CA2497043C - Articulating diamond-surfaced spinal implants - Google Patents

Articulating diamond-surfaced spinal implants Download PDF

Info

Publication number
CA2497043C
CA2497043C CA2497043A CA2497043A CA2497043C CA 2497043 C CA2497043 C CA 2497043C CA 2497043 A CA2497043 A CA 2497043A CA 2497043 A CA2497043 A CA 2497043A CA 2497043 C CA2497043 C CA 2497043C
Authority
CA
Canada
Prior art keywords
diamond
protrusion
implant
receptacle
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA2497043A
Other languages
French (fr)
Other versions
CA2497043A1 (en
Inventor
Bill J. Pope
Richard H. Dixon
Jeffrey K. Taylor
Clayton F. Gardinier
Troy Medford
Dean C. Blackburn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diamicron Inc
Original Assignee
Diamicron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diamicron Inc filed Critical Diamicron Inc
Publication of CA2497043A1 publication Critical patent/CA2497043A1/en
Application granted granted Critical
Publication of CA2497043C publication Critical patent/CA2497043C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/006Pressing and sintering powders, granules or fibres
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/44Joints for the spine, e.g. vertebrae, spinal discs
    • A61F2/442Intervertebral or spinal discs, e.g. resilient
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/44Joints for the spine, e.g. vertebrae, spinal discs
    • A61F2/442Intervertebral or spinal discs, e.g. resilient
    • A61F2/4425Intervertebral or spinal discs, e.g. resilient made of articulated components
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/02Inorganic materials
    • A61L27/04Metals or alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/02Inorganic materials
    • A61L27/04Metals or alloys
    • A61L27/045Cobalt or cobalt alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/02Inorganic materials
    • A61L27/08Carbon ; Graphite
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00Materials for grafts or prostheses or for coating grafts or prostheses
    • A61L27/28Materials for coating prostheses
    • A61L27/30Inorganic materials
    • A61L27/303Carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B17/00Surgical instruments, devices or methods, e.g. tourniquets
    • A61B17/56Surgical instruments or methods for treatment of bones or joints; Devices specially adapted therefor
    • A61B17/58Surgical instruments or methods for treatment of bones or joints; Devices specially adapted therefor for osteosynthesis, e.g. bone plates, screws, setting implements or the like
    • A61B17/68Internal fixation devices, including fasteners and spinal fixators, even if a part thereof projects from the skin
    • A61B17/84Fasteners therefor or fasteners being internal fixation devices
    • A61B17/86Pins or screws or threaded wires; nuts therefor
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30721Accessories
    • A61F2/30749Fixation appliances for connecting prostheses to the body
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/3094Designing or manufacturing processes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30003Material related properties of the prosthesis or of a coating on the prosthesis
    • A61F2002/30004Material related properties of the prosthesis or of a coating on the prosthesis the prosthesis being made from materials having different values of a given property at different locations within the same prosthesis
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30003Material related properties of the prosthesis or of a coating on the prosthesis
    • A61F2002/3006Properties of materials and coating materials
    • A61F2002/30084Materials having a crystalline structure
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30003Material related properties of the prosthesis or of a coating on the prosthesis
    • A61F2002/3006Properties of materials and coating materials
    • A61F2002/30092Properties of materials and coating materials using shape memory or superelastic materials, e.g. nitinol
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30329Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2002/30331Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by longitudinally pushing a protrusion into a complementarily-shaped recess, e.g. held by friction fit
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30329Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2002/30383Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by laterally inserting a protrusion, e.g. a rib into a complementarily-shaped groove
    • A61F2002/3039Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by laterally inserting a protrusion, e.g. a rib into a complementarily-shaped groove with possibility of relative movement of the rib within the groove
    • A61F2002/30392Rotation
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30329Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2002/30383Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by laterally inserting a protrusion, e.g. a rib into a complementarily-shaped groove
    • A61F2002/3039Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by laterally inserting a protrusion, e.g. a rib into a complementarily-shaped groove with possibility of relative movement of the rib within the groove
    • A61F2002/30398Sliding
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30329Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2002/30433Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements using additional screws, bolts, dowels, rivets or washers e.g. connecting screws
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30329Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2002/30451Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements soldered or brazed or welded
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30316The prosthesis having different structural features at different locations within the same prosthesis; Connections between prosthetic parts; Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30535Special structural features of bone or joint prostheses not otherwise provided for
    • A61F2002/30576Special structural features of bone or joint prostheses not otherwise provided for with extending fixation tabs
    • A61F2002/30578Special structural features of bone or joint prostheses not otherwise provided for with extending fixation tabs having apertures, e.g. for receiving fixation screws
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30621Features concerning the anatomical functioning or articulation of the prosthetic joint
    • A61F2002/30649Ball-and-socket joints
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2002/30001Additional features of subject-matter classified in A61F2/28, A61F2/30 and subgroups thereof
    • A61F2002/30667Features concerning an interaction with the environment or a particular use of the prosthesis
    • A61F2002/30682Means for preventing migration of particles released by the joint, e.g. wear debris or cement particles
    • A61F2002/30685Means for reducing or preventing the generation of wear particulates
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30841Sharp anchoring protrusions for impaction into the bone, e.g. sharp pins, spikes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30878Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves with non-sharp protrusions, for instance contacting the bone for anchoring, e.g. keels, pegs, pins, posts, shanks, stems, struts
    • A61F2002/30884Fins or wings, e.g. longitudinal wings for preventing rotation within the bone cavity
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30878Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves with non-sharp protrusions, for instance contacting the bone for anchoring, e.g. keels, pegs, pins, posts, shanks, stems, struts
    • A61F2002/30891Plurality of protrusions
    • A61F2002/30892Plurality of protrusions parallel
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2/30771Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves
    • A61F2002/30904Special external or bone-contacting surface, e.g. coating for improving bone ingrowth applied in original prostheses, e.g. holes or grooves serrated profile, i.e. saw-toothed
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/30767Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
    • A61F2002/30934Special articulating surfaces
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/3094Designing or manufacturing processes
    • A61F2002/30968Sintering
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/3094Designing or manufacturing processes
    • A61F2002/3097Designing or manufacturing processes using laser
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/3094Designing or manufacturing processes
    • A61F2002/30971Laminates, i.e. layered products
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2/00Filters implantable into blood vessels; Prostheses, i.e. artificial substitutes or replacements for parts of the body; Appliances for connecting them with the body; Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents
    • A61F2/02Prostheses implantable into the body
    • A61F2/30Joints
    • A61F2/44Joints for the spine, e.g. vertebrae, spinal discs
    • A61F2/442Intervertebral or spinal discs, e.g. resilient
    • A61F2/4425Intervertebral or spinal discs, e.g. resilient made of articulated components
    • A61F2002/443Intervertebral or spinal discs, e.g. resilient made of articulated components having two transversal endplates and at least one intermediate component
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2210/00Particular material properties of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2210/0014Particular material properties of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof using shape memory or superelastic materials, e.g. nitinol
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2220/00Fixations or connections for prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2220/0008Fixation appliances for connecting prostheses to the body
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2220/00Fixations or connections for prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2220/0025Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2220/00Fixations or connections for prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2220/0025Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2220/0033Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements made by longitudinally pushing a protrusion into a complementary-shaped recess, e.g. held by friction fit
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2220/00Fixations or connections for prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2220/0025Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2220/0041Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements using additional screws, bolts, dowels or rivets, e.g. connecting screws
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2220/00Fixations or connections for prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2220/0025Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements
    • A61F2220/0058Connections or couplings between prosthetic parts, e.g. between modular parts; Connecting elements soldered or brazed or welded
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2250/00Special features of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2250/0014Special features of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof having different values of a given property or geometrical feature, e.g. mechanical property or material property, at different locations within the same prosthesis
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00017Iron- or Fe-based alloys, e.g. stainless steel
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00023Titanium or titanium-based alloys, e.g. Ti-Ni alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00029Cobalt-based alloys, e.g. Co-Cr alloys or Vitallium
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00035Other metals or alloys
    • A61F2310/00095Niobium or Nb-based alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00035Other metals or alloys
    • A61F2310/00131Tantalum or Ta-based alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00011Metals or alloys
    • A61F2310/00035Other metals or alloys
    • A61F2310/00149Platinum or Pt-based alloys
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00161Carbon; Graphite
    • A61F2310/00167Diamond or diamond-like carbon
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00179Ceramics or ceramic-like structures
    • A61F2310/00269Ceramics or ceramic-like structures based on metal carbides
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00179Ceramics or ceramic-like structures
    • A61F2310/00269Ceramics or ceramic-like structures based on metal carbides
    • A61F2310/00281Ceramics or ceramic-like structures based on metal carbides containing silicon carbide
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00005The prosthesis being constructed from a particular material
    • A61F2310/00179Ceramics or ceramic-like structures
    • A61F2310/00293Ceramics or ceramic-like structures containing a phosphorus-containing compound, e.g. apatite
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2310/00Prostheses classified in A61F2/28 or A61F2/30 - A61F2/44 being constructed from or coated with a particular material
    • A61F2310/00389The prosthesis being coated or covered with a particular material
    • A61F2310/00574Coating or prosthesis-covering structure made of carbon, e.g. of pyrocarbon
    • A61F2310/0058Coating made of diamond or of diamond-like carbon DLC
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C2043/043Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds rotating on their own axis without linear displacement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/361Moulds for making articles of definite length, i.e. discrete articles with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons
    • B29C2043/3615Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices
    • B29C2043/3618Forming elements, e.g. mandrels or rams or stampers or pistons or plungers or punching devices plurality of counteracting elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/753Medical equipment; Accessories therefor
    • B29L2031/7532Artificial members, protheses

Abstract

An articulating diamond-surfaced spinal implants having a first component (60074) with a concave surface end and a corresponding second element (60075) having a convex surface. The two components form a device with diamond to diamond contact at the articulation point.

Description

Articulating Diamond-Surfaced Spinal Implants CROSS-REFERENCE TO RELATED APPLICATIONS
Priority is claimed to United States Patent Application Serial No. 10/229,907 filed on August 28, 2002.
BACKGROUND
In the past, various spinal implants were known. Most prior art spinal 1o implants were adapted for fusion therapy, although there were some articulating spinal implants as well.
SUMMARY
Various articulating diamond-surfaced spinal implants, materials for making 15 them, and methods for making them.
BRIEF DESCRIPTION OF DRAWINGS
Figures 1 A-1 BB depict sintering of a polycrystalline diamond compact.
Figures 1 C & 1 D depict formation of a diamond table on a substrate by a 2o CVD, PVD or laser deposition method.
Figures 3-12 depict preparation of superhard materials for use in making an articulating diamond-surfaced spinal implant component.
Figures 13-36 depict final preparation of superhard materials prior to sintering.
25 Figure 37 depicts the anvils of a cubic press that may be used in making superhard articulating diamond-surfaced spinal implant components.
Figures 38-50 depict machining and finishing superhard articulating diamond-surfaced spinal implant components.
Figures 51 and 52 depict a human spine.
3o Figures 53 to 112-3 depict various embodiments of spinal implants.
DETAILED DESCRIPTION
Various embodiments of the devices disclosed herein relate to superhard surfaces for articulating diamond-surfaced spinal implants and materials of various 35 compositions, devices of various geometries, attachment mechanisms, methods for making those superhard surfaces for articulating diamond-surfaced spinal implants and components, and products, which include those superhard surfaces for articulating diamond-surfaced spinal implants and components. More specifically, some embodiments of the devices relate to diamond and sintered polycrystalline diamond surfaces and articulating diamond-surfaced spinal implants that include diamond and polycrystalline diamond surfaces. Some embodiments of the devices utilize a polycrystalline diamond compact ("PDC") to provide a very strong, low friction, long-wearing surface in an articulating diamond-surfaced spinal implant. Any surface, including surfaces outside the field of articulating diamond-surfaced spinal implants, which experience wear and require strength and durability will benefit from advances made here.
There are several design objectives for articulating spinal implants. The 1o implant should maintain height between adjacent vertebrae. It should produce translational stability of the vertebrae. It should provide for intervertebral mobility.
And the implant should reproduce disc kinematics. Some embodiments of the spinal implants herein utilize compound bearings and some use non-congruent bearings. One or more of the load bearing and articulation surfaces or contact surfaces of the implant may utilize diamond for smooth and low-friction articulation.
The table below provides a comparison of sintered polycrystalline diamond ("PCD") to some other materials.

COMPARISON OF SINTERED PCD TO OTHER MATERIALS
Material Specific Hardness Thermal CTE

Gravity (ICnoop) Conductivity(x 106) (W/m K) Sintered 3.5-4.0 9000 900 1.50-4.8 Polycrystalline Diamond Compact Cubic Boron 3.48 4500 800 1.0-4.0 Nitride Silicon Carbide3.00 2500 84 4.7-5.3 Aluminum 3.50 2000 7.8-8.8 Oxide Tungsten 14.6 2200 112 4-6 Carbide (10%

Co) Cobalt Chrome8.2 43 RC 16.9 Ti6A14V 4.43 6.6-17.5 11 Silicon Nitride 3.2 14.2 15-7 1.8-3.7 In view ofi the superior hardness of sintered PCD, it is expected that sintered PCD will provide improved wear and durability characteristics.
Reference will now be made to the drawings in which the various elements of the present devices will be discussed. Persons skilled in the design of articulating diamond-surfaced spinal implants and other surfaces will understand the application of the various embodiments of the devices and their principles to articulating diamond-surfaced spinal implants of all types, and components of articulating diamond-surfaced spinal implants, and devices other than those exemplified herein.
1o As discussed in greater detail below, the articulating diamond-surfaced spinal implant or articulating diamond-surfaced spinal implant component may use polycrystalline diamond compacts in order to form durable load bearing and articulation surfaces. In a polycrystalline diamond compact that includes a substrate, the diamond table may be chemically bonded and/or mechanically fixed to 15 the substrate in a manufacturing process that may use a combination of high pressure and high temperature to form the sintered polycrystalline diamond.
Alternatively, free-standing sintered polycrystalline diamond absent a substrate may be formed. Free-standing diamond (without a substrate) may also be referred to as solid diamond. The chemical bonds between diamond and a solvent-catalyst metal 2o are established during the sintering process y combinations of unsatisfied spa carbon bonds with unsatisfied substrate metal bonds. Where a substrate is used, the mechanical bond strength of the diamond table to the substrate that results is a consequence of shape of the substrate and diamond table and differences in the physical properties of the substrate and the diamond table as well as the gradient 25 interface between the substrate and the diamond table. The resulting sintered polycrystalline diamond compact forms a durable articulating diamond-surfaced spinal implant or component.
The diamond table may be polished to a very smooth and glass-like finish to achieve a very low coefficient of friction. The high surface energy of sintered 3o polycrystalline diamond compact causes it to work very well as a load-bearing and articulation surface when a lubricating fluid is present. Its inherent nature allows it to perform very well when a lubricant is absent as well.
While there is discussion herein concerning polycrystalline diamond compacts, the following materials could be considered for forming an articulating 35 spinal implant or component: polycrystalline diamond, monocrystal diamond, natural diamond, diamond created by physical vapor deposition, diamond created by chemical vapor deposition, diamond like carbon, carbonado, cubic boron nitride, hexagonal boron nitride, or a combination of these, cobalt, chromium, titanium, vanadium, stainless steel, niobium, aluminum, nickel, hafnium, silicon, tungsten, molybdenum, aluminum, zirconium, nitinol, cobalt chrome, cobalt chrome molybdenum, cobalt chrome tungsten, tungsten carbide, titanium carbide, tantalum carbide, zirconium carbide, hafnium carbide, Ti6/4, silicon carbide, chrome carbide, vanadium carbide, yttria stabilized zirconia, magnesia stabilized zirconia, zirconia toughened alumina, titanium molybdenum hafnium, alloys including one or more of the above metals, ceramics, quartz, garnet, sapphire, combinations of these materials, combinations of these and other materials, and other materials may also 1o be used for a desired articulating diamond-surfaced~spinal implant or component.
SINTERED POLYCRYSTALLINE DIAMOND COMPACTS
One useful material for manufacturing articulating diamond-surfaced spinal implant surfaces, however, is a sintered polycrystalline diamond compact due to its 15 superior performance. Diamond has the greatest hardness and the lowest coefficient of friction of any currently known material. Sintered polycrystalline diamond compacts are chemically inert, are impervious to all solvents, and have the highest thermal conductivity at room temperature of any known material.
In some embodiments of the devices, a polycrystalline diamond compact 2o provides unique chemical bonding and mechanical grip between the diamond and the substrate material.
A method by which PDC may be manufactured is described later in this document. Briefly, it involves sintering diamond crystals to each other, and to a substrate under high pressure and high temperature. Figures 1 A and 1 B
illustrate 25 the physical and chemical processes involved manufacturing polycrystalline diamond compacts.
In Figure 1 A, a quantity of diamond feedstock 130 (such as diamond powder or crystals) is placed adjacent to a metal-containing substrate 110 prior to sintering.
In the region of the diamond feedstock 130, individual diamond crystals 131 may be 3o seen, and between the individual diamond crystals 131 there are interstitial spaces 132. If desired, a quantity of solvent-catalyst metal may be placed into the interstitial spaces 132. The substrate may also contain solvent-catalyst metal.
The substrate 110 may be a suitable pure metal or alloy, or a cemented carbide containing a suitable metal or alloy as a cementing agent such as cobalt-35 cemented tungsten carbide. The substrate may be a metal with high tensile strength.
In a cobalt-chrome substrate of the devices, the cobalt-chrome alloy will serve as a solvent-catalyst metal for solvating diamond crystals during the sintering process.

The illustration shows the individual diamond crystals and the contiguous metal crystals in the metal substrate. The interface 120 between diamond powder and substrate material is a critical region where bonding of the diamond table to the substrate must occur. In some embodiments ofi the devices, a boundary layer of a third material different than the diamond and the substrate is placed at the interface 120. This interface boundary layer material, when present, may serve several functions including, but not limited fio, enhancing the bond of the diamond table to the substrate, and mitigation of the residual stress field at the diamond-substrate interface.
1o Once diamond powder or crystals and substrate are assembled as shown in Figure 1 A, the assembly is subjected to high pressure and high temperature as described later herein in order to cause bonding of diamond crystals to diamond crystals and to the substrate. The resulting structure of sintered polycrystalline diamond table bonded to a substrate is called a polycrystalline diamond compact 15 (PDC). A compact, as the term is used herein, is a composite structure of two different materials, such as diamond crystals, and a substrate metal. The analogous structure incorporating cubic boron nitride crystals in the sintering process instead of diamond crystals is called polycrystalline cubic boron nitride compact (PCBNC).
Many of the processes described herein for the fabrication and finishing of PDC
2o structures and parts work in a similar fashion for PCBNC. In some embodiments of the devices, PCBNC may be substituted for PDC.
Figure 1 B depicts a polycrystalline diamond compact 101 after the high pressure and high temperature sintering of diamond feedstock to a substrate.
Within the PDC structure, there is an identifiable volume of substrate 102, an identifiable 25 volume of diamond table 103, and a transition zone 104 between diamond table and substrate containing diamond crystals and substrate material. Crystalline grains of substrate material 105 and sintered crystals of diamond 106 are depicted.
On casual examination, the finished compact of Figure 1 B will appear to consist of a solid table of diamond 103 attached to the substrate 402 with a discrete 3o boundary. On very close examination, however, a transition zone 104 between diamond table 103 and substrate 102 can be characterized. This zone represents a gradient interface between diamond table and substrate with a gradual transition of ratios between diamond content and metal content. At the substrate side of the transition zone, there will be only a small percentage of diamond crystals and a high 35 percentage of substrate metal, and on the diamond table side, there will be a high percentage of diamond crystals and a low percentage of substrate metal.
Because of this gradual transition of ratios of polycrystalline diamond to substrate metal in the transition zone, the diamond table and the substrate have a gradient interface.

In the transition zone or gradient transition zone where diamond crystals and substrate metal are intermingled, chemical bonds are formed between the diamond and metal. From the transition zone 104 into the diamond table 103, the metal content diminishes and is limited to solvent-catalyst metal that fills the three-s dimensional vein-like structure of interstitial voids, openings or asperities 107 within the sintered diamond table structure 103. The solvent-catalyst metal found in the voids or openings 107 may have been swept up from the substrate during sintering or may have been solvent-catalyst metal added to the diamond feedstock before sintering.
1o During the sintering process, there are three types of chemical bonds that are created: diamond-to-diamond bonds, diamond-to-metal bonds, and metal-to-metal bonds. In the diamond table, there are diamond-to-diamond bonds (spa carbon bonds) created when diamond particles partially solvate in the solvate-catalyst metal and then are bonded together. In the substrate and in the diamond table, there are ~5 metal-to-metal bonds created by the high pressure and high temperature sintering process. And in the gradient transition zone, diamond-to-metal bonds are created between diamond and solvent-catalyst metal.
The combination of these various chemical bonds and the mechanical grip exerted by solvent-catalyst metal in the diamond table such as in the interstitial 2o spaces of the diamond structure diamond table provide extraordinarily high bond strength between the diamond table and the substrate. Interstitial spaces are present in the diamond structure and those spaces typically are filled with solvent-catalyst metal, forming veins of solvent-catalyst metal within the polycrystalline diamond structure. This bonding structure contributes to the extraordinary fracture 25 toughness of the compact, and the veins of metal within the diamond table act as energy sinks halting propagation of incipient cracks within the diamond structure.
The transition zone and metal vein structure provide the compact with a gradient of material properties between those of the diamond table and those of substrate material, further contributing to the extreme toughness of the compact. The transition 3o zone can also be called an interface, a gradient transition zone, a composition gradient zone, or a composition gradient, depending on its characteristics.
The transition zone distributes diamond/substrate stress over the thickness of the zone, reducing zone high stress of a distinct linear interface. The subject residual stress is created as pressure and temperature are reduced at the conclusion of the high 35 pressure/high temperature sintering process due to the difference in pressure and thermal expansive properties of the diamond and substrate materials.
The diamond sintering process occurs under conditions of extremely high pressure and high temperature. According to the inventors' best experimental and theoretical understanding, the diamond sintering process progresses through the following sequence of events. At pressure, a cell containing feedstock of unbonded diamond powder or crystals (diamond feedstock) and a substrate is heated to a temperature above the melting point of the substrate metal 110 and molten metal flows or sweeps into the interstitial voids 107 between the adjacent diamond crystals 106. It is carried by the pressure gradient to fill the voids as well as being pulled in by the surface energy or capillary action of the large surface area of the diamond crystals 106. As the temperature continues to rise, carbon atoms from the surface of diamond crystals dissolve into this interstitial molten metal, forming a carbon solution.
1o At the proper threshold of temperature and pressure, diamond becomes the thermodynamically favored crystalline allotrope of carbon. As the solution becomes super saturated with respect to Cd (carbon diamond), carbon from this solution begins to crystallize as diamond onto the surfaces of diamond crystals bonding adjacent diamond crystals together with diamond-diamond bonds into a sintered 15 polycrystalline diamond structure 106. The interstitial metal fills the remaining void space forming the vein-like lattice structure 107 within the diamond table by capillary forces and pressure driving forces. Because of the crucial role that the interstitial metal plays in forming a solution of carbon atoms and stabilizing these reactive atoms during the diamond crystallization phase in which the polycrystalline diamond 2o structure is formed, the metal is referred to as a solvent-catalyst metal.
Figure 1 BB depicts a sintered polycrystalline diamond compact having both substrate metal 180 and diamond 181, but in which there is a continuous gradient transition 182 from substrate metal to diamond. In such a compact, the gradient transition zone may be the entire compact, or a portion of the compact. The 25 substrate side of the compact may contain nearly pure metal for easy machining and attachment to other components, while the diamond side may be extremely hard, smooth and durable for use in a hostile work environment.
In some embodiments of the devices, a quantity of solvent-catalyst metal may be combined with the diamond feedstock prior to sintering. This is found to be useful 3o when forming thick PCD tables, solid PDC structures, or when using multimodal fine diamond where there is little residual free space within the diamond powder.
In each of these cases, there may not be sufficient ingress of solvent-catalyst metal via the sweep mechanism to adequately mediate the sintering process as a solvent-catalyst.
The metal may be added by direct addition of powder, or by generation of metal 35 powder in situ with an attritor mill or by the well-known method of chemical reduction of metal salts deposited on diamond crystals. Added metal may constitute any amount from less than 1 % by mass, to greater than 35%. This added metal may consist of the same metal or alloy as is found in the substrate, or may be a different metal or alloy selected because of its material and mechanical properties.
Example ratios of diamond feedstock to solvent-catalyst metal prior to sintering include mass ratios of 70:30, 85:15, 90:10, and 95:15. The metal in.the diamond feedstock may be added powder metal, metal added by an attritor method, vapor deposition or chemical reduction of metal into powder.
When sintering diamond on a substrate with an interface boundary layer, it may be that no solvent-catalyst metal from the substrate is available to sweep info the diamond table and participate in the sintering process. In this case, the boundary layer material, if composed of a suitable material, metal or alloy that can function as a 1o solvent-catalyst, may serve as the sweep material mediating the diamond sintering process. In other cases where the desired boundary material cannot serve as a solvent-catalyst, a suitable amount of solvent-catalyst metal powder as described herein is added to the diamond crystal feed stock as described above. This assembly is then taken through the sintering process. In the absence of a substrate metal source, the solvent-catalyst metal for the diamond sintering process must be supplied entirely from the added metal powder. The boundary material may bond chemically to the substrate material, and bonds chemically to the diamond table and/or the added solvent-catalyst metal in the diamond table. The remainder of the sintering and fabrication process may be the same as with the conventional solvent-2o catalyst sweep sintering and fabrication process.
For the sake of simplicity and clarity in this patent, the substrate, transition zone, and diamond table have been discussed as distinct layers. However, it is important to realize that the finished sintered object may be a composite structure characterized by a continuous gradient transition from substrate material to diamond table rather than as distinct layers with clear and discrete boundaries, hence the term "compact", In addition to the sintering processes described above, diamond parts suitable for use as articulating diamond-surfaced spinal implants components may also be fabricated as solid or free-standing polycrystalline diamond structures without 3o a substrate. These may be formed by placing the diamond powder combined with a suitable amount of added solvent-catalyst metal powder as described above in a refractory metal can (typically Ta, Nb, Zr, or Mo) with a shape approximating the shape of the final part desired. This assembly is then taken through the sintering process. However, in the absence of a substrate metal source, the solvent-catalyst metal for the diamond sintering process must be supplied entirely from the added metal powder. With suitable finishing, objects thus formed may be used as is, or bonded to metal or other substrates.

