CA2271125A1 - A new non-thermal process for annealing crystalline materials - Google Patents
A new non-thermal process for annealing crystalline materialsInfo
- Publication number
- CA2271125A1 CA2271125A1 CA002271125A CA2271125A CA2271125A1 CA 2271125 A1 CA2271125 A1 CA 2271125A1 CA 002271125 A CA002271125 A CA 002271125A CA 2271125 A CA2271125 A CA 2271125A CA 2271125 A1 CA2271125 A1 CA 2271125A1
- Authority
- CA
- Canada
- Prior art keywords
- crystalline materials
- thermal process
- new non
- annealing
- annealing crystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Abstract
Bulk crystalline materials are annealed by introducing into them mechanical energy of sufficient intensity to create a large amplitude sound wave. The mechanical energy may be introduced into the material, for example, by laser ablation. Where the bulk crystalline material is a doped semiconductor, the process also electrically activates the material.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/670,909 US6001715A (en) | 1996-06-26 | 1996-06-26 | Non-thermal process for annealing crystalline materials |
US08/670,909 | 1996-06-26 | ||
PCT/US1997/011113 WO1997050114A1 (en) | 1996-06-26 | 1997-06-26 | A new non-thermal process for annealing crystalline materials |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2271125A1 true CA2271125A1 (en) | 1997-12-31 |
CA2271125C CA2271125C (en) | 2003-05-27 |
Family
ID=24692388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002271125A Expired - Fee Related CA2271125C (en) | 1996-06-26 | 1997-06-26 | A new non-thermal process for annealing crystalline materials |
Country Status (5)
Country | Link |
---|---|
US (1) | US6001715A (en) |
EP (1) | EP0958595A4 (en) |
AU (1) | AU3579597A (en) |
CA (1) | CA2271125C (en) |
WO (1) | WO1997050114A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6372520B1 (en) * | 1998-07-10 | 2002-04-16 | Lsi Logic Corporation | Sonic assisted strengthening of gate oxides |
US7194801B2 (en) | 2000-03-24 | 2007-03-27 | Cymbet Corporation | Thin-film battery having ultra-thin electrolyte and associated method |
US7135423B2 (en) | 2002-05-09 | 2006-11-14 | Varian Semiconductor Equipment Associates, Inc | Methods for forming low resistivity, ultrashallow junctions with low damage |
US7211351B2 (en) * | 2003-10-16 | 2007-05-01 | Cymbet Corporation | Lithium/air batteries with LiPON as separator and protective barrier and method |
US7176112B2 (en) * | 2004-09-21 | 2007-02-13 | Atmel Corporation | Non-thermal annealing with electromagnetic radiation in the terahertz range of doped semiconductor material |
KR101387855B1 (en) | 2005-07-15 | 2014-04-22 | 사임베트 코퍼레이션 | Thin-film batteries with soft and hard electrolyte layers and method |
US7776478B2 (en) | 2005-07-15 | 2010-08-17 | Cymbet Corporation | Thin-film batteries with polymer and LiPON electrolyte layers and method |
US20110056531A1 (en) * | 2009-09-08 | 2011-03-10 | Gm Global Technology Operations, Inc. | Method for enhancing the performance of thermoelectric materials by irradiation-processing |
US11527774B2 (en) | 2011-06-29 | 2022-12-13 | Space Charge, LLC | Electrochemical energy storage devices |
US10601074B2 (en) | 2011-06-29 | 2020-03-24 | Space Charge, LLC | Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices |
US9853325B2 (en) | 2011-06-29 | 2017-12-26 | Space Charge, LLC | Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices |
US8662442B2 (en) * | 2011-11-01 | 2014-03-04 | Textron Innovations Inc. | Active prop rotor stability system |
US9142465B1 (en) * | 2013-03-13 | 2015-09-22 | Sandia Corporation | Precise annealing of focal plane arrays for optical detection |
EP3762989A4 (en) | 2018-03-07 | 2021-12-15 | Space Charge, LLC | Thin-film solid-state energy-storage devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4154625A (en) * | 1977-11-16 | 1979-05-15 | Bell Telephone Laboratories, Incorporated | Annealing of uncapped compound semiconductor materials by pulsed energy deposition |
DE3714357C2 (en) * | 1986-04-30 | 1994-02-03 | Toshiba Ceramics Co | Silicon wafer and method of manufacturing the same, and silicon wafer selector |
US5286313A (en) * | 1991-10-31 | 1994-02-15 | Surface Combustion, Inc. | Process control system using polarizing interferometer |
-
1996
- 1996-06-26 US US08/670,909 patent/US6001715A/en not_active Expired - Lifetime
-
1997
- 1997-06-26 AU AU35795/97A patent/AU3579597A/en not_active Abandoned
- 1997-06-26 WO PCT/US1997/011113 patent/WO1997050114A1/en active Application Filing
- 1997-06-26 CA CA002271125A patent/CA2271125C/en not_active Expired - Fee Related
- 1997-06-26 EP EP97932303A patent/EP0958595A4/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP0958595A4 (en) | 2000-01-05 |
EP0958595A1 (en) | 1999-11-24 |
WO1997050114A1 (en) | 1997-12-31 |
AU3579597A (en) | 1998-01-14 |
CA2271125C (en) | 2003-05-27 |
US6001715A (en) | 1999-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |