CA2448912A1 - Implantable devices having a liquid crystal polymer substrate - Google Patents
Implantable devices having a liquid crystal polymer substrate Download PDFInfo
- Publication number
- CA2448912A1 CA2448912A1 CA002448912A CA2448912A CA2448912A1 CA 2448912 A1 CA2448912 A1 CA 2448912A1 CA 002448912 A CA002448912 A CA 002448912A CA 2448912 A CA2448912 A CA 2448912A CA 2448912 A1 CA2448912 A1 CA 2448912A1
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- CA
- Canada
- Prior art keywords
- electrode
- conductor
- interconnect
- substrate
- lcp
- Prior art date
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0551—Spinal or peripheral nerve electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0531—Brain cortex electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0534—Electrodes for deep brain stimulation
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0539—Anchoring of brain electrode systems, e.g. within burr hole
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0541—Cochlear electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0543—Retinal electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0551—Spinal or peripheral nerve electrodes
- A61N1/0553—Paddle shaped electrodes, e.g. for laminotomy
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0551—Spinal or peripheral nerve electrodes
- A61N1/0558—Anchoring or fixation means therefor
Abstract
An implantable medical device (IMD) is disclosed that is formed on a substra te composed of liquid crystal polymer (LCP). In one embodiment, the IMD can be an interconnection module for interconnecting an electrode array (102) to an equipment module (116). The interconnecting module (109) includes conductors (110A-110C) disposed on the LCP substrate and coupled to the electrode array , and wherein the conductors are encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode array and interconnect module disposed on an integral LCP substrate. An equipment modu le can be coupled to the interconnect module. Alternatively, a hybrid electroni c circuit can be coupled to the interconnect module for signal processing and conditioning signals received from the electrode array or for providing stimulus signals to the electrode array. In this embodiment, all of the conductors and at least a portion of the electrodes in the electrode array a re encapsulated using a silicone or LCP encapsulant. In another embodiment, the IMD is an electrode disposed on an LCP substrate. The interconnecting module is used to provide signal paths to and from the electrodes in the electrode array to the hybrid circuit. In this embodiment, all of the conductors, the hybrid electronic circuit and at least a portion of the electrodes in the electrode array are encapsulated using a silicone or LCP encapsulant .</SDOA B>
Claims (42)
1. An implantable electrode and interconnect module comprising:
a first substrate;
a second substrate composed of LCP;
the first substrate including at least one electrode conductor disposed thereon and an associated interconnect conductor disposed thereon electrically connected to the electrode conductor;
the second substrate including an electrical interconnection bonding pad electrically coupled to the interconnect conductor of the first substrate and a conductor electrically connected to the interconnection bonding pad;
a first encapsulant covering a portion of the electrode conductor and completely covering the interconnect conductor, the first encapsulant chemically bonded to the first substrate, wherein the portion of the electrode conductor and the interconnect conductor are protected from an external environment;
and a second encapsulant completely covering the interconnect conductor and the electrical interconnection bonding pad, the second encapsulant chemically bonded to the second substrate, wherein the interconnect conductor and the electrical interconnection bonding pad are protected from an external environment.
a first substrate;
a second substrate composed of LCP;
the first substrate including at least one electrode conductor disposed thereon and an associated interconnect conductor disposed thereon electrically connected to the electrode conductor;
the second substrate including an electrical interconnection bonding pad electrically coupled to the interconnect conductor of the first substrate and a conductor electrically connected to the interconnection bonding pad;
a first encapsulant covering a portion of the electrode conductor and completely covering the interconnect conductor, the first encapsulant chemically bonded to the first substrate, wherein the portion of the electrode conductor and the interconnect conductor are protected from an external environment;
and a second encapsulant completely covering the interconnect conductor and the electrical interconnection bonding pad, the second encapsulant chemically bonded to the second substrate, wherein the interconnect conductor and the electrical interconnection bonding pad are protected from an external environment.
2. The implantable electrode of claim 1 wherein the first substrate is silicon.
3. The implantable electrode of claim 1 wherein the first substrate is LCP.
4. The implantable electrode of claim 1 wherein the first encapsulant is silicone.
5. The implantable electrode of claim 1 wherein the first encapsulant is LCP.
6. The implantable electrode of claim 1 wherein the second encapsulant is silicone.
7. The implantable electrode of claim 1 wherein the second encapsulant is LCP.
8. The implantable electrode of claim 1 wherein the electrical interconnection bonding pad is electrically coupled to the interconnect conductor of the first substrate via an encapsulated conductor.
