CA2498133A1 - A scalable computer system having surface-mounted capacitive couplers for intercommunication - Google Patents

A scalable computer system having surface-mounted capacitive couplers for intercommunication Download PDF

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Publication number
CA2498133A1
CA2498133A1 CA002498133A CA2498133A CA2498133A1 CA 2498133 A1 CA2498133 A1 CA 2498133A1 CA 002498133 A CA002498133 A CA 002498133A CA 2498133 A CA2498133 A CA 2498133A CA 2498133 A1 CA2498133 A1 CA 2498133A1
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CA
Canada
Prior art keywords
subsystem
subsystems
pads
signal
electrical
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Granted
Application number
CA002498133A
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French (fr)
Other versions
CA2498133C (en
Inventor
Robert B Garner
Winfried W Wilcke
Howard Kahn
Barry J Rubin
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GlobalFoundries Inc
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Individual
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Publication of CA2498133A1 publication Critical patent/CA2498133A1/en
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Publication of CA2498133C publication Critical patent/CA2498133C/en
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Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/95—Electrical connector adapted to transmit electricity to mating connector without physical contact, e.g. by induction, magnetism, or electrostatic field

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Near-Field Transmission Systems (AREA)
  • Combinations Of Printed Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

A scalable and compact computer system of three-dimensional subsystems (20-23) each having capacitive couplers (25) of its external surfaces for transmitting and receiving electrical signals to and from adjacent subsystems (20-23). Each surface having an electrically non-conducting substrate, one or more electrically conducting pads on the substrate, and electrical leads for coupling the pads to the subsystem's circuits. Two adjacent pads, each from a different subsystem (20-23), form a capacitive coupler (35) to carry the signals between the subsystems (20-23). The pads are covered by a low-loss dielectric material having a large dielectric constant for improved signal transmission. A differential signal may be supported using two capacitive couplers (25) to respectively carry the positive and negative signals of the differential signal. The subsystems (20-23) might be replaced or left in place when they failed. Additional subsystems (20-23) might be added to the system to expand its capacity.

Claims (18)

1. A computer system comprising:
a plurality of three-dimensional subsystems each having one or more external surfaces, at least a first surface of each subsystem being adjacent and conforming to a second surface of another subsystem, each surface including:
an electrically non-conducting substrate;
a plurality of electrically conducting pads disposed on said substrate; and an electrical lead attached to each pad;
wherein two of said pads, respectively disposed on the first and second surfaces, form a capacitive coupler to allow an electrical signal to be conveyed between the respective subsystems.
2. The system as in claim 1, wherein the pads are covered by a dielectric material.
3. The system as in claim 2, wherein the dielectric material has low-loss characteristics and a large dielectric constant for improved signal conveyance.
4. The system as in claim 1, wherein the signal is time-varying.
5. The system as in claim 1 wherein:
the signal is a differential one having a positive signal and a complementary negative signal; and a first capacitive coupler between two subsystems carries the positive signal white a second capacitive coupler between said two subsystems carries the negative signal.
6. The system as in claim 1, wherein the surfaces are generally flat.
7. The system as in claim 1, wherein:
each subsystem includes electrical circuits; and the electrical leads of the capacitive couplers on the subsystem are coupled to the electrical circuits.
8. The system as in claim 1, wherein:
each pad includes a plurality of vias; and the electrical leads are attached to the pads through said vias.
9. The system as in claim 1, wherein the first and second surfaces are in contact.
10. The system as in claim 1, wherein the first and second surfaces are slidable past each other.
11. The system as in claim 10, wherein the first and second surfaces include means for aligning the capacitive couplers.
12. The system as in claim 10, wherein the first and second surfaces are held together by a mechanical means.
13. The system as in claim 1, wherein each subsystem is a storage device capable of storing, receiving and sending data.
14. The system as in claim 13, wherein each subsystem includes a plurality of data-storage disks and supporting electrical circuits.
15. The system as in claim 1, wherein each subsystem is a data processing subsystem.
16. The system as in claim 1, wherein each subsystem is a data communications subsystem.
17. The system as in claim 1, wherein each subsystem is a cube having six external surfaces.
18. A data storage system comprising:
a plurality data storage subsystems each having one or more external surfaces, at least a first surface of each subsystem being adjacent and conforming to a second surface of another subsystem, each surface including:
an electrically non-conducting substrate;
a plurality of electrically conducting pads disposed on said substrate; and an electrical lead attached to each pad;
wherein two of said pads, respectively disposed on the first and second surfaces, form a capacitive coupler to allow an electrical signal to be conveyed between the respective subsystems
CA2498133A 2002-10-03 2003-09-19 A scalable computer system having surface-mounted capacitive couplers for intercommunication Expired - Fee Related CA2498133C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/264,893 2002-10-03
US10/264,893 US7038553B2 (en) 2002-10-03 2002-10-03 Scalable computer system having surface-mounted capacitive couplers for intercommunication
PCT/US2003/030130 WO2004034240A2 (en) 2002-10-03 2003-09-19 A scalable computer system having surface-mounted capacitive couplers for intercommunication

