腔64中的压力和温度条件下。图3示出本专利公开的低温低压成型处理如何实际地使顶层24的顶表面55遵从顶模44中高级智能卡成型腔64的结构。再者，在图3中示出了将底层26的底表面58模压在底模46的大致平坦的内表面60上的状态。这是制造本专利公开的高级智能卡的一个特别优选的安排。
在图2和图3中，顶模44的前唇区域66和底模46的前唇区域68被示出彼此隔开距离70(考虑到顶层24和底层26的厚度)，实际上，所述距离70限制了顶层24和底层26在模44和模46的唇区域处的距离36(即空隙的宽度)。此距离70应当使得热固聚合材料34能够被注入空隙36中超过整个高级智能卡的长度(例如从其左侧到其右侧)。安装在图2所示系统右侧的模具的对应距离70’和左侧的对应距离70可以不同。在任何情况下，距离70’都应当使限定在通过顶模44的后唇66’的顶层24内表面38与通过底模46的后唇68’的底模26内表面40之间的距离36’很小，但仍有限。也就是说，这个很小的距离36’应当足够大，以允许空隙36中最初分别存在于顶层24和底层26(再次参见图2)之间的气体72(如空气、聚合物成分反应产生的气体等)、以及过量的聚合材料从所述空隙36中排出，但是该距离还应当足够小，以保持注入热固聚合材料的注入压力。事实上，距离36’优选地具有足够大的尺寸以允许液体聚合材料34自身的平滑薄层“喷出”或“飞出”空隙36——并由此使得所有残留在、或产生于空隙36中的全部气体从所述空隙、实际上从模具系统自身中被排出去。这样，所有的气体72会完全被引入的液体热固材料34所替换。此项排气技术用于防止在最终(即在热固材料凝固时)会构成核心层28的热固材料34内形成气泡。
图4示出从模具系统中移出的如图3所示类型的高级智能卡的半成品或前体。截面线84-84和86-86分别示出如何切除或修剪高级智能卡的前体的左端和右端，来产生最终的高级智能卡的锐边和精确的尺寸。在此情况下，距离74约为85毫米，以符合识别卡的ISO7810规格。
图5说明根据本专利公开的某些优选实施例而进行的模制过程，其中同时模制了6个尺寸约为85mm×54mm的高级智能卡。
图6说明根据本专利公开的指导制造的完全接触式高级智能卡。
图7说明根据本专利公开的指导制造的完全非接触式高级智能卡。
图8说明根据本专利公开的指导制造的双接口式高级智能卡。
图9说明根据本专利公开的指导制造的带指纹传感器30的双接口式高级智能卡。
图10说明一种带有传感器条37的化学敏感高级智能卡，其中该高级智能卡是化学反应性的，并且在检测到特定的化学物质或辐射时提供可见信号。通过本公开中卡制造方法所用的低温低压处理可以保护该热敏传感器条免受高温劣化的影响。
图11说明一种根据本专利公开的指导制造的带有声学扬声器73的非接触式智能卡。
尽管对本发明的描述与各种特定示例以及基于使用特殊胶合剂和胶合过程的概念的倾向有关，但是应当理解，文中所述的发明在范围上仅受权利要求的限制。

Claims (21)