Sintering is a method of creating a diamond table with a strong and durable constitution. Other methods of producing a diamond table that may or may not be bonded to a substrate are possible. At present, these typically are not as strong or durable as those fabricated with the sintering process. It is also possible to use these methods to form diamond structures directly onto substrates suitable for use as articulating diamond-surfaced spinal implants. A table of polycrystalline diamond either with or without a substrate may be manufactured and later attached to an articulating diamond-surfaced spinal implant in a location such that it will form a surface. The attachment could be performed with any suitable method, including 1o welding, brazing, sintering, diffusion welding, diffusion bonding, inertial welding, adhesive bonding, or the use of fasteners such as screws, bolts, or rivets. In the case of attaching a diamond table without a substrate to another object, the use of such methods as brazing, diffusion welding/bonding or inertia welding may be most appropriate.
15 Although high pressure/high temperature sintering is a method for creating a diamond surface, other methods for producing a volume of diamond may be employed as well. For example, either chemical vapor deposition (CVD), or physical vapor deposition (PVD) processes may be used. CVD produces a diamond layer by thermally cracking an organic molecule and depositing carbon radicals on a 2o substrate. PVD produces a diamond layer by electrically causing carbon radicals to be ejected from a source material and to deposit on a substrate where they build a diamond crystal structure.
The CVD and PVD processes have some advantages over sintering.
Sintering is performed in large, expensive presses at high pressure (such as 25 kilobars) and at high temperatures (such as 1200 to 1500 degrees Celsius).
It is difficult to achieve and maintain desired component shape using a sintering process because of flow of high pressure mediums used and possible deformation of substrate materials.
In contrast, CVD and PVD take place at atmospheric pressure or lower, so 3o there no need for a pressure medium and there is no deformation of substrates Another disadvantage of sintering is that it is difficult to achieve some geometries in a sintered polycrystalline diamond compact. When CVD or PVD are used, however, the gas phase used for carbon radical deposition can completely conform to the shape of the object being coated, making it easy to achieve a desired 35 non-planar shape.
Another potential disadvantage of sintering polycrystalline diamond compacts is that the finished component will tend to have large residual stresses caused by differences in the coefficient of thermal expansion and modulus between the diamond and the substrate. While residual stresses can be used to improve strength of a part, they can also be disadvantageous. When CVD or PVD is used, residual stresses can be minimized because CVD and PVD processes do not involve a significant pressure transition (such from 68 Kbar to atmospheric pressure in high pressure and high temperature sintering) during manufacturing.
Another potential disadvantage of sintering polycrystalline diamond compacts is that few substrates have been found that are suitable for sintering.
Tungsten carbide is a common choice for substrate materials. When CVD or PVD are used, however, synthetic diamond can be placed on many substrates, including titanium, 1o most carbides, silicon, molybdenum and others. This is because the temperature and pressure of the CVD and PVD coating processes are low enough that differences in coefficient of thermal expansion and modulus between diamond and the substrate are not as critical as they are in a high temperature and high pressure sintering process.
A further difficulty in manufacturing sintered polycrystalline diamond compacts is that as the size of the part to be manufactured increases, the size of the press must increase as well. Sintering of diamond will only take place at certain pressures and temperatures, such as those described herein. In order to manufacture larger sintered polycrystalline diamond compacts, ram pressure of the press (tonnage) and 2o size of tooling (such as dies and anvils) must be increased in order to achieve the necessary pressure for sintering to take place. But increasing the size and capacity of a press is more difficult than simply increasing the dimensions of its components.
There may be a practical physical size constraints on press size due to the manufacturing process used to produce press tooling.
Tooling for a press is typically made from cemented tungsten carbide. In order to make tooling, the cemented tungsten, carbide is sintered in a vacuum furnace followed by pressing in a hot isosatic press ("HIP") apparatus.
Nipping must be performed in a manner that maintains uniform temperature throughout the tungsten carbide in order to achieve uniform physical qualities and quality.
These 3o requirements impose a practical limit on the size tooling that can be produced for a press that is useful for sintering polycrystalline diamond compacts. The limit on the size tooling that can be produced also limits the size press that can be produced.
CVD and PVD manufacturing apparatuses may be scaled up in size with few limitations, allowing them to produce polycrystalline diamond compacts of almost any desired size.
CVD and PVD processes are also advantageous because they permit precise control of the thickness and uniformity of the diamond coating to be applied to a substrate. Temperature is adjusted within the range of 500 to 1000 degrees Celsius, and pressure is adjusted in a range of less than 1 atmosphere to achieve desired diamond coating thickness.
Another advantage of CVD and PVD processes is that they allow the manufacturing process to be monitored as it progresses. A CVD or PVD reactor can be opened before manufacture of a part is completed so that the thickness and quality of the diamond coating being applied to the part may be determined.
From the thickness of the diamond coating that has already been applied, time to completion of manufacture can be calculated. Alternatively, if the coating is not of desired quality, the manufacturing processes may be aborted in order to save time 1o and money.
In contrast, sintering of polycrystalline diamond compacts is performed as a batch process that cannot be interrupted, and progress of sintering cannot be monitored. The pressing process must be run to completion and the part may only be examined afterward.
CVD AND PVD DIAMOND
CVD is performed in an apparatus called a reactor. A basic CVD reactor includes four components. The first component of the reactor is one or more gas inlets. Gas inlets may be chosen based on whether gases are premixed before 2o introduction to the chamber or whether the gases are allowed to mix for the first time in the chamber. The second component of the reactor is one or more power sources for the generation of thermal energy. A power source is needed to heat the gases in the chamber. A second power source may be used to heat the substrate material uniformly in order to achieve a uniform coating of diamond on the substrate.
The third component of the reactor is a stage or platform on which a substrate is placed.
The substrate will be coated with diamond during the CVD process. Stages used include a fixed stage, a translating stage, a rotating stage and a vibratory stage. An appropriate stage must be chosen to achieved desired diamond coating quality and uniformity. The fourth component of the reactor is an exit port for removing exhaust 3o gas from the chamber. After gas has reacted with the substrate, it must be removed from the chamber as quickly as possible so that it does not participate in other reactions, which would be deleterious to the diamond coating.
CVD reactors are classified according to the power source used. The power source is chosen to create the desired species necessary to carry out diamond thin film deposition. Some CVD reactor types include plasma-assisted microwave, hot filament, electron beam, single, double or multiple laser beam, arc jet and DC
discharge. These reactors differ in the way they impart thermal energy to the gas species and in their efficiency in breaking gases down to the species necessary for deposition of diamond. It is possible to have an array of lasers to perform local heating inside a high pressure cell. Alternatively, an array of optical fibers could be used to deliver light into the cell.
The basic process by which CVD reactors work is as follows. A substrate is placed into the reactor chamber. Reactants are introduced to the chamber via one or more gas inlets. For diamond CVD, methane (CH4) and hydrogen (H2) gases may be brought into the chamber in premixed form. Instead of methane, any carbon-bearing gas in which the carbon has spa bonding may be used. Other gases may be added to the gas stream in order to control quality of the diamond film, deposition 1o temperature, gain structure and growth rate. These include oxygen, carbon dioxide, argon, halogens and others.
The gas pressure in the chamber may be maintained at about 100 tort. Flow rates for the gases through the chamber may be about 10 standard cubic centimeters per minute for methane and about 100 standard cubic centimeters per minute for hydrogen. The composition of the gas phase in the chamber may be in the range of 90-99.5% hydrogen and 0.5-10% methane.
When the gases are introduced into the chamber, they are heated. Heating may be accomplished by many methods. In a plasma-assisted process, the gases are heated by passing them through a plasma. Otherwise, the gases may be passed 2o over a series of wires such as those found in a hot filament reactor.
Heating the methane and hydrogen will break them down into various free radicals. Through a complicated mixture of reactions, carbon is deposited on the substrate and joins with other carbon to form crystalline diamond by spa bonding.
The atomic hydrogen in the chamber reacts with and removes hydrogen atoms from methyl radicals attached to the substrate surface in order to create molecular hydrogen, leaving a clear solid surface for further deposition of free radicals.
If the substrate surface promotes the formation of sp2 carbon bonds, or if the gas composition, flow rates, substrate temperature or other variables are incorrect, then graphite rather than diamond will grow on the substrate.
3o There are many similarities between CVD reactors and processes and PVD
reactors and processes. PVD reactors differ from CVD reactors in the way that they generate the deposition species and in the physical characteristics of the deposition species. In a PVD reactor, a plate of source material is used as a thermal source, rather than having a separate thermal source as in CVD reactors. A PVD reactor generates electrical bias across a plate of source material in order to generate and eject carbon radicals from the source material. The reactor bombards the source material with high energy ions. When the high energy ions collide with source material, they cause ejection of the desired carbon radicals from the source material.

The carbon radicals are ejected radially from the source material into the chamber.
The carbon radicals then deposit themselves onto whatever is in their path, including the stage, the reactor itself, and the substrate.
Referring to Figure 1 C, a substrate 140 of appropriate material is depicted having a deposition face 141 on which diamond may be deposited by a CVD or PVD
process. Figure 1 D depicts the substrate 140 and the deposition face 141 on which a volume of diamond 142 has been deposited by CVD or PVD processes. A small transition zone 143 is present in which both diamond and substrate are located. In comparison to Figure 1 B, it can be seen that the CVD or PVD diamond deposited on 1o a substrate lacks the more extensive gradient transition zone of sintered polycrystalline diamond compacts because there is no sweep of solvent-catalyst metal through the diamond table in a CVD or PVD process.
Both CVD and PVD processes achieve diamond deposition by line of sight.
Means (such as vibration and rotation) are provided for exposing all desired surfaces 15 for diamond deposition. If a vibratory stage is to be used, the surface will vibrate up and down with the stage and thereby present all surfaces to the free radical source.
There are several methods, which may be implemented in order to coat cylindrical objects with diamond using CVD or PVD processes. If a plasma assisted microwave process is to be used to achieve diamond deposition, then the object to 2o receive the diamond must be directly under the plasma in order to achieve the highest quality and most uniform coating of diamond. A rotating or translational stage may be used to present every aspect of the surface to the plasma for diamond coating. As the stage rotates or translates, all portions of the surface may be brought directly under the plasma for coating in such a way to achieve sufficiently uniform 25 coating.
If a hot filament CVD process is used, then the surface should be placed on a stationary stage. Wires or filaments (typically tungsten) are strung over the stage so that their coverage includes the surface to be coated. The distance between the filaments and the surface and the distance between the filaments themselves may be 3o chosen to achieve a uniform coating of diamond directly under the filaments.
Diamond surfaces can be manufactured by CVD and PVD process either by coating a substrate with diamond or by creating a free standing volume of diamond, which is later mounted for use. A free standing volume of diamond may be created by CVD and PVD processes in a two-step operation. First, a thick film of diamond is 35 deposited on a suitable substrate, such as silicon, molybdenum, tungsten or others.
Second, the diamond film is released from the substrate.
As desired, segments of diamond film may be cut away, such as by use of a Q-switched YAG laser. Although diamond is transparent to a YAG laser, there is usually a sufficient amount of sp2 bonded carbon (as found in graphite) to allow cutting to take place. If not, then a line may be drawn on the diamond film using a carbon-based ink. The line should be sufficient to permit cutting to start, and once started, cutting will proceed slowly.
After an appropriately-sized piece of diamond has been cut from a diamond film, it can be attached to a desired object in order to serve as a surface.
For example, the diamond may be attached to a substrate by welding, diffusion bonding, adhesion bonding, mechanical fixation or high pressure and high temperature bonding in a press.
to Although CVD and PVD diamond on a substrate do not exhibit a gradient transition zone that is found in sintered polycrystalline diamond compacts, CVD and PVD process can be conducted in order to incorporate metal into the diamond table.
As mentioned elsewhere herein, incorporation of metal into the diamond table enhances adhesion of the diamond table to its substrate and can strengthen the polycrystalline diamond compact. Incorporation of diamond into the diamond table can be used to achieve a diamond table with a coefficient of thermal expansion and compressibility different from that of pure diamond, and consequently increasing fracture toughness of the diamond table as compared to pure diamond. Diamond has a low coefficient of thermal expansion and a low compressibility compared to 2o metals. Therefore the presence of metal with diamond in the diamond table achieves a higher and more metal-like coefficient of thermal expansion and the average compressibility for the diamond table than for pure diamond. Consequently, residual stresses at the interface of the diamond table and the substrate are reduced, and delamination of the diamond table from the substrate is less likely.
A pure diamond crystal also has low fracture toughness. Therefore, in pure diamond, when a small crack is formed, the entire diamond component fails catastrophically. In comparison, metals have a high fracture toughness and can accommodate large cracks without catastrophic failure. Incorporation of metal into the diamond table achieves a greater fracture toughness than pure diamond. In a 3o diamond table having interstitial spaces and metal within those interstitial spaces, if a crack forms in the diamond and propagates to an interstitial space containing metal, the crack will terminate at the metal and catastrophic failure will be avoided.
Because of this characteristic, a diamond table with metal in its interstitial spaces is able to sustain much higher fiorces and workloads without catastrophic failure compared to pure diamond.
Diamond-diamond bonding tends to decrease as metal content in the diamond table increases. CVD and PVD processes can be conducted so that a transition zone is established. However, the surface can be essentially pure polycrystalline diamond for low wear properties.
Generally CVD and PVD diamond is formed without large interstitial spaces filled with metal. Consequently, most PVD and CVD diamond is more brittle or has a lower fracture toughness than sintered polycrystalline diamond compacts. CVD
and PVD diamond may also exhibit the maximum residual stresses possible between the diamond table and the substrate. It is possible, however, to form CVD and PVD
diamond film that has metal incorporated into it with either a uniform or a functionally gradient composition.
One method for incorporating metal into a CVD or PVD diamond film it to use 1o two different source materials in order to simultaneously deposit the two materials on a substrate in a CVD of PVD diamond production process. This method may be used regardless of whether diamond is being produced by CVD, PVD or a combination of the two.
Another method for incorporating metal into a CVD diamond film chemical 15 vapor infiltration. This process would first create a porous layer of material, and then fill the pores by chemical vapor infiltration. The porous layer thickness should be approximately equal to the desired thickness for either the uniform or gradient layer.
The size and distribution of the pores can be sued to control ultimate composition of the layer. Deposition in vapor infiltration occurs first at the interface between the 2o porous layer and the substrate. As deposition continues, the interface along which the material is deposited moves outward from the substrate to fill pores in the porous layer. As the growth interface moves outward, the deposition temperature along the interface is maintained by moving the sample relative to a heater or by moving the heater relative to the growth interface. It is imperative that the porous region between the outside of the sample and the growth interface be maintained at a temperature that does not promote deposition of material (either the pore-filling material or undesired reaction products). Deposition in this region would close the pores prematurely and prevent infiltration and deposition of the desired material in inner pores. The result would be a substrate with open porosity and poor physical 3o properties.
LASER DEPOSITION OF DIAMOND
Another alternative manufacturing process that may be used to produce surfaces and components of the devices involves use of energy beams, such as laser energy, to vaporize constituents in a substrate and redeposit those constituents on the substrate in a new form, such as in the form of a diamond coating. As an example, a metal, polymeric or other substrate may be obtained or produced containing carbon, carbides or other desired constituent elements. Appropriate energy, such as laser energy, may be.directed at the substrate to cause constituent elements to move from within the substrate to the surface of the substrate adjacent the area of application of energy to the substrate. Continued application of energy to the concentrated constituent elements on the surface of the substrate can be used to cause vaporization of some of those constituent elements. The vaporized constituents may then be reacted with another element to change the properties and structure of the vaporized constituent elements, Next, the vaporized and reacted constituent elements (which may be diamond) may be diffused into the surface of the substrate. A separate fabricated 1o coating may be produced on the surface of the substrate having the same or a different chemical composition than that of the vaporized and reacted constituent elements. Alternatively, some of the changed constituent elements which were diffused into the substrate may be vaporized and reacted again and deposited as a coating on the. By this process and variations of it, appropriate coatings such as 15 diamond, cubic boron nitride, diamond like carbon, B4C, SiC, TiC, TiN, TiB, cCN, Cr3C2, and Si3N4 may be formed on a substrate.
In other manufacturing environments, high temperature laser application, electroplating, sputtering, energetic laser excited plasma deposition or other methods may be used to place a volume of diamond, diamond-like material, a hard material or 2o a superhard material in a location in which will serve as a surface.
In light of the disclosure herein, those of ordinary skill in the art will comprehend the apparatuses, materials and process conditions necessary for the formation and use of high quality diamond on a substrate using any of the manufacturing methods described herein in order to create a diamond surface.
MATERIAL PROPERTY CONSIDERATIONS
There is a particular problem posed by the manufacture of a non-planar diamond surface. The non-planar component design requires that pressures be applied radially in making the part. During the high pressure sintering process, 3o described in detail below, all displacements must be along a radian emanating from the center of the part that will be produced in order to achieve the desired non-planar geometry. To achieve this in high temperature/high pressure pressing, an isostatic pressure field must be created. During the manufacture of such non-planar parts, it there is any deviatoric stress component, it will result in distortion of the part and may render the manufactured part useless.
Special considerations that must be taken into account in making non-planar polycrystalline diamond compacts are discussed below.
Modulus Most polycrystalline diamond compacts include both a diamond table and a substrate. The material properties of the diamond and the substrate may be compatible, but the high pressure and high temperature sintering process in the formation of a polycrystalline diamond compact may result in a component with excessively high residual stresses. For example, for a polycrystalline diamond compact using tungsten carbide as the substrate, the sintered diamond has a Young's modulus of approximately 120 million p.s.i., and cobalt cemented tungsten carbide has a modulus of approximately 90 million p.s.i. Modulus refers to the slope of the curve of the stress plotted against the stress for a material. Modulus indicates 1o the stiffness of the material. Bull< modulus refers to the ratio of isostatic strain to isostatic stress, or the unit volume reduction of a material versus the applied pressure or stress.
Because diamond and most substrate materials have such a high modulus, a very small stress or displacement of the polycrystalline diamond compact can induce 15 very large stresses. If the stresses exceed the yield strength of either the diamond or the substrate, the component will fail. The strongest polycrystalline diamond compact is not necessarily stress free. In a sintered polycrystalline diamond compact with optimal distribution of residual stress, more energy is required to induce a fracture than in a stress free component. Thus, the difference in modulus between 2o the substrate and the diamond must be noted and used to design a component that will have the best strength for its application with sufficient abrasion resistance and fracture toughness.
Coefficient of Thermal Expansion (CTE) The extent to which diamond and its substrate differ in how they deform 25 relative to changes in temperature also affects their mechanical compatibility.
Coefficient of thermal expansion ("CTE") is a measure of the unit change of a dimension with unit change in temperature or the propensity of a material to expand under heat or to contract when cooled. As a material experiences a phase change, calculations based on CTE in the initial phase will not be applicable. It is notable that 3o when compacts of materials with different CTE's and moduluses are used, they will stress differently at the same stress.
Polycrystalline diamond has a coefficient of thermal expansion (as above and hereafter referred to as "CTE" on the order of 2-4 micro inches per inch (10-6 inches) of material per degree (in/in°C). In contrast, carbide has a CTE on the order of 6-8 35 in/in°C. Although these values appear to be close numerically, the influence of the high modulus creates very high residual stress fields when a temperature gradient of a few hundred degrees is imposed upon the combination of substrate and diamond.
The difference in coefficient of thermal expansion is less of a problem in simple planar polycrystalline diamond compacts than in the manufacture of non-planar or complex shapes. When a non-planar polycrystalline diamond compact is manufactured, differences in the CTE between the diamond and the substrate can cause high residual stress with subsequent cracking and failure of the diamond table, the substrate or both at any time during or after high pressure/high temperature sintering.
Dilatoric and Deviatoric Stresses The diamond and substrate assembly will experience a reduction of free volume during the sintering process. The sintering process, described in detail 1o below, involves subjecting the substrate and diamond assembly to pressure ordinarily in the range of about 40 to about 68 kilobar. The pressure will cause volume reduction of the substrate. Some geometrical distortion of the diamond and/or the substrate may also occur. The stress that causes geometrical distortion is called deviatoric stress, and the stress that causes a change in volume is called dilatoric stress. In an isostatic system, the deviatoric stresses sum to zero and only the dilatoric stress component remains. Failure to consider all of these stress factors in designing and sintering a polycrystalline diamond component with complex geometry (such as concave and convex non-planar polycrystalline diamond compacts) will likely result in failure of the process.
2o Free Volume Reduction of Diamond Feedstock As a consequence of the physical nature of the feedstock diamond, large amounts of free volume are present unless special preparation of the feedstock is undertaken prior to sintering. It is necessary to eliminate as much of the free volume in the diamond as possible, and if the free volume present in the diamond feedstock is too great, then sintering may not occur. It is also possible to eliminate the free volume during sintering if a press with sufficient ram displacement is employed. Is important to maintain a desired uniform geometry of the diamond and substrate during any process which reduces free volume in the feedstock, or a distorted or faulty component may result.
3o Selection of Solvent-Catalyst Metal Formation of synthetic diamond in a high temperature and high pressure press without the use of a solvent-catalyst metal is not a viable method at this time, although it may become viable in the future. A solvent-catalyst metal is at this time required to achieve desired crystal formation in synthetic diamond. The solvent-catalyst metal first solvates carbon preferentially from the sharp contact points of the diamond feedstock crystals. It then recrystallizes the carbon as diamond in the interstices of the diamond matrix with diamond-diamond bonding sufficient to achieve a solid with 95 to 97% of theoretical density with solvent metal 5-3% by volume. That solid distributed over the substrate surface is referred to herein as a polycrystalline diamond table. The solvent-catalyst metal also enhances the formation of chemical bonds with substrate atoms.
A method for adding the solvent-catalyst metal to diamond feedstock is by causing it to sweep from the substrate that contains solvent-catalyst metal during high pressure and high temperature sintering. Powdered solvent-catalyst metal may also be added to the diamond feedstock before sintering, particularly if thicker diamond tables are desired. An attritor method may also be used to add the solvent-catalyst metal to diamond feedstock before sintering. If too much or too little solvent-1o catalyst metal is used, then the resulting part may lack the desired mechanical properties, so it is important to select an amount of solvent-catalyst metal and a method for adding it to diamond feedstock that is appropriate for the particular part to be manufactured.
Diamond Feedstock Particle Size and Distribution 15 The durability of the finished diamond product is integrally linked to the size of the feedstock diamond and also to the particle distribution. Selection of the proper sizes) of diamond feedstock and particle distribution depends upon the service requirement of the specimen and also its working environment. The durability of polycrystalline diamond is enhanced if smaller diamond feedstock crystals are used 2o and a highly diamond-diamond bonded diamond table is achieved.
Although polycrystalline diamond may be made from single modal diamond feedstock, use of multi-modal feedstock increases both impact strength and wear resistance. The use of a combination of large crystal sizes and small crystal sizes of diamond feedstock together provides a part with high impact strength and wear 25 resistance, in part because the interstitial spaces between the large diamond crystals may be filled with small diamond crystals. During sintering, the small crystals will solvate and reprecipitate in a manner that binds all of the diamond crystals into a strong and tightly bonded compact.
Diamond Feedstock Loading Methodology 3o Contamination of the diamond feedstock before or during loading will cause failure of the sintering process. Great care must be taken to ensure the cleanliness of diamond feedstock and any added solvent-catalyst metal or binder before sintering.
In order to prepare for sintering, clean diamond feedstock, substrate, and 35 container components are prepared for loading. The diamond feedstock and the substrate are placed into a refractory metal container called a "can" which will seal its contents from outside contamination. The diamond feedstock and the substrate will remain in the can while undergoing high pressure and high temperature sintering in order to form a polycrystalline diamond compact. The can may be sealed by electron beam welding at high temperature and in a vacuum.
Enough diamond aggregate (powder or grit) is loaded to account for linear shrinkage during high pressure and high temperature sintering. The method used for 5 loading diamond feedstock into a can for sintering affects the general shape and tolerances of the final part. In particular, the packing density of the feedstock diamond throughout the can should be as uniform as possible in order to produce a good quality sintered polycrystalline diamond compact structure. In loading, bridging of diamond can be avoided by staged addition and packing.
1o The degree of uniformity in the density of the feedstock material after loading will affect geometry of the polycrystalline diamond compact. Loading of the feedstock diamond in a dry form versus loading diamond combined with a binder and the subsequent process applied for the removal of the binder will also affect the characteristics of the finished polycrystalline diamond compact. In order to properly 15 pre-compact diamond for sintering, the pre-compaction pressures should be applied under isostatic conditions.
Selection of Substrate Material The unique material properties of diamond and its relative differences in modulus and CTE compared to most potential substrate materials diamond make 2o selection of an appropriate polycrystalline diamond substrate a formidable task. A
great disparity in material properties between the diamond and the substrate creates challenges successful manufacture of a polycrystalline diamond component with the needed strength and durability. Even very hard substrates appear to be soft compared to polycrystalline diamond. The substrate and the diamond must be able to withstand not only the pressure and temperature of sintering, but must be able to return to room temperature and atmospheric pressure without delaminating, cracking or otherwise failing.
Selection of substrate material also requires consideration of the intended application for the part, impact resistance and strengths required, and the amount of 3o solvent-catalyst metal that will be incorporated into the diamond table during sintering. Substrate materials must be selected with material properties that are compatible with those of the diamond table to be formed.
Substrate Geometry Further, it is important to consider whether to use a substrate which has a smooth surface or a surface with topographical features. Substrate surfaces may be formed with a variety of topographical features so that the diamond table is fixed to the substrate with both a chemical bond and a mechanical grip. Use of topographical features on the substrate provides a greater surface area for chemical bonds and with the mechanical grip provided by the topographical features, can result in a stronger and more durable component.
EXAMPLE MATERIALS AND MANUFACTURING STEPS
The inventors have discovered and determined materials and manufacturing processes for constructing polycrystalline diamond compacts for use in an articulating diamond-surfaced spinal implant. It is also possible to manufacture the invented surfaces by methods and using materials other than those listed below.
The steps described below, such as selection of substrate material and 1o geometry, selection of diamond feedstock, loading and sintering methods, will affect each other, so although they are listed as separate steps that must be taken to manufacture a polycrystalline diamond compact, no step is completely independent of the others, and all steps must be standardized to ensure success of the manufacturing process.
Select Substrate and/or Solvent-Catalyst Metal In order to manufacture any polycrystalline diamond component, an appropriate substrate should be selected. For the manufacture of a polycrystalline diamond component to be used in an articulating diamond-surfaced spinal implant, various substrates may be used as desired.

SOME SUBSTRATES FOR ARTICULATING DIAMOND-SURFACED
SPINAL IMPLANT APPLICATIONS
SUBSTRATE ALLOY NAME REMARKS

Titanium Ti6/4 (TiAIVa) A thin tantalum barrier may ASTM F-1313 (TiNbZr)be placed on the titanium ASTM F-620 substrate before loading ASTM F-1580 diamond feedstock.

TiMbHf Nitinol (TiNi+other) Cobalt chrome ASTM F-799 Contains cobalt, chromium and molybdenum. Wrought product Cobalt chrome ASTM F-90 Contains cobalt, chromium, tungsten and nickel.

Cobalt chrome ASTM F-75 Contains cobalt, chromium and molybdenum. Cast product.

Cobalt chrome ASTM F-562 Contains cobalt, chromium, molybdenum and nickel.

Cobalt chrome ASTM F-563 Contains cobalt, chromium, molybdenum, tungsten, iron and nickel.

Tantalum ASTM F-560 (unalloyed)refractory metal.

Platinum various Niobium ASTM F-67 (unalloyed)refractory metal.

Maganese Various May include Cr, Ni, Mg, molybdenum.

Cobalt cemented tungstenWC Commonly used in synthetic carbide diamond production Cobalt chrome cementedCoCr cemented WC

tungsten carbide Cobalt chrome cementedCoCr cemented CrC

chrome carbide Cobalt chrome cementedCoCr cemented SiC

silicon carbide Fused silicon carbideSiC

Cobalt chrome CoCrMo A thin tungsten or molybdenum tungstenlcobalt layer may be placed on the substrate before loading diamond feedstock.

Stainless steel Various The CoCr used as a substrate or solvent-catalyst metal may be CoCrMo or CoCrW
or another suitable CoCr. Alternatively, an Fe-based alloy, a Ni-based alloy (such as Co-Cr-W-Ni) or another alloy may be used. Co and Ni alloys tend to provide a corrosion-resistant component. The preceding substrates and solvent-catalyst metals are examples only. In addition to these substrates, other materials may be appropriate for use as substrates for construction of articulating diamond-surfaced spinal implant s and other surfaces.
When titanium is used as the substrate, sometimes place a thin tantalum 1o barrier layer is placed on the titanium substrate. The tantalum barrier prevents mixing of the titanium alloys with cobalt alloys used in the diamond feedstock. If the titanium alloys and the cobalt alloys mix, it possible that a detrimentally low melting point eutectic inter-metallic compound will be formed during the high pressure and high temperature sintering process. The tantalum barrier bonds to both the titanium and cobalt alloys, and to the polycrystalline diamond that contains cobalt solvent-catalyst metals. Thus, a polycrystalline diamond compact made using a titanium substrate with a tantalum barrier layer and diamond feedstock that has cobalt solvent-catalyst metals can be very strong and well formed. Alternatively, the titanium substrate may be provided with an alpha case oxide coating (an oxidation layer) forming a barrier which prevents formation of a eutectic metal.
If a cobalt chrome molybdenum substrate is used, a thin tungsten layer or a thin tungsten and cobalt layer can be placed on the substrate before loading of the 1o diamond feedstock in order to control formation of chrome carbide (CrC) during sintering.
In addition to those listed, other appropriate substrates may be used for forming polycrystalline diamond compact surfaces. Further, it is possible within the scope of the devices to form a diamond surface for use without a substrate. It is also 15 possible to form a surface from any of the superhard materials and other materials listed herein, in which case a substrate may not be needed. Additionally, if it is desired to use a type of diamond or carbon other than polycrystalline diamond, substrate selection may differ. For example, if a diamond surface is to be created by use of chemical vapor deposition or physical vapor deposition, then use of a 2o substrate appropriate for those manufacturing environments and for the compositions used will be necessary.
Determination of Substrate Geometry A substrate geometry appropriate for the compact to be manufactured and 25 appropriate for the materials being used should be selected. In order to manufacture a non-planar diamond surface, it is necessary to select a substrate geometry that will facilitate the manufacture of those parts. In order to ensure proper diamond formation and avoid compact distortion, forces acting on the diamond and the substrate during sintering must be strictly radial. Therefore the substrate geometry at 3o the contact surface with diamond feedstock for manufacturing a complex surface in some instances may be generally non-planar.
As mentioned previously, there is a great disparity in the material characteristics of synthetic diamond and most available substrate materials.
!n particular, modulus and CTE are of concern.. But when applied in combination with 35 each other, some substrates can form a stable and strong polycrystalline diamond compact. The table below lists physical properties of some substrate materials.

MATERIAL PROPERTIES OF SOME EXAMPLE SUBSTRATES
SUBSTRATE MATERIAL MODULUS CTE

Ti 6/4 16.5 million psi 5.4 CoCrMo 35.5 million psi 16.9 CoCrW 35.3 million psi 16.3 Use of either titanium or cobalt chrome substrates alone for the manufacture of non-planar polycrystalline diamond compacts may result in cracking of the diamond table or separation of the substrate from the diamond table. In particular, it appears that titanium's dominant property during high pressure and high temperature sintering is compressibility while cobalt chrome's dominant property during sintering is CTE. In to some embodiments of the devices, a substrate of two or more layers may be used in order to achieve dimensional stability during and after manufacturing.
In various embodiments of the devices, a single layer substrate may be utilized. In other embodiments of the devices, a two-layer substrate may be utilized, as discussed. Depending on the properties of the components being used, however, it may be desired to utilize a substrate that includes three, four or more layers. Such multi-layer substrates are intended to be comprehended within the scope of the devices.
Substrate Surface Topography Depending on the application, it may be advantageous to include substrate 2o surface topographical features on a substrate that is to be formed into a polycrystalline diamond compact. Regardless whether a one-piece, a two-piece of a multi-piece substrate is used, it may be desirable to modify the surface of the substrate or provide topographical features on the substrate in order to increase the total surface area of diamond to enhance substrate to diamond contact and to provide a mechanical grip of the diamond table.
The placement of topographical features on a substrate serves to modify the substrate surface geometry or contours from what the substrate surface geometry or contours would be if formed as a simple planar or non-planar figure. Substrate surface topographical features may include one or more different types of 3o topographical features which result in protruding, indented or contoured features that serve to increase surface, mechanically interlock the diamond table to the substrate, prevent crack formation, or prevent crack propagation.
Substrate surface topographical features or substrate surface modifications serve a variety of useful functions. Use of substrate topographical features increases total substrate surface area of contact between the substrate and the diamond table.
This increased surface area of contact between diamond table and substrate results in a greater total number of chemical bonds between diamond table and substrate than if the substrate surface topographical features were absent, thus achieving a 5 stronger polycrystalline diamond compact.
Substrate surface topographical features also serve to create a mechanical interlock between the substrate and the diamond table. The mechanical interlock is achieved by the nature of the substrate topographical features and also enhances strength of the polycrystalline diamond compact.
1o Substrate surface topographical features may also be used to distribute the residual stress field of the polycrystalline diamond compact over a larger surface area and over a larger volume of diamond and substrate material. This greater distribution can be used to keep stresses below the threshold for crack initiation and/or crack propagation at the diamond table/substrate interface, within the 15 diamond itself and within the substrate itself.
Substrate surface topographical features increase the depth of the gradient interface or transition zone between diamond table and substrate, in order to distribute the residual stress field through a longer segment of the composite compact structure and to achieve a stronger part.
2o Substrate surface modifications can be used to created a sintered polycrystalline diamond compact that has residual stresses that fortify the strength of the diamond layer and yield a more robust polycrystalline diamond compact with greater resistance to breakage than if no surface topographical features were used.
This is because in order to break the diamond layer, it is necessary to first overcome 25 the residual stresses in the part and then overcome the strength of the diamond table.
Substrate surface topographical features redistribute forces received by the diamond table. Substrate surface topographical features cause a force transmitted through the diamond layer to be re-transmitted from single force vector along multiple 3o force vectors. This redistribution of forces traveling to the substrate avoids conditions that would deform the substrate material at a more rapid rate than the diamond table, as such differences in deformation can cause cracking and failure of the diamond table.
Substrate surface topographical features may be used to mitigate the intensity of the stress field between the diamond and the substrate in order to achieve a stronger part.
Substrate surface topographical features may be used to distribute the residual stress field throughout the polycrystalline diamond compact structure in order to reduce the stress per unit volume of structure.
Substrate surface topographical features may be used to mechanically interlock the diamond table to the substrate by causing the substrate to compress over an edge of the diamond table during manufacturing. Dovetailed, heminon-planar and lentate modifications act to provide force vectors that tend to compress and enhance the interface of diamond table,and substrate during cooling as the substrate dilitates radially.
Substrate surface topographical features may also be used to achieve a manufacturable form. As mentioned herein, differences in coefficient of thermal 1o expansion and modulus between diamond and the chosen substrate may result in failure of the polycrystalline diamond compact during manufacturing. For certain parts, the stronger interface between substrate and diamond table that may be achieved when substrate topographical features are used can achieve a polycrystalline diamond compact that can be successfully manufactured. But if a 15 similar part of the same dimensions is to be made using a substrate with a simple substrate surface rather than specialized substrate surface topographical features, the diamond table may crack or separate from the substrate due to differences in coefficient of thermal expansion or modulus of the diamond and the substrate.
Examples of useful substrate surface topographical features include waves, 2o grooves, ridges, other longitudinal surface features (any of which may be arranged longitudinally, lattitudinally, crossing each other at a desired angle, in random patterns, and in geometric patterns), three dimensional textures, non-planar segment depressions, non-planar segment protrusions, triangular depressions, triangular protrusions, arcuate depressions, arcuate protrusions, partially non-planar 25 depressions, partially non-planar protrusions, cylindrical depressions, cylindrical protrusions, rectangular depressions, rectangular protrusions, depressions of n-sided polygonal shapes where n is an integer, protrusions of n-sided polygonal shapes, a waffle pattern of ridges, a waffle iron pattern of protruding structures, dimples, nipples, protrusions, ribs, fenestrations, grooves, troughs or ridges that have a cross-3o sectional shape that is rounded, triangular, arcuate, square, polygonal, curved, or otherwise, or other shapes. Machining, pressing, extrusion, punching, injection molding and other manufacturing techniques for creating such forms may be used to achieve desired substrate topography. Although for illustration purposes, some sharp corners are depicted on substrate topography or other structures in the 35 drawings, in practice it is expected that all corners will have a small radius to achieve a component with superior durability.
Although many substrate topographies have been depicted in convex non-planar substrates, those surface topographies may be applied to convex non-planar substrate surfaces, other non-planar substrate surfaces, and flat substrate surfaces.
Substrate surface topographies which are variations or modifications of those shown, and other substrate topographies which increase component strength or durability may also be used.
Diamond Feedstock Selection It is anticipated that typically the diamond particles used will be in the range of less than 1 micron to more than 100 microns. In some embodiments of the devices, however, diamond particles as small as 1 nanometer may be used. Smaller diamond particles are used for smoother surfaces. Commonly, diamond particle sizes will be 1o in,the range of 0.5 to 2.0 microns or 0.1 to 10 microns.
An example diamond feedstock is shown in the table below.

EXAMPLE BIMODAL DIAMOND FEEDSTOCK
MATERIAL AMOUNT

4 to 8 micron diamond about 90%

0.5 to 1.0 micron diamond about 9%

Titanium carbonitride powder about 1 This formulation mixes some smaller and some larger diamond crystals so that during sintering, the small crystals may dissolve and then recrystallize in order to form a lattice structure with the larger diamond crystals. Titanium carbonitride 2o powder may optionally be included in the diamond feedstock in order to prevent excessive diamond grain growth during sintering in order to produce a finished product that has smaller diamond crystals.
Another diamond feedstock example is provided in the table below.

EXAMPLE TRIIMODAL DIAMOND FEEDSTOCK
MATERIAL AMOUNT

Size x diamond crystals about 90%

Size 0.1 x diamond crystals about 9%

Size 0.01 x diamond crystals about 1 The trimodal diamond feedstock described above can be used with any suitable diamond feedstock having a first size or diameter "x", a second size 0.1x and a third size 0.01x. This ratio of diamond crystals allows packing of the feedstock to about 89% theoretical density, closing most interstitial spaces and providing the densest diamond table in the finished polycrystalline diamond compact.
Another diamond feedstock example is provided in the table below.

EXAMPLE TRIIMODAL DIAMOND FEEDSTOCK
MATERIAL AMOUNT

Size x diamond crystals about 88-92%

Size 0.1 x diamond crystals about 8-12%

Size 0.01 x diamond crystals about 0.8-1.2%

Another diamond feedstock example is provided in the table below.

EXAMPLE TRIIMODAL DIAMOND FEEDSTOCK
MATERIAL AMOUNT

Size x diamond crystals about 85-95%

Size 0.1 x diamond crystals about 5-15%

Size 0.01 x diamond crystals about 0.5-1.5%

Another diamond feedstock example is provided in the table below.

EXAMPLE TRIIMODAL DIAMOND FEEDSTOCK
MATERIAL AMOUNT

Size x diamond crystals about 80-90%

Size 0.1 x diamond crystals about ~ 0-20%

Size 0.01 x diamond crystals about 0-2%

In some embodiments of the devices, the diamond feedstock used will be 2o diamond powder having a greatest dimension of about 100 nanometers or less.
In some embodiments of the devices some solvent-catalyst metal is included with the diamond feedstock to aid in the sintering process, although in many applications there will be a significant solvent-catalyst metal sweep from the substrate during sintering as well.
Solvent Metal Selection It has already been mentioned that solvent metal will sweep from the substrate through the diamond feedstock during sintering in order to solvate some diamond crystals so that they may later recrystallize and form a diamond-diamond bonded lattice network that characterizes polycrystalline diamond. It is possible to include some solvent-catalyst metal in the diamond feedstock only when required to supplement the sweep of solvent-catalyst metal from the substrate.
Traditionally, cobalt, nickel and iron have been used as solvent metals for making polycrystalline diamond. Platinum and other materials could also be used for a binder.
1o CoCr may be used as a solvent-catalyst metal for sintering PCD to achieve a more wear resistant PDC. Infiltrating diamond particles with Cobalt (Co) metal produces standard polycrystalline diamond compact. As the cobalt infiltrates the diamond, carbon is dissolved (mainly from the smaller diamond grains) and reprecipitates onto the larger diamond grains causing the grains to grow together.
15 This is known as liquid phase sintering. The remaining pore spaces between the diamond grains are filled with cobalt metal.
In this example, the alloy Cobalt Chrome (CoCr) may be used as the solvent metal which acts similarly to Co metal. However, it differs in that the CoCr reacts with some of the dissolved carbon resulting in the precipitation of CoCr carbides.
2o These carbides, like most carbides, are harder (abrasion resistant) than cobalt metal and results in a more wear or abrasion resistant PDC.
Other metals can be added to Co to form metal carbides as precipitates within the pore spaces between the diamond grains. These metals include the following, but not limited to, Ti, W, Mo, V, Ta, Nb, Zr, Si, and combinations thereof.
25 It is important not just to add the solvent metal to diamond feedstock, but also to include solvent metal in an appropriate proportion and to mix it evenly with the feedstock. The use of about 86% diamond feedstock and 15% solvent metal by mass (weight) has provided good result, other useful ratios of diamond feedstock to solvent metal may include 5:95, 10:90, 20:80, 30:70, 40:60, 50:50, 60:40, 65:35, 30 75:25, 80:20, 90:10, 95:5, 97:3, 98:2, 99:1, 99.5:0.5, 99.7:0.3, 99.8:0.2, 99.9:0.1 and others.
In order to mix the diamond feedstock with solvent-catalyst metal, first the amounts of feedstock and solvent metal to be mixed may be placed together in a mixing bowl, such as a mixing bowl made of the desired solvent-catalyst metal.
Then 35 the combination of feedstock and solvent metal may be mixed at an appropriate speed (such as 200 rpm) with dry methanol and attritor balls for an appropriate time period, such as 30 minutes. The attritor balls, the mixing fixture and the mixing bowl may be made from the solvent-catalyst metal. The methanol may then be decanted and the diamond feedstock separated from the attritor balls. The feedstock may then be dried and cleaned by firing in a molecular hydrogen furnace at about 1000 degrees Celsius for about 1 hour. The feedstock is then ready for loading and sintering. Alternatively, it may be stored in conditions which will preserve its cleanliness. Appropriate furnaces which may be used for firing also include hydrogen plasma furnaces and vacuum furnaces.
Loading Diamond Feedstock Referring to Figure 3, an apparatus for carrying out a loading technique is depicted. The apparatus includes a spinning rod 301 with a longitudinal axis 302, the 1o spinning rod being capable of spinning about its longitudinal axis. The spinning rod 701 has an end 303 matched to the size and shape of the part to be manufactured.
For example, if the part to be manufactured is non-planar, the spinning rod end 303 may be heminon-planar.
A compression ring 304 is provided with a bore 305 through which the 15 spinning rod 301 may project. A die 306 or can is provided with a cavity 307 also matched to the size and shape of the part to be made.
In order to load diamond feedstock, the spinning rod is placed into a drill chuck and the spinning rod is aligned with the center point of the die. The depth to which the spinning rod stops in relation to the cavity of the die is controlled with a set 2o screw and monitored with a dial indicator.
The die is charged with a known amount of diamond feedstock material. The spinning rod is then spun about its longitudinal axis and lowered into the die cavity to a predetermined depth. The spinning rod contacts and rearranges the diamond feedstock during this operation. Then the spinning of the spinning rod is stopped and 25 the spinning rod is locked in place.
The compression ring is then lowered around the outside of the spinning rod to a point where the compression ring contacts diamond feedstock in the cavity of the die. The part of the compression ring that contacts the diamond is annular.
The compression ring is tamped up and down to compact the diamond. This type of 3o compaction is used to distribute diamond material throughout the cavity to the same density and may be done in stages to prevent bridging. Packing the diamond with the compaction ring causes the density of the diamond around the equator of the sample caused to be very uniform and the same as that of the polar region in the cavity. In this configuration, the diamond sinters in a truly non-planar fashion and the resulting part maintains its sphericity to close tolerances.
Controlling Large Volumes of Powder Feedstocks, Such As Diamond The following information provides further instruction on control and pre-processing of diamond feedstock before sintering. Polycrystalline Diamond Compact (PDC) and Polycrystalline Cubic Boron Nitride (PCBN) powders reduce in volume during the sintering process. The amount of shrinkage experienced is dependent on a number of factors such as:
a. The amount of metal mixed with the diamond.
b. The loading density of the powders.
c. The bulk density of diamond metal mix.
d. The volume of powder loaded.
e. Particle size distribution (PSD) of the powders.
In most PDC and CBN sintering applications, the volume of powder used is 1o small enough that shrinkage is easily managed, as shown in Figure 3A-1. In Figure 3A, we can see a can 3A-54 in which can halves 3A-53 contain a substrate 3A-52 and a diamond table 3A-51. However, when sintering large volumes of diamond powders in spherical configurations, shrinkage is great enough to cause buckling of the containment cans 3A-66 as shown in Figure 3A-2 and the cross section of Figure 15 3A-3. The diamond has sintered 3A-75 but the can has buckles 3A-77 and wrinkles 3A-78, resulting in a non-uniform and damaged part. The following method is an improved loading, pre-compression, densification, and refractory can sealing method for spherical and non-planar parts loaded with large volumes of diamond and/or metal powders. The processing steps are described below.
2o Referring to Figure 3A-4 and its cross section at Figure 3A-5, PDC or PCBN
powders 3A-911 are loaded against a substrate 3A-99 and into a refractory metal containment can 3A-910 having a seal 3A-912. Extra powder may be loaded normal to the seam in the cans to accommodate shrinkage.
Referring to Figure 3A-6, a can assembly 3A-913 is placed into compaction 25 fixture 3A-1014, which may be a cylindrical holder or slide 3A-1015 with two hemispherical punches 3A-1016 and 3A-1017. The fixture is designed to support the containment cans and allow~the cans to slip at the seam during the pressing operation.
Referring to Figure 3A-7-1, relationship of the can half skins 3A-910 with the 3o junction 3A-912 and the punch 3A-1016 is seen.
Referring to Figure 3A-7, fixture 3A-1014 with can 3A-913 is placed into a press 3A-1218 and the upper and lower punches compress the can assembly. The containment can halves slip past each other preventing buckling while the powdered feedstock is compressed.
35 Referring to Figure 3A-8, the upper punch is retracted and a crimping die is attached to the cylinder.

Referring to Figures 3A-9 and 3A-9-1, the lower punch is raised driving excess can material into the hemispherical portion of the crimping die folding the excess around the upper can.
Referring to Figure 3A-10, the lower punch is raised expelling the can assembly from the cylinder.
Referring to Figure 3A-11, the can assembly emerges from pressing operation spherical with high loading density. The part can then be sintered in a cubic or other press without buckling or breaking the containment cans.
Binding Diamond Feedstock Generally 1o Another method which may be employed to maintain a uniform density of the feedstock diamond is the use of a binder. A binder is added to the correct volume of feedstock diamond, and then the combination is pressed into a can. Some binders which might be used include polyvinyl butyryl, polymethyl methacrylate, polyvinyl formol, polyvinyl chloride acetate, polyethylene, ethyl cellulose, methylabietate, 1s paraffin wax, polypropylene carbonate and polyethyl methacrylate.
In one embodiment of the devices, the process of binding diamond feedstock includes four steps. First, a binder solution is prepared. A binder solution may be prepared by adding about 5 to 25% plasticizer to pellets of polypropylene carbonate), and dissolving this mixture in solvent such as 2-butanone to make about 2o a 20% solution by weight.
Plasticizers that may be used include nonaqueous binders generally, glycol, dibutyl phthalate, benzyl butyl phthalate, alkyl benzyl phthalate, diethylhexyl phthalate, diisoecyl phthalate, diisononyl phthalate, dimethyl phthalate, dipropylene glycol dibenzoate, mixed glycols dibenzoate, 2-ethylhexyl diphenyl dibenzoate, mixed 25 glycols dibenzoate, 2-ethylhexyl diphenyl phosphate, isodecyl diphenyl phosphate, isodecyl diphenl phosphate, tricrestyl phosphate, tributoxy ethyl phosphate, dihexyl adipate, triisooctyi trimellitate, dioctyl phthalate, epoxidized linseed oil, epoxidized soybean oil, acetyl triethyl citrate, propylene carbonate, various phthalate esters, butyl stearate, glycerin, polyalkyl glycol derivatives, diethyl oxalate, paraffin wax and 3o triethylene glycol. Other appropriate plasticizers may be used as well.
Solvents that may be used include 2-butanone, methylene chloride, chloroform, 1,2-dichloroethne, trichlorethylene, methyl acetate, ethyl acetate, vinyl acetate, propylene carbonate, n-propyl acetate, acetonitrile, dimethylformamide, propionitrile, n-mehyl-2-pyrrolidene, glacial acetic acid, dimethyl sulfoxide, acetone, 35 methyl ethyl ketone, cyclohexanone, oxysolve 80a, caprotactone, butyrolactone, tetrahydrofuran, 1,4 dioxane, propylene oxide, cellosolve acetate, 2-methoxy ethyl ether, benzene, styrene, xylene, ethanol, methanol, toluene, cyclohexane, chlorinated hydrocarbons, esters, ketones, ethers, ethyl benzene and various hydrocarbons. Other appropriate solvents may be used as well.
Second, diamond is mixed with the binder solution. Diamond may be added to the binder solution to achieve about a 2-25% binder solution (the percentage is calculated without regard to the 2-butanone).
Third, the mixture of diamond and binder solution is dried. This may be accomplished by placing the diamond and binder solution mixture in a vacuum oven for about 24 hours at about 50 degrees Celsius in order to drive out all of the solvent 2-butanone. Fourth, the diamond and binder may be pressed into shape. When the 1o diamond and binder is removed from the oven, it will be in a clump that may be broken into pieces which are then pressed into the desired shape with a compaction press. A pressing spindle of the desired geometry may be contacted with the bound diamond to form it into a desired shape. When the diamond and binder have been pressed, the spindle is retracted. The final density of diamond and binder after pressing may be at least about 2.6 grams per cubic centimeter.
If a volatile binder is used, it should be removed from the shaped diamond prior to sintering. The shaped diamond is placed into a furnace and the binding agent is either gasified or pyrolized for a sufficient length of time such that there is no binder remaining. Polycrystalline diamond compact quality is reduced by foreign 2o contamination of the diamond or substrate, and great care must be taken to ensure that contaminants and binder are removed during the furnace cycle. Ramp up and the time and temperature combination are critical for effective pyrolization of the binder. For the binder example given above, the debinding process that may be used to remove the binder is as follows. Reviewing Figure 4 while reading this description may be helpful.
First, the shaped diamond and binder are heated to from ambient temperature to about 500 degrees Celsius. The temperature may be increased by about 2 degrees Celsius per minute until about 500 degrees Celsius is reached.
Second, the temperature of the bound and shaped diamond is maintained at about 500 degrees Celsius for about 2 hours. Third, the temperature of the diamond is increased again. The temperature may be increased from about 500 degrees Celsius by about 4 degrees per minute until a temperature of about 950 degrees Celsius is reached. Fourth, the diamond is maintained at about 950 degrees Celsius for about 6 hours. Fifth, the diamond is then permitted to return to ambient temperature at a temperature decrease of about 2 degrees per minute.
In some embodiments of the devices, it may be desirable to preform bound diamond feedstock by an appropriate process, such as injection molding. The diamond feedstock may include diamond crystals of one or more sizes, solvent-catalyst metal, and other ingredients to control diamond recrystallization and solvent-catalyst metal distribution. Handling the diamond feedstock is not difficult when the desired final curvature of the part is flat, convex dome or conical. However, when the desired final curvature of the part has complex contours, such as illustrated herein, providing uniform thickness and accuracy of contours of the polycrystalline diamond compact is more difficult when using powder diamond feedstock. In such cases it may be desirable to perform the diamond feedstock before sintering.
If it is desired to perform diamond feedstock prior to loading into a can for sintering, rather than placing powder diamond feedstock into the can, the steps 1o described herein and variations of them may be followed. First, as already described, a suitable binder is added to the diamond feedstock. Optionally, powdered solvent-catalyst metal and other components may be added to the feedstock as well. The binder will typically be a polymer chosen for certain characteristics, such as melting point, solubility in various solvents, and CTE. One or 15 more polymers may be included in the binder. The binder may also include an elastomer and/or solvents as desired in order to achieve desired binding, fluid flow and injection molding characteristics. The working volume of the binder to be added to a feedstock may be equal to or slightly more than the measured volume of empty space in a quantity of lightly compressed powder. Since binders typically consist of 2o materials such as organic polymers with relatively high CTE's, the working volume should be calculated for the injection molding temperatures expected. The binder and feedstock should be mixed thoroughly to assure uniformity of composition.
When heated, the binder and feedstock will have sufficient fluid character to flow in high pressure injection molding. The heated feedstock and binder mixture is then 25 injected under pressure into molds of desired shape. The molded part then cools in the mold until set, and the mold can then be opened and the part removed.
Depending on the final polycrystalline diamond compact geometry desired, one or more molded diamond feedstock component can be created and placed into a can for polycrystalline diamond compact sintering. Further, use of this method permits 3o diamond feedstock to be molded into a desired form and then stored for long periods of time prior to use in the sintering process, thereby simplifying manufacturing and resulting in more efficient production.
As desired, the binder may be removed from the injection molded diamond feedstock form. A variety of methods are available to achieve this. For example, by 35 simple vacuum or hydrogen furnace treatment, the binder may be removed from the diamond feedstock form. In such a method, the form would be brought up to a desired temperature in a vacuum or in a very low pressure hydrogen (reducing) environment. The binder will then volatilize with increasing temperature and will be removed from the form. The form may then be removed from the furnace. When hydrogen is used, it helps to maintain extremely clean and chemically active surfaces on the diamond crystals of the diamond feedstock form.
An alternative method for removing the binder from the form involves utilizing 5 two or polymer (such as polyethylene) binders with different molecular weights. After initial injection molding, the diamond feedstock form is placed in a solvent bath which removes the lower molecular weight polymer, leaving the higher molecular weight polymer to maintain the shape of the diamond feedstock form. Then the diamond feedstock form is placed in a furnace for vacuum or very low pressure hydrogen to treatment for removal of the higher molecular weight polymer.
Partial or complete binder removal from the diamond feedstock form may be performed prior to assembly of the form in a pressure assembly for polycrystalline diamond compact sintering. Alternatively, the pressure assembly including the diamond feedstock form may be placed into a furnace for vacuum or very low 15 pressure hydrogen furnace treatment and binder removal.
Dilute Binder In some embodiments, dilute binder may be added to PCD, PCBN or ceramic powders to hold form. This technique may be used to provide an improved method of forming Polycrystalline Diamond Compact (PDC), Polycrystalline Cubic Boron 2o Nitride (PCBN), ceramic, or cermet powders into layers of various geometries. A
PDC, PCBN, ceramic or cermet powder may be mixed with a temporary organic binder. This mixture may be mixed and cast or calendared into a sheet (tape) of the desired thickness. The sheet may be dried to remove water or organic solvents.
The dried tape may be then cut into shapes needed to conform to the geometry of a 25 corresponding substrate. The tape/substrate assembly may be then heated in a vacuum furnace to drive off the binder material. The temperature may be then raised to a level where the ceramic or cermet powder fuses to itself and/or to the substrate, thereby producing a uniform continuous ceramic or cermet coating bonded to the substrate.
3o Referring to Figure 5, a die 55 with a cup/can in it 54 and diamond feedstock against it 52 are depicted. A punch 53 is used to form the diamond feedstock into a desired shape. Binder liquid 51 is not added to the powder until after the diamond, PCBN, ceramic or cermet powder 52 is in the desired geometry. Dry powder 52 is spin formed using a rotating formed punch 53 in a refectory containment can 54 35 supported in a holding die 55. In another method shown in Figure 6, feedstock powder 62 is added to a mold 66. A punch forms the feedstock to shape. A
vibrator 67 may be used help the powder 62 take on the shape of the mold 66. After the powder feedstock is in the desired geometry, a dilute solution of an organic binder with a solvent is allowed to percolate through the powder granules.
As shown in Figures 7 and 8, one powder layer 88 can be loaded, and after a few minutes, when the binder is cured sufficiently at room temperature, another layer 89 can be loaded on top of the first layer 88. This method is particularly useful in producing PDC or CBN with multiple layers of varying powder particle size and metal content. The process can be repeated to produce as many layers as desired.
Figure 7 shows a section view of a spherical, multi-layered powder load using a first layer 88, second layer 89, third layer 810, and final layer 811. The binder content should 1o be kept to minimum to produce good loading density and to limit the amount of gas produced during the binder removal phase to reduce the tendency of the containment cans being displaced from a build up of internal pressure.
Once all of the powder layers are loaded the binder may be burned-out in a vacuum oven at a vacuum of about200 Militorrs or less and at the time and desired 15 temperature profile, such as that shown in Figure 9. An acceptable binder is 0.5 to 5% propylene carbonate in methyl ethyl keytone. An example binder burn out cycle that may be used to remove binder is as follows:
Time Temperature (minutes) (degrees Centigrade) 2o Gradients Diamond feedstock may be selected and loaded in order to create different types of gradients in the diamond table. These include an interface gradient diamond table, an incremental gradient diamond table, and a continuous gradient diamond table.
25 If a single type or mix of diamond feedstock is loaded adjacent a substrate, as discussed elsewhere herein, sweep of solvent-catalyst metal through the diamond will create an interface gradient in the gradient transition zone of the diamond table.
An incremental gradient diamond table may be created by loading diamond feedstocks of differing characteristics (diamond particle size, diamond particle 3o distribution, metal content, etc.) in different strata or layers before sintering.. For example, a substrate is selected, and a first diamond feedstock containing 60%
solvent-catalyst metal by weight is loaded in a first strata adjacent the substrate.
Then a second diamond feedstock containing 40% solvent-catalyst metal by weight is loaded in a second strata adjacent the first strata. Optionally, additional strata of diamond feedstock may be used. For example, a third strata of diamond feedstock containing 20% solvent-catalyst metal by weight may be loaded adjacent the second strata.
A continuous gradient diamond table may be created by loading diamond feedstock in a manner that one or more of its characteristics continuously vary from one depth in the diamond table to another. For example, diamond particle size may vary from large near a substrate (in order to create large interstitial spaces in the diamond for solvent-catalyst metal to sweep into) to small near the diamond surface in order to create a part that is strongly bonded to the substrate but that has a very low friction surface.
The diamond feedstocks of the different strata may be of the same or different diamond particle size and distribution. Solvent-catalyst metal may be included in the diamond feedstock of the different strata in weight percentages of from about 0% to more than about 80%. In some embodiments, diamond feedstock will be loaded with no solvent-catalyst metal in it, relying on sweep of solvent-catalyst metal from the 2o substrate to achieve sintering. Use of a plurality of diamond feedstock strata, the strata having different diamond particle size and distribution, different solvent-catalyst metal by weight, or both, allows a diamond table to be made that has different physical characteristics at the interface with the substrate than at the surface. This allows a polycrystalline diamond compact to be manufactured which has a diamond table very firmly bonded to its substrate.
Bisquing Processes to Hold Shapes If desired, a bisquing process may be used to hold shapes for subsequent processing of polycrystalline diamond compacts, polycrystalline cubic boron nitride, and ceramic or cermet products. This involves an interim processing step in High 3o Temperature High Pressure (HTHP) sintering of Polycrystalline Diamond Compact (PDC), Polycrystalline Boron Nitride (PCBN), ceramic, or cermet powders called "bisquing." Bisquing may provide the following enhancements to the processing of the above products:
a. Pre-sintered shapes can be controlled that are at a certain density and size.
b. Product consistency is improved dramatically.
c. Shapes can be handled easily in the bisque form.
d. In layered constructs, bisquing keeps the different layers from contaminating each other.

e. Bisquing different components or layers separately increase the separation of work elements increasing production efficiency and quality.
f. Bisquing molds are often Baser to handle and manage prior to final assembly that the smaller final product forms.
Bisquing molds or containers can be fabricated from any high temperature material that has a melting point higher than the highest melting point of any mix component to be bisque. Bisque mold / container materials that work well are Graphite, Quartz, Solid Hexagonal Boron Nitride (HBN), and ceramics. Some refractory type metals (High temperature stainless steels, Nb, W, Ta, Mo, etc) work 1o well is some applications where bisquing temperatures are lower and sticking of the bisque powder mix is not a problem. Molds or containers can be shaped by pressing, forming, or machining, and are preferably polished at the interface between the bisque material and the mold / container itself. Some mold / container materials glazing and /or firing prior to use.
15 Figure 10 shows an embodiment 1006 for making a cylinder with a concave relief or trough using the bisquing process. Pre-mixed powders of PDC, PCBN, ceramic, or cermet materials 1001 which contain enough metal to undergo solid phase sintering are loaded into the bisquing molds or containers 1002 and 1004. A
release agent may be required between the mold / container to ensure that the final bisque 2o form can be removed following furnace firing. Some release agents that may be used are HBN, Graphite, Mica, and Diamond Powder. A bisque mold / container lid with an integral support form 1005 is placed over the loaded powder material to ensure that the material holds form during the sintering process. The bisque mold /
container assembly is then placed in a hydrogen atmosphere furnace, or alternately, 25 in a vacuum furnace which is drawn to a vacuum ranging from 200 to 0 Militorrs. The load is then heated within a range of 0.6 to 0.8 of the melting temperature of the largest volume mix metal. A typical furnace cycle is shown in Figure 12. Once the furnace cycle is completed and the mold / container is cooled, the hardened bisque formed powders can be removed for further HPHT processing. A bisque form of 3o feedstock 1003 is the net product.
Figure 11 shows fabrication 1110 of a bisque form for a full hemispherical part 1109 that has multiple powder layers 1107a and 1107b. Pre-mixed powders of PDC, PCBN, ceramic, or cermet materials which contain enough metal to undergo solid phase sintering are loaded into the bisquing molds or containers. A release agent 35 may be required between the mold / container to ensure that the final bisque form can be removed following furnace firing. The bisque mold / container assembly may then placed in a vacuum furnace which is drawn to a vacuum ranging from 200 to Militorrs. The load is then heated within a range of 0.6 to 0.8 of the melting temperature of the largest volume mix metal. Once the furnace cycle is completed and the mold / container is cooled, the hardened bisque 1109 formed powders can be removed for further HPHT processing. An example of a bisque binder burn-out cycle that may be used to remove the unwanted materials before sintering is as follows:
Time Temperature (hours) (degrees Centigrade) 0.25 21 5.19 800 6.19 800 10.19 21 Reduction of Free Volume in Diamond Feedstock As mentioned earlier, it may be desirable to remove free volume in the 1o diamond feedstock before sintering is attempted. This may be a useful procedure especially when producing non-planar concave and convex parts. If a press with sufficient anvil travel is used for high pressure and high temperature sintering, however, this step may not be necessary. Free volume in the diamond feedstock may in some instances be reduced so that the resulting diamond feedstock is at least 15 about 95% theoretical density and sometimes closer to about 97% of theoretical density.
Referring to Figures 13 and 14a, an assembly used for precompressing diamond to eliminate free volume is depicted. In the drawing, the diamond feedstock is intended to be used to make a convex non-planar polycrystalline diamond part.
2o The assembly may be adapted for precompressing diamond feedstock for making polycyrstalline diamond compacts of other complex shapes.
The assembly depicted includes a cube 1301 of a pressure transfer medium.
A cube is made from pyrophillite or other appropriate pressure transfer material such as a synthetic pressure medium and is intended to undergo pressure from a cubic 25 press with anvils simultaneously pressing the six faces of the cube. A
cylindrical cell rather than a cube would be used if a belt press were utilized for this step.
The cube 801 has a cylindrical cavity 1302 or passage through it. The center of the cavity 1302 will receive a non-planar refractory metal can 1310 loaded with diamond feedstock 806 that is to be precompressed. The diamond feedstock 1306 3o may have a substrate with it.
The can 1310 consists of two heminon-planar can halves 131 Oa and 1310b, one of which overlaps the other to form a slight lip 1312. The can may be an appropriate refractory metal such as niobium, tantalum, molybdenum, etc. The can is typically two hemispheres, one which is slightly larger to accept the other being slid inside of it to fully enclosed the diamond feedstock. A rebated area or lip is provided in the larger can so that the smaller can will satisfactorily fit therein. The seam of the can is sealed with an appropriate sealant such as dry hexagonal boronitride or a synthetic compression medium. The sealant forms a barrier that prevents the salt pressure medium from penetrating the can. The can seam may also be welded by plasma, laser, or electron beam processes.
An appropriately shaped pair of salt domes 1304 and 1307 surround the can l0 1310 containing the diamond feedstock 1306. In the example shown, the salt domes each have a heminon-planar cavity 1305 and 1308 for receiving the can 1310 containing the non-planar diamond feedstock 1306. The salt domes and the can and diamond feedstock are assembled together so that the salt domes encase the diamond feedstock. A pair of cylindrical salt disks 1303 and 1309 are assembled on 15 the exterior of the salt domes 1304 and 1307. All of the aforementioned components fit within the bore 1302 of the pressure medium cube 1301.
The entire pyrocube assembly is placed into a press and pressurized under appropriate pressure (such as about 40-68 Kbar) and for an appropriate although brief duration to precompress the diamond and prepare it for sintering. No heat is 2o necessary for this step.
Mold Releases When making non-planar shapes, it may be desirable to use a mold in the sintering process to produce the desired net shape. CoCr metal may used as a mold release in forming shaped diamond or other superhard products. Sintering the 25 superhard powder feed stocks to a substrate, the object of which is to lend support to the resulting superhard table, may be utilized to produce standard Polycrystalline Diamond Compact (PDC) and Polycrystalline Cubic Boron Nitride (PCBN) parts.
However, in some applications, it is desired to remove the diamond table from the substrate.
3o Referring to Figure 14, a diamond layer 1402 and 1403 has been sintered to a substrate 1401 at an interface 1404. The interface 1404 must be broken to result in free standing diamond if the substrate is not required in the final product. A mold release may be used to remove the substrate from the diamond table. If CoCr alloy is used for the substrate, then the CoCr itself serves as a mold release, as well as 35 serving as a solvent-catalyst metal. CoCr works well as a mold release because its Coefficient of Thermal Expansion (CTE) is dramatically different than that of sintered PDC or PCBN 3. Because of the large disparity in the CTE's between PDC and PCBN and CoCr, high stress is formed at the interface 1501 between these two materials as shown in Figure 15. The stress that is formed is greater than the bond energy between the two materials. When the stress is greater than the bond energy, a crack is formed at the point of highest stress. The crack then propagates following the narrow region of high stress concentrated at the interface. Referring to Figure 16, in this way, the CoCr substrate 1601 will separate from the PCD or PCBN

that was sintered around it, regardless of the shape of the interface.
Materials other than CoCr can be used as a mold release. These materials include those metals with high CTE's and, in particular, those that are not good carbide formers. These are, for example, Co, Ni, CoCr, CoFe, CoNi, Fe, steel, etc.
to Gradient Layers and Stress Modifiers Gradient layers and stress modifiers may be used in the making of superhard constructs. Gradient layers may be used to achieve any of the following objectives:
a. Improve the "sweep" of solvent metal into the outer layer of superhard material and to control the amount of solvent metal introduced for sintering into said outer layer.
b. Provide a "sweep" source to flush out impurities for deposit on the surface of the outer layer of superhard material and/or chemical attachment/combination with the refractory containment cans.
c. Control the Bulk Modulus of the various gradient layers and thereby 2o control the overall dilatation of the construct during the sintering process.
d. Affect the "Coefficient of Thermal Expansion" (CTE) of each of the various layers by changing the ratio of metal or carbides to diamond, PCBN or other Superhard materials to reduce the CTE of an individual gradient layer.
e. Allow for the control of structural stress fields through the various levels of gradient layers to optimize the overall construct.
f. Change the direction of stress tensors to improve the outer Superhard layer, e.g., direct the tensor vectors toward the center of a spherical 3o construct to place the outer layer diamond into compression, or conversely, direct the tensor vectors from the center of the construct to reduce interface stresses between the various gradient layers.
g. Improve the overall structural stress compliance to external or internal loads by providing a construct that has substantially reduced brittleness and increased toughness wherein loads are transferred through the construct without crack initiation and propagation.