Publications (2)

Publication Number Publication Date
CA2498133A1 true CA2498133A1 (en) 2004-04-22
CA2498133C CA2498133C (en) 2011-02-22

Family

ID=32042352

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2498133A Expired - Fee Related CA2498133C (en) 2002-10-03 2003-09-19 A scalable computer system having surface-mounted capacitive couplers for intercommunication

Country Status (10)

Country Link
US (3) US7038553B2 (en)
EP (1) EP1550023A2 (en)
JP (1) JP2006517039A (en)
KR (1) KR100754565B1 (en)
CN (1) CN1316329C (en)
AU (1) AU2003278895A1 (en)
CA (1) CA2498133C (en)
MX (1) MXPA05003568A (en)
TW (1) TWI280496B (en)
WO (1) WO2004034240A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7242579B2 (en) * 2004-01-09 2007-07-10 International Business Machines Corporation System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers
US7617336B1 (en) 2005-04-05 2009-11-10 Sprint Communications Company L.P. Blade computing system
US8351204B2 (en) * 2008-01-31 2013-01-08 Hewlett-Packard Development Company, L.P. Modular data processing components and systems
ES2370587T3 (en) * 2009-04-14 2011-12-20 Actaris Sas WIRELESS BIDIRECTIONAL TRANSMISSION OF SERIAL DATA SIGNS BETWEEN AN ELECTRONIC EQUIPMENT AND AN ENERGY METER.
US8405229B2 (en) * 2009-11-30 2013-03-26 Endicott Interconnect Technologies, Inc. Electronic package including high density interposer and circuitized substrate assembly utilizing same
US8174826B2 (en) * 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
US8496527B2 (en) * 2010-06-02 2013-07-30 Sony Computer Entertainment Inc. Capacitive input for computer program
US8894439B2 (en) 2010-11-22 2014-11-25 Andrew Llc Capacitivly coupled flat conductor connector
US8622762B2 (en) 2010-11-22 2014-01-07 Andrew Llc Blind mate capacitively coupled connector
US8622768B2 (en) 2010-11-22 2014-01-07 Andrew Llc Connector with capacitively coupled connector interface
CN103959555B (en) 2011-12-22 2017-03-08 康普技术有限责任公司 Capacitive character blindmate module interconnects
US9048527B2 (en) 2012-11-09 2015-06-02 Commscope Technologies Llc Coaxial connector with capacitively coupled connector interface and method of manufacture
GB2529617B (en) * 2014-08-05 2018-11-28 Cybula Ltd Computing devices
US9924595B2 (en) * 2014-12-11 2018-03-20 Intel Corporation Cable for alternative interconnect attachement
US10816583B2 (en) * 2018-11-28 2020-10-27 The Boeing Company Differential capacitive probe for measuring contact resistance
CN111508901B (en) 2019-10-01 2022-01-25 威锋电子股份有限公司 Integrated circuit chip, packaging substrate and electronic assembly
TWM599029U (en) * 2019-10-01 2020-07-21 威鋒電子股份有限公司 Integrated circuit chip, package substrate and electronic assembly

