CN100561666C - Semiconductor technology processing system and processing method thereof - Google Patents
Semiconductor technology processing system and processing method thereof Download PDFInfo
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- CN100561666C CN100561666C CNB2007101949752A CN200710194975A CN100561666C CN 100561666 C CN100561666 C CN 100561666C CN B2007101949752 A CNB2007101949752 A CN B2007101949752A CN 200710194975 A CN200710194975 A CN 200710194975A CN 100561666 C CN100561666 C CN 100561666C
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Abstract
A kind of semiconductor technology processing system, it comprises vacuum lock, transfer chamber and one or more treatment chamber; Wherein, transfer chamber is between vacuum lock and treatment chamber, and treatment chamber can center on the transfer chamber setting; Be provided with conveyer in the transfer chamber.The present invention can be only by the motion of conveyer, and do not need vacuum lock or treatment chamber to adjust the position at vertical direction, can finish process conditions loading and unloading or switching motion, thereby can reach loading and unloading and exchange process spare at low cost more rapidly, the raising production capacity.The invention also discloses a kind of treatment chamber that adopts the air inlet system and exhaust system of particular design, make and form reacting gas curtain barrier between each processing platform in the treatment chamber, can promote between each processing platform all once, avoided the reacting gas between the different disposal platform to crosstalk.
Description
This case is that application number is 200510028562.8, and the applying date is on August 5th, 2005, and name is called the dividing an application of patent application of " semiconductor technology processing system and processing method thereof ".
Technical field
The present invention relates in particular to a kind of semiconductor technology processing system and processing method thereof about the semiconductor manufacturing facility technical field.
Background technology
Two kinds of semiconductor technology processing systems commonly used are arranged at present, and a kind of is the system that process conditions is carried out batch process, and another kind then carries out monolithic to process conditions to be handled.In batch processing system, the multi-disc process conditions is by flatly or be placed vertically and handle simultaneously.
Owing to handle the multi-disc process conditions simultaneously in the device, so the spacing between the process conditions is extremely limited.This just need handle with low pressure and eliminate the gas pressure gradient, and generally speaking, under the situation of process conditions spacing greater than its thickness 1/4th, pressure should be less than 500 millitorrs, and deposition rate at this moment can be less than 100A/min.This means need be longer process time.
Though the monolithic treatment system has advantage aspect product treatment homogeneity, thermal effect and single batch of process velocity, its low production capacity and expensive production cost obviously are the critical defects that is difficult to overcome.
A kind of system of batch process is provided for the background parts that overcomes the above problems No. the 5855681st, United States Patent (USP).As shown in figure 12, this batch processing system 101 has treatment chamber 102, and 102 have a plurality of processing platforms 103 in the treatment chamber, treatment chamber 102 single treatment multi-disc process conditions simultaneously just like this, and needn't consider pitch problems between the process conditions.
But there are some problems too in this type systematic, and influences the processing speed and the quality of process conditions, handles when can not carry out the high volume process part effectively.Wherein, the problem of main influence processing quality is the homogeneity of the treatment conditions of each processing platform.The homogeneity of treatment conditions mainly contains the influence of two aspects, i.e. reacting gas and temperature.If airtight between the general processing platform, then form the thermal isolation between the platform, the temperature homogeneous between each processing platform is difficult to control; If not airtight between the processing platform, then the reacting gas between each processing platform may form mutually and crosstalk, and influences the homogeneity of handling atmosphere between each processing platform.
Handle when therefore, the present treatment chamber that comprises a plurality of processing platforms still can not be carried out the high volume process part equably.
In addition, United States Patent (USP) provides another kind of process conditions batch processing system No. 6860965.As shown in figure 13, this system simplification transfer chamber 111, realized the floor space that board is littler.But these system loading system 112 complexity, the process conditions rate of loading is slower, needs in the operation to reserve the loading and unloading that a period of time is used to wait for process conditions, has influenced production efficiency.This just need provide a kind of handler of process conditions fast and method, to reduce the stand-by period of cargo handling process, accelerates the process conditions treatment effeciency.
Arts piece processing device in this patent can only have a treatment chamber 113 simultaneously.Therefore reduce the quantity that each board can simultaneously treated process conditions, increased production cost.
In addition, existing processes part batch process device also exists a common problem, i.e. complicated in mechanical structure, and not easy care, and conveyer is when loading and unloading or exchange process spare, and it is higher to transmit cost, and the unit's of making production capacity descends.
Summary of the invention
The object of the present invention is to provide and a kind ofly solve that present process conditions mass production device reliability is not high, the semiconductor technology processing system of the problem of complicated in mechanical structure.
The present invention realizes by following technical method: a kind of semiconductor technology processing system comprises:
A plurality of treatment chamber, each described treatment chamber inside is provided with a plurality of process conditions processing platforms;
One transfer chamber, described a plurality of treatment chamber are around described transfer chamber setting;
A plurality of vacuum locks, link to each other with described transfer chamber, each described vacuum lock is provided with a plurality of grooves and is used to place semiconductor arts piece, and described vacuum lock is used for untreated semiconductor arts piece being provided and receiving the semiconductor arts piece of handling from described a plurality of treatment chamber for described a plurality of treatment chamber;
A conveyer that is arranged in the described transfer chamber, it has at least two telescopic transferring arms, each described transferring arm can move up and down and do the horizontal direction rotation to adjust the position, so that take out, place semiconductor arts piece in described a plurality of vacuum locks and described a plurality of treatment chamber along the main shaft of conveyer.
Another object of the present invention is to provide a kind of semiconductor technology processing system that present process conditions mass production device processing homogeneous is not high, can not carry out the problem of process conditions batch process in high quality that solves.
The present invention realizes above-mentioned purpose by following technical method: a kind of semiconductor processing chamber, comprise chamber top cover and chamber basal disc, be provided with a plurality of processing platforms in the described treatment chamber, it is characterized in that: described treatment chamber inside comprises that also the division board of bleeding is positioned on described a plurality of processing platform, and the described division board of bleeding has a plurality of and the corresponding clearance hole of bleeding of processing platform.
Wherein, in semiconductor processing process, described chamber top cover and chamber basal disc lump together, and in its confined reaction space of inner formation, the described division board of bleeding is positioned at described confined reaction space.Described chamber top cover is provided with depressed part, and described depressed part and described a plurality of clearance hole of bleeding spatially are connected.The depressed part of described chamber top cover is provided with the spray head of several and each corresponding projection of clearance hole of bleeding, be provided with in the chamber basal disc below the described division board of bleeding and the corresponding heating base of each clearance hole of bleeding, in the semiconductor arts piece processing procedure, spray head is near the clearance hole and spray reacting gas to the semiconductor arts piece that is positioned on the heating base of bleeding of the division board of bleeding, reacting gas again from spray head with bleed between clearance hole the gap discharge and flow into depressed part.