Referring to Figure 17, The liquid sintering phase of Polycrystalline Diamond (PDC) and Polycrystalline Cubic Boron Nitride (PCBN) is typically accomplished by mixing the solvent sintering metal 1701 directly with the Diamond or PCBN powders 1702 rp for to the "High Temperature High Pressure (HPHT) pressing, or (referring to Figure 18) "sweeping"
the solvent metal 1802 from a substrate 1801 into feedstock powders from the adjacent substrate durin HPHT. The very best high quality PDC or PCBN is created using the "sweep" process.
There are several theories related to the increased PDC and CBH quality when using the sweep method. However, most of those familiar with the field agree to that allowing the sintering metal to "sweep" from the substrate material provides a "wave front" of sintering metal that quickly "wets" and dissolves the diamond or CBN
and uses only as much metal as required to precipitate Diamond or PCBN
particle-to-particle bonding. Whereas in a "premixed" environment the metal "blinds off"
the particle-to particle reaction because too much metal is present, or conversely, not 15 enough metal is present to ensure the optimal reaction.
Furthermore, it is felt that the "wave front" of metal sweeping through the powder matrix also carries away impurities that would otherwise impede the formation of high quality PDC of PCBN. These impurities are normally "pushed"
ahead of the sintering metal "wave front" and are deposited in pools adjacent to the 2o refractory containment cans. Figure 19 depicts the substrate 1904, the wavefront 1903, and the feedstock crystals or powder 1902 which the wavefront will sweep through 1901. Certain refractory material such as Niobium, Molybdenum, and Zirconium can act as "getters" which combine with the impurities as they immerge from the matrix giving additional assistance in the creation of high quality end 25 products.
While there are compelling reasons to use the "sweep" process in sintering PDC and PCBN there are also problems that arise out of its use. For example, not all substrate metals are as controllable as others as to the quantity of material that is delivered and ultimately utilized by the powder matrix during sintering.
Cobalt metal 30 (6 to 13% by volume) sweeping from cemented tungsten carbide is very controllable when used against diamond or PCBN powders ranging from 1 to 40 microns particle sized. On the other hand, Cobalt Chrome Molybdenum (CoCrMo) that is useful as a solvent metal to make PDC for some applications overwhelms the same PDC matrix with CoCrMo metal in a pure sweep process sometimes producing inferior quality 35 PDC. The fact that the CoCrMo has a lower melting point than cobalt, and further that there is an inexhaustible supply when using a solid CoCrMo substrate adjacent to the PDC matrix, creates a non-controllable processing condition.

In some applications where it is necessary to use sintering metals such a CoCrMo that can not be "swept" from a cemented carbide product, it is necessary to provide a simulated substrate against the PDC powders that provides a controlled release and limited supply of CoCrMo for the process.
These "simulated" substrates have been developed in the forms of "gradient"
layers of mixtures of diamond, carbides, and metals to produce the desired "sweep"
affect for sintering the outer layer of PDC. The first "gradient layer" (just adjacent to the outer or primary diamond layer which will act as the bearing or wear surface) can be prepared using a mixture of Diamond, Cr3C2, and CoCrMo. Depending of the size 1o fraction of the diamond powder used in the outer layer, the first gradient layers diamond size fraction and metal content is adjusted for the optimal sintering conditions.
Where a "simulated" substrate is used, it has been discovered that often a small amount of solvent metal, in this case CoCrMo must be added to the outside diamond layer as catalyst to "kick-off" the sintering reaction.
One embodiment utilizes the mix ranges for the outer 2001 and inner 2002 gradient layers of Figure 20 that are listed in Table 9.

GRAD(ANT DIAMOND DIAMOND Cr3C2 CoCrMo LAYERS (Vol. Percent)(Size Fraction-(Vol. (Vol.

,um) Percent) Percent) Outer 92 25 0 8 Inner 70 40 ~ 10 20 The use of gradient layers with solid layers of metal allows the designer to match the Bulk Modulus to the Coefficient of Thermal Expansion (CTE) of various features of the construct to counteract dilatory forces encountered during the HTHP
phase of the sintering process. For example, in a spherical construct as the pressure increases the metals in the construct are compressed or dilated radially toward the center of the sphere. Conversely, as the sintering temperature increases the metal expands radially away from the center of the sphere. Unless these forces are 3o balanced in some way, the compressive dilatory forces will initiate cracks in the outer diamond layer and cause the construct to be unusable.
Typically, changes in bulk modulus of solid metal features in the construct are controlled by selecting metals with a compatible modulus of elasticity. The thickness and other sizing features are also important. CTE, on the other hand, is changed by the addition of diamond or other carbides to the gradient layers.
One embodiment, depicted in Figure 21, involves the use of two gradient outer layers 2101 and 2102, a solid titanium layer 2103 and an inner CoCrMo sphere 2104. In this embodiment the first gradient layer provides a "sweep source" of biocompatible CoCrMo solvent metal to the outer diamond layer. The solid Titanium layer provides a dilatory source that offsets the CTE from the solid CoCrMo center ball and keeps it from "pulling away" from the Titanium/CoCrMo interface as the sintering pressure and temperature go from the 65Kbar and 1400 °C
sintering range 1o to 1 bar and room temperature.
Where two or more powder based gradient layers are to be used in the construct it becomes increasingly important to control the CTE of each layer to ensure structural integrity following sintering. During the sintering process stresses are induced along the interface between each of the gradient layers. These high 15 stresses are a direct result of the differences in the CTE between any two adjacent layers. To reduce these stresses one or both of the layer materials CTE's must be modified.
The CTE of the a substrate can be modified by either changing to a substrate with a CTE close to that of diamond (an example is the use of cemented Tungsten 2o Carbide, where the CTE of Diamond is approximately 1.8,~m/m °C and Cemented Tungsten Carbide is Approximately 4.4,um/m °C), or in the case of powdered layers, by adding a low CTE material to the substrate layer itself. That is, making a mixture of two or more materials, one or more of which will alter the CTE of the substrate layer.
25 Metal powders can be mixed with diamond or other superhard materials to produce a material with a CTE close to that of diamond and thus produce stresses low enough following sintering to prevent delamination of the layers at their interfaces. Experimental data shows that the CTE altering materials will not generally react with each other, which allows the investigator to predict the outcome 30 of the intermediate CTE for each gradient level.
The desired CTE is obtained by mixing specific quantities of two materials according to the rule of mixtures. TabIelO shows the change in CTE between two materials, A and B as a function of composition (Volume Percent). In this example, materials A and B have CTE's of 150 and 600,u In./In. - °F
respectively. By adding 35 50 mol % of A to 50 mol % of B the resulting CTE is 375,u in/ in °F.
One or more of the following component processes is incorporated into the mold release system:

1 ) An intermediate layer of material between the polycrystalline diamond compact part and the mould that prevents bonding of the polycrystalline diamond compact to the mould surface.
2) A mold material that does not bond to the polycrystalline diamond compact under the conditions of synthesis.
3) A mold material that, in the final stages of, or at the conclusion of, the polycrystalline diamond compact synthesis cycle either contracts away from the polycrystalline diamond compact in the case of a net concave polycrystalline diamond compact geometry, or expands away from the polycrystalline diamond 1o compact in the case of a net convex polycrystalline diamond compact geometry.
4) The mold shape can also act, simultaneously as a source of sweep metal useful in the polycrystalline diamond compact synthesis process.
As an example, a mold release system may be utilized in manufacturing a polycrystalline diamond compact by employing a negative shape of the desired 15 geometry to produce heminon-planar parts. The mold surface contracts away from the final net concave geometry, the mold surface acts as a source of solvent-catalyst metal for the polycrystalline diamond compact synthesis process, and the mold surface has poor bonding properties to polycrystalline diamond compacts.
Table 10 2o PREDICTED DIIVVIENSIONAL CHANGES IN AN EIGHT INCH LAYERED
CONSTRUCT
A % B% CTE Total LengthFinal Dimension (,u In. / Change (In.) In F) (In.) 100 0 150 .0012 7.9988 90 10 195 .0016 7.9984 80 20 240 .0019 7.9981 70 30 285 .0023 7.9977 60 40 330 .0026 7.9974 50 375 .0030 7.9970 40 60 420 .0034 7.9966 30 70 465 .0037 7.9963 20 80 510 .0041 7.9959 10 90 555 .0044 7.9956 0 100 600 .0048 7.9952 Referring to Figure 22, an illustration of how the above CTE modification works in a one-dimensional example. The one-dimensional example works as well in a three-dimensional construct. If the above materials A and B are packed in alternating layers 2201 and 2202 as shown in Figure 22, separately in their pure forms, with their CTE's of 150 and 600,u In./In. - °F respectively, they will contract exactly 150,u In./In. - °F and 600,u In./In. - °F for every degree decrease in temperature. For an eight inch block of the one inch thick stacked layers the total change in dimension for a one degree decrease in temperature will be:
Material A: (4 X 1 In.) X (.00015 In. l In. - °F) X 1 °F =
.0006 In.
io Material B: (4 X 1 In.) X (.00060 In. / In. - °F) X 1 ) °F =
.0024 In.
Total overall length decrease in eight inches = .0030 In.
By comparison, each of the layers is modified by using a mixture of 50% of A
is and 50% of B, and all eight layers are stacked into the eight-inch block configuration shown in Fig. 7. Re-calculation of the overall length decrease using the new composite CET of 375,u In./In. °F from Table II shows:
Material A + B: (8 X 1 In.) X (.000375 In. / In. - °F) X 1 °F = .0030 In.
2o Total overall length decrease in eight inches = .0030 In.
The length decrease in this case was accurately predicted for the one-dimensional construct using one-inch thick layers by using the Rule of Mixtures.
Metals have very high CTE values as compared to diamond, which has one 25 of the lowest CTE's of any known material. When metals are used as substrates for PDC and PCBN sintering considerable stress is developed at the interface.
Therefore, mixing low CTE material with the biocompatible metal for medical implants can be used to reduce interfacial stresses. One of the best candidate materials is diamond itself. Other materials include refractory metal carbides and bitrides, and 3o some oxides. Borides and silicides would also be good materials from a theoretical standpoint, but may not be biocompatible. The following is a list of candidate materials:
Carbides Silicides Oxynitrides 35 Nitrides Oxides Oxyborides Borides Oxycarbides Carbonitrides There are other materials and combinations of materials that could be utilized as CTE modifiers.
There are also other factors that also apply to the reduction of interface stresses for a particular geometrical construct. The thickness of the gradient layer, its position in the construct, and the general shape of the final construct all contribute in interfacial stress tensor reduction. Geometries that are more spherical tend to promote interface circumferential failures from positive or negative radial tensors while geometries of a cylindrical configuration tend to fail at the layer interfaces to precipitated by bending stress couples.
The design of the gradient layers respecting CTE and the amount of contraction the each individual layer will experience during cooling form the HTHP
sintering process will largely dictate the direction of stress tensors in the construct.
Generally, the designer will always desire to have the outer wear layer of superhard material in compression to prevent delamination and crack propagation. In spherical geometries the stress tensors would be directed radially toward the center of the spherical shape giving special attention to the interfacial stresses at each layer interface to prevent failures at these interfaces as well. In cylindrical geometries the stress tensors would be adjusted to prevent stress couples from initiating cracks in 2o either end of the cylinder, especially at the end where the wear surface is present.
The following are embodiments that relates to a spherical geometry wherein combinations of gradient layers andlor solid metal balls are used to control the final outcomes of the constructs. Figure 23 is an embodiment that shows a spherical construct, which utilizes five gradient layers wherein the composition of each layer is described in Tables 11 and 12:

LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size (~, Volume Volume Volume THICKNESS (In.) m) % % %

First (Outer20 92 8 0 .090 Layer) Second 2302 40 70 20 20 .104 Third 2303 70 60 20 20 .120 Forth 2304 70 60 26 26 .138 Fifth 2305 70 25 37.5 37.5 .154 LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size Volume Volume Volume THICKNESS (In.) (~. % % %
m) First (OuterLayer)20 100 0 0 .090 Second 2302 40 70 20 20 .104 Third 2304 70 60 20 20 .120 Forth 2304 70 60 26 26 .138 Fifth 2305 70 25 37.5 37.5 .154 Figure 24 is an embodiment that shows a spherical construct, which utilizes four gradient layers wherein the composition of each layer is described in Tables 13 and 14.

LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size Volume Volume Volume THICKNESS (In.) (fit % % %
m) First (Outer 20 92 0 8 .097 Layer) Second 40 70 10 20 .125 Third 70 60 20 20 .144 Forth 70 50 25 25 .240 LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size Volume Volume Volume THICKNESS (In.) (~. % % %
m) First (Outer 20 100 0 0 .097 Layer) Second 2402 40 70 10 20 .125 Third 2403 70 60 20 20 .144 Forth 2404 70 50 25 25 .240 ~

Figure 25 shows an embodiment construct that utilizes a center support ball with gradient layers laid up on the ball and each other to form the complete construct.
The inner ball of solid metal CoCrMo is encapsulate with a .003 to .010 inch thick refractory barrier can to prevent the over saturation of the system with the ball metal during the HTHP phase of sintering. The composition of each layer is described in Tables 15 and 16.

LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size (~. Volume Volume Volume THICKNESS
m) % % % (In.) First (Outer 20 92 0 8 .097 Layer) Second 2502 40 70 10 20 .125 Third 2503 70 60 20 20 .144 CoCrMo Ball N/A N/A N/A N/A N/A

LAYER DIAMOND Cr3C2 CoCrMo LAYER

Size (~, Volume Volume Volume THICKNESS
m) % % % (In.) First (Outer 20 100 0 0 .097 Layer) Second 2502 40 70 10 20 .125 Third 2503 70 60 20 20 .144 CoCrMo Ball N/A N/A N/A NlA NlA

Predicated on the end use function of the sphere above, the inner ball could be made of Cemented Tungsten Carbide, Niobium, Nickel, Stainless steel, Steel, or one of to several other metal or ceramic materials to suite the designers needs.
Embodiments relating to dome shapes are described as follow:
Figure 26 shows a dome embodiment construct that utilizes two gradient 15 layers 2601 and 2602 wherein the composition of each layer is described in Tables 17 and 18.

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~. % % % %
m) (In.) First 20 94 0 6 0.05 .200 (Outer Layer) Second 70 60 20 20 0.05 .125 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(,u % % % % (In.) m) First (Outer 20 100 0 0 0.05 .200 Layer) Second 2601 70 60 20 20 0.05 .125 Figure 27 shows a dome embodiment construct that utilizes two gradient layers and 2702 wherein the composition of each layer is described in Tables 19 and 20:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~. % % % % (In.) m) First (Oute 20 94 0 6 0.05 .128 Layer) Second 2701 70 60 20 20 0.05 .230 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % %a (In.) m) First (Outer 20 100 0 0 0.05 .128 Layer) Second 2701 70 60 20 20 0.05 .230 Figure 28 shows a dome embodiment construct that utilizes three gradient layers 2801, 2802 and 2803 where the composition of each layer is described in Tables and 22:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size (~, Volume Volume Volume Volume THICKNE
m) % % % %

SS (In.) First (Outer 20 96 0 4 0.05 .168 Layer) Second 2802 40 80 10 10 0.05 .060 Third 2803 70 60 20 20 0.05 .130 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size (~, Volume Volume Volume Volume THICKNESS
m) % % % % (In.) First (Outer20 100 0 0 0.05 .168 Layer) Second 2802 40 80 10 10 0.05 .060 Third 2803 70 60 20 20 0.05 .130 Figure 29 shows a dome embodiment construct that utilizes three gradient layers 2901, 2902 and 9803 wherein the composition of each layer is described in Tables 23 and 24:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size (~. Volume Volume Volume Volume THICKNESS
m) % % % % (In.) First (Outer20 96 0 4 0.05 .065 Layer) Second 2902 40 80 10 10 0.05 .050 Third 2903 70 60 20 20 0.05 .243 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size (~, Volume Volume Volume Volume THICKNES
m) % % % % S (In.) First (Outer20 100 0 0 0.05 .065 Layer) Second 2902 40 80 10 IO 0.05 .050 Third 2903 70 60 20 20 0.05 .243 Embodiments relating to Flat Cylindrical shapes are described as follows:

Figure 30 shows a flat cylindrical embodiment construct that utilizes two gradient layers 3001 and 3002 wherein the composition of each layer is described in Tables 25 and 26:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer 20 94 0 6 0.05 Layer) Second 3002 70 60 20 20 0.05 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer 20 100 0 0 0.05 Layer) Second 3002 70 60 20 20 0.05 1o Figure 31 shows a flat cylindrical embodiment construct that utilizes three gradient layers 3101, 3102, 3103 wherein the composition of each layer is described in Tables 27 and 28:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(fit % % % % (In.) m) First (Outer 20 96 0 4 0.05 Layer) Second 3102 40 80 10 10 0.05 Third 3103 70 60 20 20 0.05 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNES
(~. % % % %

m) S (In.) First (Outer 20 100 0 0 0.05 Layer) Second 3102 40 80 10 10 0.05 Third 3103 70 60 20 20 0.05 Figure 32 shows a flat cylindrical embodiment construct that utilizes three gradient layers 3201, 3202, 3203 laid up on a CoCrMo substrate 3204. The cylindrical substrate of solid metal CoCrMo is encapsulate with a .003 to .010 inch thick refractory barrier can 3205 to prevent the over saturation of the system with the substrate metal during the HTHP phase of sintering. The composition of each layer is described in Tables 29 and 30:
to TABLE 29 LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~. % % % % (In.) m) First (Outer 20 96 0 4 0.05 Layer) Second 3202 40 80 10 10 0.05 Third 3203 70 60 20 20 0.05 CoCrMo SubstrateN/A N/A N/A N/A NlA

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(,u % % % % (In.) m) First (Outer 20 100 0 0 0.05 Layer) Second 3202 40 80 10 10 0.05 Third 3203 70 60 20 20 0.05 CoCrMo SubstrateN/A N/A N/A N/A NlA

Predicated on the end use function of the cylinder shape of Figure 32 the inner substrate could be made of Cemented Tungsten Carbide, Niobium, Nickel, Stainless steel, Steel, or one of several other metal or ceramic materials to suite the designers needs.

Embodiments relating to Flat Cylindrical Shapes with Formed-in-Place Concave Features are described as follow:
Figure 33 show an embodiment of a flat cylindrical shape with a formed in place concave trough 3303 that utilizes two gradient layers 3301 and 3302 wherein the composition of each layer is described in Tables 31 and 32:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(p. % % % % (In.) m) First (Outer 20 94 0 6 0.05 .156 Layer) Second 3302 70 60 20 20 0.05 .060 Filler Support70 60 20 20 0.05 N/A

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~ % % % % (In.) m) First (Outer 20 100 0 0 0.05 .156 Layer) Second 3302 70 60 20 20 0.05 .060 Filler Support70 60 20 20 0.05 N/A

Figure 34 shows an embodiment of a flat cylindrical shape with a formed in place concave trough 3402 that utilizes two gradient layers 3401 and 3402 wherein the composition of each layer is described in Tables 33 and 34:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(p, % % % % (In.) m) First (Outer 20 94 0 6 0.05 .156 Layer) Second 3402 70 60 20 20 0.05 .060 Filler Support70 60 20 20 0.05 N/A

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer 20 100 0 0 0.05 .156 Layer) Second 3402 70 60 20 20 0.05 .060 Filler Support70 60 20 20 0.05 N/A

Figure 35 shows an embodiment of a flat cylindrical shape with a formed in place concave 3504 trough that utilizes three gradient layers 3501, 3502, 2503 wherein the composition of each layer is described in Tables 35 and 36:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(,u % % % % (In.) m) First (Outer 20 96 0 4 0.05 .110 Layer) Second 3502 40 80 10 10 0.05 .040 Third 2503 70 60 20 20 0.05 .057 Filler Support70 60 20 20 0.05 N/A

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer 20 100 0 0 0.05 .110 Layer) Second 3502 40 80 10 10 0.05 .040 Third 3503 70 60 20 20 0.05 .057 Filler Support70 60 20 20 0.05 NIA

Figure 36 shows an embodiment of a flat cylindrical shape with a formed in place concave trough 3604 that utilizes three gradient layers 3601, 3602, 3603 wherein the composition of each layer is described in Tables 37 and 38:

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer20 96 0 4 0.05 .110 Layer) Second 3602 40 80 10 10 0.05 .040 Third 3603 70 60 20 ~ 20 0.05 .057 Filler Support70 60 20 20 0.05 N/A

LAYER DIAMOND Cr3C2 CoCrMo TiCTiN LAYER

Size Volume Volume Volume Volume THICKNESS
(~, % % % % (In.) m) First (Outer20 100 0 0 0.05 ,110 Layer) Second 3602 40 80 10 10 0.05 .040 Third 3603 70 60 20 20 0.05 .057 Filler Support70 60 20 20 0.05 N/A

Prepare Heater Assembly In order to sinter the assembled and loaded diamond feedstock described above into polycrystalline diamond, both heat and pressure are required. Heat is provided electrically as the part undergoes pressure in a press. A heater assembly is to used to provide the required heat.
A refractory metal can containing loaded and precompressed diamond feedstock is placed into a heater assembly. Salt domes are used to encase the can.
The salt domes used may be white salt (NaCI) that is precompressed to at least about 90- 95% of theoretical density. This density of the salt is desired to preserve high pressures of the sintering system and to maintain geometrical stability of the manufactured part. The salt domes and can are placed into a graphite heater tube assembly. The salt and graphite components of the heater assembly may be baked in a vacuum oven at greater than 100 degrees Celsius and at a vacuum of at least 23 torr for about 1 hour in order to eliminate adsorped water prior to loading in the 2o heater assembly . Other materials which may be used in construction of a heater assembly include solid or foil graphite, amorphous carbon, pyrolitic carbon, refractory metals and high electrical resistant metals.
Once electrical power is supplied to the heater tube, it will generate heat required for polycrystalline diamond formation in the high pressure/high temperature pressing operation.
Preparation of Pressure Assembly for Sintering Once a heater assembly has been prepared, it is placed into a pressure assembly for sintering in a press under high pressure and high temperature. A
cubic press or a belt press may be used for this purpose, with the pressure assembly differing somewhat depending on the type of press used. The pressure assembly is intended to receive pressure from a press and transfer it to the diamond feedstock so that sintering of the diamond may occur under isostatic conditions.
1o If a cubic press is used, then a cube of suitable pressure transfer media such as pyrophillite will contain the heater assembly. Cell pressure medium would be used if sintering were to take place in a belt press. Salt may be used as a pressure transfer media between the cube and the heater assembly. Thermocouples may be used on the cube to monitor temperature during sintering. The cube with the heater assembly inside of it is considered a pressure assembly, and is place into a press a press for sintering.
Sintering of Feedstock into Polycrystalline Diamond The pressure assembly described above containing a refractory metal can that has diamond feedstock loaded and precompressed within is placed into an 2o appropriate press. The type of press used at the time of the devices may be a cubic press (i.e., the press has six anvil faces) for transmitting high pressure to the assembly along 3 axes from six different directions. Alternatively, a belt press and a cylindrical cell can be used to obtain similar results. Other presses may be used as well. Referring to Figure 37, a representation of the 6 anvils of a cubic press 3720 is provided. The anvils 3721, 3722, 3723, 3724, 3725 and 3726 are situated around a pressure assembly 3730.
To prepare for sintering, the entire pressure assembly is loaded into a press and initially pressurized to about 40-68 Kbars. The pressure to be used depends on the product to be manufactured and must be determined empirically. Then electrical 3o power may be added to the pressure assembly in order to reach a temperature in the range of less than about 1145 or 1200 to more than about 1500 degrees Celsius.
About 5800 watts of electrical power may be used at two opposing anvil faces, creating the current flow required for the heater assembly to generate the desired level of heat. Once the desired temperature is reached, the pressure assembly is subjected to pressure of about 1 million pounds per square inch at the anvil face.
The components of the pressure assembly transmit pressure to the diamond feedstock. These conditions may be maintained for about 3-12 minutes, but could be from less than 1 minute to more than 30 minutes. The sintering of polycrystalline diamond compacts takes place in an isostatic environment where the pressure transfer components are permitted only to change in volume but are not permitted to otherwise deform. Once the sintering cycle is complete, about a 90 second cool down period is allowed, and then pressure is removed. The polycrystalline diamond compact is then removed for finishing.
Removal of a sintered polycrystalline diamond compact having a curved, compound or complex shape from a pressure assembly is simple due to the differences in material properties between diamond and the surrounding metals in some embodiments of the devices. This is generally referred to as the mold release to system of the devices.
Removal of Solvent-Catalyst Metal from PCD
If desired, the solvent-catalyst metal remaining in interstitial spaces of the sintered polycrystalline diamond may be removed. Such removal is accomplished by chemical leaching as is known in the art. After solvent-catalyst metal has been 15 removed from the interstitial spaces in the diamond table, the diamond table will have greater stability at high temperatures. This is because there is no catalyst for the diamond to react with and break down.
After leaching solvent-catalyst metal from the diamond table, it may be replaced by another metal, metal or metal compound in order to form thermally stable 2o diamond that is stronger than leached polycrystalline diamond. If it is intended to weld synthetic diamond or a polycrystalline diamond compact to a substrate or to another surface such as by inertia welding, it may be desirable to use thermally stable diamond due to its resistance to heat generated by the welding process.
Finishing Methods and Apparatuses 25 Once a polycrystalline diamond compact has been sintered, a mechanical finishing process may be employed to prepare the final product. The finishing steps explained below are described with respect to finishing a polycrystalline diamond compact, but they could be used to finish any other surface or any other type of component.
3o Prior to the devices herein, the synthetic diamond industry was faced with the problem of finishing flat surfaces and thin edges of diamond compacts. Methods for removal of large amounts of diamond from non-planar surfaces or finishing those surfaces to high degrees of accuracy for sphericity, size and surface finish had not been developed in the past.
35 Finishing of Superhard Cylindrical and Flat Forms.
In order to provide a greater perspective on finishing techniques for curved and non-planar superhard surfaces for articulating diamond-surfaced spinal implants, a description of other finishing techniques is provided.