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3921167A (en) * 1974-06-14 1975-11-18 Ibm Capacitive circuitboard
US4423465A (en) * 1981-09-30 1983-12-27 Teng Ching Weng Combination electronic circuit element with multidirectionally adjustable joints
US4486739A (en) 1982-06-30 1984-12-04 International Business Machines Corporation Byte oriented DC balanced (0,4) 8B/10B partitioned block transmission code
GB8501155D0 (en) 1985-01-17 1985-02-20 Shell Int Research Capacitive underwater electrical connector
US4884982A (en) 1989-04-03 1989-12-05 Amp Incorporated Capacitive coupled connector
US5065277A (en) 1990-07-13 1991-11-12 Sun Microsystems, Inc. Three dimensional packaging arrangement for computer systems and the like
US5274336A (en) 1992-01-14 1993-12-28 Hewlett-Packard Company Capacitively-coupled test probe
US5691885A (en) * 1992-03-17 1997-11-25 Massachusetts Institute Of Technology Three-dimensional interconnect having modules with vertical top and bottom connectors
US6728113B1 (en) 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
GB9325625D0 (en) 1993-12-15 1994-02-16 Bsc Developments Ltd Contactless data/power bus
US5591885A (en) * 1994-09-23 1997-01-07 Hoffman-La Roche Inc. Process for the preparation of halogenated α-aminoketone compounds
US5552633A (en) * 1995-06-06 1996-09-03 Martin Marietta Corporation Three-dimensional multimodule HDI arrays with heat spreading
ES2144229T3 (en) 1996-01-02 2000-06-01 Ibm RADIO FREQUENCY CONNECTOR PCMCIA.
WO1997028595A1 (en) 1996-01-16 1997-08-07 Electro Dynamics, Inc. Capacitive charge coupling with dual connector assemblies and charging system
US5808529A (en) * 1996-07-12 1998-09-15 Storage Technology Corporation Printed circuit board layering configuration for very high bandwidth interconnect
US6033263A (en) 1996-10-15 2000-03-07 The Whitaker Corporation Electrically connector with capacitive coupling
US5977841A (en) 1996-12-20 1999-11-02 Raytheon Company Noncontact RF connector
US6205138B1 (en) 1998-04-24 2001-03-20 International Business Machines Corporation Broadband any point to any point switch matrix
US6299280B1 (en) 1998-05-18 2001-10-09 Canon Research Centre France S.A. Method of transmitting information by capacitive connection and a device adapted to implement it, such as a printer
US6525620B1 (en) * 1999-05-21 2003-02-25 Intel Corporation Capacitive signal coupling device
US6563042B2 (en) * 1999-05-21 2003-05-13 Intel Corporation Radiating enclosure
US6362972B1 (en) 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
JP5041499B2 (en) 2000-09-21 2012-10-03 庸美 徳原 Combined computer
US6554492B2 (en) * 2001-06-01 2003-04-29 Stratos Lightwave Addressable transceiver module
US6977841B2 (en) * 2002-11-21 2005-12-20 Micron Technology, Inc. Preconditioning of defective and redundant columns in a memory device

Also Published As

Publication number Publication date
JP2006517039A (en) 2006-07-13
AU2003278895A1 (en) 2004-05-04
US20040066249A1 (en) 2004-04-08
KR20060032947A (en) 2006-04-18
MXPA05003568A (en) 2005-06-03
US20080238582A1 (en) 2008-10-02
EP1550023A2 (en) 2005-07-06
WO2004034240A3 (en) 2004-10-07
CA2498133C (en) 2011-02-22
KR100754565B1 (en) 2007-09-05
US20070085625A1 (en) 2007-04-19
TW200414000A (en) 2004-08-01
TWI280496B (en) 2007-05-01
CN1316329C (en) 2007-05-16
US7038553B2 (en) 2006-05-02
US7385457B2 (en) 2008-06-10
CN1688954A (en) 2005-10-26
WO2004034240A2 (en) 2004-04-22
AU2003278895A8 (en) 2004-05-04

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Effective date: 20170919