Depressed part periphery on the described chamber top cover is provided with the extension that is connected with depressed part.Also be provided with the exhaust outlet that is connected with described extension around the described division board of bleeding.On the chamber basal disc, be provided with the air discharge duct that at least one is used for exhaust, and air discharge duct is connected with the exhaust outlet of the division board of bleeding.Described chamber basal disc bottom is provided with the exhaust passage that communicates with described air discharge duct, and described exhaust passage links to each other with exhaust apparatus.
Air flow direction is in the described treatment chamber: reacting gas is sent into each processing platform by spray head, the semiconductor arts piece that is placed on the heating base is handled, because the air pressure of gas handling system and exhaust apparatus are to the extraction of reacting gas, reacting gas flows out from spray head and the gap between clearance hole of bleeding, enter the depressed part of chamber top cover, and it is mobile to the extension of depressed part, exhaust outlet around the division board of bleeding flow in the air discharge duct of chamber basal disc, enters exhaust apparatus by the exhaust passage that communicates with air discharge duct again.
Be provided with the exhaust outlet of a plurality of symmetries around the described division board of bleeding.
Be provided with the inert gas air curtain that upwards sprays around the described heating base, below heating base, deposit and film growth to prevent particulate dust.
The aperture of the described clearance hole of bleeding is wide at the top and narrow at the bottom.
Another technical scheme is: a kind of semiconductor processing chamber, comprise chamber top cover and chamber basal disc, be provided with a plurality of processing platforms in the described treatment chamber, it is characterized in that: comprise that also the division board of bleeding is placed on described a plurality of processing platform, the described division board of bleeding has a plurality of bleed clearance holes corresponding with processing platform, described chamber top cover is provided with spray head a plurality of and each corresponding projection of clearance hole of bleeding, be provided with in the chamber basal disc below the described division board of bleeding and the corresponding heating base of each clearance hole of bleeding, in the semiconductor arts piece processing procedure, the spray head of the projection of described each correspondence, bleed clearance hole and heating base acting in conjunction makes each processing platform reaction environment isolate mutually.
Wherein, described each corresponding spray head, bleed clearance hole and heating base acting in conjunction processing a slice semiconductor arts piece.
The periphery of the described clearance hole of bleeding is provided with several radial slot, and being distributed as near a side of the division board periphery of bleeding of described radial groove dredged near a side at the division board center of bleeding.
The chamber basal disc is provided with the loading hatch that is used for the loading and unloading capacity part over against transfer chamber one side.The heating base bottom is connected with inert gas and deposits and film growth below heating base to prevent particulate dust.
A further object of the present invention is to provide the present process conditions mass production device of a kind of solution process conditions handling speed slow, the treatment system of the problem that the process conditions treatment effeciency is low.
The present invention realizes above-mentioned purpose by following technical method: a kind of transmission method of process conditions of semiconductor technology processing system comprises:
A plurality of treatment chamber are provided, and each described treatment chamber inside is provided with a plurality of process conditions processing platforms;
One transfer chamber is provided, and described a plurality of treatment chamber are around described transfer chamber setting;
A plurality of vacuum locks are provided, link to each other with described transfer chamber, each described vacuum lock is provided with a plurality of grooves and is used to place semiconductor arts piece, and described vacuum lock is used for untreated semiconductor arts piece being provided and receiving the semiconductor arts piece of handling from described a plurality of treatment chamber for described a plurality of treatment chamber;
A conveyer that is arranged in the described transfer chamber is provided, described conveyer is provided with at least one first transferring arm and one second transferring arm, described first transferring arm and second transferring arm can stretch, and can be respectively move up and down and do the horizontal direction rotation to adjust the position along the main shaft of conveyer, each described transferring arm can take out, place semiconductor arts piece respectively in described a plurality of vacuum locks and described a plurality of treatment chamber;
First transferring arm of described conveyer from described a plurality of vacuum locks one takes out the untreated semiconductor arts piece of a slice, rotates this first transferring arm and second transferring arm loading hatch of one to described a plurality of treatment chamber then;
In the vertical direction moves second transferring arm of described conveyer to the appropriate orientation of aiming at described loading hatch, flatly mobile this second transferring arm is by loading hatch and enter described treatment chamber, in described treatment chamber, take out the semiconductor arts piece that a slice was handled, then, this second transferring arm semiconductor arts piece of carrying described processing is withdrawn from described loading hatch;
In the vertical direction moves first transferring arm of described conveyer to the appropriate orientation of aiming at described loading hatch, flatly mobile this first transferring arm is by loading hatch and enter described treatment chamber, and described untreated semiconductor arts piece is put into described treatment chamber.
Another technical scheme of the present invention is: a kind of process conditions stowage of semiconductor technology processing system comprises:
A., a plurality of treatment chamber are provided, and each described treatment chamber inside is provided with n semiconductor arts piece processing platform, and each described treatment chamber comprises a loading hatch;
B., one process conditions switching plane is provided, and it is arranged at each movably and handles chamber interior, is used for patting throughout and transmits process conditions between the platform;
C., one transfer chamber is provided, and described a plurality of treatment chamber are around described transfer chamber setting;
D., a plurality of vacuum locks are provided, it links to each other with described transfer chamber, each described vacuum lock is provided with a plurality of grooves and is used to place semiconductor arts piece, and described a plurality of vacuum locks are used for untreated semiconductor arts piece being provided and receiving the semiconductor arts piece of handling from described a plurality of treatment chamber for described a plurality of treatment chamber;
E., a conveyer that is arranged in the described transfer chamber is provided, described conveyer is provided with at least one first transferring arm and one second transferring arm, described first transferring arm and second transferring arm can stretch, and can be respectively move up and down and do the horizontal direction rotation to adjust the position along the main shaft of conveyer, described first transferring arm and second transferring arm can point to loading hatch and described a plurality of vacuum lock of described each treatment chamber respectively, to take out, to place semiconductor arts piece respectively in described a plurality of vacuum locks and described a plurality of treatment chamber;
F. respectively take out the untreated semiconductor arts piece of a slice among from described a plurality of vacuum locks one of described first transferring arm and second transferring arm;
G. rotate first transferring arm and the adjustment and first transferring arm that flatly stretches vertically, be located at over against the position of some loading hatch of described a plurality of treatment chamber;
H. move described first transferring arm carry a slice semiconductor arts piece, make it by described loading hatch and enter described treatment chamber inside, semiconductor arts piece is placed on the process conditions switching plane;
I. described first transferring arm is from the inner withdrawal of treatment chamber;
J. process conditions switching plane rotation n/one encloses;
K. rotate second transferring arm and the adjustment and second transferring arm that flatly stretches vertically, be located at position over against described loading hatch;
L. move described second transferring arm carry a slice semiconductor arts piece, make it by loading hatch and enter treatment chamber inside, semiconductor arts piece is placed on the process conditions switching plane;
M. described second transferring arm is from the inner withdrawal of treatment chamber;
N. process conditions switching plane rotation n/one encloses;
O. repeat above-mentioned steps f to n, until all corresponding a slice semiconductor arts piece that loads of n semiconductor arts piece processing platform of treatment chamber.