1.一种制造高级智能卡或类似设备的方法，其中所述高级智能卡或类似设备包括顶层、热固聚合材料的核心层、以及包含安装在基片上的集成电子组件的底层，所述方法包括步骤：
(1)将安装在基片上的集成电子组件置于底模中，使得基片中的孔被底模中的模定位器紧固；
(2)将合成纸(例如TeslinTM)或其它合适材料的顶层置于顶模中；
(3)按照使顶层和集成电子组件之间产生空隙的方式将顶模贴近至底模；
(4)将热固聚合材料在一定的温度和压力条件下注入空隙中，使得：
(a)通过模定位器将安装在基片上的集成电子组件固定在原位；材料的顶层至少部分地被低温低压模压入顶模的型腔中；
(b)气体和过量的聚合材料被从空隙中排出；
(c)把集成电子组件的暴露区封装在热固聚合材料中；并且
(d)热固聚合材料粘合顶层与底层来制成高级智能卡体的统一前体；
(5)从顶模和底模中移出高级智能卡体的统一前体；以及
(6)将高级智能卡的前体修剪至所期望的尺寸以制成最终的高级智能卡。
2.如权利要求1所述的方法，其中所述安装在基片上的集成电子组件具有最大为54mm高、85.6mm长、和0.50mm厚的尺寸。
3.如权利要求1所述的方法，其中所述基片是印刷电路板。
4.如权利要求1所述的方法，其中对顶层的内表面和底层的内表面进行处理，使得顶层和热固材料之间以及底层和热固材料之间易于产生强固的粘结。
5.如权利要求1所述的方法，其中通过对顶层的内表面和底层的内表面敷涂粘合增强剂来进行处理。
6.如权利要求1所述的方法，其中通过电晕放电处理来对顶层的内表面和底层的内表面进行处理。
7.如权利要求1所述的方法，其中热固聚合材料以大约环境压力和大约500psi之间的压力注入空隙中。
8.如权利要求1所述的方法，其中热固聚合材料以大约80和大约120psi之间的压力注入空隙中。
9.如权利要求1所述的方法，其中热固聚合材料以大约56.和大约100.之间的温度注入空隙中。
10.如权利要求1所述的方法，其中热固聚合材料以大约65.和大约70.之间的温度注入所述空隙中。
11.如权利要求1所述的方法，其中薄膜承载的字母数字/图形信息被施加到顶层的内表面上。
12.如权利要求1所述的方法，其中把不透明防护材料层施加到顶层的内表面上。
13.如权利要求1所述的方法，其中所述集成电子组件包括从如下组中选择的电子部件：微处理器、天线、集成电路(IC)芯片、电池、发光二极管(LED)、液晶显示器(LCD)、聚合物半球形开关、电阻、传感器(比如指纹传感器)、以及电容器。
14.如权利要求1所述的方法，其中顶层由聚合材料的平板形成。
15.如权利要求1所述的方法，其中顶层被预形成为带有至少一个卡成型腔。
16.如权利要求1所述的方法，其中顶层被模压进入顶模的高级智能卡成型腔，底层被模压为与底模的一个大致平坦的表面相对。
17.如权利要求1所述的方法，其中所述热固聚合材料是聚氨酯。
18.如权利要求1所述的方法，其中所述热固聚合材料是环氧树脂。
19.如权利要求1所述的方法，其中所述热固聚合材料是不饱和聚酯。
20.如权利要求1所述的方法，其中所述空隙被一个门充满，所述门的宽度至少是通过该门所填充的高级智能卡的前体边缘宽度的25％。
21.一种制造高级智能卡或类似设备的方法，其中所述高级智能卡或类似设备包括顶层、热固聚合材料的核心层、以及包含安装在基片上的集成电子组件的底层，所述方法包括步骤：
(1)使用最大尺寸为54mm宽、85.6mm长、和0.50mm厚的安装在基片上的集成电子组件，把该安装在基片上的集成电子组件置于底模中，使得基片中的孔被底模中的模定位器紧固；
(2)将合成纸(例如TeslinTM)或其它合适材料的顶层置于顶模中；
(3)按照使顶层和集成电子组件之间产生空隙的方式将顶模贴近至底模；
(4)将热固聚合材料在65.和70.之间的温度以及80PSI至120PSI之间的压力条件下注入空隙中，使得：
(a)通过模定位器将安装在基片上的集成电子组件固定在原位；
(b)材料的顶层至少部分地被低温低压模压入顶模的型腔中；
(c)气体和过量的聚合材料被从空隙中排出；
(d)把集成电子组件的暴露部分封装在热固聚合材料中；并且
(e)热固聚合材料粘合顶层与底层来制成高级智能卡体的统一前体；
(5)从顶模和底模中移出高级智能卡体的统一前体；以及
(6)将高级智能卡的前体修剪至所期望的尺寸以制成最终的高级智能卡。
CNA2005800492594A 2005-03-23 2005-03-23 使用带有高质量外表面的各向同性热固粘合材料制造带有集成电子器件的高级智能卡的方法 Pending CN101156163A (zh)

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