Lapping.
A wet slurry of diamond grit on cast iron or copper rotating plates are used to remove material on larger flat surfaces (e.g., up to about 70 mm. in diameter). End coated cylinders of size ranging from about 3 mm to about 70 mm may also be lapped to create flat surfaces. Lapping is generally slow and not dimensionally controllable for depth and layer thickness, although flatness and surface finishes can be held to very close tolerances.
Grinding.
Diamond impregnated grinding wheels are used to shape cylindrical and flat to surfaces. Grinding wheels are usually resin bonded in a variety of different shapes depending on the type of material removal required (i.e., cylindrical centerless grinding or edge grinding). Polycrystalline diamond compacts are difficult to grind, and large polycrystalline diamond compact surfaces are nearly impossible to grind.
Consequently, it is desirable to keep grinding to a minimum, and grinding is usually 15 confined to a narrow edge or perimeter or to the sharpening of a sized PDC
end-coated cylinder or machine tool insert.
Electro Spark Discharge Grinding (EDG).
Rough machining of polycrystalline diamond compact may be accomplished with electro spark discharge grinding ("EDG") on large diameter (e.g., up to about 70 2o mm.) flat surfaces. This technology typically involves the use of a rotating carbon wheel with a positive electrical current running against a polycrystalline diamond compact flat surface with a negative electrical potential. The automatic controls of the EDG machine maintain proper electrical erosion of the polycrystalline diamond compact material by controlling variables such as spark frequency, voltage and 25 others. EDG is typically a more efficient method for removing larger volumes of diamond than lapping or grinding. After EDG, the surface must be finish lapped or ground to remove what is referred to as the heat affected area or re-cast layer left by EDG.
Wire Electrical Discharge Machining (WEDM).
3o WEDM is used to cut superhard parts of various shapes and sizes from larger cylinders or flat pieces. Typically, cutting tips and inserts for machine tools and re-shaping cutters for oil well drilling bits represent the greatest use for WEDM
in PDC
finishing.
Polishing.
35 Polishing superhard surfaces for articulating diamond-surfaced spinal implants to very high tolerances may be accomplished by diamond impregnated high speed polishing machines. The combination of high speed and high friction temperatures tends to burnish a PDC surface finished by this method, while maintaining high degrees of flatness, thereby producing a mirror-like appearance with precise dimensional accuracy.
b. Finishing A Non-planar Geometry.
Finishing a non-planar surface (concave non-planar or convex non-planar) s presents a greater problem than finishing a flat surface or the rounded edge of a cylinder. The total surface area of a sphere to be finished compared to the total surface area of a round end of a cylinder of like radius is four (4) times greater, resulting in the need to remove four (4) times the amount of polycrystalline diamond compact material. The nature of a non-planar surface makes traditional processing 1o techniques such as lapping, grinding and others unusable because they are adapted to flat and cylindrical surfaces. The contact point on a sphere should be point contact that is tangential to the edge of the sphere, resulting in a smaller amount of material removed per unit of time, and a proportional increase in finishing time required. Also, the design and types of processing equipment and tooling required for finishing non-15 planar objects must be more accurate and must function to closer tolerances than those for other shapes. Non-planar finishing equipment also requires greater degrees of adjustment for positioning the workpiece and tool ingress and egress.
The following are steps that may be performed in order to finish a non-planar, rounded or arcuate surface.
20 1.) Rough Machining.
Initially roughing out the dimensions of the surface using a specialized electrical discharge machining apparatus may be performed. Referring to Figure 38, roughing a polycrystalline diamond compact sphere 3803 is depicted. A rotator is provided that is continuously rotatable about its longitudinal axis (the z axis 25 depicted). The sphere 3803 to be roughed is attached to a spindle of the rotator 3802. An electrode 3801 is provided with a contact end 3801 A that is shaped to accommodate the part to be roughed. fn this case the contact end 3801A has a partially non-planar shape. The electrode 3801 is rotated continuously about its longitudinal axis (the y axis depicted). Angular orientation of the longitudinal axis y of 3o the electrode 3801 with respect to the longitudinal axis z of the rotator 3802 at a desired angle f3 is adjusted to cause the electrode 3801 to remove material from the entire non-planar surface of the ball 3803 as desired.
Thus, the electrode 3801 and the sphere 3803 are rotating about different axes. Adjustment of the axes can be used to achieve near perfect non-planar 35 movement of the part to be roughed. Consequently, a nearly perfect non-planar part results from this process. This method produces polycrystalline diamond compact non-planar surfaces with a high degree of sphericity and cut to very close tolerances.
By controlling the amount of current introduced to the erosion process, the depth and amount of the heat affected zone can be minimized. In the case of a polycrystalline diamond compact, the heat affected zone can be kept to about 3 to 5 microns in depth and is easily removed by grinding and polishing with diamond impregnated grinding and polishing wheels.
Referring to Figure 39, roughing a convex non-planar polycrystalline diamond compact 1003 such as an articulating diamond-surfaced spinal implant is depicted. A
rotator 3902 is provided that is continuously rotatable about its longitudinal axis (the z axis depicted). The part 3903 to be roughed is attached to a spindle of the rotator 3902. An electrode 3901 is provided with a contact end 3901 A that is shaped to 1o accommodate the part to be roughed. The electrode 3901 is continuously rotatable about its longitudinal axis (the y axis depicted). Angular orientation of the longitudinal axis y of the electrode 3901 with respect to the longitudinal axis z of the rotator 3902 at a desired angle fi is adjusted to cause the electrode 3901 to remove material from the entire non-planar surface of the articulating diamond-surfaced spinal implant 3903 as desired.
In some embodiments of the devices, multiple electro discharge machine electrodes will be used in succession in order to machine a part. A battery of electro discharge machines may be employed to carry this out in assembly line fashion.
Further refinements to machining processes and apparatuses are described below.
2o Complex positive or negative relief (concave or convex) forms can be machined into Polycrystalline Diamond Compacts (PDC) or Polycrystalline cubic Boron Nitride (PCBN) parts. This a standard Electrical Discharge Machining (EDM) CNC machining center and suitably machined electrodes accomplish the desired forms.
Figure 40 (side view) and Figure 40a (end view) show an electrode 4001 with a convex form 4002 machined on the active end of the electrode 4001, and the electrode base 4005. Figure 41 (cross section at 41-41 ) and Figure 41 a show an electrode 4101 with a concave form 4102 and base 4105. The opposite ends of the electrodes are provided with an attachment mechanism at the base 4105 suitable for 3o the particular EDM machine being utilized. There are a variety of electrode materials that can be utilized such a copper, copper tungsten, graphite, and combinations of graphite and metal mixes. Materials best suited for machining PDC and PCBN are copper tungsten for roughing and pure graphite, or graphite popper tungsten mixes.
Not all EDM machines are capable of machining PDC and PCBN. ~nly those equipped with capacitor discharge power supplies can generate spark intensities with enough power to efficiently erode these materials.
The actual size of the machined relief form is usually machined undersized to allow for a suitable spark gap for the burning/erosion process to take place.
Each spark gap length dictates a set of machining parameters that must be set by the machine operator to ensure efficient electrical discharge erosion of the material to be removed. Normally, two to four electrodes are prepared with different spark gap allowances. For example, an electrode using a .006 In. spark gap could be prepared for "roughing," and an "interim" electrode at .002 In. spark gap, and "finishing"
electrode at .0005 In. spark gap. In each case the machining voltage (V), peak amperage (AP), pulse duration (P), reference frequency (RF), pulse duration (A), retract duration (R), under-the-cut duration (U), and servo voltage (SV) must be set up within the machines control system.
1o Figure 42 shows an EDM relief form 4201 sinking operation in a PDC insert part 4202. Table 39 describes the settings for the using a copper tungsten electrode 4203 for roughing and a graphitelcopper tungsten electrode for finishing. The spark gap 4204 is also depicted.

ElectrodeSpark V AP P RF A R U SV

4203 Gap Roughing .006 -2 7 13 56 9 0 9 50 Finishing.001 -5 4 2 60 2 0 9 55 Those familiar with the field of EDM machining will recognize that variations in the parameters show will be required based on the electrode configuration, electrode 2o wear rates desired, and surface finishes required. Generally, higher machining rates, i.e., higher values of "V" and "AP" produce higher rates of discharge erosion, but conversely rougher surface finishes.
Obtaining very smooth and accurate finishes also requires the use of a proper dielectric machining fluid. Synthetic hydrocarbons with satellite electrodes as disclosed in United States Patent No. 5,773,782, which is hereby incorporated by reference, appear to assist in obtaining high quality surface finishes.
Figure 43 shows an embodiment wherein a single ball-nosed (spherical radiused) EDM electrode 4301 is used to form a concave relief form 4303 in a PDC
or PCBN part 4302. The electrode 4301 is plunged vertically into the part 4302 and then moved laterally to accomplish the rest of the desired shape. By programming a CNC system EDM electrode "cutting path" of the EDM machine, an infinite variety of concave or convex shapes can be machined. Controlling the rate of "down"
plunging and "lateral" cross cutting, and using the correct EDM material will dictate the quality of the size dimensions and surface finishes obtained.
2.) Finish Grinding and Polishing.
Once the non-planar surface (whether concave or convex) has been rough machined as described above or by other methods, finish grinding and polishing of a part can take place. Grinding is intended to remove the heat affected zone in the polycrystalline diamond compact material left behind by electrodes.
In some embodiments of the devices, grinding utilizes a grit size ranging from 100 to 150 according to standard ANSI B74.16-1971 and polishing utilizes a grit size 1o ranging from 240 to 1500, although grit size may be selected according to the user's preference. Wheel speed for grinding should be adjusted by the user to achieve a favorable material removal rate, depending on grit size and the material being ground. A small amount of experimentation can be used to determine appropriate wheel speed for grinding. Once the spherical surface (whether concave or convex) 15 has been rough machined as described above or by other methods, finish grinding and polishing of a part can take place. Grinding is intended to remove the heat affected zone in the polycrystalline diamond compact material left behind by electrodes. Use of the same rotational geometry as depicted in Figures 9 and allows sphericity of the part to be maintained while improving its surface finish 2o characteristics.
Referring to Figure 44, it can be seen that a rotator 4401 holds a part to be finished 4403, in this case a convex sphere, by use of a spindle. The rotator 4401 is rotated continuously about its longitudinal axis (the z axis). A grinding or polishing wheel 4402 is provided is rotated continuously about its longitudinal axis (the x axis).
25 The moving part 4403 is contacted with the moving grinding or polishing wheel 4402.
The angular orientation f3 of the rotator 4401 with respect to the grinding or polishing wheel 4402 may be adjusted and oscillated to effect grinding or polishing of the part (ball or socket) across its entire surface and to maintain sphericity.
Referring to Figure 45, it can be seen that a rotator 4501 holds a part to be 3o finished 4503, in this case a convex spherical cup or race, by use of a spindle. The rotator 4501 is rotated continuously about its longitudinal axis (the z axis).
A grinding or polishing wheel 4502 is provided that is continuously rotatable about its longitudinal axis (the x axis). The moving part 4503 is contacted with the moving grinding or polishing wheel 4502. The angular orientation f3 of the rotator 4501 with 35 respect to the grinding or polishing wheel 4502 may be adjusted and oscillated if required to effect grinding or polishing of the part across the spherical portion of it surface.

In one embodiment, grinding utilizes a grit size ranging from 100 to 150 according to standard ANSI B74.16-1971 and polishing utilizes a grit size ranging from 240 to 1500, although grit size may be selected according to the user's preference. Wheel speed for grinding should be adjusted by the user to achieve a favorable material removal rate, depending on grit size and the material being ground. A small amount of experimentation can be used to determine appropriate wheel speed for grinding.
As desired, a diamond abrasive hollow grill may be used for polishing diamond or superhard bearing surfaces. A diamond abrasive hollow grill includes a to hollow tube with a diamond matrix of metal, ceramic and resin (polymer) is found.
If a diamond surface is being polished, then the wheel speed for polishing mayl be adjusted to cause a temperature increase or heat buildup on the diamond surface. This heat buildup will cause burnishing of the diamond crystals to create a very smooth and mirror-like low friction surface. Actual material removal during 15 polishing of diamond is not as important as removal sub-micron sized asperities in the surface by a high temperature burnishing action of diamond particles rubbing against each other. A surface speed of 6000 feet per minute minimum is generally required together with a high degree of pressure to carry out burnishing.
Surface speeds of 4000 to 10,000 feet per minute are believed to be the most desirable 2o range. Depending on pressure applied to the diamond being polished, polishing may be carried out at from about 500 linear feet per minute and 20,000 linear feet per minute.
Pressure must be applied to the workpiece in order to raise the temperature of the part being polished and thus to achieve the most desired mirror-tike polish, but 25 temperature should not be increased to the point that it causes complete degradation of the resin bond that holds the diamond polishing wheel matrix together, or resin will be deposited on the diamond. Excessive heat will also unnecessarily degrade the surface of the diamond.
Maintaining a constant flow of coolant (such as water) across the diamond 3o surface being polished, maintaining an appropriate wheel speed such as 6000 linear feet per minute, applying sufficient pressure against the diamond to cause heat buildup but not so much as to degrade the wheel or damage the diamond, and timing the polishing appropriately are all important and must all be determined and adjusted according to the particular equipment being used and the particular part being 35 polished. Generally the surface temperature of the diamond being polished should not be permitted to rise above 800 degrees Celsius or excessive degradation of the diamond will occur. Desirable surface finishing of the diamond, called burnishing, generally occurs between 650 and 750 degrees Celsius.

During polishing it is important to achieve a surface finish that has the lowest possible coefficient of friction, thereby providing a low friction and long-lasting articulation surface. Preferably, once a diamond or other superhard surface is formed in a bearing component, the surface is then polished to an Ra value of 0.3 to 5 0.005 microns. Acceptable polishing will include an Ra value in the range of 0.5 to 0.005 microns or less. The parts of the bearing component may be polished individually before assembly or as a unit after assembly. Other methods of polishing polycrystalline diamond compacts and other superhard materials could be adapted to work with the articulation surfaces of the invented bearing components, with the to objective being to achieve a smooth surface, preferably with an Ra value of 0.01-0.005 microns. Further grinding and polishing details are provided below.
Figure 46 shows a diamond grinding form 4601 mounted to an arbor 4602, which is in turn mounted into the high-speed spindle 4603 of a CNC grinding machine. The cutting path motion 4604 of the grinding form 4601 is controlled by the 15 CNC program allowing the necessary surface coverage requiring grinding or polishing. The spindle speed is generally related to the diameter of the grinding form and the surface speed desired at the interface with the material 4505 to be removed.
The surface speed should range between 4,000 and 17,000 feet per minuet for both grinding and polishing. For grinding, the basic grinding media for the grinding form 2o should be as "free" cutting as practical with diamond grit sizes in the range of 30 to 120 microns and concentrations rangirig from 75 to 125. For polishing the grinding media should not be as "free cutting," i.e., the grinding form should generally be harder and denser with grit sizes ranging from 120 to 300 microns and concentrations ranging from 100 to 150.
25 Superhard materials can be more readily removed by grinding if the actual area of the material being removed is kept as small as possible. Ideally the bruiting form 4601 should be rotated to create conditions in the range from 20,000 to 40,000 surface feet per minuet between the part 4605 and the bruiting form 4601.
Spindle pressure between the part 4605 and the bruiting form 4601 operating in a range of 10 3o to 100 Lbs - force producing an interface temperature between 650 and 750 Deg C
is required. Cooling water is needed to take away excess heat to keep the part from failing possible. The simplest way to keep the grind area small is to utilize a small cylindrical contact point (usually a ball form, although a radiused end of a cylinder accomplishes the same purpose), operating against a larger surface area.
35 Figures 47 shows the tangential area of contact 4620 between the grinding form 4601 and the substantially larger superhard material 4621. By controlling the path of the grinding form cutter, small grooves 4630 (Figure 48) can be ground into the surface of the superhard material 4621 removing the material and leaving small "cusp" 4640 between the adjacent grooves. As the grooves are cut shallower and closer together the "cusp" 4640 become imperceptible to the naked eye and are easily removed by subsequent polishing operations. The cutter line path of the grinding form cutter should be controlled by programming the CNC system of the grinding machine to optimize the cusp size, grinding form cutter wear, and material removal rates.
Bruting Obtaining highly polished surface finishes on Polycrystalline Diamond Compact (PDC), Polycrystalline Cubic Boron Nitride (PBCN), and other superhard 1o materials in the range of 0.05 to 0.005 pm can be obtained by running PDC
form against the surface to be polished. "Bruiting" or rubbing a diamond surface under high pressure and temperature against another superhard material degredates or burns away any positive asperities remaining from previous grinding and polishing operations producing a surface finish not obtainable in any other way.
Figure 49 shows a PDC dome part 4901 on a holder 4904 and being "Bruit Polished" using a PDC bruiting form 4902 being rotated in a high-speed spindle 4903. Ideally the bruiting form should be rotated in a range from 20,000 to 40,000 surface feet per minute with the spindle pressure operating in a range of 10 to 100 Lbs - force producing an interface temperature between 650 and 750 Deg C.
2o Cooling water is generally required to take away excess heat to keep the part from failing.
Figure 50 shows another embodiment of the bruiting polishing technique wherein the PDC Bruiting form 5001 is controlled through a complex surface path 5002 by a CNC system of a grinding machine or a CNC Miil equipped with a high-speed spindle to control the point of contact 5003 of the form 5001 with a superhard component 5004.
USE OF COBALT CHROME MOLYBDENUM (CoCrMo) ALLOYS TO AUGMENT
BIOCOMPATABILITY IN POLYCRYSTALLINE DIAMOND COMPACTS
Cobalt and Nickel may be used as catalyst metals for sintering diamond 3o powder to produce sintered polycrystalline diamond compacts. The toxicity of both Co and Ni is well documented; however, use of CoCr alloys which contain Co and Ni have outstanding corrosion resistance and avoid passing on the toxic effects of Co or Ni alone. Use of CoCrMo alloy as a solvent-catalyst metal in the making of sintered polycrystalline diamond compacts yields a biocompatible and corrosion resistant material. Such alloys may be defined as any suitable biocompatible combination of the following metals: Co, Cr, Ni, Mo, Ti and W. Examples include ASTM F-75, F-and F-90. Each of these will serve as a solvent-catalyst metal when sintering diamond. Elemental analysis of the interstitial metal in PDC made with these alloys has shown that the composition is substantially more corrosion resistant than PDC
made with Co or Ni alone.
EXAMPLE ARTICULATING DIAMOND-SURFACED SPINAL IMPLANTS
As used herein, the term "articulating" means that the spinal implant permits some range of motion, in contrast with fusion therapy in which two vertebrae are permanently locked together with respect to each other. The spinal implants may provide rotation about the axial, coronaf and/or sagittal axes and/or translation in the axial plane. The rotation may permit anterior and posterior bending, lateral bending, and twisting of the torso. The translation may include anterior, posterior and lateral 1o translation. A combination of such rotation and translation is desired in order to approximate the flexion and extension of a human spine.
Also, as used herein "diamond-surfaced" means that the spinal implant includes diamond on at least a portion of one load bearing or articulation surface.
The implant may include diamond located on a substrate, it may be solid free-standing diamond, or it may be of another structure. The diamond may be sintered polycrystalline diamond that is a free-standing table or a diamond table sintered or otherwise attached to a substrate.
SPINAL DISK IMPLANTS WITH BEARING SURFACES WEAR ENHANCED BY
DIAMOND
The mode of devices included herein includes the enhancement of spinal disk implants 5100 with bearing surfaces wear-enhanced by the application or presence of Poly Crystalline Diamond Compact (PDC). All of the spinal disk implants Fig. 51 and Fig. 52 including theCervfcal Disk (one through seven) 51, the Thoracic Disk (one through twelve) 52, and the Lumbar Disk (one through five) 53 can be enhanced by the application of PDC and are included as parts of this devices.
Figs. 53, 53-1, 53-2, 53-3 and 53-4 show a spinal disk replacement implant 101 which uses an Ultra High Molecular Weight Polyethylene (UHMWPE) hemispherical dome 5304 running against a cobalt chrome metal concave cup 5305.
3o The UHMWPE dome insert 5304 is held in place by a tongue and groove retainer g roove 5306.
Figs. 54-56 show the disk replacement implant 5101 in a typical installation between two adjacent vertebras 5607, 5608, and Fig's. 55 and 56 depict the relative position of the implant 5101 viewed from the axial plane view, and the coronal plane view. Fig. 57 shows the relative side-to-side lateral angular motion possible by using a two part congruent bearing insert 5101. The angle a typically allows a lateral bending range of plus or minus 10 degrees and is centered about the base of the spinous process. Fig. 58 shows the rotation (3 5810 available in the axial plane which is not limited by the implant 5101 itself, but rather by the surrounding tissue such as muscle and ligaments. Fig. 59 shows the flexion angle A 5911 which is typically 10 to 13 degrees, and the extension angle cp 5912 of Fig. 60 typically ranging from 5 to 8 degrees. A prosthetic spinal disk may permit some or all of the foregoing articulation, in greater or lesser degrees of flexibility.
Figs. 61 and 61-1 depict spinal disk implant 600102 including the use of a metal substrate 60013 on which PDC 60014 has been applied. The Substrate / PDC
assembly 600103 is held in place by a tongue and groove retainer groove 60015 in the inferior endplate 60016. The mating convex cup 60017 has PDC 60018 applied to directly to the superior endplate 60019.
The spinal disk implant 600104 shown in Figs. 62-1 and 62 shows a solid PDC dome insert 60020 held in place in the inferior endplate 60021 by a tongue and groove retainer groove 60022. The mating convex cup 60023 has PDC 60024 applied directly to the superior endplate 60025.
The PDC dome insert 600105 shown in Figs. 63 and 63-1 is held in place by a surrounding injection molded insert base 60026. The molded polymer 60026 surrounds the protrusions 60027 formed in the PDC 60028 restricting movement and holding it in place. The injected molded l PDC insert assembly 600106 is held in place in the inferior endplate 60029 by a tongue and groove retainer groove 60030.
2o The mating convex cup 60031 has PDC 60032 applied directly to the superior endplate 60033.
Spinal disk implant 600107 depicted in Figs. 64 and 64-1 shows a solid PDC
dome insert 60033 installed and held in place by an interference fit between the outside diameter 60034 of the dome insert and the receiving bore 60035 in the inferior endplate 60036. The mating convex solid PDC cup insert 60037 is also installed and held in place by an interference fit between the outside diameter of the cup insert 60038 and the receiving bore 60039 in the superior endplate 60040.
Alternate retaining methods to hold the PDC inserts 60033 and 60037 in the inferior 60036 and superior 60040 endplates could involve the use of brazing, polymer 3o bonding adhesives, retaining screws, or other standard attachment methods.
Fig's. 65 through 65-4 show a three part spinal disk implant 600108 with three components including the inferior endplate 60041, superior endplate 60042, both of which contain a convex cup receiver 60043, 60044 for the domes 60045 and 60046, of the double hemispherical dome center part 60047. The two endplates 60041 and 60042 are generally fabricated form Cobalt Chrome metal but could be fabricated from any other biocompatible metal with sufficient wear qualities. The center double dome part 60047 is fabricated from High Molecular Weight Polyethylene (UHMWPE).

Fig. 66 shows a disk replacement implant 600108 in a typical installation between two adjacent vertebras 60048, 60049, and Fig's. 67 and 68 depict the relative position of the implant 600108 viewed from the axial plane view, and the coronal plane view.
Fig. 69 shows the relative side-to-side lateral angular motion possible by using a three part congruent bearing insert 600108. The angles a 60050 typically allow a lateral bending range of plus or minus 10 degrees. Fig. 70 shows the rotation ~3 60051 available in the axial plane which is not limited by the implant 600108 itself, but rather by the surrounding tissue. Fig's. 71 and 72 shows the flexion angles 8 60052 which are typically 10 to 13 degrees, and the extension angle c~ 60053 Fig. 72 typically ranging from 5 to 8 degrees.
Figs. 73 and 73-1 show a typical three piece spinal implant 600109 with PDC
60054 and 60055 applied to the inferior endplate 60056 and superior endplate to form the convex cup receivers 60059, 60060. The double hemispherical dome i5 center part 60061 has PDC 60062 applied to form the mating domes 60063, 600 for the cup receivers 60059, 60060.
The three piece spinal implant 600110 shown in Figs 74 and 74-1 has been enhanced by applying PDC to the inferior 60065 and superior 60066 endplate convex cup receivers 60067, 60068. The PDC dome inserts 60069, 60070 have been 2o preformed and finished and then injection molded into the double dome hemispherical center part 60071. The PDC domes inserts 60069, 60070 are retained in place on the center part by the overlap 60072 of the injection molded polymer material.
Solid PDC inferior 60073 and superior 60074 end plates are used in the three 25 piece spinal implant Figs. 75 and 75-1 600111 and for the double dome center part 60075. The center PDC double dome part 60075 has been injection molded into polymer material to form the complete articulating center part 60076. The overlap 60077 of the injection molded polymer material retains the outer ring bumper onto the solid or free standing PDC center part 60075.
3o The spinal implant 600112 of Figs. 76, 77 and 77-2 depicts the PDC
enhancement of the bearing couple Dome 60079 and the convex cup / trough 60080.
The PDC dome insert 60079 is installed into the superior endplate 60081 and held in place by an interference fit between the outside diameter 60082 of the dome insert 60079 and the receiving bore 60083 in the superior endplate 60081. The PDC cup /
35 trough insert 60080 is installed into the inferior endplate 60084 and held in place by an interference fit between the outside diameter 85 of the cup / trough insert and the receiving bore 60086 in the inferior endplate 60084. Alternate retaining methods to hold the PDC inserts 60079 and 60080 in the inferior 60084 and superior 60081 endplates could involve the use of brazing, polymer bonding adhesives, retaining screws, or other standard attachment methods. The configuration of the cup / trough insert 60080 allows for not only angular side-to-side motion and flexion and extension motion, but also provides for translational motion X 60086 Fig.
77 in 5 the posterior and anterior directions plus or minus 1 mm or more if desired.
The radial sides of the dome 60079 will not be close enough to the sides of the cup /
trough 60080 Fig. 77-1 to provide hydrodynamic support where even minimal bearing clearance has been provided, and likewise, the trough ends 60087 will not provide any support. Therefore, unlike the fully congruent bearings of the spinal inserts 10 600200 through 600111, the dome 60079 will be "point loaded" in the cup l trough 60080 generally promoting extreme bearing loading conditions. The extreme conditions wrought by non-congruent bearing configurations will generally not wear or function well with known biocompatible metals. This type of problem, depicted with the spinal implant 600112, functions extremely well when enhanced by PDC
as 15 described above. Test results showing less that 0.3mg weight loss for 30 million unlubricated cycles at five times the anatomical load are typical. Metal bearings tested under similar conditions would fail within a few hundred cycles.
Fig. 79 depicts the spinal implant 600113 section view wherein the congruent bearings concave cup 60088 and the matching dome 60089 have received surface 2o enhancement of PCD.
The Spinal implant 114 of Fig. 80A and Fig. 80B depicts the PCD surface enhancement 60090 of the superior insert 60091, and the PCD surface enhancement 60092 of the inferior insert 60093.
Figs. 81A and 81 B of the spinal implant 600115 shows the PCD surface 25 enhancement 60094 of the superior insert 60095, and the PCD surface enhancement 60096, 60097, 60098 of the inferior insert 60099.
The spinal implant 600116 shown in Fig. 82A and Fig. 82B depict the PCD
surface enhancement 600100, 600101, 600102 of the superior insert 600103, and the PCD surface enhancement 600104, 600105, 600106 of the inferior insert 30 600107.
The non-congruent spinal implant 600200 Fig. 83A and Fig. 83B depict the diamond enhancement 600108, 600109 of the dome surface 600110 and the concave running surface 600111. The sides 600112 of the running surface 600111 have also been PDC enhanced to prevent metallic wear by contact with the dome 35 600110.
Fig 84 depicts a similar bearing configuration 600201 wherein the convex running surface 600111 PDC 600109 enhancement does not include the sides 600116 of the convex running surface 600111. These implant bearing designs have maximal angular a 600113 and (3 600114, and transitional motion X 600115, but relies totally on the ability of the bearing interface materials to handle the very significant point loading of the dome 600110 against the concave running surface 600111. This bearing, like the bearings 600112 of Fig. 76, benefits greatly from PDC
enhancement.
Fig. 85 depicts a congruent spinal disk bearing 600202 with four mating surfaces which have been PDC enhanced. Two dome surfaces 600117, 600118 have PDC surfacing applied, and two concave cup mating receiving surfaces 600119, 600120 also have PDC surfacing applied.
1o The spinal implant 203 shown in Fig. 86 has been PDC enhanced on the inferior and superior convex surfaces 600121, 600122 as shown in Fig. 87 and Fig.
87-1 to improve the wear resistance and biocompatibility.
Fig. 88 and Fig. 89 depict a spinal disk implant device 600204 that has had the inferior convex surface 600123 and superior surface 600124 enhanced by the i5 application of PDC.
Fig. 90 depicts a congruent spinal disk bearing 600205 with two mating surfaces which have been PDC enhanced. The inner ball surface 600125 has PDC
surfacing applied, and the outer concave cup mating receiving surfaces 600126 also have PDC surfacing applied for increased wear resistance and biocompatibility.
2o The congruent bearing spinal implant shown in Fig. 91 as 600206 has been PDC enhanced on the interior dome surface 600127, and the superior convex cup surface 600128 to improve the wear resistance and biocompatibility.
Fig. 92 depicts a congruent spinal disk bearing 600207 with two mating surfaces which have been PDC enhanced. The inner baN surface 600129 has PDC
25 surfacing applied, and the outer concave cup mating receiving surfaces 600130 also have PDC surfacing applied for increased wear resistance and biocompatibility.
APPLICATION OF POLYCRYSILLINE DIMOND COMPACTS FOR NON-CONGRUANT SPINAL IMPLANT BEARING SURFACES
Duplicating the anatomical motion of the human spine using spinal disk 3o replacement implants is quite challenging. The motions that must be replicated in the implant device are originally the result of compound angular and translational motions allowed through the compliance of the pillow-like spine disk. The human vertebral disk has the ability to reshape itself instantaneously predicated on the vector forces applied to it while at the same time providing a flexible attachment 35 between two adjacent vertebras. For example, side-to-side bending motion in the coronal plane causes the spinal disk pad to become thin on the inside of the bend angle and larger on the outside of the bend angle. With the angular wedge type reshaping of the spinal disk in the side-to-side motion there is also some lateral translation or parallel sliding of the two adjacent vertebras. This same motion condition is also exhibited with flexion and extension of the body in the sagittal plane;
however, the translational motion is significantly greater, often ranging from 1 to 2mm. Lateral rotation in the axial plane does not occur around the center of the spinal disk. The actual center of rotation is posterior to the spinal cord channel, often by several millimeters. This latter motion is almost completely translational parallel motion with the common centers of the adjacent vertebras swinging in an arc.
Spinal disc implants utilizing congruent dome and cup bearings 600208 as in Fig 93 simply can not adequately duplicate the compound motions exhibited in the 1o normal human anatomical motion. The very congruency of the bearing surfaces makes any kind of translational motion impossible. Lateral rotation Fig. 93-1 in the axial plane angle (3 600131, and flexion of Fig. 59 angle 8 5911, and Fig. 60 extension angle cp 5912 in the sagittal plane are severely restricted. This condition prevents the realization of full anatomical restoration following surgery and tends to place additional collateral forces on the adjacent spinal disc above and below the spinal disk implant leading to possible future problems.
The use of disc implants 600209 employing non-congruent dome and cup bearings of Fig 93 and 93-1 can provide substantially superior or near perfect anatomical duplication. By employing a dome, or similar dome shape, 600132 operating in a convex oval, kidney, or other suitably shaped mating receiver both angular and transiational motion can be fully duplicated.
However, non-congruent bearings as utilized in spinal implants tend to produce overwhelming "point load forces" for typical biocompatible metals where the dome contacts the mating convex bearing receiver. These "point load forces"
quickly wear away the bearing surfaces generally making them inoperable and producing wear particles which react with the surrounding tissue.
Polycrystalline diamond compact (PDC) utilized in spinal implants with non-congruent bearing surfaces completely ameliorates the "point load forces"
problem associated with these types of bearings. One embodiment of the devices includes 3o the use of PDC for the convex dome and convex articulating surface of a non-congruent spinal implant bearing. Fig. 94 and 94-1 depict a non-congruent spinal implant bearing 600209 wherein the dome 600132 has been fabricated using PDC, and also the convex articulating surface 600133 has been fabricated using PDC.
To accomplish the necessary compound angular and translational motion required the shape of the dome 600132 would be generally hemispherical but could be elliptical, oval, flattened, or any other configuration that would allow for the motion required.
The convex articulating surface 600133 could be shaped to allow the dome to not only rock angularly in the direction desired but to also translate horizontally in the axial plane X 600134.
Figures 94a and 94a-1 depict an alternative sprinal prosthesis 600140a in which a hemispherical protrusion 600140a1 rides along a trough 600140a1 along an arc of a circle defined by circle center C located at the base of the spinal process, and radius R to provide ~i degrees of rotational movement within the trough.
The trough has a kidney bean appearance.
The actual contour of the convex surface of the recess can be designed to meet any special angular and translational requirement. Figs. 95, 95-1 and 95-1o show a spinal insert 600210 configuration wherein the radius r2 600135 of the convex articulating surface 600138 are significantly larger than the dome radius r1 600136 allowing the dome 600137 to rotate freely, but to also translate in any direction until restrained from further movement by the surrounding tissue.
Figs. 96, 96-1 and 96-2 depict a modified articulating surfaces 600211 wherein the convex articulating surface radius r4 600138 is significantly larger than the end radiuses r3 600139, and the radius r6 600140 is significantly larger than the end radiuses r5 600141. The center radiuses r4 600138 and r6 600140 can be equal, but may also be unequal, also the end radiuses r3 600139 and r5 600141 can be equal, but may also be unequal. The dome radius r2 600142 would generally be 2o slightly smaller than the smallest of radiuses r3 600139 and r5 600141.
Figs. 97, 97-1 and 97-2 depict a modified articulating surfaces 600212 wherein the recessed articulating surface has a flat area 600143 and end radiuses r3 600144. The end radiuses r3 600144 and r4 600145 can be equal, but may also be unequal. The dome radius r2 600146 would generally be slightly smaller than the smallest of radiuses r3 600144 and r4 600145.
Figs. 98, 98-1 and 98-2 depict a modified articulating surfaces 600213 wherein the convex articulating surface has a conical area 600147 defined by the angle ~ 600148 and end radiuses r3 600149. The end radiuses r3 600149 and r4 600150 can be equal, but may also be unequal. The dome radius r2 600151 would 3o generally be slightly smaller than the smallest of radiuses r3 600149 and r4 600150.
Fig. 99-1 and 49-2 depict a modified articulating surface 600214 wherein the convex articulating surface is an elliptically shaped area 600152. The elliptical shape 600152 can be equal to the elliptical shape 600153, but may also be unequal or another shape configuration. The dome radius r2 600154 would generally be of size to allow for the required angular and transitional motion.
Figs. 100, 100-1 and 100-2 depict a modified articulating surface 600215 wherein the convex articulating surface 600155 is a defined by a three dimensional mathematically defined function of the general form:

Surface = f (r;~~,0;~~,~;~k) The dome radius r2 600156 would generally be of size to allow for the required angular and transitional motion.
Figs. 101 and 101-1 show modified articulating surfaces for a three part spinal implant insert 600216 configuration wherein the radius ri 600157 of the convex articulating surface 600158 is significantly larger than the dome radiuses r2 600159 allowing the domes to rotate freely, but to also translate in any direction until 1o restrained from further movement by the surrounding tissue.
Figs. 102, 102-1 and 102-2 depict modified articulating surfaces for a three part spinal implant 600217 wherein the convex articulating surface radiuses r4 600159 is significantly larger than the end radiuses r3 600160 and the radius r6 600161 is significantly larger than the end radiuses r5 600162. The center radiuses r4 600159 and r6 600161 can be equal, but may also be unequal, also the end radiuses r3 600160 and r5 600162 can be equal, but may also be unequal. The dome radius r2 600163 would generally be slightly smaller than the smallest of radiuses r3 600160 and r5 600162.
Figs. 103, 103-1 and 103-2 depict articulating surfaces for a three part spinal 2o implant 600218 wherein the recessed articulating surface has a flat area 600164 and end radiuses r3 600165. The end radiuses r3 600165 and r4 600166 can be equal, but may also be unequal. The dome radius r2 600167 would generally be slightly smaller than the smallest of radiuses r3 600165 and r4 600166.
Figs. 104, 104-1 and 104-2 depict an articulating surfaces for a three part spinal implant 600219 wherein the convex articulating surface has a conical area 600168 defined by the angle X600 169 and end radiuses r3 600170. The end radiuses r3 600170 and r4 600171 can be equal, but may also be unequal. The dome radius r2 600172 would generally be slightly smaller than the smallest of radiuses r3 600170 and r4 600171.
3o Figs. 105, 105-1 and 105-2 depict an articulating surface for a three part spinal implant 600220 wherein the convex articulating surface is an elliptically shaped area 600173. The elliptical shape 600173 can be equal to the elliptical shape 600174, but may also be unequal or another shape configuration. The dome radius r2 600175 would generally be of size to allow for the required angular and transitional motion.
Figs. 106, 106-1 and 106-2 depict articulating surfaces for a three part spinal implant 600221 wherein the convex articulating surface600 176 is a defined by a three dimensional mathematically defined function of the general form:

Surface = f (r;~k,0;~k,4~;~k) The dome radius r2 600177 would generally be of size to allow for the required angular and transitional motion.
Figs. 107 and 107-2 depict a three part spinal implant 600222 wherein the inferior endplate 600178 and the superior endplate 600179 have been fabricated using PDC. The outer surfaces 600180, 600181 and the attachment protrusions 600182 which will contact the adjacent vertebrae following surgery have been 1o chemically leached using a suitable acid leaching bath such as nitric-hydro sulfuric acid to remove the interstitial metal between the diamond crystals. The depth of the leached areas 600180, 600181, 600182 would generally range from 0.5 to 1.5mm or more. The voids left between the diamond crystals would be available for bone in growth infusion, or the application of other bone growth surfaces, or bone growth 15 accelerators such as Hydroxyl Appetite.
Figs. 108 and 108-1 depict a two part spinal implant 600223 wherein the inferior endplate 600183 and the superior endplate 600184 have been fabricated using PDC. The outer surfaces 600185, 600186 and the attachment protrusions 600187 which will contact the adjacent vertebrae following surgery have been 2o chemically leached using a suitable acid leaching bath such as nitric-hydro sulfuric acid to remove the interstitial metal between the diamond crystals. The depth of the leached areas 600185, 600186, 600187 would generally range from 0.5 to 1.5mm or more. The voids left between the diamond crystals would be available for bone in growth infusion, or the application of other bone growth surfaces or bone growth 25 accelerators. In addition, any bone mating surface depicted anywhere herein could include a bone growth accelerator, a roughened or textured surface to promote bone fixation, pores to permit bone ingrowth, and protrusions to achieve mechanical bone fixation. In addition, adhesives, glues or epoxies may also be used to achieve bone fixation.
3o SPINAL IMPLANT FIXATION METHOD USING SCREWS WITH PARTIAL
HEMASPHERICALENGAGEMENT
The devices shown in Fig. 109, 109-1, 109-2 , 109-3a, 109-3b, 109-4 and 109-5 disclose a method and apparatus by which one or more screws 7001 may be used to assist in the installation of a spinal implant appliance 7002, provide partial 35 fixation during the period of bone in-growth to the receptor surfaces 7003 of the appliance 7002, and full fixation for the life of the implant. Another object of this devices is to provide fixation without any protrusion of the fixation screws 7001 or other components into the anterior or posterior areas surrounding the spinal implant device 7002.
Fixation of the spinal implant device 7002 is accomplished by the engagement of slightly less than one-half of the hemispherical portion of the full length of the screw threads 7004 of the fixation screws 7001 into the adjacent vertebral bones 7005 as depicted in the Figures. The complementary pressure of the tissue tending to hold and draw the two corresponding vertebra 7004 together generally provides contact pressures 7006 normal toward the screw thread 7004 surfaces and the bone surface 7007 allowing adequate frictional and buttressing 1o fixation. The screws 7001 are held captive in the appliance 7002 superior 7008 and inferior 7009 plate surfaces 7003 by machining the screw holes 70010 slightly below the plate surfaces 7003 of the appliance 7002 which interfaces with the bone surfaces 7007. The centerline locating dimension ~i 70011 of the screw holes can be adjusted based on the diameter 70012 of the screw 7001 to ensure that part 15 of the plate material 70013 extends slightly beyond the centerline of the screw 7001 securing it in place within the plates 7008 and 7009. The screw holes 70010 in the superior 7008 and the inferior 7009 plates of the implant device 7002 can be a drilled hole only 70014 as shown in Fig. 109-3a with a diameter slightly larger than the major diameter 70012 of the screws 7001, or tap drilled to the minor of the screw 20 7001 and then threaded 70015 as shown in Fig 109-3b.
One, two, or more fixation screws 7001 could be used to provide the device 7002 securement. The fixation screws 7001 can also be located at an angel a ranging between 0.0 Deg and 90 Deg. One embodiment would locate two screws at an angle a 70016 of approximately 35 Deg. which provides the most favorable strain 25 resistance against component forces exerted laterally along the horizontal plane of the body. Threads in the vertebrae 7005 bone surface 7007 can be created by using the screw 7001 only, or by pre-cutting the threads 70015 using a typical thread tap of the correct size, form, and length in conjunction with a suitable tap drill hole location fixture and tapping fixture.
3o The head 70017 of the securing screws 7001 is recessed into a relief counter-bore 70018 of Fig. 109-5 to prevent any protrusion at the anterior face of the spinal implant 7002.
The surfaces 7003 of the superior 7008 and inferior 7009 plates of the spinal implant device 2 may be prepared for bone in growth by the application of Hydroxy 35 Apatite coating, chemical coating, attached metal beads, etched surfacing, leached poly crystalline diamond, or any other treatment that would promote bone ingrowth and attachment.

SPINAL IMPLANT FIXATION METHOD USING SCREWS WITH ANGULAR
VECTOR BONE ENGAGEMENT
The devices shown in Figs. 110, 110-1, 110-2 and 110-3 disclose methods and apparatuses by which one or more screws 8001 may be used to assist in the installation of a spinal implant appliance 8002, provide partial fixation during the period of bone in-growth to the receptor surfaces 8003 of the appliance 8002, and full fixation for the life of the implant. Another object of this devices is to provide fixation without any protrusion of the fixation screws 8001 or other components into the anterior or posterior areas surrounding the spinal implant device 8002.
1o Fixation of the spinal implant device 8002 is accomplished by the engagement of the screw threads 8004 of the fixation screws 8001 into the adjacent vertebral bones 8005 as more fully depicted in the Figures. The complementary pressure of the tissue tending to hold and draw the two corresponding vertebra together generally provides contact pressure 8006 toward the bone surfaces 15 and is augmented by component forces associated with the holding resistance of the screws 8001 acting at angles o 8008 and angle a 8009.
One, two, or more fixation screws 8001 could be used to provide the device 8002 securement. The fixation screws 8001 can be located at an angel a 8009 ranging between 0.0 Deg and 90 Deg. and angle ~ 8008 ranging between 2o approximately 10 Deg. and 45 Deg. One embodiment would locate two screws at an angle a 8008 of approximately 25 Deg. and angle a 8009 at approximately 35 Deg. which would provide the most favorable strain resistance against component forces exerted axially along the median/coronal planes and laterally along the horizontal plane of the body. Threads in the vertebrae 8005 bone can be created by 25 using the screw 8001 only, or by pre-cutting the threads 80010 Fig. 110-3 using a typical thread tap of the correct size, form, and length in conjunction with a suitable tap drill hole location fixture and tapping fixture.
The head 80011 of the securing screws 8001 is recessed into a relief counter-bore 80012 of Fig. 110-3 to prevent any protrusion at the anterior face of the spinal 3o implant 8002.
The surfaces 8003 of the superior 80013 and inferior 80014 plates of the spinal implant device 8002 may be prepared for bone in growth and attachment.
SPINAL IMPLANT FIXATION METHOD USING SCREWS WITH ANGULAR
VECTOR PLATE ENGAGEMENT
35 The devices shown in Figures 111, 111-1, 111-2 and 111-3 discloses methods and apparatuses by which one or more screws 8501 may be used to assist in the installation of a spinal implant appliance 8502, provide partial fixation during the period of bone in-growth to the receptor surfaces 8503 of the appliance 8502, and full fixation for the life of the implant. Another object of this devices is to provide fixation without any protrusion of the fixation screws 8501 or other components into the anterior or posterior areas surrounding the spinal implant device 8502.
Fixation of the spinal implant device 8502 is accomplished by the engagement of the screw threads 8504 of the fixation screws 8501 into the superior 8505 and inferior 8506 implant plates 8507 after having passed through the adjacent vertebral bones 8508 as more fully depicted in the Figures. The complementary pressure of the tissue tending to hold and draw the two corresponding vertebra together generally provides contact pressure 8509 toward the bone surfaces 1o and is augmented by component forces associated with the holding resistance of the screws 8501 acting at angles Q 85011 and angle a 85012.
One, two, or more fixation screws 8501 could be used to provide the device 8502 securement. The fixation screws 8501 can be located at an angel a 85012 ranging between 0.0 Deg and 90 Deg. and angle o 85011 ranging between approximately 10 Deg. and 45 Deg. One embodiment would locate two screws 8501 at an angle Q 85011 of approximately 25 Deg. and angle a 85012 at approximately 35 Deg. which would provide the most favorable strain resistance against component forces exerted axially along the medianlcoronal planes and laterally along the horizontal plane of the body. The fixation screws engage the 2o superior 8505 and inferior 8506 plates 8507 at in pre-threaded holes 85013.
The fixation screws 8501 can be threaded along the full length of the screw 8501, or only for the length which engages the superior 8505 and inferior 8506 plates 8507.
Clearance holes for the fixation screws 8501 are pre-drilled using a suitable location fixture to ensure proper location and engagement of the screws 8501 into the superior 5850 and inferior 8506 plates 8507.
The head 85014 of the securing screws 8501 is recessed into a relief counter-bore 85015 to prevent any protrusion at the anterior face of the spinal implant 8502.
The surfaces 8503 of the superior 8505 and inferior 8506 plates 8507 of the spinal implant device 8502 may be prepared for bone in growth.
3o SPINAL IMPLANT FIXATION METHOD USING SECURMENT LUGS WITH
ATTACHMENT SCREWS AND ANTI ROTATION POSITIONIONERS
The devices shown in Figs. 112, 112-1, 112-2 and 112-3 disclose method and apparatuses by which one or more lugs or clips 9001 may be used to assist in the installation of a spinal implant appliance 9002, provide partial fixation during the period of bone in-growth to the receptor surfaces 9003 of the appliance 9002, and full fixation for the life of the implant. Another object of this device is to provide fixation without any protrusion of the fixation clips 9001, screws 9004 or other components into the anterior or posterior areas surrounding the spinal implant device 9002.

Fixation of the spinal implant device 9002 is accomplished by the engagement of the lugs 9001 into the recesses 9005 previously machined into the vertebra by the surgeon. The clips 9001 may be stabilized by the use of a square or rectangular matching tongue protrusions 9006 and grooves 9007 running parallel and perpendicular to the median plane of the body. Other tongue and groove configurations such as the angular tongue 9008 and angular groove, or a hemispherical tongue and grooves could be used to prevent rotation of the clip.
The head 90012 of the securing screw 9004 is recessed into a relief counter-bore 90013 to prevent any protrusion at the anterior face of the spinal implant 9002.
1o The clip 9001 is also rounded 90014 and recessed 90015 to prevent any protrusion at the anterior face of the spinal implant 9002.The surfaces 9003 of the superior 90016 and inferior 90017 plates of the spinal implant device 9002 may be prepared for bone in growth.
While the present devices and methods have been described and illustrated in conjunction with a number of specific configurations, those skilled in the art will appreciate that variations and modifications may be made without departing from the principles herein illustrated, described, and claimed. The present invention, as defined by the appended claims, may be embodied in other specific forms without departing from its spirit or essential characteristics. The configurations described 2o herein are to be considered in all respects as only illustrative, and not restrictive. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (24)

1. An articulating diamond-surfaced prosthetic spinal implant for implantation between vertebrae in a human body, the implant comprising:
a first component, said first component having a convex protruding dome member, said dome member including a first component load bearing and articulation surface, said first component load bearing and articulation surface being formed at least in part by a sintered polycrystalline diamond table, said sintered polycrystalline diamond table in said first component serving to provide a durable, biocompatible and low-friction surface for articulation of the implant, a second component, said second component having a concave trough, said trough having a shape and size that permits said protruding dome member to protrude therein, said trough having a shape and size that permits contact of said protruding dome member therewith at a plurality of contact points, said trough including a second component load bearing and articulation surface, said second component load bearing and articulation surface being formed at least in part by a sintered polycrystalline diamond table, said sintered polycrystalline diamond table in said second component serving to provide a durable, biocompatible and low-friction surface for articulation of the implant, said first component being movable with respect to said second component in at a point that has diamond to diamond contact between said first and second components.
2. An implant as recited in claim 1 wherein said first component and said second component are able to articulate with respect to each other to provide rotation about the axial, coronal and/or sagittal axes of the human spine.
3. An implant as recited in claim 1 wherein said first component and said second component are able to articulate with respect to each other to provide translation in the axial plane of a human spine.
4. An implant as recited in claim 1 wherein said first component and said second component are able to articulate with respect to each other to provide rotation about the axial, coronal and/or sagittal axes of the human spine; and wherein said first component and said second component are able to articulate with respect to each other to provide translation in the axial plane of a human spine;
and wherein said rotation and translation accommodate anterior bending, posterior bending, lateral bending, twisting of a spine about its longitudinal axis, anterior translation, posterior translation and lateral translation.
5. An implant as recited in claim 1 wherein said dome member has a shape that is at least partially spherical convex.
6. An implant as recited in claim 1 wherein said first and second components include congruent bearing surfaces.
7. An implant as recited in claim 1 wherein said first and second components include non-congruent bearing surfaces.
8. An implant as recited in claim 1 further comprising:
carbon to carbon bonds in at least one of said sintered polycrystalline diamond table.
9. An implant as recited in claim 8 further comprising:
spa carbon bonds in at least one of said sintered polycrystalline diamond table.
10. An implant as recited in claim 9 further comprising:
a crystalline diamond structure in at least one of said sintered polycrystalline diamond table.
11. An implant as recited in claim 10 further comprising:
interstitial spaces in said crystalline diamond structure.
12. An implant as recited in claim 11 further comprising:
solvent-catalyst metal in said interstitial spaces.
13. An implant as recited in claim 12 further comprising:
diamond to metal bonds between said solvent-catalyst metal and diamond in said sintered polycrystalline diamond table.
14. An implant as recited in claim 13 wherein said solvent-catalyst metal was used to facilitate sintering of said polycrystalline diamond compact at high temperature and high pressure.
15. An implant as recited in claim 12 wherein said solvent-catalyst metal includes a material selected from the group consisting of Co, Cr and Mo.
16. An implant recited in claim 12 wherein said solvent-catalyst metal includes CoCr.
17. An implant as recited in claim 12 wherein said solvent-catalyst metal includes CoCrMo.
18. An implant as recited in claim 1 further comprising a gradient transition zone in at least one of said sintered polycrystalline diamond tables, said gradient transition zone having a first side and a second, said gradient transition zone having both solvent-catalyst metal and diamond therein, and said gradient transition zone exhibiting a transition of ratios of percentage content of solvent-catalyst metal to diamond from said first side to said second side such that at a first point in said gradient transition zone, the ratio of percentage content of solvent-catalyst metal to diamond is greater than it is at a second point in gradient transition zone.
19. An implant as recited in claim 1 wherein at least one of said sintered polycrystalline diamond tables is a free standing diamond table.
20. An implant as recited in claim 1 wherein at least one of said sintered polycrystalline diamond tables includes diamond sintered to a substrate.
21. An implant as recited in claim 1 wherein at least one of said sintered polycrystalline diamond tables includes a diamond table attached to a substrate.
22. An articulating diamond-surfaced prosthetic spinal implant for implantation between vertebrae in a human body, the implant comprising:
a protrusion, a protrusion load bearing and articulation surface located on said protrusion, said protrusion load bearing and articulation surface being formed at least in part by diamond, a receptacle, a receptacle load bearing and articulation surface located on said receptacle, said receptacle load bearing and articulation surface being formed at least in part by diamond, said protrusion and said receptacle being sized and shaped to accommodate said protrusion protruding into said receptacle, and contact of said protrusion load bearing and articulation surface with said receptacle load bearing and articulation surface, said contact of said protrusion with said receptacle being accomplished by diamond to diamond contact of said protrusion and receptacle load bearing and articulation surfaces.
23. An articulating diamond-surfaced prosthetic spinal implant for implantation between vertebrae in a human body, the implant comprising:
a protrusion, a protrusion load bearing and articulation surface located on said protrusion, said protrusion load bearing and articulation surface being formed at least in part by diamond, a receptacle, a receptacle load bearing and articulation surface located on said receptacle, said receptacle load bearing and articulation surface being formed at least in part by diamond, said protrusion and said receptacle being sized and shaped to accommodate said protrusion protruding into said receptacle, and said protrusion load bearing and articulation surface contacting said receptacle load bearing and articulation surface, said contact of said protrusion with said receptacle being accomplished by diamond to diamond contact of said protrusion and receptacle load bearing and articulation surfaces, said contact of said protrusion with said receptacle occurring at a diamond to diamond contact point where diamond of said protrusion contacts diamond of said receptacle, said protrusion being pivotally movable with respect to said receptacle about said diamond to diamond contact point to provide translational or rotational movement of said protrusion with respect to said receptacle.
24. An articulating diamond-surfaced prosthetic spinal implant for implantation between vertebrae in a human body, the implant comprising:
a protrusion, a protrusion load bearing and articulation surface located on said protrusion, said protrusion load bearing and articulation surface being formed at least in part by diamond, said protrusion having a curvature defined by at least one radius R1, a receptacle, a receptacle load bearing and articulation surface located on said receptacle, said receptacle load bearing and articulation surface being formed at least in part by diamond, said receptacle having a curvature defined by at least one radius R2, said protrusion and said receptacle being sized and curved to accommodate said protrusion protruding into said receptacle, and to accommodate said protrusion load bearing and articulation surface contacting said receptacle load bearing and articulation surface, said contact of said protrusion with said receptacle being accomplished by diamond to diamond contact of said protrusion and receptacle load bearing and articulation surfaces, said contact of said protrusion with said receptacle occurring at a diamond to diamond contact point where diamond of said protrusion contacts diamond of said receptacle, said protrusion being translationally movable with respect to said receptacle in the axial plan of a human spine, said translational movement being accomplished by a sliding or rolling movement of diamond against diamond;

wherein R1 and R2 are chosen to accommodate said translational movement;
and wherein at least some of said translational movement occurs in the axial plane of a human spine about an arc of a circle having a radius R3 whose center is located at the base of the spinal process of a human spine, and wherein R3 is not equal to R1 or R2.
CA2497043A 2002-08-28 2003-08-28 Articulating diamond-surfaced spinal implants Expired - Lifetime CA2497043C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/229,907 2002-08-28
US10/229,907 US7494507B2 (en) 2000-01-30 2002-08-28 Articulating diamond-surfaced spinal implants
PCT/US2003/027088 WO2004019830A1 (en) 2002-08-28 2003-08-28 Articulating diamond-surfaced spinal implants

Publications (2)

Publication Number Publication Date
CA2497043A1 CA2497043A1 (en) 2004-03-11
CA2497043C true CA2497043C (en) 2011-01-04

Family

ID=31976349

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2497043A Expired - Lifetime CA2497043C (en) 2002-08-28 2003-08-28 Articulating diamond-surfaced spinal implants

Country Status (9)

Country Link
US (2) US7494507B2 (en)
EP (1) EP1539052B1 (en)
JP (1) JP2005537065A (en)
AT (1) ATE481949T1 (en)
AU (1) AU2003293277A1 (en)
CA (1) CA2497043C (en)
DE (1) DE60334305D1 (en)
WO (1) WO2004019830A1 (en)
ZA (1) ZA200502467B (en)

Families Citing this family (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494507B2 (en) 2000-01-30 2009-02-24 Diamicron, Inc. Articulating diamond-surfaced spinal implants
US7678325B2 (en) 1999-12-08 2010-03-16 Diamicron, Inc. Use of a metal and Sn as a solvent material for the bulk crystallization and sintering of diamond to produce biocompatbile biomedical devices
US8603181B2 (en) 2000-01-30 2013-12-10 Dimicron, Inc Use of Ti and Nb cemented in TiC in prosthetic joints
US6989032B2 (en) * 2001-07-16 2006-01-24 Spinecore, Inc. Artificial intervertebral disc
US6607559B2 (en) * 2001-07-16 2003-08-19 Spine Care, Inc. Trial intervertebral distraction spacers
US6673113B2 (en) 2001-10-18 2004-01-06 Spinecore, Inc. Intervertebral spacer device having arch shaped spring elements
US7223291B2 (en) * 2001-07-16 2007-05-29 Spinecore, Inc. Intervertebral spacer device having engagement hole pairs for manipulation using a surgical tool
US8858564B2 (en) * 2001-02-15 2014-10-14 Spinecore, Inc. Wedge plate inserter/impactor and related methods for use in implanting an artificial intervertebral disc
US8940047B2 (en) * 2001-02-15 2015-01-27 Spinecore, Inc. Intervertebral spacer device having recessed notch pairs for manipulation using a surgical tool
US7575576B2 (en) * 2001-07-16 2009-08-18 Spinecore, Inc. Wedge ramp distractor and related methods for use in implanting artificial intervertebral discs
US7169182B2 (en) * 2001-07-16 2007-01-30 Spinecore, Inc. Implanting an artificial intervertebral disc
US6655845B1 (en) 2001-04-22 2003-12-02 Diamicron, Inc. Bearings, races and components thereof having diamond and other superhard surfaces
US20070198092A1 (en) * 2001-07-16 2007-08-23 Spinecore, Inc. System for inserting artificial intervertebral discs
US8366775B2 (en) * 2001-07-16 2013-02-05 Spinecore, Inc. Intervertebral spacer device having an angled perimeter for manipulation using a surgical tool
US20090177283A9 (en) * 2001-10-01 2009-07-09 Ralph James D Intervertebral spacer device utilizing a spirally slotted belleville washer and a rotational mounting
US7771477B2 (en) 2001-10-01 2010-08-10 Spinecore, Inc. Intervertebral spacer device utilizing a belleville washer having radially spaced concentric grooves
FR2846550B1 (en) 2002-11-05 2006-01-13 Ldr Medical INTERVERTEBRAL DISC PROSTHESIS
US20060147332A1 (en) 2004-12-30 2006-07-06 Howmedica Osteonics Corp. Laser-produced porous structure
EP1418013B1 (en) 2002-11-08 2005-01-19 Howmedica Osteonics Corp. Laser-produced porous surface
BR0215968B1 (en) * 2002-12-17 2012-08-21 intervertebral implant with elements driven by universal joint.
US7771478B2 (en) 2003-04-04 2010-08-10 Theken Spine, Llc Artificial disc prosthesis
US7909869B2 (en) 2003-08-05 2011-03-22 Flexuspine, Inc. Artificial spinal unit assemblies
US8052723B2 (en) 2003-08-05 2011-11-08 Flexuspine Inc. Dynamic posterior stabilization systems and methods of use
US7753958B2 (en) 2003-08-05 2010-07-13 Gordon Charles R Expandable intervertebral implant
US7766914B2 (en) * 2003-09-10 2010-08-03 Warsaw Orthopedic, Inc. Adjustable drill guide
US7794465B2 (en) * 2003-09-10 2010-09-14 Warsaw Orthopedic, Inc. Artificial spinal discs and associated implantation instruments and methods
EP1578314B1 (en) * 2003-11-07 2007-05-30 Impliant Ltd. Spinal prostheses
ATE508713T1 (en) * 2003-11-18 2011-05-15 Zimmer Gmbh DISC IMPLANT
ATE507803T1 (en) 2004-02-04 2011-05-15 Ldr Medical DISC PROSTHESIS
FR2865629B1 (en) 2004-02-04 2007-01-26 Ldr Medical INTERVERTEBRAL DISC PROSTHESIS
FR2869528B1 (en) * 2004-04-28 2007-02-02 Ldr Medical INTERVERTEBRAL DISC PROSTHESIS
US20060024140A1 (en) * 2004-07-30 2006-02-02 Wolff Edward C Removable tap chasers and tap systems including the same
AT501408B1 (en) * 2004-12-07 2011-03-15 Physikalisches Buero Steinmueller Gmbh BIOLOGICAL SURFACES
CH697330B1 (en) * 2004-12-28 2008-08-29 Synthes Gmbh Intervertebral prosthesis.
US20060190079A1 (en) * 2005-01-21 2006-08-24 Naim Istephanous Articulating spinal disc implants with amorphous metal elements
US8449991B2 (en) 2005-04-07 2013-05-28 Dimicron, Inc. Use of SN and pore size control to improve biocompatibility in polycrystalline diamond compacts
US20060235523A1 (en) * 2005-04-19 2006-10-19 Sdgi Holdings, Inc. Implant having a sheath with a motion-limiting attribute
US20060235525A1 (en) * 2005-04-19 2006-10-19 Sdgi Holdings, Inc. Composite structure for biomedical implants
GB0508678D0 (en) 2005-04-28 2005-06-08 Cope Aiden Motion segment intervertebral disc prosthesis
US20060247769A1 (en) * 2005-04-28 2006-11-02 Sdgi Holdings, Inc. Polycrystalline diamond compact surfaces on facet arthroplasty devices
US20060247789A1 (en) * 2005-04-29 2006-11-02 Sdgi Holdings, Inc. Method and device for stabilization of prosthetic devices
US7799083B2 (en) * 2005-05-02 2010-09-21 Seaspine, Inc. Prosthesis for restoring motion in an appendage or spinal joint and an intervertebral spacer
AU2006242416A1 (en) * 2005-05-02 2006-11-09 Seaspine, Inc. Motion restoring intervertebral device
US8637127B2 (en) * 2005-06-27 2014-01-28 Kennametal Inc. Composite article with coolant channels and tool fabrication method
FR2891135B1 (en) 2005-09-23 2008-09-12 Ldr Medical Sarl INTERVERTEBRAL DISC PROSTHESIS
FR2893838B1 (en) 2005-11-30 2008-08-08 Ldr Medical Soc Par Actions Si PROSTHESIS OF INTERVERTEBRAL DISC AND INSTRUMENTATION OF INSERTION OF THE PROSTHESIS BETWEEN VERTEBRATES
US8728387B2 (en) 2005-12-06 2014-05-20 Howmedica Osteonics Corp. Laser-produced porous surface
US20070135923A1 (en) * 2005-12-14 2007-06-14 Sdgi Holdings, Inc. Ceramic and polymer prosthetic device
EP1803513B1 (en) * 2005-12-30 2017-03-29 Howmedica Osteonics Corp. Method of manufacturing implants using laser
US20070168037A1 (en) * 2006-01-13 2007-07-19 Posnick Jeffrey C Orthopedic implant
US8118869B2 (en) 2006-03-08 2012-02-21 Flexuspine, Inc. Dynamic interbody device
US20070270971A1 (en) * 2006-03-14 2007-11-22 Sdgi Holdings, Inc. Intervertebral prosthetic disc with improved wear resistance
EP2478873B1 (en) * 2006-03-21 2014-05-28 DePuy (Ireland) Moment induced total arthroplasty prosthetic
US8282641B2 (en) 2006-03-28 2012-10-09 Depuy Spine, Inc. Methods and instrumentation for disc replacement
US8137404B2 (en) 2006-03-28 2012-03-20 Depuy Spine, Inc. Artificial disc replacement using posterior approach
EP2024599B1 (en) 2006-04-27 2011-06-08 TDY Industries, Inc. Modular fixed cutter earth-boring bits and modular fixed cutter earth-boring bit bodies
US8147861B2 (en) 2006-08-15 2012-04-03 Howmedica Osteonics Corp. Antimicrobial implant
US8236074B1 (en) 2006-10-10 2012-08-07 Us Synthetic Corporation Superabrasive elements, methods of manufacturing, and drill bits including same
US9017438B1 (en) 2006-10-10 2015-04-28 Us Synthetic Corporation Polycrystalline diamond compact including a polycrystalline diamond table with a thermally-stable region having at least one low-carbon-solubility material and applications therefor
KR101438852B1 (en) * 2006-10-25 2014-09-05 티디와이 인더스트리스, 엘엘씨 Articles Having Improved Resistance to Thermal Cracking
US7914580B2 (en) 2006-11-07 2011-03-29 Biomedflex Llc Prosthetic ball-and-socket joint
US8512413B2 (en) 2006-11-07 2013-08-20 Biomedflex, Llc Prosthetic knee joint
EP2081520B1 (en) 2006-11-07 2017-07-12 Biomedflex, LLC Medical implants
US8070823B2 (en) 2006-11-07 2011-12-06 Biomedflex Llc Prosthetic ball-and-socket joint
US8308812B2 (en) 2006-11-07 2012-11-13 Biomedflex, Llc Prosthetic joint assembly and joint member therefor
US20110166671A1 (en) 2006-11-07 2011-07-07 Kellar Franz W Prosthetic joint
US9005307B2 (en) 2006-11-07 2015-04-14 Biomedflex, Llc Prosthetic ball-and-socket joint
US7905919B2 (en) 2006-11-07 2011-03-15 Biomedflex Llc Prosthetic joint
US8029574B2 (en) 2006-11-07 2011-10-04 Biomedflex Llc Prosthetic knee joint
NL1032851C2 (en) * 2006-11-10 2008-05-14 Fondel Finance B V Kit and method for fixing a prosthesis or part thereof and / or filling bony defects.
US8080074B2 (en) 2006-11-20 2011-12-20 Us Synthetic Corporation Polycrystalline diamond compacts, and related methods and applications
US8034136B2 (en) 2006-11-20 2011-10-11 Us Synthetic Corporation Methods of fabricating superabrasive articles
EP2120749B1 (en) * 2006-12-07 2020-05-20 AlpineSpine LLC Press-on pedicle screw assembly
US8715352B2 (en) 2006-12-14 2014-05-06 Depuy Spine, Inc. Buckling disc replacement
US8377098B2 (en) 2007-01-19 2013-02-19 Flexuspine, Inc. Artificial functional spinal unit system and method for use
US20080178535A1 (en) * 2007-01-26 2008-07-31 Diamond Innovations, Inc. Graded drilling cutter
KR101410181B1 (en) 2007-02-09 2014-06-19 다이아마이크론, 인코포레이티드 Multi-lobe artificial spine joint
US8308801B2 (en) * 2007-02-12 2012-11-13 Brigham Young University Spinal implant
US8465546B2 (en) 2007-02-16 2013-06-18 Ldr Medical Intervertebral disc prosthesis insertion assemblies
US8066770B2 (en) * 2007-05-31 2011-11-29 Depuy Products, Inc. Sintered coatings for implantable prostheses
US7604662B2 (en) * 2007-07-13 2009-10-20 Boston Scientific Scimed, Inc. Endoprostheses containing boride intermetallic phases
WO2009014718A1 (en) 2007-07-24 2009-01-29 Porex Corporation Porous laser sintered articles
US8632600B2 (en) 2007-09-25 2014-01-21 Depuy (Ireland) Prosthesis with modular extensions
US8128703B2 (en) 2007-09-28 2012-03-06 Depuy Products, Inc. Fixed-bearing knee prosthesis having interchangeable components
US9204967B2 (en) 2007-09-28 2015-12-08 Depuy (Ireland) Fixed-bearing knee prosthesis having interchangeable components
US8187330B2 (en) 2007-10-22 2012-05-29 Flexuspine, Inc. Dampener system for a posterior stabilization system with a variable length elongated member
US8162994B2 (en) 2007-10-22 2012-04-24 Flexuspine, Inc. Posterior stabilization system with isolated, dual dampener systems
US8182514B2 (en) 2007-10-22 2012-05-22 Flexuspine, Inc. Dampener system for a posterior stabilization system with a fixed length elongated member
US8157844B2 (en) 2007-10-22 2012-04-17 Flexuspine, Inc. Dampener system for a posterior stabilization system with a variable length elongated member
US8523912B2 (en) 2007-10-22 2013-09-03 Flexuspine, Inc. Posterior stabilization systems with shared, dual dampener systems
US8267965B2 (en) 2007-10-22 2012-09-18 Flexuspine, Inc. Spinal stabilization systems with dynamic interbody devices
US8999025B1 (en) 2008-03-03 2015-04-07 Us Synthetic Corporation Methods of fabricating a polycrystalline diamond body with a sintering aid/infiltrant at least saturated with non-diamond carbon and resultant products such as compacts
US8147499B2 (en) * 2008-04-24 2012-04-03 Spinecore, Inc. Dynamic distractor
GB0809721D0 (en) * 2008-05-28 2008-07-02 Univ Bath Improvements in or relating to joints and/or implants
US8790439B2 (en) 2008-06-02 2014-07-29 Kennametal Inc. Composite sintered powder metal articles
WO2009149371A1 (en) * 2008-06-05 2009-12-10 Synthes Usa, Llc Articulating disc implant
US9220603B2 (en) * 2008-07-02 2015-12-29 Simplify Medical, Inc. Limited motion prosthetic intervertebral disc
US20100255337A1 (en) * 2008-11-24 2010-10-07 Langhorn Jason B Multilayer Coatings
US8323292B2 (en) * 2008-12-15 2012-12-04 Spinecore, Inc. Adjustable pin drill guide and methods therefor
US20100217324A1 (en) * 2009-02-19 2010-08-26 Bowden Anton E Compliant Dynamic Spinal Implant And Associated Methods
EP2408389B1 (en) 2009-02-23 2021-04-14 Crocker Spinal, L.L.C. Press-on link for surgical screws
DE102009011648A1 (en) * 2009-03-04 2010-09-09 Advanced Medical Technologies Ag Implant system with support elements
WO2010108010A2 (en) * 2009-03-19 2010-09-23 Halverson Peter A Spinal implant
US8663359B2 (en) 2009-06-26 2014-03-04 Dimicron, Inc. Thick sintered polycrystalline diamond and sintered jewelry
RU2607167C2 (en) * 2009-07-10 2017-01-10 Милакс Холдинг С.А. Device for hip joint and method
US9157497B1 (en) 2009-10-30 2015-10-13 Brigham Young University Lamina emergent torsional joint and related methods
US9643236B2 (en) * 2009-11-11 2017-05-09 Landis Solutions Llc Thread rolling die and method of making same
US8945226B2 (en) * 2009-12-31 2015-02-03 Rhausler Vertebral spacer
US9408718B2 (en) * 2009-12-31 2016-08-09 Rhausler, Inc. Inter-vertebral implant with angled plate
US9011547B2 (en) * 2010-01-21 2015-04-21 Depuy (Ireland) Knee prosthesis system
US10005672B2 (en) 2010-04-14 2018-06-26 Baker Hughes, A Ge Company, Llc Method of forming particles comprising carbon and articles therefrom
US9205531B2 (en) 2011-09-16 2015-12-08 Baker Hughes Incorporated Methods of fabricating polycrystalline diamond, and cutting elements and earth-boring tools comprising polycrystalline diamond
US8317870B2 (en) 2010-09-30 2012-11-27 Depuy Products, Inc. Tibial component of a knee prosthesis having an angled cement pocket
US8287601B2 (en) 2010-09-30 2012-10-16 Depuy Products, Inc. Femoral component of a knee prosthesis having an angled cement pocket
US10309158B2 (en) 2010-12-07 2019-06-04 Us Synthetic Corporation Method of partially infiltrating an at least partially leached polycrystalline diamond table and resultant polycrystalline diamond compacts
US9358122B2 (en) 2011-01-07 2016-06-07 K2M, Inc. Interbody spacer
US8702412B2 (en) 2011-01-12 2014-04-22 Us Synthetic Corporation Superhard components for injection molds
US8512023B2 (en) 2011-01-12 2013-08-20 Us Synthetic Corporation Injection mold assembly including an injection mold cavity at least partially defined by a polycrystalline diamond material
US9027675B1 (en) 2011-02-15 2015-05-12 Us Synthetic Corporation Polycrystalline diamond compact including a polycrystalline diamond table containing aluminum carbide therein and applications therefor
EP2517660B1 (en) 2011-04-25 2018-03-07 Nexus Spine, L.L.C. Coupling system to connect two or more surgical screws
GB201108967D0 (en) * 2011-05-27 2011-07-13 Element Six Ltd Superhard structure, tool element and method of making same
EP2717807A2 (en) 2011-06-07 2014-04-16 Brigham Young University Serpentine spinal stability device and associated methods
GB201113391D0 (en) * 2011-08-03 2011-09-21 Element Six Abrasives Sa Super-hard construction and method for making same
US8800848B2 (en) 2011-08-31 2014-08-12 Kennametal Inc. Methods of forming wear resistant layers on metallic surfaces
CA2848733A1 (en) 2011-09-16 2013-03-21 Baker Hughes Incorporated Methods of fabricating polycrystalline diamond, and cutting elements and earth-boring tools comprising polycrystalline diamond
US8840673B2 (en) * 2011-09-21 2014-09-23 Linares Medical Devices, Llc Implantable elbow joint assembly with spherical inter-support
US9016406B2 (en) 2011-09-22 2015-04-28 Kennametal Inc. Cutting inserts for earth-boring bits
US9017410B2 (en) * 2011-10-26 2015-04-28 Globus Medical, Inc. Artificial discs
US9364896B2 (en) 2012-02-07 2016-06-14 Medical Modeling Inc. Fabrication of hybrid solid-porous medical implantable devices with electron beam melting technology
US9180010B2 (en) 2012-04-06 2015-11-10 Howmedica Osteonics Corp. Surface modified unit cell lattice structures for optimized secure freeform fabrication
US9135374B2 (en) 2012-04-06 2015-09-15 Howmedica Osteonics Corp. Surface modified unit cell lattice structures for optimized secure freeform fabrication
US10864081B2 (en) * 2012-10-19 2020-12-15 Tyber Medical, LLC Wedge osteotomy device and method of use
US9492288B2 (en) 2013-02-20 2016-11-15 Flexuspine, Inc. Expandable fusion device for positioning between adjacent vertebral bodies
DE102013227136B4 (en) * 2013-12-23 2020-12-31 Mathys Ag Bettlach Coated hemiprosthetic implant
WO2015191884A1 (en) 2014-06-12 2015-12-17 Brigham Young University Inverted serpentine spinal stability device and associated methods
GB201416867D0 (en) * 2014-09-24 2014-11-05 Fitzbionics Ltd A prosthetic intervertebral disc joint assembly
WO2017087027A1 (en) * 2015-11-22 2017-05-26 Tyber Medical Llc Anti-microbial and osteointegation nanotextured surfaces
GB201523173D0 (en) * 2015-12-31 2016-02-17 Element Six Ltd A medical implant & methods of making same
EP3463796B8 (en) * 2016-05-27 2023-06-07 Husky Injection Molding Systems Ltd. Mold gate structures
AU2018203479A1 (en) 2017-05-18 2018-12-06 Howmedica Osteonics Corp. High fatigue strength porous structure
GB201718797D0 (en) * 2017-11-14 2017-12-27 Element Six (Uk) Ltd Bearing assemblies roller bearing units races methods of making same and apparatus comprising same
CN108324987B (en) * 2018-02-09 2020-11-24 华南理工大学 Hollow porous spherical particle artificial bone and preparation method and application thereof
US11452618B2 (en) 2019-09-23 2022-09-27 Dimicron, Inc Spinal artificial disc removal tool
CN111627873A (en) * 2020-04-17 2020-09-04 柯文政 Diamond film conductive layer structure with high heat conductivity and manufacturing method thereof
JP2022124951A (en) * 2021-02-16 2022-08-26 大同メタル工業株式会社 ball socket structure
CN113750288B (en) * 2021-09-09 2023-04-07 西京学院 Ceramic particle reinforced Ti-Ta-based bone implantation composite material and preparation method thereof