A kind of process conditions discharging method of semiconductor technology processing system comprises:
A., a plurality of treatment chamber are provided, and each described treatment chamber inside is provided with n semiconductor arts piece processing platform, and each described treatment chamber comprises a loading hatch;
B., one process conditions switching plane is provided, and it is arranged at each movably and handles chamber interior, is used for patting throughout and transmits process conditions between the platform;
C., one transfer chamber is provided, and described a plurality of treatment chamber are around described transfer chamber setting;
D., at least one vacuum lock is provided, links to each other with described transfer chamber;
E., a conveyer that is arranged in the described transfer chamber is provided, described conveyer is provided with at least one first transferring arm and one second transferring arm, described first transferring arm and second transferring arm can stretch, and can be respectively move up and down and do the horizontal direction rotation to adjust the position along the main shaft of conveyer, described first transferring arm and second transferring arm can point to the loading hatch and the described vacuum lock of described each treatment chamber respectively, to take out, to place semiconductor arts piece respectively in described vacuum lock and described a plurality of treatment chamber;
F. rotate first transferring arm and the adjustment and first transferring arm that flatly stretches vertically, be located at over against the position of some loading hatch of described a plurality of treatment chamber;
G. move described first transferring arm, make it by described loading hatch and enter described treatment chamber inside, take out the semiconductor arts piece that a slice was handled from the process conditions switching plane;
H. first transferring arm is carrying semiconductor arts piece that a slice handled from the inner withdrawal of described treatment chamber;
I. process conditions switching plane rotation n/one encloses;
J. rotate second transferring arm and the adjustment and second transferring arm that flatly stretches vertically, be located at position over against described loading hatch;
K. move described second transferring arm, make it by described loading hatch and enter described treatment chamber inside, take out the semiconductor arts piece that other a slice was handled from the process conditions switching plane;
L. second transferring arm is carrying semiconductor arts piece that described other a slice handled from the inner withdrawal of described treatment chamber;
M. rotate and stretch described first transferring arm and second transferring arm, and adjust the position of described first transferring arm and second transferring arm at vertical direction, make described first transferring arm and second transferring arm point to described vacuum lock;
N. the semiconductor arts piece that described first transferring arm and second transferring arm put in the described processing that described vacuum lock will carry separately respectively is positioned in the described vacuum lock;
O. repeat above-mentioned steps f to n, all unloaded until the semiconductor arts piece of n semiconductor arts piece processing platform of described treatment chamber.
A kind of process conditions switching method of semiconductor technology processing system comprises:
A., a plurality of treatment chamber are provided, each described treatment chamber inside is provided with n semiconductor arts piece processing platform, each described treatment chamber comprises a loading hatch, wherein is placed with the semiconductor arts piece that a slice was handled at least one processing platform of at least one described treatment chamber;
B., one process conditions switching plane is provided, and it is arranged at each movably and handles chamber interior, is used for patting throughout and transmits process conditions between the platform;
C., one transfer chamber is provided, and described a plurality of treatment chamber are around described transfer chamber setting;
D., a plurality of vacuum locks are provided, link to each other with described transfer chamber, each described vacuum lock is provided with a plurality of grooves and is used to place semiconductor arts piece, and described vacuum lock is used for untreated semiconductor arts piece being provided and receiving the semiconductor arts piece of handling from described a plurality of treatment chamber for described a plurality of treatment chamber;
E., a conveyer that is arranged in the described transfer chamber is provided, described conveyer is provided with at least one first transferring arm and one second transferring arm, described first transferring arm and second transferring arm can stretch, and can be respectively move up and down and do the horizontal direction rotation to adjust the position along the main shaft of conveyer, described first transferring arm and second transferring arm can point to loading hatch and described a plurality of vacuum lock of described each treatment chamber respectively, to take out, to place semiconductor arts piece respectively in described a plurality of vacuum locks and described a plurality of treatment chamber;
F. rotate and stretch first transferring arm and adjust first transferring arm vertically is located at the some positions over against described a plurality of vacuum locks;
G. first transferring arm puts in described vacuum lock and takes out the untreated semiconductor arts piece of a slice, again from described vacuum lock withdrawal;
H. rotate the described process conditions switching plane that is placed with the semiconductor arts piece that a slice handled, make semiconductor arts piece that described a slice at least handled loading hatch place over against its treatment chamber;
I. rotate and stretch second transferring arm and adjust second transferring arm vertically is located at the position over against described loading hatch;
J. move described second transferring arm, make it by described loading hatch and enter treatment chamber inside, take out the semiconductor arts piece of described processing from the process conditions switching plane;
K. rotate and stretch first transferring arm and adjust first transferring arm vertically is located at the position over against described loading hatch;
First transferring arm that l. will carry described untreated semiconductor arts piece puts in described treatment chamber, and described untreated semiconductor arts piece is placed on the described process conditions switching plane, and first transferring arm is withdrawn in described treatment chamber again;
M. rotate and stretch second transferring arm and adjust second transferring arm vertically is located at the position over against vacuum lock;
J. second transferring arm puts in the semiconductor arts piece that vacuum lock will handle and is placed in the vacuum lock, and second transferring arm is withdrawn in described vacuum lock again.
The present invention adopts unique conveyer process conditions transfer structure, and more promptly the loading and unloading capacity part improves production capacity.Treatment chamber of the present invention adopts the air inlet system and exhaust system of particular design, makes to form reacting gas curtain barrier between each processing platform, can promote between each platform all once, avoided the reacting gas between the different disposal platform to crosstalk.
Description of drawings
Fig. 1 is the perspective view of semiconductor technology processing system of the present invention.
Fig. 2 is the vertical view of semiconductor technology processing system of the present invention when omitting the treatment chamber top cover.
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of the treatment chamber of semiconductor technology processing system of the present invention.
Fig. 4 is the schematic diagram of a treatment chamber when chamber top cover open mode of semiconductor technology processing system of the present invention.
Fig. 5 is the schematic bottom view of the chamber basal disc of semiconductor technology processing system of the present invention.
Fig. 6 is the structural representation of the division board of bleeding of treatment chamber of the present invention.
The cutaway view that Fig. 7 cuts open along the I-I line for the chamber basal disc shown in Fig. 4.
Fig. 8 is the structural representation of vacuum lock of the present invention and transfer chamber.
Fig. 9 is positioned at the vertical view of treatment chamber for conveyer of the present invention.
Figure 10 is positioned at the vertical view of treatment chamber for process conditions switching plane of the present invention.
Figure 11 is a semiconductor arts piece loading process schematic diagram of the present invention.
Figure 12 is a kind of schematic diagram of existing semiconductor technology processing system.
Figure 13 is the schematic diagram of another kind of existing semiconductor technology processing system.
Embodiment
See also Fig. 1, Fig. 1 is the perspective view of semiconductor technology processing system of the present invention.The present invention is made of the factory interface 1 of a standard, two vacuum locks 2, transfer chamber 3, an one or more treatment chamber 4.Wherein, factory interface 1 is adjacent with vacuum lock 2.Transfer chamber 3 is between vacuum lock 2 and treatment chamber 4.A plurality of treatment chamber 4 can be provided with around transfer chamber 3.Include a plurality of processing platforms 5 in each treatment chamber 4, each processing platform 5 can be handled a slice semiconductor arts piece.In embodiment as shown in Figure 1, semiconductor technology processing system comprises that 4, two treatment chamber of two treatment chamber 4 are provided with around transfer chamber 3.Each treatment chamber 4 top is provided with a chamber top cover 8, and for the ease of explanation of the present invention, the chamber top cover 8 of one of them treatment chamber 4 is in closure state, and another chamber top cover 8 is in open mode.From the chamber top cover 8 of closure state, can see, the chamber top cover 8 of treatment chamber 4 is provided with a reacting gas feeding mechanism 6, and this reacting gas feeding mechanism 6 can be imported reacting gass from top different processing platform 5 in treatment chamber 4 of chamber top cover 8 by air inlet pipe.Can see that from the chamber top cover of opening 8 chamber top cover 8 inside have a depressed part 9, an extension 10 is respectively arranged around the depressed part 9.The spray head 11 that has a plurality of projectioies identical with the number of processing platform 1 in depressed part 9, spray head 11 are provided with several pores 12 that evenly gather and import in the processing platform 5 for the reacting gas that reacting gas feeding mechanism 6 provides.In addition, also be provided with at the support side of treatment chamber 4 and carry out process conditions and handle required control, exhaust and power set 7,, do not describe in detail herein for for purpose of brevity.Each treatment chamber 4 of the present invention can shared cover cleaning source and reacting gas generator, exhaust pump and an end-probing device.Under the situation of plasma activated chemical vapour deposition, can also a shared cover radio-frequency (RF) energy input unit between the processing platform 5 of same treatment chamber 4.
See also Fig. 2, Fig. 2 is the vertical view of semiconductor technology processing system of the present invention when default process chamber top cover.Among the embodiment among Fig. 2, transfer chamber 3 is pentagonal, can around it three treatment chamber 4 be set at most, is provided with two among the embodiment of Fig. 2, can certainly have only a treatment chamber 4.In some other embodiment, transfer chamber 3 also can be other different shapes, for example hexagons.Accordingly, the number of the treatment chamber 4 that can be provided with at most around the transfer chamber 3 also can be different.Treatment chamber 4 is to have the quadrangle that has four chamferings among the embodiment as shown in Figure 2, and its inside is provided with four processing platforms 5.Certainly in other some embodiment, treatment chamber 4 also can have the processing platform 5 of other different shapes and different numbers.
See also Fig. 3, Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of the treatment chamber in the semiconductor technology processing system of the present invention.In Fig. 3, treatment chamber comprises chamber top cover 8, the division board 13 of bleeding, process conditions switching plane 25, heating base 19 and chamber basal disc 18.Wherein, heating base 19 is installed in the axis hole 31 ' of chamber basal disc 18 by its central shaft 31, bleed division board 13, process conditions switching plane 25 and chamber basal disc 18 is installed together up and down along as shown in the figure common axial lines, and chamber top cover 8 and chamber basal disc 18 are mechanically coupled together and can open or closed.When chamber top cover 8 covers on chamber basal disc 18, chamber top cover 8 and airtight process conditions treatment chamber of chamber basal disc 18 inner formation.Need to prove that the treatment chamber inside among the present invention can be provided with a plurality of process conditions processing platforms, for convenience of explanation, in the embodiment shown in fig. 3, is example with four process conditions processing platforms only.
Chamber top cover 8 caves inward, and forms a depressed part 9, and the extension 10 of the overshooting shape of extension is arranged around this depressed part 9.When handling semiconductor arts piece, chamber top cover 8 closes with the chamber top cover, confined reaction cavity of inner formation, and reaction gas cognition flows in depressed part 9, and finally discharges treatment chamber (being detailed later).Be provided with four spray heads 11 in the depressed part 9 of chamber top cover 8, be uniform-distribution with pore 12 on the spray head 11 for the reacting gas input from depressed part 9 projectioies.
The division board 13 of bleeding is provided with and corresponding several of number and position of spray head 11 clearance hole 16 of bleeding.The bleed aperture of clearance hole 16 is wide at the top and narrow at the bottom, accordingly, spray head 11 diameters on the chamber top cover 8 are less than the upper end diameter of this clearance hole 16 of bleeding, lower end diameter greater than this clearance hole 16 of bleeding, this set makes when chamber top cover 8 covers at chamber basal disc 18, and spray head 11 has more closely with the clearance hole 16 of bleeding and contacts.In addition, bleed and also be provided with four exhaust outlets 14 that are connected with the extension 10 of the depressed part 9 of chamber top cover 8 around the division board 13.
Process conditions switching plane 25 is used for patting throughout between the platform 5 and transmits process conditions, but it has a shaft hole 33 and transferring arm 37 evenly that be provided with along shaft hole 33 peripheries and the folding corresponding logarithm of process conditions platform number, and each is to being used to place process conditions on the transferring arm 37.Process conditions switching plane 25 can rotate, and can make each transferring arm 37 just in time is positioned at the top of a processing platform 5.In the present embodiment, but that the division board exhaust outlet process conditions switching plane 25 of bleeding has a transferring arm 37 of four pairs of foldings is corresponding with the clearance hole 16 of bleeding of the division board 13 of bleeding.
In conjunction with reference to figure 3 and Fig. 4, be provided with an axis hole 33 ' with the shaft hole 33 coaxial hearts of process conditions switching plane 25 in the middle of the chamber basal disc 18, process conditions switching plane 25 is installed on the axis hole 33 ' in the chamber basal disc 18 by a rotating mechanism (not shown).Be provided with 4 process conditions processing platforms 5 in the chamber basal disc 18, each process conditions processing platform the inside is provided with an axis hole 31 ' and three axis holes 20 ', the support bar 31 of heating base 19 can oscilaltion in axis hole 31 ', and thimble 20 can oscilaltion in axis hole 20 '.Chamber basal disc 18 is provided with a process conditions loading hatch 23 for the process conditions turnover over against a side of a process conditions processing platform 5.Respectively be provided with an air discharge duct 17 that is used for exhaust in process conditions loading hatch 23 relative both sides on the chamber basal disc 18.Chamber basal disc 18 bottoms also are provided with the exhaust apparatus 22 that is connected with exhaust passage 21.Please combination is with reference to figure 7 again, and Fig. 7 is the cutaway view that the chamber basal disc 18 shown in Fig. 4 is cut open along the I-I line.As shown in Figure 7, by a link slot 27 the two is connected together between air discharge duct 17 and the exhaust passage 21.Therefore, air discharge duct 17, exhaust passage 21 and exhaust apparatus 22 are interconnected.
Fig. 6 is the structural representation of the division board 13 of bleeding of the present invention, as shown in Figure 6, the periphery of the clearance hole 16 of bleeding of division board 13 of bleeding is provided with several radial grooves 24, also is provided with a plurality of exhaust outlets 14 that are connected with the extension 10 of the depressed part 9 of chamber top cover 8 around the division board 13 of bleeding.
Please in conjunction with reference to figure 3, when process conditions is handled, chamber top cover 8 covers and form a process chamber on chamber basal disc 18, in process chamber, the division board 13 of bleeding is placed on the chamber basal disc 18, and each of the division board 13 of bleeding clearance hole 16 of bleeding just in time is positioned at the top of heating base 19, the spray head 11 of chamber top cover 8 and the division board 13 of bleeding bleed clearance hole 16 near, heating base 19 with bleed division board 13 near, processed process conditions is placed on heating base 19 and bleeds between the division board 13, the transferring arm 37 of process conditions switching plane 25 can make transferring arm 37 be positioned at the position that does not stop heating base 19 by the setting of variety of way, be not directly injected on the process conditions that is positioned on the heating base 19 thereby do not influence from the reacting gas of spray head 11 ejections.Thus, spray head 11, bleed division board 13 and heating base 19 actings in conjunction processing a slice semiconductor arts piece.Reacting gas feeding mechanism 6 gives processing platform 5 input reacting gass from the top of chamber top cover 8 by the pore on the spray head 11 12.Reacting gas gushes out from spray head 11, the semiconductor arts piece that is placed on the heating base 19 is handled, division board 13 is provided with radial slot 24 owing to bleed, make on the chamber top cover 8 spray head 11 with bleed division board 13 can not be airtight fully, the pore 12 that gathers from spray head 11 enters the reacting gas of processing platform 5 after handling process conditions, spill through the division board hole of bleeding that constitutes by these radial slot 24, enter the depressed part 9 that chamber top cover 8 caves inward, and it is mobile to the extension 10 of depressed part 9, because extension 10 is connected with a plurality of exhaust outlets 14 of the division board 13 of bleeding, again because the effect of exhaust apparatus 22, the gas that spills flow to a plurality of exhaust outlets 14 places on the division board 13 of bleeding automatically, because a plurality of exhaust outlets 14 are connected with air discharge duct 17 on being arranged on chamber basal disc 18, and because air discharge duct 17 and exhaust passage 21 are connected, gas just thus path entered exhaust passage 21, finally be deflated device 22 and extract out, form a complete air intake-exhaust system.Because the air pressure of reacting gas feeding mechanism 6 and the extraction of 22 pairs of reacting gass of exhaust apparatus, the flow velocity of the reacting gas of whole air intake-exhaust system can be very fast, around processing platform 5, form air curtain, make that the reacting gas between each platform is unlikely to interfere with each other.
Further, the influence of considering the difference of treatment chamber 4 air pressure inside sizes and the flow velocity of reacting gas being produced, the distribution of the present invention's radial slot 24 is set to dredge near a side of division board 13 central shaft holes 35 of bleeding near a side of division board 13 peripheries of bleeding.The complexity that flows to exhaust apparatus 22 for the reacting gas that flows out in each radial slot 24 is consistent like this, thereby air-flow is also just more even.
Because the processing platform 5 in the treatment chamber 4 is symmetrically arranged, the suffered obstruction of reacting gas that each processing platform 5 is discharged is consistent.The present invention has guaranteed the processing homogeneity between the multi-disc process conditions by making the gases of discharging by evenly, promptly be drawn out of near being arranged on air discharge duct 17 on the chamber basal disc 18 around the division board 13 of bleeding.And the present invention has adopted spray head 11 and the hole that is made of radial slot 14 between the division board 13 of bleeding is used as the exhaust outlet of processing platform 5, make that the air-flow in the processing platform 5 is more even, and the gas of discharging has formed air curtain, under the open condition of chamber interior, formed the air curtain isolation, made that the processing environment of each processing platform is relatively independent.Can around heating base 19, be provided with the inert reaction gas air curtain that upwards sprays in addition, further prevent reacting gas from heating base 19 and bleed between the division board 13 slot leakage or enter.By these measures, can avoid the phase mutual interference of reacting gas between the processing platform 5 effectively.
Please refer to Fig. 2, Fig. 2 is the vertical view of semiconductor technology processing system of the present invention when omitting the treatment chamber top cover.Process conditions is delivered to semiconductor technology processing system of the present invention by the process conditions casket through streamline, and factory interface 1 is taken out process conditions and is placed in the vacuum lock 2 from the process conditions casket.Be provided with a conveyer 15 in the transfer chamber 3, this conveyer 15 has at least two transferring arms (being detailed later) that can stretch respectively.Among the embodiment shown in the figure, conveyer 15 is the tow-armed robots with two transferring arms, can certainly be the robot that comprises two above transferring arms.This conveyer 15 takes out process conditions in vacuum lock 2, be placed into 5 li of processing platforms in the treatment chamber 4.When having placed process conditions in all processing platforms 5 of a treatment chamber 4, this treatment chamber 4 just can be carried out process conditions and be handled.After handling, take out the process conditions of handling by the conveyer in the transfer chamber 3 15 again, put into the processing that untreated process conditions is carried out next batch more simultaneously in position.The process conditions of taking out is put into vacuum lock 2 coolings.Via factory interface 1 it is placed into again after having cooled off and sends into next processing step in the process conditions casket on the streamline and handle.
See also Fig. 8, Fig. 8 is the structural representation of vacuum lock 2 of the present invention and transfer chamber 3.The present invention has two vacuum locks 2, and vacuum lock 2 is positioned at two adjacent edges of pentagon transfer chamber 3 near factory interface 1.Wherein each vacuum lock 2 is separated into four grooves, can hold a slice process conditions in each groove.Vacuum lock 2 and each groove thereof can be pumped into vacuum.Factory interface 1 can be loaded onto the process conditions in four grooves in the vacuum lock 2 or take away in one or many ground.Vacuum lock 2 can be divided into exchange layer and cooling layer in other embodiment, the former is used for process conditions passing between vacuum lock 2 and treatment chamber 4, the latter then is used for the intact process conditions of cooling processing, and it is delivered in the non-vacuum environment take away for factory interface 1.
As the transfer chamber among Fig. 83 are pentagonal vacuum chambers.In transfer chamber 3, has a conveyer 15, two transferring arms of conveyer 15 can on horizontal plane, rotate synchronously or independently rotate separately angle (such as, two transferring arms can be rotated into and be 180 degree mutually), and move up and down along main shaft separately, and can be elastic in the horizontal direction at vertical direction.During work, factory interface 1 transmits the box extraction process part to vacuum lock 2 from process conditions, again by the conveyer in the transfer chamber 3 15 with the process conditions treatment chamber 4 of packing into.
Fig. 9 is the vertical view that conveyer of the present invention is positioned at treatment chamber, and this conveyer 15 has two transferring arms 151,152, and these two transferring arms 151,152 are positioned at the upper-lower position of same main shaft.Two transferring arms 151,152 of conveyer 15 can rotate on the horizontal plane between vacuum lock 2 (Fig. 2) and the treatment chamber 4 (Fig. 2) or independent rotation synchronously.Conveyer 15 is packed into by the loading hatch 23 of its process conditions or is drawn off a slice process conditions to a treatment chamber by some transferring arms (transferring arm 151 or transferring arm 152) at every turn, and conveyer 15 can take out two blade technolgy spares at every turn in one or more vacuum locks 2.Each arm 151,152 of conveyer 15 can move down with the main shaft in the vertical direction of conveyer 15 and adjust the position, and each arm 151,152 of conveyer 15 can be freely elastic in the horizontal direction.Two transferring arms 151,152 of conveyer 15 can point to some directions simultaneously, such as, point to same vacuum lock or same treatment chamber simultaneously, also can be separately the different direction of sense of rotation separately, such as, two transferring arms point to two different technology framves of same vacuum lock respectively, or point to the technology frame of two different vacuum locks respectively; Perhaps, a transferring arm points to a vacuum lock, is used for getting or putting in this vacuum lock semiconductor arts piece, and another transferring arm points to a treatment chamber, is used for getting or putting in this treatment chamber semiconductor arts piece; Perhaps, two transferring arms point to two different treatment chamber that are arranged on the transfer chamber limit respectively, are used for getting or put semiconductor arts piece respectively in two treatment chamber.Therefore, a plurality of transferring arms of conveyer of the present invention can be carried out the action that picks and places of semiconductor arts piece neatly separately, can be simultaneously in one or more vacuum locks loading or unloading two chip semiconductor process conditions, can not have stand-by period ground continuously yet and in one or more treatment chamber, finish loading, unloading or the switching motion of semiconductor arts piece, be particularly useful for being integrated with the semiconductor technology processing system of a plurality of vacuum locks or treatment chamber, thereby the output of whole semiconductor technology processing system (throughput) is improved greatly.Therefore, conveyer 15 of the present invention is in process conditions exchange or cargo handling process, only need vertical position by the transferring arm 151,152 of adjusting conveyer 15, vacuum lock 2 process conditions supports with and treatment chamber 4 in process conditions switching plane 25 fix at vertical position, only finish the process conditions exchange by the motion of conveyer 15.
See also Figure 10, bleeding is provided with between division board 13 and the heating base 19 and each clearance hole 16 corresponding process conditions switching plane 25 of bleeding.In embodiment as shown in figure 10, it is corresponding with four clearance holes 16 of bleeding that this process conditions switching plane 25 has four pairs of transferring arms 37.This process conditions switching plane 25 can rotate and make it each is positioned at the top of processing platform 5 to transferring arm 37, transferring arm 37 tops are in order to place semiconductor arts piece, by cooperating the action of the thimble 20 among Fig. 3, can at an easy rate the transferring arm 37 of semiconductor arts piece from process conditions switching plane 25 be placed on the heating base 19, otherwise or, be placed into semiconductor arts piece on the transferring arm 37 of process conditions switching plane 25 from heating base 19, the transmission action of this process conditions is very general in the prior art, multiple mode can be arranged, do not describe in detail herein.This process conditions switching plane 25 can also rotate make wherein a pair of and loading hatch 23 over against, to cooperate conveyers 15 in the transfer chamber 3 process conditions to be positioned on a pair of transferring arm 37 of process conditions switching plane 25 or unloading process spare from the transferring arm 37.
After disposing, again process conditions is taken out chamber.Cooperate earlier the action of the thimble 20 among Fig. 3, make process conditions fall to placing on four pairs of transferring arms 37 on the process conditions switching plane 25.By rotating process conditions switching plane 25, make on the process conditions switching plane 25 each move to a side successively over against process conditions loading hatch 23 to transferring arm 37, transferring arm by conveyer 15 takes out the process conditions handled from each to transferring arm 37 by process conditions loading hatch 23 again, and is sent to vacuum lock 2.
Introduce the flow process of conveyer loading and unloading capacity part below in conjunction with accompanying drawing.As shown in figure 11, contain the transfer chamber 3 of conveyer 15 with 201,202, one of two vacuum locks here and the structure of two treatment chamber 401,402 is an example.Two vacuum locks 201,202 respectively have four grooves (not shown) in the present embodiment.Conveyer 15 has two transferring arms 151,152; Two treatment chamber 401 and 402 have a loading hatch 231,232 respectively over against transfer chamber 3, have four processing platforms in the treatment chamber 401,402 respectively, i.e. processing platform 511,512,513,514 and processing platform 521,522,523,524.
In the vacuum lock 201,202 four blade technolgy spares are arranged respectively at the beginning, do not have process conditions in two treatment chamber 401,402.Conveyer 15 utilizes two transferring arm 151,152 to take out a slice process conditions respectively from two grooves of vacuum lock 201, and this moment, two transferring arms 151,152 were in vertical position up and down.Again two transferring arms 151,152 are rotated in the horizontal direction loading hatch 231 places towards treatment chamber 401, then adjust the vertical position of transferring arm 151, make it over against loading hatch 231, and be placed on a pair of transferring arm 37 on the process conditions switching plane 25 process conditions switching plane 25 rotations 1/4th circles by the process conditions that elastic transferring arm 151 is held transferring arm 151; Next another one transferring arm 152 in the vertical directions of conveyer 15 are adjusted to over against loading hatch 231 places, the process conditions that transferring arm 152 is held is placed on the following a pair of transferring arm 37 on the process conditions switching plane 25, and process conditions switching plane 25 rotates 1/4th circles again.Thereafter two blade technolgy spares are taken out in conveyer 15 reposition again from two other groove of vacuum lock 201, and transferring arm 151,152 is rotated to over against loading hatch 231 places.Repeat aforementioned process, process conditions successively is placed on the process conditions switching plane 25, after process conditions switching plane 25 rotates a circle, all carry process conditions on four pairs of transferring arms 37, by the oscilaltion of process conditions switching plane 25 and the action of cooperation thimble 20 process conditions is placed on the processing platform 511,512,513,514 together again.So finish the process conditions loading work of a treatment chamber 401.Again conveyer 15 is retreated to the position of vacuum lock 202, repeat the process conditions loading work that above-mentioned steps is finished treatment chamber 402.
After loading was finished, vacuum lock 201,202 can be by the needs process conditions of reloading from the process conditions casket.Among the above embodiment, the order that the process conditions in the vacuum lock 201,202 picks and places is freely, might not need from top to bottom or from bottom to top.
After treatment chamber 401,402 is finished dealing with, the process conditions of having handled in the treatment chamber 401,402 need be taken out, and change untreated process conditions.Detailed process is as follows: conveyer 15 with taking out the untreated process conditions of a slice in the groove of its transferring arm 152 from vacuum lock 201, rotates to conveyer 15 at loading hatch 231 places of treatment chamber 401 from vacuum lock 201.Suppose transferring arm 152 this moment below transferring arm 151, and transferring arm 151 is over against loading hatch 231.Transferring arm 151 a pair of transferring arm 37 over against loading hatch 231 from the process conditions switching plane 25 takes out the process conditions that a slices were handled, after taking away, on a pair of transferring arm 37 of loading hatch 231, there is not process conditions, can wait for and put into the new untreated process conditions of a slice, then, transferring arm 152 rises to over against the position of loading hatch 231, and the untreated process conditions that its a slice of taking out from vacuum lock is new is placed on a pair of transferring arm 37 of just having taken the process conditions of handling on the process conditions switching plane 25 away, thereby can only pass through the transferring arm up and down 151 of conveyer 15,152 action is changed the process conditions that a slice was handled with the new untreated process conditions of a slice on the same a pair of transferring arm 37 of process conditions switching plane 25.Then, process conditions switching plane 25 rotates 1/4th circles again.Conveyer 15 repositions, its transferring arm 151 is placed on its process conditions of getting from process conditions switching plane 25 in the groove the vacuum lock 201, and transferring arm 152 takes out a slice process conditions in another groove from vacuum lock 201 again.Repeat above step, after the whole exchanges of four blade technolgy spares of a treatment chamber were finished, process conditions switching plane 25 is unified again to be placed into process conditions on the processing platform.And then carry out the process conditions exchange work of treatment chamber 402 again.
The another one preferred embodiment of vacuum lock design is vacuum lock to be designed to two-layer, and it is a transmission and an exchange that the exchange layer is used for process conditions at the middle and upper levels, and lower floor then is provided with the quartz pad that is easy to dispel the heat, and such design can be accelerated the cooling rate of process conditions.Supposing has 4 blade technolgy spares to handle in treatment chamber.Factory interface 1 can be placed a untreated process conditions at the exchange layer, and conveyer 15 usefulness transferring arms 152 take out untreated process conditions and rotate to loading hatch 231 positions of treatment chamber 401 from the exchange layer of vacuum lock.Transferring arm 151 is over against loading hatch 231, and transferring arm 152 is below transferring arm 151.Transferring arm 151 takes out the process conditions of handling on the process conditions switching plane 25, transferring arm 152 rises to over against the position of loading hatch 231 then, its process conditions of taking out from vacuum lock is placed on the process conditions switching plane 25, and process conditions switching plane 25 rotates 1/4th.Conveyer 15 rotates to vacuum lock 202, and transferring arm 151 is put into its cooling layer with the process conditions of handling, and transferring arm 152 is picked up a new untreated process conditions from the exchange layer of vacuum lock 202.Vacuum lock 201 and 202 exchange layer are obtained the new process conditions that is untreated from factory interface 1.The cooling layer of vacuum lock 202 cools off this process conditions and delivers in the non-vacuum environment so that factory interface 1 is picked up.More than finished the exchange of a slice process conditions.Then conveyer 15 returns vacuum lock 201 again after finishing exchange.Repeat same step, the process conditions exchange in treatment chamber 401 is finished, and carries out the process conditions exchange process of treatment chamber 402 again.
Only introduced the treatment chamber with four processing platforms among the above embodiment, the semiconductor technology processing system that has other numbers processing platform for each treatment chamber also can be released its handling method according to the simple class of last example.
Because conveyer of the present invention has at least two transferring arms that are positioned at the upper-lower position relation, and transferring arm can be regulated its upper-lower position along conveyer main shaft in the vertical direction, therefore, at conveyer in vacuum lock or treatment chamber during the pick-up process part, can be only motion by conveyer, and do not need vacuum lock or treatment chamber in the vertical direction adjustment, can finish process conditions loading and unloading or switching motion.In detail, semiconductor technology processing system is in the process of process conditions loading and unloading or exchange, the a plurality of transferring arms that only need to regulate conveyer are in the position of vertical direction, and do not need will adjust vacuum lock or the treatment chamber position at vertical direction as semiconductor technology processing system of the prior art.And, only pass through the action of the transferring arm up and down of conveyer, make it the loading hatch of aligned with process chamber respectively, change the process conditions that a slice was handled with the new untreated process conditions of a slice on the same a pair of transferring arm of the process conditions switching plane in treatment chamber at an easy rate, thereby can reach loading and unloading and exchange process spare at low cost more rapidly, improve production capacity.
The present invention uses above-mentioned conveyer in semiconductor technology processing system, has lot of advantages: compare with the conveyer of the double blade both arms (dual blades dual arms) of prior art, the cost of manufacture of conveyer of the present invention is lower, and in transmitting the process of semiconductor arts piece, locate more flexible and accuracy is higher; In addition, at least two transferring arms of conveyer of the present invention are along the main shaft upper and lower settings, the both arms that are different from the conveyer of prior art are provided with according to horizontal direction, thereby transfer chamber of the present invention can be provided with very for a short time, not only be convenient to the design of transfer chamber, and the floor space of whole semiconductor technology processing system is diminished, reduce manufacturing cost and maintenance cost greatly.Moreover, a plurality of transferring arms of conveyer of the present invention can be carried out the action that picks and places of semiconductor arts piece neatly separately, can be simultaneously in one or more vacuum locks loading or unloading two chip semiconductor process conditions, can not have stand-by period ground continuously yet and in one or more treatment chamber, finish loading, unloading or the switching motion of semiconductor arts piece, be particularly useful for being integrated with the semiconductor technology processing system of a plurality of vacuum locks or treatment chamber, thereby the output of whole semiconductor technology processing system is improved greatly.