9. The implantable electrode of claim 1 further including an equipment module electrically coupled to the conductor of the second substrate.
10. The implantable electrode of claim 9 wherein the equipment module is electrically coupled to the conductor of the second substrate via an encapsulated conductor.
11. The implantable electrode of claim 9 wherein the equipment module is a percutaneous connector.
12. The implantable electrode of claim 9 wherein the equipment module is a telemetry module.
13. The implantable electrode of claim 1 further including a hybrid electronic circuit electrically coupled to the conductor of the second substrate.
14. The implantable electrode of claim 13 wherein the hybrid electronic circuit is electrically coupled to the conductor of the second substrate via an encapsulated conductor.
15. The implantable electrode of claim 13 further including an equipment module electrically coupled to the hybrid electronic circuit.
16. The implantable electrode of claim 15 wherein the equipment module is electrically coupled to the hybrid electronic circuit via an encapsulated conductor.
17. An electrode array comprising:
an LCP substrate having an electrode portion and an interconnect portion;
an electrode disposed on the surface of the electrode portion of the LCP substrate;
an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;
an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;
an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP
substrate, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor and the encapsulated portion of the electrode are protected from an external environment.
an LCP substrate having an electrode portion and an interconnect portion;
an electrode disposed on the surface of the electrode portion of the LCP substrate;
an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;
an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;
an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP
substrate, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor and the encapsulated portion of the electrode are protected from an external environment.
18. The electrode array of claim 17 wherein the electrode portion of the LCP substrate includes two or more shafts formed with the LCP substrate, and each of the at least two shafts includes at least one electrode disposed on the surface of the respective shaft, and wherein the electrode interconnect conductor includes a number of electrode interconnect conductors corresponding to the number of electrodes, and wherein the interconnect conductor includes a number of interconnect conductors corresponding to the number of electrode interconnect conductors.
19. The electrode array of claim 18 wherein the encapsulant is a silicone encapsulant.
20. The electrode array of claim 18 wherein the encapsulant is an LCP encapsulant.
21. The electrode array of claim 18 further including an equipment module electrically coupled to at least one of the interconnect conductors.
22. The electrode array of claim 21 wherein the equipment module is electrically coupled to the at least one interconnect conductor via an encapsulated conductor.
23. The implantable electrode of claim 21 wherein the equipment module is a percutaneous connector.
24. The implantable electrode of claim 21 wherein the equipment module is a telemetry module.
25. The implantable electrode of claim 18 further including a hybrid electronic circuit electrically coupled to at least one interconnect conductor.
26. The implantable electrode of claim 25 wherein the hybrid electronic circuit is electrically coupled to the at least one interconnect conductor via at least one encapsulated conductor.
27. The implantable electrode of claim 26 further including an equipment module electrically coupled to the hybrid electronic circuit.
28. The implantable electrode of claim 27 wherein the equipment module is electrically coupled to the hybrid electronic circuit via an encapsulated conductor.
29. An electrode array comprising an LCP substrate having an electrode portion, an interconnect portion, and a hybrid circuit portion;
an electrode disposed on the surface of the electrode portion of the LCP substrate;
an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;
an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;
a hybrid circuit disposed on the hybrid circuit portion of the LCP substrate, the hybrid circuit electrically connected to the interconnect conductor formed on the interconnect portion of the LCP substrate;
an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP
substrate, the hybrid circuit, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor, the hybrid circuit and the encapsulated portion of the electrode are protected from an external environment.
an electrode disposed on the surface of the electrode portion of the LCP substrate;
an electrode interconnect conductor disposed on the electrode portion of the LCP substrate, the conductor electrically connected to the electrode;
an interconnect conductor formed on the interconnect portion of the LCP substrate, the interconnect conductor electrically connected to the electrode interconnect conductor;
a hybrid circuit disposed on the hybrid circuit portion of the LCP substrate, the hybrid circuit electrically connected to the interconnect conductor formed on the interconnect portion of the LCP substrate;
an encapsulant covering the interconnect conductor formed on the interconnect portion of the LCP substrate, the electrode interconnect conductor formed on the electrode portion of the LCP
substrate, the hybrid circuit, and covering a portion the electrode formed on the electrode portion of the LCP substrate, the encapsulant chemically bonded to the LCP substrate, wherein the encapsulated electrode interconnect conductor, the encapsulated interconnect conductor, the hybrid circuit and the encapsulated portion of the electrode are protected from an external environment.