Family Cites Families (309)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2254549A (en) 1938-11-12 1941-09-02 Small Louis Sintered metal composition
NL114085C (en) 1955-08-29
US3097929A (en) 1956-04-16 1963-07-16 Gladding Mcbean & Co Method for continuous manufacture of ceramic sheathing
US2947610A (en) 1958-01-06 1960-08-02 Gen Electric Method of making diamonds
US2947611A (en) 1958-01-06 1960-08-02 Gen Electric Diamond synthesis
US2947609A (en) 1958-01-06 1960-08-02 Gen Electric Diamond synthesis
NL246888A (en) 1958-12-29
DE1176623B (en) * 1959-11-27 1964-08-27 General Electric Company, Schenectady, N. Y. (V. St. A.) Process for the production of diamond crystals
US3102536A (en) 1960-12-07 1963-09-03 Robert M Rose Hip prosthesis
US3201828A (en) 1961-12-27 1965-08-24 Asea Ab High pressure apparatus
US3297407A (en) * 1962-12-10 1967-01-10 Gen Electric Method of growing diamond on a diamond seed crystal
US3150413A (en) 1962-12-13 1964-09-29 Barogenics Inc High pressure presses and components thereof
US3115729A (en) 1963-01-16 1963-12-31 Cincinnati Milling Machine Co Centerles grinding machine
US3292997A (en) 1964-11-12 1966-12-20 Gen Electric Apparatus and method of controlling pressure
GB1126961A (en) 1965-01-14 1968-09-11 Nat Res Dev Artificial joints for use in surgery
US3407445A (en) 1966-03-02 1968-10-29 Gen Electric High pressure reaction vessel for the preparation of diamond
US3488153A (en) * 1966-12-01 1970-01-06 Gen Electric Non-catalytically produced cubic and hexagonal diamond
US3423177A (en) * 1966-12-27 1969-01-21 Gen Electric Process for growing diamond on a diamond seed crystal
CH490077A (en) * 1968-04-25 1970-05-15 Arnold Heinrich Dr Med Huggler Hip joint prosthesis
US3574580A (en) * 1968-11-08 1971-04-13 Atomic Energy Commission Process for producing sintered diamond compact and products
US3597158A (en) 1969-01-13 1971-08-03 Megadiamond Corp Method of making diamonds
US3702573A (en) 1969-03-19 1972-11-14 Kennametal Inc Cermet product and method and apparatus for the manufacture thereof
CH514331A (en) * 1969-05-23 1971-10-31 Osteo Ag Hip joint prosthesis
US4089933A (en) 1970-01-04 1978-05-16 Institut Fiziki Vysokikh Daleny Akademi Nauk, Sssr Method of producing polycrystalline diamond aggregates
US3778586A (en) 1970-04-02 1973-12-11 Composite Sciences Process for coating metals using resistance heating of preformed layer
US3683421A (en) 1970-07-13 1972-08-15 Skf Ind Inc Prosthetic joint assembly
US3864409A (en) * 1970-11-30 1975-02-04 Bill J Pope Method For Vinyl Halides
US3816085A (en) 1971-01-29 1974-06-11 Megadiamond Corp Diamond-nondiamond carbon polycrystalline composites
US3871031A (en) 1971-12-03 1975-03-18 Ceraver Total hip prosthetic apparatus made of non-porous alumina
DE2225577C3 (en) * 1972-05-26 1980-01-31 Edelstahlwerk Witten Ag, 5810 Witten Use of a cobalt-chromium-based alloy as a biomaterial
US3852045A (en) 1972-08-14 1974-12-03 Battelle Memorial Institute Void metal composite material and method
US4012229A (en) * 1972-10-10 1977-03-15 Cabot Corporation Ductile cobalt-base alloys
US3819814A (en) 1972-11-01 1974-06-25 Megadiamond Corp Plural molded diamond articles and their manufacture from diamond powders under high temperature and pressure
US4196181A (en) * 1973-03-20 1980-04-01 Preobrazhensky Alexandr Y Microcrystalline monolithic carbon material
US3864758A (en) * 1973-08-31 1975-02-11 Sam Savo Yakich Hip joint bearing prosthesis
CH568753A5 (en) 1973-08-31 1975-11-14 Oscobal Ag
FR2272637B2 (en) 1974-05-29 1977-09-30 Ceraver
CH593054A5 (en) 1975-06-18 1977-11-15 Sulzer Ag
US4104441A (en) 1975-07-29 1978-08-01 Institut Sverkhtverdykh Materialov Ssr Polycrystalline diamond member and method of preparing same
DE2535649C3 (en) * 1975-08-09 1981-07-02 Rosenthal Technik Ag, 8672 Selb Ceramic spherical hip joint cap prosthesis for cementless implantation
US4104344A (en) 1975-09-12 1978-08-01 Brigham Young University High thermal conductivity substrate
US4055862A (en) 1976-01-23 1977-11-01 Zimmer Usa, Inc. Human body implant of graphitic carbon fiber reinforced ultra-high molecular weight polyethylene
DE2611744C2 (en) 1976-03-19 1982-01-28 Werner Dipl.-Ing. 8000 Muenchen Kraus Device for maintaining the vitality of bone tissue for endoprostheses
FR2349319A2 (en) 1976-04-26 1977-11-25 Rambert Andre HIP PROSTHESIS
US4126924A (en) 1977-02-07 1978-11-28 General Atomic Company Socket and joint prostheses
US4259072A (en) * 1977-04-04 1981-03-31 Kyoto Ceramic Co., Ltd. Ceramic endosseous implant
US4164794A (en) 1977-04-14 1979-08-21 Union Carbide Corporation Prosthetic devices having coatings of selected porous bioengineering thermoplastics
CA1103042A (en) 1977-05-04 1981-06-16 Akio Hara Sintered compact for use in a cutting tool and a method of producing the same
US4166292A (en) 1977-09-08 1979-09-04 Carbomedics, Inc. Stress reinforced artificial joint prostheses
US4206517A (en) 1977-12-01 1980-06-10 Biomedical Engineering Corp. Floating center prosthetic joint
US4470158A (en) 1978-03-10 1984-09-11 Biomedical Engineering Corp. Joint endoprosthesis
US4687487A (en) 1978-07-21 1987-08-18 Association Suisse Pour La Recherches Horlogere Joint implant
ATE11733T1 (en) 1979-02-22 1985-02-15 John Milton Agee JOINT PROSTHESIS.
US4260397A (en) * 1979-08-23 1981-04-07 General Electric Company Method for preparing diamond compacts containing single crystal diamond
US4260203A (en) * 1979-09-10 1981-04-07 Smith International, Inc. Bearing structure for a rotary rock bit
US4534934A (en) 1980-02-29 1985-08-13 General Electric Company Axial sweep-through process for preparing diamond wire die compacts
US4289123A (en) 1980-03-31 1981-09-15 Dunn Harold K Orthopedic appliance
US4454612A (en) 1980-05-07 1984-06-19 Biomet, Inc. Prosthesis formation having solid and porous polymeric components
CA1146301A (en) 1980-06-13 1983-05-17 J. David Kuntz Intervertebral disc prosthesis
US4311490A (en) * 1980-12-22 1982-01-19 General Electric Company Diamond and cubic boron nitride abrasive compacts using size selective abrasive particle layers
US4380471A (en) * 1981-01-05 1983-04-19 General Electric Company Polycrystalline diamond and cemented carbide substrate and synthesizing process therefor
US4535486A (en) 1981-05-18 1985-08-20 Rensselaer Polytechnic Institute Low friction bearing surfaces and structures particularly for artificial prosthetic joints
US4547910A (en) 1981-05-18 1985-10-22 Rensselaer Polytechnic Institute Low friction bearing surfaces and structures particularly for artificial prosthetic joints
US4525179A (en) 1981-07-27 1985-06-25 General Electric Company Process for making diamond and cubic boron nitride compacts
US4410054A (en) 1981-12-03 1983-10-18 Maurer Engineering Inc. Well drilling tool with diamond radial/thrust bearings
US4592422A (en) 1982-04-01 1986-06-03 Petro-Drive, Inc. Casing hanger apparatus and method of installation therefor
US4518659A (en) 1982-04-02 1985-05-21 General Electric Company Sweep through process for making polycrystalline compacts
US5387247A (en) * 1983-10-25 1995-02-07 Sorin Biomedia S.P.A. Prosthetic device having a biocompatible carbon film thereon and a method of and apparatus for forming such device
US5037423A (en) 1983-10-26 1991-08-06 Pfizer Hospital Products Group, Inc. Method and instrumentation for the replacement of a knee prosthesis
US4610699A (en) 1984-01-18 1986-09-09 Sumitomo Electric Industries, Ltd. Hard diamond sintered body and the method for producing the same
US4846839A (en) 1984-02-09 1989-07-11 Joint Medical Products Corporation Apparatus for affixing a prosthesis to bone
US4525178A (en) 1984-04-16 1985-06-25 Megadiamond Industries, Inc. Composite polycrystalline diamond
CH663895A5 (en) 1984-08-28 1988-01-29 Mathys Robert Co Artificial hueftgelenkpfanne with hydrostatic head bearing.
EP0176728B1 (en) 1984-09-04 1989-07-26 Humboldt-Universität zu Berlin Intervertebral-disc prosthesis
US5030233A (en) 1984-10-17 1991-07-09 Paul Ducheyne Porous flexible metal fiber material for surgical implantation
US4738322A (en) 1984-12-21 1988-04-19 Smith International Inc. Polycrystalline diamond bearing system for a roller cone rock bit
US4778486A (en) 1985-02-04 1988-10-18 The General Electric Company Directional catalyst alloy sweep through process for preparing diamond compacts
US4694918A (en) 1985-04-29 1987-09-22 Smith International, Inc. Rock bit with diamond tip inserts
US4797241A (en) * 1985-05-20 1989-01-10 Sii Megadiamond Method for producing multiple polycrystalline bodies
US4662348A (en) 1985-06-20 1987-05-05 Megadiamond, Inc. Burnishing diamond
US4714473A (en) 1985-07-25 1987-12-22 Harrington Arthritis Research Center Knee prosthesis
US4714468A (en) 1985-08-13 1987-12-22 Pfizer Hospital Products Group Inc. Prosthesis formed from dispersion strengthened cobalt-chromium-molybdenum alloy produced by gas atomization
US4668290A (en) * 1985-08-13 1987-05-26 Pfizer Hospital Products Group Inc. Dispersion strengthened cobalt-chromium-molybdenum alloy produced by gas atomization
AU577958B2 (en) 1985-08-22 1988-10-06 De Beers Industrial Diamond Division (Proprietary) Limited Abrasive compact
US4618269A (en) 1985-09-18 1986-10-21 Reed Tool Company Hardened bearing surface and method of forming same
CH667988A5 (en) 1985-11-18 1988-11-30 Sulzer Ag ARTIFICIAL HIP PAN.
US4784023A (en) 1985-12-05 1988-11-15 Diamant Boart-Stratabit (Usa) Inc. Cutting element having composite formed of cemented carbide substrate and diamond layer and method of making same
US4797326A (en) * 1986-01-14 1989-01-10 The General Electric Company Supported polycrystalline compacts
US4808185A (en) * 1986-02-07 1989-02-28 Penenberg Brad L Tibial prosthesis, template and reamer
DE3625520A1 (en) 1986-03-15 1987-09-17 Mecron Med Prod Gmbh BONE IMPLANT
DE8611697U1 (en) 1986-04-25 1986-06-19 Mecron Medizinische Produkte Gmbh, 1000 Berlin Kit for a stem prosthesis
DE3707518A1 (en) * 1986-05-16 1987-11-26 Copf Franz PROSTHESE PART AND METHOD FOR THE PRODUCTION THEREOF
DE3687798T2 (en) 1986-05-19 1993-08-05 Smith International COOLING NETWORKS FOR BEARING AREAS MADE OF POLYCRYSTALLINE DIAMOND.
US4822365A (en) * 1986-05-30 1989-04-18 Walker Peter S Method of design of human joint prosthesis
US4822368A (en) * 1986-06-02 1989-04-18 Boehringer Mannheim Corporation Sugical method of attaching enclosure member for prosthetic joint
US4731088A (en) * 1986-06-02 1988-03-15 Boehringer Mannheim Corp Enclosure member for prosthetic joint
US5080685A (en) * 1986-08-15 1992-01-14 Boehringer Mannheim Corporation Modular hip prosthesis
EP0257359B1 (en) * 1986-08-15 1991-11-27 Boehringer Mannheim Corporation Modular hip prosthesis
IN167706B (en) * 1986-08-21 1990-12-08 Sree Chitra Tirunal Inst For M
US4822366A (en) * 1986-10-16 1989-04-18 Boehringer Mannheim Corporation Modular knee prosthesis
US4759350A (en) 1986-10-17 1988-07-26 Dunn Harold K Instruments for shaping distal femoral and proximal tibial surfaces
US4755185A (en) 1987-01-27 1988-07-05 Boehringer Mannheim Corporation Prosthetic joint
IT1202437B (en) * 1987-01-28 1989-02-09 Cremascoli Spa G STRUCTURE OF TOTAL ANCHOR PROSTHESIS, INCLUDING A FEMORAL COMPONENT AND AN ACETABULAR COMPONENT, REALIZED, BOTH, PART IN METAL MATERIAL AND PART IN CERAMIC MATERIAL
IE62468B1 (en) 1987-02-09 1995-02-08 De Beers Ind Diamond Abrasive product
CA1283501C (en) 1987-02-12 1991-04-30 Thomas P. Hedman Artificial spinal disc
FR2616780B1 (en) * 1987-06-16 1992-08-28 Combustible Nucleaire PROCESS FOR PRODUCING COMPOSITE THERMOSTABLE ABRASIVE PRODUCT
US4766040A (en) 1987-06-26 1988-08-23 Sandvik Aktiebolag Temperature resistant abrasive polycrystalline diamond bodies
IT1213873B (en) 1987-08-03 1990-01-05 Cremascoli Spa G STRUCTURE OF HIP PROSTHESIS LIKELY TO BE EASILY ADAPTED TO THE PARTICULAR CONFORMATION OF THE COXO-FEMORAL ARTICULATION OF INDIVIDUAL PATIENTS
DE3726969C1 (en) 1987-08-13 1989-03-16 Friedrichsfeld Gmbh Knee joint endoprosthesis
DE3885261T2 (en) 1987-12-21 1994-04-21 Asahi Optical Co Ltd Process for the production of a substrate coated with apatite.
US5194066A (en) * 1988-01-11 1993-03-16 Boehringer Mannheim Corporation Modular joint prosthesis
US4892547A (en) * 1988-02-03 1990-01-09 Biomet, Inc. Partially stabilized knee prosthesis
US4944756A (en) 1988-02-03 1990-07-31 Pfizer Hospital Products Group Prosthetic knee joint with improved patellar component tracking
US4865603A (en) 1988-02-04 1989-09-12 Joint Medical Products Corporation Metallic prosthetic devices having micro-textured outer surfaces
FR2631832B1 (en) * 1988-05-24 1994-05-27 Unirec METHOD FOR REDUCING THE COEFFICIENT OF FRICTION AND WEAR BETWEEN A METAL PIECE AND A PIECE BASED ON AN ORGANIC POLYMER OR COPOLYMER AND ITS APPLICATION TO JOINT PROSTHESES
US4925701A (en) 1988-05-27 1990-05-15 Xerox Corporation Processes for the preparation of polycrystalline diamond films
US5092898A (en) * 1988-05-31 1992-03-03 Ngk Spark Plug Co., Ltd. Artificial joint
US4931068A (en) 1988-08-29 1990-06-05 Exxon Research And Engineering Company Method for fabricating fracture-resistant diamond and diamond composite articles
US4922898A (en) 1988-10-04 1990-05-08 Dunn Harold K Procedure for verifying prosthetic implant seating
US5002580A (en) * 1988-10-07 1991-03-26 Pfizer Hospital Products Group, Inc. Prosthetic device and method of implantation
US5009673A (en) * 1988-11-30 1991-04-23 The General Electric Company Method for making polycrystalline sandwich compacts
US5478906A (en) 1988-12-02 1995-12-26 E. I. Du Pont De Nemours And Company Ultrahigh molecular weight linear polyethylene and articles thereof
US5019083A (en) 1989-01-31 1991-05-28 Advanced Osseous Technologies, Inc. Implanting and removal of orthopedic prostheses
US5108452A (en) * 1989-02-08 1992-04-28 Smith & Nephew Richards Inc. Modular hip prosthesis
US4959066A (en) 1989-02-24 1990-09-25 Zimmer, Inc. Femoral osteotomy guide assembly
US4940404A (en) 1989-04-13 1990-07-10 Westinghouse Electric Corp. Method of making a high velocity armor penetrator
US5002731A (en) * 1989-04-17 1991-03-26 Haynes International, Inc. Corrosion-and-wear-resistant cobalt-base alloy
US4935200A (en) 1989-06-26 1990-06-19 Allied-Signal Inc. High density, high strength uranium-titanium-hafnium alloys
CA2021814C (en) * 1989-07-25 2002-04-02 James A. Davidson Zirconium alloy-based prosthesis with zirconium oxide or zirconium nitride coating
US5152795A (en) 1990-04-25 1992-10-06 Spire Corporation Surgical implants and method
US5152794A (en) 1989-07-25 1992-10-06 Smith & Nephew Richards Inc. Zirconium oxide and nitride coated prothesis for reduced microfretting
US5258022A (en) 1989-07-25 1993-11-02 Smith & Nephew Richards, Inc. Zirconium oxide and nitride coated cardiovascular implants
US5370694A (en) 1989-07-25 1994-12-06 Smith & Nephew Richards, Inc. Zirconium oxide and nitride coated endoprostheses for tissue protection
US5011515B1 (en) * 1989-08-07 1999-07-06 Robert H Frushour Composite polycrystalline diamond compact with improved impact resistance
US5002577A (en) * 1989-08-10 1991-03-26 Boehringer Mannheim Corporation Variable position acetabular cup
US4979957A (en) 1989-09-11 1990-12-25 Zimmer, Inc. Textured prosthetic implant
US5002581A (en) * 1989-11-03 1991-03-26 Dow Corning Wright Corporation Modular hip joint prosthesis with adjustable anteversion
US5082359A (en) * 1989-11-28 1992-01-21 Epion Corporation Diamond films and method of growing diamond films on nondiamond substrates
US5477864A (en) * 1989-12-21 1995-12-26 Smith & Nephew Richards, Inc. Cardiovascular guidewire of enhanced biocompatibility
US5002578A (en) * 1990-05-04 1991-03-26 Venus Corporation Modular hip stem prosthesis apparatus and method
US5092895A (en) * 1990-05-30 1992-03-03 Albrektsson Bjoern Knee-joint prosthesis
ATE191632T1 (en) * 1990-06-01 2000-04-15 Depuy Orthopaedics Inc ORTHOPEDIC IMPLANT MADE OF A METAL/COMPOSITE HYBRID
US5108432A (en) * 1990-06-24 1992-04-28 Pfizer Hospital Products Group, Inc. Porous fixation surface
US5133757A (en) 1990-07-31 1992-07-28 Spire Corporation Ion implantation of plastic orthopaedic implants
US5330826A (en) 1990-08-13 1994-07-19 Mcdonnell Douglas Corporation Preparation of ceramic-metal coatings
US5861042A (en) * 1990-09-17 1999-01-19 Buechel; Frederick F. Prosthesis with biologically inert wear resistant surface
US5702448A (en) * 1990-09-17 1997-12-30 Buechel; Frederick F. Prosthesis with biologically inert wear resistant surface
AU644213B2 (en) 1990-09-26 1993-12-02 De Beers Industrial Diamond Division (Proprietary) Limited Composite diamond abrasive compact
SE9003251D0 (en) * 1990-10-11 1990-10-11 Diamant Boart Stratabit Sa IMPROVED TOOLS FOR ROCK DRILLING, METAL CUTTING AND WEAR PART APPLICATIONS
US5192323A (en) * 1990-11-05 1993-03-09 Zimmer, Inc. Method of surface hardening orthopedic implant devices
US5180452A (en) * 1990-12-27 1993-01-19 Thiokol Corporation Solid propellant formualtions producing acid neutralizing exhaust
ES2086516T3 (en) * 1991-01-18 1996-07-01 Sulzer Medizinaltechnik Ag PROTECTION OF THE KNEE JOINT.
ES2073723T3 (en) * 1991-01-18 1995-08-16 Sulzer Medizinaltechnik Ag IMPLANT CONSISTING OF TWO COOPERATING PARTS OF SLIDING.
US5108451A (en) * 1991-01-31 1992-04-28 Forte Mark R Femoral component of a hip joint prosthesis
CA2060823C (en) * 1991-02-08 2002-09-10 Naoya Omori Diamond-or diamond-like carbon-coated hard materials
US5211726A (en) * 1991-03-14 1993-05-18 General Electric Company Products and process for making multigrain abrasive compacts
JPH04305096A (en) * 1991-04-01 1992-10-28 Sumitomo Electric Ind Ltd Low-temperature formation of high-quality gaseous phase synthesized diamond
US5092687A (en) * 1991-06-04 1992-03-03 Anadrill, Inc. Diamond thrust bearing and method for manufacturing same
FR2677374B1 (en) * 1991-06-05 1994-10-14 Seb Sa PROCESS FOR COOKING EMAIL ON A METAL OBJECT, PARTICULARLY IN ALUMINUM, AND DEVICE FOR IMPLEMENTING SAME.
US5154023A (en) 1991-06-11 1992-10-13 Spire Corporation Polishing process for refractory materials
US5080752A (en) * 1991-07-08 1992-01-14 The United States Of America As Represented By The Secretary Of The Navy Consolidation of diamond packed powders
US5380547A (en) * 1991-12-06 1995-01-10 Higgins; Joel C. Method for manufacturing titanium-containing orthopedic implant devices
US5425773A (en) 1992-01-06 1995-06-20 Danek Medical, Inc. Intervertebral disk arthroplasty device
US5258031A (en) 1992-01-06 1993-11-02 Danek Medical Intervertebral disk arthroplasty
DK0555033T3 (en) * 1992-02-07 1999-12-13 Smith & Nephew Inc Surface-cured, biocompatible metal medical implants
US5383934A (en) * 1992-03-04 1995-01-24 Implant Sciences, Corporation Method for ion beam treating orthopaedic implant components
DE4208116C2 (en) * 1992-03-13 1995-08-03 Link Waldemar Gmbh Co Intervertebral disc prosthesis
EP0562782A3 (en) * 1992-03-24 1994-05-25 Smith & Nephew Richards Inc Dual composition coupler for modular medical implants
FR2694882B1 (en) * 1992-08-24 1994-10-21 Sofamor Intervertebral disc prosthesis.
US5284483A (en) * 1992-09-16 1994-02-08 Zimmer, Inc. Acetabular cup inserting instrument
US5236545A (en) 1992-10-05 1993-08-17 The Board Of Governors Of Wayne State University Method for heteroepitaxial diamond film development
JPH06178787A (en) 1992-12-14 1994-06-28 Shima Yumiko Centrum spacer with joint, intervertebral cavity measuring device and centrum spacer pattern
US5358525A (en) 1992-12-28 1994-10-25 Fox John E Bearing surface for prosthesis and replacement of meniscal cartilage
US5676701A (en) 1993-01-14 1997-10-14 Smith & Nephew, Inc. Low wear artificial spinal disc
US5507824A (en) * 1993-02-23 1996-04-16 Lennox; Dennis W. Adjustable prosthetic socket component, for articulating anatomical joints
US5308412A (en) * 1993-03-15 1994-05-03 Zimmer, Inc. Method of surface hardening cobalt-chromium based alloys for orthopedic implant devices
US5824651A (en) 1993-05-10 1998-10-20 Universite De Montreal Process for modification of implant surface with bioactive conjugates for improved integration
US5414049A (en) * 1993-06-01 1995-05-09 Howmedica Inc. Non-oxidizing polymeric medical implant
US5645596A (en) 1993-07-07 1997-07-08 Asahi Kogaku Kogyo Kabushiki Kaisha Ceramic vertebrae prosthesis
US5486137A (en) * 1993-07-21 1996-01-23 General Electric Company Abrasive tool insert
US5494477A (en) * 1993-08-11 1996-02-27 General Electric Company Abrasive tool insert
US5379854A (en) * 1993-08-17 1995-01-10 Dennis Tool Company Cutting element for drill bits
US5372660A (en) 1993-08-26 1994-12-13 Smith & Nephew Richards, Inc. Surface and near surface hardened medical implants
US5379853A (en) * 1993-09-20 1995-01-10 Smith International, Inc. Diamond drag bit cutting elements
DE4335931B4 (en) * 1993-10-21 2006-10-12 Cerasiv Gmbh Innovatives Keramik-Engineering acetabulum
EP0655549B1 (en) * 1993-11-10 1999-02-10 Camco Drilling Group Limited Improvements in or relating to elements faced with superhard material
GB2283772B (en) 1993-11-10 1997-01-15 Camco Drilling Group Ltd Improvements in or relating to elements faced with superhard material
US5605198A (en) * 1993-12-09 1997-02-25 Baker Hughes Incorporated Stress related placement of engineered superabrasive cutting elements on rotary drag bits
US5590729A (en) * 1993-12-09 1997-01-07 Baker Hughes Incorporated Superhard cutting structures for earth boring with enhanced stiffness and heat transfer capabilities
US5554415A (en) 1994-01-18 1996-09-10 Qqc, Inc. Substrate coating techniques, including fabricating materials on a surface of a substrate
US5620754A (en) * 1994-01-21 1997-04-15 Qqc, Inc. Method of treating and coating substrates
CA2142634C (en) 1994-02-18 2005-09-20 Salvatore Caldarise Self-lubricating implantable articulation member
US5508368A (en) * 1994-03-03 1996-04-16 Diamonex, Incorporated Ion beam process for deposition of highly abrasion-resistant coatings
US5601477A (en) * 1994-03-16 1997-02-11 U.S. Synthetic Corporation Polycrystalline abrasive compact with honed edge
US5391407A (en) * 1994-03-18 1995-02-21 Southwest Research Institute Process for forming protective diamond-like carbon coatings on metallic surfaces
US5605714A (en) * 1994-03-29 1997-02-25 Southwest Research Institute Treatments to reduce thrombogeneticity in heart valves made from titanium and its alloys
US5725573A (en) * 1994-03-29 1998-03-10 Southwest Research Institute Medical implants made of metal alloys bearing cohesive diamond like carbon coatings
US5593719A (en) * 1994-03-29 1997-01-14 Southwest Research Institute Treatments to reduce frictional wear between components made of ultra-high molecular weight polyethylene and metal alloys
US5507814A (en) * 1994-03-30 1996-04-16 Northwestern University Orthopedic implant with self-reinforced mantle
US5947893A (en) 1994-04-27 1999-09-07 Board Of Regents, The University Of Texas System Method of making a porous prothesis with biodegradable coatings
US5512235A (en) * 1994-05-06 1996-04-30 General Electric Company Supported polycrystalline compacts having improved physical properties and method for making same
US5458827A (en) 1994-05-10 1995-10-17 Rockwell International Corporation Method of polishing and figuring diamond and other superhard material surfaces
ZA954736B (en) * 1994-06-16 1996-01-26 De Beers Ind Diamond Tool component
US5492188A (en) * 1994-06-17 1996-02-20 Baker Hughes Incorporated Stress-reduced superhard cutting element
GB9412247D0 (en) 1994-06-18 1994-08-10 Camco Drilling Group Ltd Improvements in or relating to elements faced with superhard material
GB9412779D0 (en) * 1994-06-24 1994-08-17 Camco Drilling Group Ltd Improvements in or relating to elements faced with superhard materials
US7396501B2 (en) 1994-08-12 2008-07-08 Diamicron, Inc. Use of gradient layers and stress modifiers to fabricate composite constructs
AU1050695A (en) 1994-08-12 1996-03-07 U. S. Synthetic Prosthetic joint with diamond coated interfaces
US6596225B1 (en) 2000-01-31 2003-07-22 Diamicron, Inc. Methods for manufacturing a diamond prosthetic joint component
US6494918B1 (en) 2000-01-30 2002-12-17 Diamicron, Inc. Component for a prosthetic joint having a diamond load bearing and articulation surface
US7678325B2 (en) * 1999-12-08 2010-03-16 Diamicron, Inc. Use of a metal and Sn as a solvent material for the bulk crystallization and sintering of diamond to produce biocompatbile biomedical devices
US6497727B1 (en) 2000-01-30 2002-12-24 Diamicron, Inc. Component for use in prosthetic hip, the component having a polycrystalline diamond articulation surface and a plurality of substrate layers
US7396505B2 (en) 1994-08-12 2008-07-08 Diamicron, Inc. Use of CoCrMo to augment biocompatibility in polycrystalline diamond compacts
US6425922B1 (en) * 2000-01-30 2002-07-30 Diamicron, Inc. Prosthetic hip joint having at least one sintered polycrystalline diamond compact articulation surface
US6676704B1 (en) * 1994-08-12 2004-01-13 Diamicron, Inc. Prosthetic joint component having at least one sintered polycrystalline diamond compact articulation surface and substrate surface topographical features in said polycrystalline diamond compact
US7494507B2 (en) * 2000-01-30 2009-02-24 Diamicron, Inc. Articulating diamond-surfaced spinal implants
US6290726B1 (en) * 2000-01-30 2001-09-18 Diamicron, Inc. Prosthetic hip joint having sintered polycrystalline diamond compact articulation surfaces
US7465219B2 (en) 1994-08-12 2008-12-16 Diamicron, Inc. Brut polishing of superhard materials
US6800095B1 (en) 1994-08-12 2004-10-05 Diamicron, Inc. Diamond-surfaced femoral head for use in a prosthetic joint
US6514289B1 (en) * 2000-01-30 2003-02-04 Diamicron, Inc. Diamond articulation surface for use in a prosthetic joint
US5507804A (en) * 1994-11-16 1996-04-16 Alcon Laboratories, Inc. Cross-linked polyethylene oxide coatings to improve the biocompatibility of implantable medical devices
US6063149A (en) * 1995-02-24 2000-05-16 Zimmer; Jerry W. Graded grain size diamond layer
US5628824A (en) * 1995-03-16 1997-05-13 The University Of Alabama At Birmingham Research Foundation High growth rate homoepitaxial diamond film deposition at high temperatures by microwave plasma-assisted chemical vapor deposition
US5530072A (en) 1995-04-19 1996-06-25 Mobil Oil Corporation Introduction of long chain branching into linear polyethylenes
US5571616A (en) 1995-05-16 1996-11-05 Crystallume Ultrasmooth adherent diamond film coated article and method for making same
US5728161A (en) * 1995-06-08 1998-03-17 Depuy Orthopedics, Inc. Large taper modular shoulder prosthesis
WO1997004209A1 (en) * 1995-07-14 1997-02-06 U.S. Synthetic Corporation Polycrystalline diamond cutter with integral carbide/diamond transition layer
US5766394A (en) 1995-09-08 1998-06-16 Smith International, Inc. Method for forming a polycrystalline layer of ultra hard material
US5830539A (en) 1995-11-17 1998-11-03 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of The University Of Oregon Methods for functionalizing and coating substrates and devices made according to the methods
US5855996A (en) * 1995-12-12 1999-01-05 General Electric Company Abrasive compact with improved properties
US5669913A (en) * 1995-12-22 1997-09-23 Zobel; Robert A. Method and apparatus for smoothing an anatomical joint bearing surface during hemi-joint replacement
JP3236768B2 (en) * 1995-12-27 2001-12-10 京セラ株式会社 Bioprosthetic members
US5706906A (en) * 1996-02-15 1998-01-13 Baker Hughes Incorporated Superabrasive cutting element with enhanced durability and increased wear life, and apparatus so equipped
US5780119A (en) 1996-03-20 1998-07-14 Southwest Research Institute Treatments to reduce friction and wear on metal alloy components
ATE282376T1 (en) * 1996-04-23 2004-12-15 Biomet Ltd METHOD FOR MAKING A HIP JOINT POCKET
US5916269A (en) 1996-06-03 1999-06-29 Depuy Orthopaedics, Inc. Wear reduced acetabular component
US5855601A (en) * 1996-06-21 1999-01-05 The Trustees Of Columbia University In The City Of New York Artificial heart valve and method and device for implanting the same
US5876459A (en) * 1996-08-30 1999-03-02 Powell; Douglas Hunter Adjustable modular orthopedic implant
US5782832A (en) 1996-10-01 1998-07-21 Surgical Dynamics, Inc. Spinal fusion implant and method of insertion thereof
EP1415598A3 (en) * 1996-10-23 2009-04-22 Smith & Nephew, Inc. Acetabular cup body prosthesis
US5895428A (en) * 1996-11-01 1999-04-20 Berry; Don Load bearing spinal joint implant
US5981827A (en) 1996-11-12 1999-11-09 Regents Of The University Of California Carbon based prosthetic devices
US6045497A (en) * 1997-01-02 2000-04-04 Myocor, Inc. Heart wall tension reduction apparatus and method
US5860982A (en) * 1997-03-26 1999-01-19 Johnson & Johnson Professional, Inc. Cemented calcar replacement varying height trial
GB9709072D0 (en) * 1997-05-02 1997-06-25 Howmedica A process for improving start up and steady rate friction of soft/compliant polyurethanes
US5879407A (en) * 1997-07-17 1999-03-09 Waggener; Herbert A. Wear resistant ball and socket joint
US6146421A (en) 1997-08-04 2000-11-14 Gordon, Maya, Roberts And Thomas, Number 1, Llc Multiple axis intervertebral prosthesis
US5888226A (en) * 1997-11-12 1999-03-30 Rogozinski; Chaim Intervertebral prosthetic disc
US5899941A (en) * 1997-12-09 1999-05-04 Chubu Bearing Kabushiki Kaisha Artificial intervertebral disk
US6179874B1 (en) * 1998-04-23 2001-01-30 Cauthen Research Group, Inc. Articulating spinal implant
US6679915B1 (en) * 1998-04-23 2004-01-20 Sdgi Holdings, Inc. Articulating spinal implant
US6019792A (en) * 1998-04-23 2000-02-01 Cauthen Research Group, Inc. Articulating spinal implant
ES2286891T3 (en) 1998-07-22 2007-12-01 Warsaw Orthopedic, Inc. DISK PROTESIS IN INDIVIDUAL OR MULTIPLE, MULTIDISCOIDAL, CYLINDRICAL AND THREADED TRAINING.
US6749635B1 (en) 1998-09-04 2004-06-15 Sdgi Holdings, Inc. Peanut spectacle multi discoid thoraco-lumbar disc prosthesis
JP2000093503A (en) * 1998-09-15 2000-04-04 Isotis Bv Method for coating medical implant
WO2000018518A1 (en) * 1998-10-01 2000-04-06 The Uab Research Foundation A process for ultra smooth diamond coating on metals and uses thereof
US6113637A (en) 1998-10-22 2000-09-05 Sofamor Danek Holdings, Inc. Artificial intervertebral joint permitting translational and rotational motion
US6039763A (en) * 1998-10-27 2000-03-21 Disc Replacement Technologies, Inc. Articulating spinal disc prosthesis
US6187045B1 (en) 1999-02-10 2001-02-13 Thomas K. Fehring Enhanced biocompatible implants and alloys
US6077148A (en) 1999-02-26 2000-06-20 Depuy Orthopaedics, Inc. Spherical lapping method
US6368350B1 (en) * 1999-03-11 2002-04-09 Sulzer Spine-Tech Inc. Intervertebral disc prosthesis and method
US7569176B2 (en) * 1999-12-08 2009-08-04 Diamicron, Inc. Method for making a sintered superhard prosthetic joint component
US7556763B2 (en) * 1999-12-08 2009-07-07 Diamicron, Inc. Method of making components for prosthetic joints
US6709463B1 (en) * 2000-01-30 2004-03-23 Diamicron, Inc. Prosthetic joint component having at least one solid polycrystalline diamond component
US6610095B1 (en) 2000-01-30 2003-08-26 Diamicron, Inc. Prosthetic joint having substrate surface topographical featurers and at least one diamond articulation surface
US20050203630A1 (en) 2000-01-30 2005-09-15 Pope Bill J. Prosthetic knee joint having at least one diamond articulation surface
US20040199260A1 (en) 2000-01-30 2004-10-07 Pope Bill J. Prosthetic joint component having at least one sintered polycrystalline diamond compact articulation surface and substrate surface topographical features in said polycrystalline diamond compact
US6410877B1 (en) 2000-01-30 2002-06-25 Diamicron, Inc. Methods for shaping and finishing prosthetic joint components including polycrystalline diamond compacts
FR2805733B1 (en) * 2000-03-03 2002-06-07 Scient X DISC PROSTHESIS FOR CERVICAL VERTEBRUS
FR2805985B1 (en) * 2000-03-10 2003-02-07 Eurosurgical INTERVERTEBRAL DISK PROSTHESIS
US6592985B2 (en) 2000-09-20 2003-07-15 Camco International (Uk) Limited Polycrystalline diamond partially depleted of catalyzing material
US20030019106A1 (en) * 2001-04-22 2003-01-30 Diamicron, Inc. Methods for making bearings, races and components thereof having diamond and other superhard surfaces
US6655845B1 (en) 2001-04-22 2003-12-02 Diamicron, Inc. Bearings, races and components thereof having diamond and other superhard surfaces
US6817550B2 (en) * 2001-07-06 2004-11-16 Diamicron, Inc. Nozzles, and components thereof and methods for making the same
US6740118B2 (en) * 2002-01-09 2004-05-25 Sdgi Holdings, Inc. Intervertebral prosthetic joint
AU2003228391A1 (en) * 2002-03-30 2003-10-20 Cool Brace Intervertebral device and method of use
US20080027548A9 (en) 2002-04-12 2008-01-31 Ferree Bret A Spacerless artificial disc replacements
US6706068B2 (en) * 2002-04-23 2004-03-16 Bret A. Ferree Artificial disc replacements with natural kinematics
US7066958B2 (en) 2002-05-10 2006-06-27 Ferree Bret A Prosthetic components with partially contained compressible resilient members
US7001433B2 (en) * 2002-05-23 2006-02-21 Pioneer Laboratories, Inc. Artificial intervertebral disc device
US6770095B2 (en) 2002-06-18 2004-08-03 Depuy Acroned, Inc. Intervertebral disc
US6793678B2 (en) * 2002-06-27 2004-09-21 Depuy Acromed, Inc. Prosthetic intervertebral motion disc having dampening
US7066960B1 (en) 2002-06-28 2006-06-27 Dickman Curtis A Intervertebral disk replacement
WO2004026186A1 (en) 2002-09-18 2004-04-01 Mathys Medizinaltechnik Ag Implant comprising a two-piece joint
GB0301085D0 (en) 2003-01-17 2003-02-19 Krishna Manoj Articulating spinal disc prosthesis
US7364589B2 (en) * 2003-02-12 2008-04-29 Warsaw Orthopedic, Inc. Mobile bearing articulating disc
US6908484B2 (en) * 2003-03-06 2005-06-21 Spinecore, Inc. Cervical disc replacement
US7105024B2 (en) 2003-05-06 2006-09-12 Aesculap Ii, Inc. Artificial intervertebral disc
DE10330698B4 (en) * 2003-07-08 2005-05-25 Aesculap Ag & Co. Kg Intervertebral implant
DE10339170B4 (en) * 2003-08-22 2009-10-15 Aesculap Ag Intervertebral implant
US20050133277A1 (en) 2003-08-28 2005-06-23 Diamicron, Inc. Superhard mill cutters and related methods
US7794465B2 (en) * 2003-09-10 2010-09-14 Warsaw Orthopedic, Inc. Artificial spinal discs and associated implantation instruments and methods
US20050187633A1 (en) 2003-11-10 2005-08-25 Ferree Bret A. Modular artificial disc replacements (ADRS) that allow translocation and axial rotation
US20050149196A1 (en) 2004-01-07 2005-07-07 St. Francis Medical Technologies, Inc. Artificial spinal disk replacement device with rotation limiter and lateral approach implantation method
US20050165487A1 (en) 2004-01-28 2005-07-28 Muhanna Nabil L. Artificial intervertebral disc
US7083651B2 (en) 2004-03-03 2006-08-01 Joint Synergy, Llc Spinal implant
US8021428B2 (en) * 2004-06-30 2011-09-20 Depuy Spine, Inc. Ceramic disc prosthesis
US20060020342A1 (en) * 2004-07-21 2006-01-26 Ferree Bret A Facet-preserving artificial disc replacements
US20060041313A1 (en) * 2004-08-19 2006-02-23 Sdgi Holdings, Inc. Intervertebral disc system
US7608333B2 (en) 2004-09-21 2009-10-27 Smith International, Inc. Thermally stable diamond polycrystalline diamond constructions
US7575600B2 (en) * 2004-09-29 2009-08-18 Kyphon Sarl Artificial vertebral disk replacement implant with translating articulation contact surface and method
US20060069441A1 (en) * 2004-09-29 2006-03-30 Zucherman James F Posterior approach implant method for assembly of multi-piece artificial spinal disk replacement device in situ
US7481840B2 (en) * 2004-09-29 2009-01-27 Kyphon Sarl Multi-piece artificial spinal disk replacement device with selectably positioning articulating element
US20060085077A1 (en) * 2004-10-18 2006-04-20 Ebi, L.P. Intervertebral implant and associated method
US8911498B2 (en) 2005-02-10 2014-12-16 DePuy Synthes Products, LLC Intervertebral prosthetic disc
US20060235530A1 (en) 2005-04-18 2006-10-19 Shelokov Alexis P Artificial prosthesis
US8394142B2 (en) 2005-06-13 2013-03-12 Synthes Usa, Llc Customizing an intervertebral implant
US7726421B2 (en) 2005-10-12 2010-06-01 Smith International, Inc. Diamond-bonded bodies and compacts with improved thermal stability and mechanical strength
US20080302579A1 (en) 2007-06-05 2008-12-11 Smith International, Inc. Polycrystalline diamond cutting elements having improved thermal resistance

Also Published As

Publication number Publication date
US8016889B2 (en) 2011-09-13
WO2004019830A1 (en) 2004-03-11
CA2497043A1 (en) 2004-03-11
DE60334305D1 (en) 2010-11-04
EP1539052B1 (en) 2010-09-22
EP1539052A4 (en) 2006-07-19
US7494507B2 (en) 2009-02-24
ZA200502467B (en) 2006-02-22
AU2003293277A1 (en) 2004-03-19
EP1539052A1 (en) 2005-06-15
US20080154380A1 (en) 2008-06-26
ATE481949T1 (en) 2010-10-15
US20030191533A1 (en) 2003-10-09
JP2005537065A (en) 2005-12-08

Similar Documents

Publication Publication Date Title
CA2497043C (en) Articulating diamond-surfaced spinal implants
CA2795754C (en) Use of ti and nb cemented tic in prosthetic joints
US7678325B2 (en) Use of a metal and Sn as a solvent material for the bulk crystallization and sintering of diamond to produce biocompatbile biomedical devices
US7569176B2 (en) Method for making a sintered superhard prosthetic joint component
US7396501B2 (en) Use of gradient layers and stress modifiers to fabricate composite constructs
US7396505B2 (en) Use of CoCrMo to augment biocompatibility in polycrystalline diamond compacts
US7465219B2 (en) Brut polishing of superhard materials
US7556763B2 (en) Method of making components for prosthetic joints
US20040111159A1 (en) Modular bearing surfaces in prosthetic joints
US20050133277A1 (en) Superhard mill cutters and related methods
US6817550B2 (en) Nozzles, and components thereof and methods for making the same
US7077867B1 (en) Prosthetic knee joint having at least one diamond articulation surface
US6793681B1 (en) Prosthetic hip joint having a polycrystalline diamond articulation surface and a plurality of substrate layers
US6514289B1 (en) Diamond articulation surface for use in a prosthetic joint
US6497727B1 (en) Component for use in prosthetic hip, the component having a polycrystalline diamond articulation surface and a plurality of substrate layers
US6410877B1 (en) Methods for shaping and finishing prosthetic joint components including polycrystalline diamond compacts
US6709463B1 (en) Prosthetic joint component having at least one solid polycrystalline diamond component
US6402787B1 (en) Prosthetic hip joint having at least one sintered polycrystalline diamond compact articulation surface and substrate surface topographical features in said polycrystalline diamond compact
JP4248787B2 (en) Parts for artificial joints with bearings and joint surfaces covered with diamonds
US6425922B1 (en) Prosthetic hip joint having at least one sintered polycrystalline diamond compact articulation surface
US20080195220A1 (en) Prosthetic hip joint having polycrystalline diamond articulation surfaces and at least one solid polycrystalline diamond compact
US20100025898A1 (en) USE OF Ti AND Nb CEMENTED TiC IN PROSTHETIC JOINTS

Legal Events

Date Code Title Description
EEER Examination request
MKEX Expiry

Effective date: 20230828