CA2271125A1 - A new non-thermal process for annealing crystalline materials - Google Patents

A new non-thermal process for annealing crystalline materials

Info

Publication number
CA2271125A1
CA2271125A1 CA002271125A CA2271125A CA2271125A1 CA 2271125 A1 CA2271125 A1 CA 2271125A1 CA 002271125 A CA002271125 A CA 002271125A CA 2271125 A CA2271125 A CA 2271125A CA 2271125 A1 CA2271125 A1 CA 2271125A1
Authority
CA
Canada
Prior art keywords
crystalline materials
thermal process
new non
annealing
annealing crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002271125A
Other languages
French (fr)
Other versions
CA2271125C (en
Inventor
Charles Keith Manka
Jacob Grun
Billy Charles Covington
William David Donnelly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Department of Navy
Original Assignee
The Government Of The United States Of America As Represented By The Sec Retary Of The Navy
Charles Keith Manka
Jacob Grun
Billy Charles Covington
William David Donnelly
Sam Houston State University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Government Of The United States Of America As Represented By The Sec Retary Of The Navy, Charles Keith Manka, Jacob Grun, Billy Charles Covington, William David Donnelly, Sam Houston State University filed Critical The Government Of The United States Of America As Represented By The Sec Retary Of The Navy
Publication of CA2271125A1 publication Critical patent/CA2271125A1/en
Application granted granted Critical
Publication of CA2271125C publication Critical patent/CA2271125C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

Bulk crystalline materials are annealed by introducing into them mechanical energy of sufficient intensity to create a large amplitude sound wave. The mechanical energy may be introduced into the material, for example, by laser ablation. Where the bulk crystalline material is a doped semiconductor, the process also electrically activates the material.
CA002271125A 1996-06-26 1997-06-26 A new non-thermal process for annealing crystalline materials Expired - Fee Related CA2271125C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/670,909 US6001715A (en) 1996-06-26 1996-06-26 Non-thermal process for annealing crystalline materials
US08/670,909 1996-06-26
PCT/US1997/011113 WO1997050114A1 (en) 1996-06-26 1997-06-26 A new non-thermal process for annealing crystalline materials

Publications (2)

Publication Number Publication Date
CA2271125A1 true CA2271125A1 (en) 1997-12-31
CA2271125C CA2271125C (en) 2003-05-27

Family

ID=24692388

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002271125A Expired - Fee Related CA2271125C (en) 1996-06-26 1997-06-26 A new non-thermal process for annealing crystalline materials

Country Status (5)

Country Link
US (1) US6001715A (en)
EP (1) EP0958595A4 (en)
AU (1) AU3579597A (en)
CA (1) CA2271125C (en)
WO (1) WO1997050114A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6372520B1 (en) * 1998-07-10 2002-04-16 Lsi Logic Corporation Sonic assisted strengthening of gate oxides
US7194801B2 (en) 2000-03-24 2007-03-27 Cymbet Corporation Thin-film battery having ultra-thin electrolyte and associated method
US7135423B2 (en) 2002-05-09 2006-11-14 Varian Semiconductor Equipment Associates, Inc Methods for forming low resistivity, ultrashallow junctions with low damage
US7211351B2 (en) * 2003-10-16 2007-05-01 Cymbet Corporation Lithium/air batteries with LiPON as separator and protective barrier and method
US7176112B2 (en) * 2004-09-21 2007-02-13 Atmel Corporation Non-thermal annealing with electromagnetic radiation in the terahertz range of doped semiconductor material
KR101387855B1 (en) 2005-07-15 2014-04-22 사임베트 코퍼레이션 Thin-film batteries with soft and hard electrolyte layers and method
US7776478B2 (en) 2005-07-15 2010-08-17 Cymbet Corporation Thin-film batteries with polymer and LiPON electrolyte layers and method
US20110056531A1 (en) * 2009-09-08 2011-03-10 Gm Global Technology Operations, Inc. Method for enhancing the performance of thermoelectric materials by irradiation-processing
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US8662442B2 (en) * 2011-11-01 2014-03-04 Textron Innovations Inc. Active prop rotor stability system
US9142465B1 (en) * 2013-03-13 2015-09-22 Sandia Corporation Precise annealing of focal plane arrays for optical detection
EP3762989A4 (en) 2018-03-07 2021-12-15 Space Charge, LLC Thin-film solid-state energy-storage devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154625A (en) * 1977-11-16 1979-05-15 Bell Telephone Laboratories, Incorporated Annealing of uncapped compound semiconductor materials by pulsed energy deposition
DE3714357C2 (en) * 1986-04-30 1994-02-03 Toshiba Ceramics Co Silicon wafer and method of manufacturing the same, and silicon wafer selector
US5286313A (en) * 1991-10-31 1994-02-15 Surface Combustion, Inc. Process control system using polarizing interferometer

Also Published As

Publication number Publication date
EP0958595A4 (en) 2000-01-05
EP0958595A1 (en) 1999-11-24
WO1997050114A1 (en) 1997-12-31
AU3579597A (en) 1998-01-14
CA2271125C (en) 2003-05-27
US6001715A (en) 1999-12-14

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed