CN100432679C - Vertical probe card - Google Patents
Vertical probe card Download PDFInfo
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- CN100432679C CN100432679C CNB2005100914121A CN200510091412A CN100432679C CN 100432679 C CN100432679 C CN 100432679C CN B2005100914121 A CNB2005100914121 A CN B2005100914121A CN 200510091412 A CN200510091412 A CN 200510091412A CN 100432679 C CN100432679 C CN 100432679C
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- probe
- frame body
- circuit board
- face
- guide mechanism
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Abstract
A vertical probe card is prepared as setting multiple concave conductive groove on surface of circuit board as each said groove being set with a ring wall, setting multiple through hole on guide mechanism being set at circuit board surface with conductive groove, setting the first end of probe in said conductive groove to make probe be connected against with ring wall and be electrically connected to circuit board and passing the second end of probe through said through hole set on guide mechanism.
Description
Technical field
The present invention is relevant with probe, is meant a kind of vertical probe carb especially.
Background technology
At present at test crystal covering type chip (Flip chip), or when having the chip of high density contact, mainly be to utilize vertical probe carb (Vertical Probe Card) to carry out the test job of chip; Each probe that vertical probe carb had is contact and the tester table that is electrically connected at chip to be tested with generally being vertical configuration, so that each probe is in order to transmit the test signal between tester table and wafer.
The structure of general vertical probe carb, as shown in Figure 4, vertical probe carb (60) includes a circuit board (61), a guide mechanism (62), and most probe (63); Circuit board (61) bottom surface has some weld pads (64) that are convex, guide mechanism (62) is located at the position of corresponding circuits plate (61) bottom surface, each probe (63) is located in the guide mechanism (62) in a movable manner, the top of each probe (63) is positioned at the below, position of each weld pad (64) of corresponding circuits plate (61), and then extend towards the outside of guide mechanism (62) bottom; When probe (60) is used to test a chip (not shown), each probe (63) bottom presses on the contact of chip, elasticity by each probe (63) makes probe (63) top be connected to each weld pad (64) simultaneously, and chip can electrically connect mutually with circuit board (61).
Yet, when each probe (63) two end of above-mentioned probe (60) electrically connect chip and circuit board (61) respectively, the electric current of moment conducting between probe (63) top and each weld pad (64) is higher, regular meeting makes the temperature overheating between the two, or even send spark, allow probe (63) top produce oxide layer and carbonization phenomenon, influence the electric conductivity and increase resistance value of each probe (63); And, probe after long-time the use, the more or less freely generation of composition member of probe (60) situation of breaking, the fiduciary level of probe is lower, serviceable life is also shorter.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of vertical probe carb, and each probe that this probe had more can not produce carbonization phenomenon, and the electric conductivity and the fiduciary level of whole probe are preferable, and serviceable life is longer.
For achieving the above object, vertical probe carb provided by the invention includes:
One circuit board, a surface of this circuit board is provided with the conductive trough that majority is recess, and respectively this conductive trough has a ring wall;
One guide mechanism, this guide mechanism have most perforation, and this guide mechanism is located at the surface that this circuit board has these conductive troughs; And
Most probes, respectively this probe has one first end and one second end; Respectively first end of this probe is located at respectively in this conductive trough, makes respectively that this probe is connected to this ring wall, and is electrically connected at this circuit board, and this second end then is arranged in the perforation of this guide mechanism.
Wherein this circuit board has an end face, a bottom surface, and one from this bottom surface towards the recessed location division of this end face, be provided with a fixture in this location division, the surface of this fixture is provided with these conductive troughs.
Wherein respectively this conductive trough has an end face, and this ring wall is located on this end face; Respectively the end face of this conductive trough and ring wall all have conducting film, and electrically connect mutually with this circuit board, and the distributing position of these conductive troughs is corresponding to the connecting point position of a chip to be measured.
Wherein this guide mechanism has a upper frame body, a distance piece of mutual storehouse, and a lower frame body, and this upper frame body and this lower frame body are located in these perforation.
Wherein this upper frame body is located in this circuit board, and each punch position of this upper frame body is corresponding to each conductive trough position of this circuit board.
Wherein this guide mechanism has a upper frame body, a distance piece of mutual storehouse, and a lower frame body, and this upper frame body and this lower frame body are located in these perforation, and this guide mechanism is to be located in the location division of this circuit board with this upper frame body.
Wherein each punch position of this upper frame body is corresponding to the position of this conductive trough respectively.
Wherein respectively this probe has an integrally formed vertical section and a stretch section; This stretch section is bending, and this first end is formed at this vertical section, and this second end is formed at this stretch section.
Wherein respectively this conductive trough has an end face, and this ring wall is located on this end face, this first end and this end face preset distance of being separated by.
Description of drawings
Fig. 1 is the diagrammatic cross-section of a preferred embodiment of the present invention;
Fig. 2 is the partial schematic diagram of a preferred embodiment of the present invention; And
Fig. 3 is analogous to Fig. 2, shows that mainly probe is connected to the situation of the end face of conductive trough;
Fig. 4 is the diagrammatic cross-section of known vertical probe carb.
Embodiment
Following conjunction with figs. is lifted a preferred embodiment, in order to structure of the present invention and effect are described further:
See also Figure 1 and Figure 2, be the vertical probe carb that a preferred embodiment of the present invention provided, probe (10) includes a circuit board (20), a guide mechanism (30), and most probe (40); Circuit board (20) has an end face (21), a bottom surface (22), and one from the bottom surface (22) towards the recessed location division (23) of end face (21), be provided with a fixture (24) in the location division (23), the surface of fixture (24) is provided with multi-conducting groove (25), respectively this conductive trough (25) is depressed in fixture (24), and then forms an end face (26) and a ring wall (27); The end face (26) and the ring wall (27) of each conductive trough (25) all have conducting film, and electrically connect mutually with circuit board (20), and the distributing position of these conductive troughs (25) is corresponding to the connecting point position of a chip (not shown) to be measured.
This guide mechanism (30) has a upper frame body (31), a distance piece (32) of mutual storehouse, and a lower frame body (33); Upper frame body (31) is all made with ceramic material with lower frame body (33), upper frame body (31) has the perforation (34,35) that majority is penetration state respectively with lower frame body (33), guide mechanism (30) is to be located in the location division (23) of circuit board (20) with upper frame body (31), and each perforation (34) position of upper frame body (31) is corresponding to each conductive trough (25) of circuit board (20).
Respectively this probe (40) is to make with conductive material, and each probe (40) is provided with an integrally formed vertical section (41) and a stretch section (42); Stretch section (42) is bending, vertical section (41) forms one first end (43), stretch section (42) forms one second end (44), the vertical section (41) of each probe (40) is located at the perforation (34) of the upper frame body (31) of guide mechanism (30), make first end (43) protrude upper frame body (31), and be embedded in each conductive trough (25) of circuit board (20); The periphery of first end (43) is connected to ring wall (27), makes each probe (40) be electrically connected at circuit board (20), and first end (43) in addition with the end face (26) of conductive trough (25) preset distance of being separated by; The stretch section (42) of each probe (40) then extends towards lower frame body (33) from vertical section (41), and is arranged in the perforation (34) of lower frame body (33), makes second end (44) protrude from lower frame body (33).
Via above-mentioned explanation, because first end (43) of each probe (40) is the ring wall (27) that directly is connected to conductive trough (25), make between each probe (40) and the circuit board (20) and all be the state of electrically conducting at any time, when probe (10) is used for test chip, and when second end (44) of each probe (40) is pressed on the contact of chip, first end (43) of probe (40) and circuit board (20) can make current lead-through between the two by conductive trough (25), electric current can not conduct in first end (43) and circuit board (20) in moment, thereby the temperature between probe (40) and circuit board (20) is lower, and first end (43) of probe (40) just can not produce carbonization phenomenon yet; In addition, as shown in Figure 2, when second end (44) of each probe (40) when pressing on chip, first end (43) of probe (40) can be because of stressed end face towards conductive trough (25) (26) direction slippage, even as illustrated in fig. 3, make first end (43) be connected to end face (26), each probe (40) that allows probe (10) be had thus all can be connected to each contact of chip.
Because can not produce carbonization phenomenon between each probe (40) and the circuit board (20), so each probe (40) the current value that can load higher, and, first end (43) of each probe (40) is with the mutual butt of the ring wall (27) of outer peripheral face and conductive trough (25), therefore the contact area between the two is bigger, the resistance of each probe (40) is less, and electric conductivity is preferable, also can be applicable to the test job of upper frequency simultaneously; In addition, because the upper and lower framework (31,33) of guide mechanism (30) is to make with stupalith, its structural strength is preferable, more can not produce the situation of structure breaking.
Thus, the present invention can reach each probe more can not produce carbonization phenomenon, and the electric conductivity and the fiduciary level of whole probe are preferable, and serviceable life is than long purpose.
Claims (8)
1. vertical probe carb includes:
One circuit board, a surface of this circuit board is provided with the conductive trough that majority is recess, and respectively this conductive trough has a ring wall;
One guide mechanism, this guide mechanism have most perforation, and this guide mechanism is located at the surface that this circuit board has these conductive troughs; And
Most probes, respectively this probe has one first end and one second end; Respectively first end of this probe is located at respectively in this conductive trough, makes respectively that this probe is connected to this ring wall, and is electrically connected at this circuit board, and this second end then is arranged in the perforation of this guide mechanism;
This probe is under test chip not, and this conductive trough has an end face, and ring wall is located at first end of this end face and probe and this end face preset distance of being separated by.
2. according to the described vertical probe carb of claim 1, it is characterized in that wherein this circuit board has an end face, a bottom surface, and one from this bottom surface towards the recessed location division of this end face, be provided with a fixture in this location division, the surface of this fixture is provided with these conductive troughs.
3. according to the described vertical probe carb of claim 1, it is characterized in that wherein respectively this conductive trough has an end face, this ring wall is located on this end face; Respectively the end face of this conductive trough and ring wall all have conducting film, and electrically connect mutually with this circuit board, and the distributing position of these conductive troughs is corresponding to the connecting point position of a chip to be measured.
4. according to the described vertical probe carb of claim 1, it is characterized in that wherein this guide mechanism has a upper frame body, a distance piece of mutual storehouse, and a lower frame body, this upper frame body and this lower frame body are located in these perforation.
5. according to the described vertical probe carb of claim 4, it is characterized in that wherein this upper frame body is located in this circuit board, each punch position of this upper frame body is corresponding to each conductive trough position of this circuit board.
6. according to the described vertical probe carb of claim 2, it is characterized in that, wherein this guide mechanism has a upper frame body, a distance piece of mutual storehouse, an and lower frame body, this upper frame body and this lower frame body are located in these perforation, and this guide mechanism is to be located in the location division of this circuit board with this upper frame body.
7. according to the described vertical probe carb of claim 6, it is characterized in that wherein each punch position of this upper frame body is corresponding to the position of this conductive trough respectively.
8. according to the described vertical probe carb of claim 1, it is characterized in that wherein respectively this probe has an integrally formed vertical section and a stretch section; This stretch section is bending, and this first end is formed at this vertical section, and this second end is formed at this stretch section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100914121A CN100432679C (en) | 2005-08-10 | 2005-08-10 | Vertical probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100914121A CN100432679C (en) | 2005-08-10 | 2005-08-10 | Vertical probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1912634A CN1912634A (en) | 2007-02-14 |
| CN100432679C true CN100432679C (en) | 2008-11-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100914121A Active CN100432679C (en) | 2005-08-10 | 2005-08-10 | Vertical probe card |
Country Status (1)
| Country | Link |
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| CN (1) | CN100432679C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101644724B (en) * | 2008-08-04 | 2012-08-08 | 旺矽科技股份有限公司 | Probe testing device |
| CN102193009B (en) * | 2010-03-16 | 2013-08-28 | 台湾积体电路制造股份有限公司 | Vertical probe card |
| CN105319400B (en) * | 2014-07-29 | 2018-03-23 | 中华大学 | Vertical probe carb and its process |
| CN107580681B (en) * | 2015-05-07 | 2020-06-19 | 泰克诺探头公司 | Test head with vertical probes, particularly for reduced pitch applications |
| TWI620938B (en) * | 2017-07-21 | 2018-04-11 | 中華精測科技股份有限公司 | Probe device |
| KR101958351B1 (en) * | 2017-08-04 | 2019-03-15 | 리노공업주식회사 | A test probe and test device using the same |
| CN110568232B (en) * | 2018-06-06 | 2023-02-17 | 台湾中华精测科技股份有限公司 | Probe card device and flat plate type switching structure thereof |
| CN110568231A (en) * | 2018-06-06 | 2019-12-13 | 中华精测科技股份有限公司 | Probe card device and three-dimensional signal switching structure thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2549589Y (en) * | 2002-04-23 | 2003-05-07 | 寰邦科技股份有限公司 | Brace and seat cover assembly |
| US6900646B2 (en) * | 1998-04-03 | 2005-05-31 | Hitachi, Ltd. | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
| CN2713630Y (en) * | 2004-06-03 | 2005-07-27 | 威盛电子股份有限公司 | Coating structure for probe card |
-
2005
- 2005-08-10 CN CNB2005100914121A patent/CN100432679C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6900646B2 (en) * | 1998-04-03 | 2005-05-31 | Hitachi, Ltd. | Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof |
| CN2549589Y (en) * | 2002-04-23 | 2003-05-07 | 寰邦科技股份有限公司 | Brace and seat cover assembly |
| CN2713630Y (en) * | 2004-06-03 | 2005-07-27 | 威盛电子股份有限公司 | Coating structure for probe card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1912634A (en) | 2007-02-14 |
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