That more than introduces only is based on several preferred embodiment of the present invention, can not limit scope of the present invention with this.Any device of the present invention is done replacement, the combination, discrete of parts well know in the art, and the invention process step is done well know in the art being equal to change or replace and all do not exceed exposure of the present invention and protection range.
Claims (14)
1, a kind of semiconductor processing chamber comprises chamber top cover and chamber basal disc, is provided with a plurality of processing platforms in the described treatment chamber, it is characterized in that:
Described treatment chamber inside comprises that also the division board of bleeding is positioned on described a plurality of processing platform, and the described division board of bleeding has a plurality of and the corresponding clearance hole of bleeding of processing platform;
Described chamber top cover is provided with the depressed part that spatially is connected with described a plurality of clearance holes of bleeding, described depressed part is provided with the spray head of several projectioies corresponding with described each clearance hole of bleeding, described spray head and bleed and have the gap between the clearance hole, this gap communicates with exhaust passage around the chamber by described depressed part as the exhaust outlet of described processing platform.
2, semiconductor processing chamber according to claim 1, it is characterized in that: in semiconductor processing process, described chamber top cover and chamber basal disc lump together, and in its confined reaction space of inner formation, the described division board of bleeding is positioned at described confined reaction space.
3, semiconductor processing chamber according to claim 1, it is characterized in that: be provided with in the chamber basal disc below the described division board of bleeding and the corresponding heating base of each clearance hole of bleeding, in the semiconductor arts piece processing procedure, spray head is near the clearance hole and spray reacting gas to the semiconductor arts piece that is positioned on the heating base of bleeding of the division board of bleeding, reacting gas again from spray head with bleed between clearance hole the gap discharge and flow into depressed part.
4, semiconductor processing chamber according to claim 3 is characterized in that: the depressed part periphery on the described chamber top cover is provided with the extension that is connected with depressed part.
5, semiconductor processing chamber according to claim 4 is characterized in that: also be provided with the exhaust outlet that is connected with described extension around the described division board of bleeding.
6, semiconductor processing chamber according to claim 5 is characterized in that: be provided with the air discharge duct that at least one is used for exhaust on the chamber basal disc, and air discharge duct is connected with the exhaust outlet of the division board of bleeding.
7, semiconductor processing chamber according to claim 6 is characterized in that: described chamber basal disc bottom is provided with the exhaust passage that communicates with described air discharge duct, and described exhaust passage links to each other with exhaust apparatus.
8, semiconductor processing chamber according to claim 7, it is characterized in that: air flow direction is in the described treatment chamber: reacting gas is sent into each processing platform by spray head, the semiconductor arts piece that is placed on the heating base is handled, because the air pressure of gas handling system and exhaust apparatus are to the extraction of reacting gas, reacting gas flows out from spray head and the gap between clearance hole of bleeding, enter the depressed part of chamber top cover, and it is mobile to the extension of depressed part, exhaust outlet around the division board of bleeding flow in the air discharge duct of chamber basal disc, enters exhaust apparatus by the exhaust passage that communicates with air discharge duct again.
9, semiconductor processing chamber according to claim 1 is characterized in that: the exhaust outlet that is provided with a plurality of symmetries around the division board of bleeding.
10, semiconductor processing chamber according to claim 3 is characterized in that: be provided with the inert gas air curtain that upwards sprays around the heating base, deposit and film growth below heating base to prevent particulate dust.
11, semiconductor processing chamber according to claim 1 is characterized in that: the aperture of the described clearance hole of bleeding is wide at the top and narrow at the bottom.
12, a kind of semiconductor processing chamber, comprise chamber top cover and chamber basal disc, be provided with a plurality of processing platforms in the described treatment chamber, it is characterized in that: comprise that also the division board of bleeding is placed on described a plurality of processing platform, the described division board of bleeding has a plurality of bleed clearance holes corresponding with processing platform, the periphery of clearance hole of bleeding is provided with several trough, described chamber top cover is provided with the depressed part that communicates with chamber exhaust passage on every side, described depressed part is provided with spray head a plurality of and each corresponding projection of clearance hole of bleeding, described spray head and described bleed clearance hole near, be provided with in the chamber basal disc below the described division board of bleeding and the corresponding heating base of each clearance hole of bleeding, in the semiconductor arts piece processing procedure, the spray head of the projection of described each correspondence, bleed clearance hole and heating base acting in conjunction makes each processing platform reaction environment isolate mutually.
13, semiconductor processing chamber according to claim 12 is characterized in that: described each corresponding spray head, bleed clearance hole and heating base acting in conjunction processing a slice semiconductor arts piece.
14, semiconductor processing chamber according to claim 12 is characterized in that:, described several trough is radial, being distributed as near a side of the division board periphery of bleeding of these several radial slot dredged near a side at the division board center of bleeding.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102194651A (en) * | 2010-03-12 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | Loading cavity of semiconductor film-forming device |
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| CN103726103B (en) * | 2012-10-10 | 2016-04-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of reaction chamber |
| CN104699025B (en) * | 2013-12-09 | 2018-03-06 | 中芯国际集成电路制造(上海)有限公司 | Process control method and process control system |
| US10236197B2 (en) * | 2014-11-06 | 2019-03-19 | Applied Materials, Inc. | Processing system containing an isolation region separating a deposition chamber from a treatment chamber |
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| CN213424928U (en) * | 2021-04-02 | 2021-06-11 | 台湾积体电路制造股份有限公司 | Semiconductor etching device |
| CN113463190A (en) * | 2021-05-13 | 2021-10-01 | 顾赢速科技(合肥)有限公司 | Epitaxial growth device |
| CN113745131B (en) * | 2021-08-31 | 2024-01-16 | 顾赢速科技(合肥)有限公司 | Multilayer epitaxy process and linear platform equipment thereof |
| CN114823432B (en) * | 2022-06-28 | 2022-09-02 | 江苏邑文微电子科技有限公司 | Semiconductor vacuum transmission platform and control method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194651A (en) * | 2010-03-12 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | Loading cavity of semiconductor film-forming device |
| CN102194651B (en) * | 2010-03-12 | 2013-03-27 | 中芯国际集成电路制造(上海)有限公司 | Loading cavity of semiconductor film-forming device |
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