30. The electrode array of claim 29 wherein the electrode portion of the LCP substrate includes two or more shafts formed with the LCP substrate, and each of the at least two shafts includes at least one electrode disposed on the surface of the respective shaft, and wherein the electrode interconnect conductor includes a number of electrode interconnect conductors corresponding to the number of electrodes, and wherein the interconnect conductor includes a number of interconnect conductors corresponding to the number of electrode interconnect conductors.
31. The electrode array of claim 30 wherein the encapsulant is a silicone encapsulant.
32. The electrode array of claim 30 wherein the encapsulant is an LCP encapsulant.
33. The electrode array of claim 30 further including an equipment module electrically coupled to the hybrid circuit.
34. The electrode array of claim 33 wherein the equipment module is electrically coupled to the hybrid circuit via an encapsulated conductor.
35. The implantable electrode of claim 33 wherein the equipment module is a percutaneous connector.
36. The implantable electrode of claim 33 wherein the equipment module is a telemetry module.
37. A micro-wire electrode array comprising:
a LCP substrate;
a plurality of electrodes disposed on the surface of the LCP
array;
a plurality of interconnecting conductors corresponding to the plurality of electrodes, wherein an electrode is electrically connected to a corresponding interconnecting electrode.
a LCP substrate;
a plurality of electrodes disposed on the surface of the LCP
array;
a plurality of interconnecting conductors corresponding to the plurality of electrodes, wherein an electrode is electrically connected to a corresponding interconnecting electrode.
38. The micro-wire electrode array of claim 37 wherein the LCP
substrate is approximately 100 micrometers wide and 25 micrometers thick.
substrate is approximately 100 micrometers wide and 25 micrometers thick.
39. A method of implanting a micro-wire electrode array comprising the steps of:
attaching a micro-wire electrode array to a surgical needle;
inserting the surgical needle a predetermined depth into cortical tissue;
threading the micro-wire electrode array through the cortical tissue using the surgical needle; and operating the micro-wire electrode array in the cortical tissue.
attaching a micro-wire electrode array to a surgical needle;
inserting the surgical needle a predetermined depth into cortical tissue;
threading the micro-wire electrode array through the cortical tissue using the surgical needle; and operating the micro-wire electrode array in the cortical tissue.
40. The method of claim 39, wherein the step of operating the micro-wire electrode array includes sensing cortical signals from the surrounding cortical tissue.
41. The method of claim 39, wherein the step of operating the micro-wire electrode array includes providing stimulating signals to the surrounding cortical tissue.
42. The method of claim 39 wherein the step of inserting the surgical needle to a predetermined depth includes inserting the surgical needle to layer 4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29434801P | 2001-05-30 | 2001-05-30 | |
| US60/294,348 | 2001-05-30 | ||
| PCT/US2002/016942 WO2002096482A2 (en) | 2001-05-30 | 2002-05-30 | Implantable devices having a liquid crystal polymer substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2448912A1 true CA2448912A1 (en) | 2002-12-05 |
| CA2448912C CA2448912C (en) | 2012-01-03 |
Family
ID=23133021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2448912A Expired - Fee Related CA2448912C (en) | 2001-05-30 | 2002-05-30 | Implantable devices having a liquid crystal polymer substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6643552B2 (en) |
| EP (1) | EP1401513A4 (en) |
| AU (1) | AU2002257344B2 (en) |
| CA (1) | CA2448912C (en) |
| WO (1) | WO2002096482A2 (en) |
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-
2002
- 2002-05-30 EP EP02726948A patent/EP1401513A4/en not_active Withdrawn
- 2002-05-30 CA CA2448912A patent/CA2448912C/en not_active Expired - Fee Related
- 2002-05-30 WO PCT/US2002/016942 patent/WO2002096482A2/en not_active Application Discontinuation
- 2002-05-30 AU AU2002257344A patent/AU2002257344B2/en not_active Ceased
- 2002-05-30 US US10/158,510 patent/US6643552B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1401513A4 (en) | 2007-09-12 |
| WO2002096482A3 (en) | 2003-10-16 |
| US6643552B2 (en) | 2003-11-04 |
| AU2002257344B2 (en) | 2006-05-25 |
| WO2002096482A2 (en) | 2002-12-05 |
| EP1401513A2 (en) | 2004-03-31 |
| CA2448912C (en) | 2012-01-03 |
| US20020198582A1 (en) | 2002-12-26 |
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| EEER | Examination request | ||
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