CA2070062A1 - Cooling structure for integrated circuits - Google Patents
Cooling structure for integrated circuitsInfo
- Publication number
- CA2070062A1 CA2070062A1 CA2070062A CA2070062A CA2070062A1 CA 2070062 A1 CA2070062 A1 CA 2070062A1 CA 2070062 A CA2070062 A CA 2070062A CA 2070062 A CA2070062 A CA 2070062A CA 2070062 A1 CA2070062 A1 CA 2070062A1
- Authority
- CA
- Canada
- Prior art keywords
- integrated circuit
- cooling structure
- liquid coolant
- integrated circuits
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
A cooling structure for an integrated circuit includes a wiring substrate and an integrated circuit mounted on the wiring substrate. Storage means for storing a liquid coolant, have an inlet and an outlet for the liquid coolant at the top thereof and an opening at the bottom thereof and adhering means for fastening together the bottom of the storing means and a heat radiating face of the integrated circuit. Spraying means, directly spray the liquid coolant on the heat radiating face of the integrated circuit through the opening.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP155634/1991 | 1991-05-30 | ||
JP15563491 | 1991-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2070062A1 true CA2070062A1 (en) | 1992-12-01 |
CA2070062C CA2070062C (en) | 1997-01-07 |
Family
ID=15610270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002070062A Expired - Fee Related CA2070062C (en) | 1991-05-30 | 1992-05-29 | Cooling structure for integrated circuits |
Country Status (3)
Country | Link |
---|---|
US (1) | US5285351A (en) |
EP (1) | EP0516478A2 (en) |
CA (1) | CA2070062C (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515910A (en) * | 1993-05-03 | 1996-05-14 | Micro Control System | Apparatus for burn-in of high power semiconductor devices |
US5606341A (en) * | 1995-10-02 | 1997-02-25 | Ncr Corporation | Passive CPU cooling and LCD heating for a laptop computer |
US5831824A (en) * | 1996-01-31 | 1998-11-03 | Motorola, Inc. | Apparatus for spray-cooling multiple electronic modules |
US5675473A (en) * | 1996-02-23 | 1997-10-07 | Motorola, Inc. | Apparatus and method for shielding an electronic module from electromagnetic radiation |
US5802707A (en) * | 1996-03-28 | 1998-09-08 | Intel Corporation | Controlled bondline thickness attachment mechanism |
US5718117A (en) * | 1996-04-10 | 1998-02-17 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5687577A (en) * | 1996-04-10 | 1997-11-18 | Motorola, Inc. | Apparatus and method for spray-cooling an electronic module |
US5731542A (en) * | 1996-05-23 | 1998-03-24 | Motorola, Inc. | Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic component mounted to a substrate |
US5777384A (en) * | 1996-10-11 | 1998-07-07 | Motorola, Inc. | Tunable semiconductor device |
US5923086A (en) * | 1997-05-14 | 1999-07-13 | Intel Corporation | Apparatus for cooling a semiconductor die |
US5818692A (en) * | 1997-05-30 | 1998-10-06 | Motorola, Inc. | Apparatus and method for cooling an electrical component |
US6152215A (en) * | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
US6317326B1 (en) * | 2000-09-14 | 2001-11-13 | Sun Microsystems, Inc. | Integrated circuit device package and heat dissipation device |
US6836131B2 (en) * | 2002-08-16 | 2004-12-28 | Credence Systems Corp. | Spray cooling and transparent cooling plate thermal management system |
US7102374B2 (en) * | 2002-08-16 | 2006-09-05 | Credence Systems Corporation | Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis |
US7078803B2 (en) * | 2002-09-27 | 2006-07-18 | Isothermal Systems Research, Inc. | Integrated circuit heat dissipation system |
US7288895B2 (en) * | 2003-11-17 | 2007-10-30 | Intel Corporation | System to improve display efficiency based on recycling local heat source |
US7269005B2 (en) * | 2003-11-21 | 2007-09-11 | Intel Corporation | Pumped loop cooling with remote heat exchanger and display cooling |
GB0411714D0 (en) * | 2004-05-25 | 2004-06-30 | Rolls Royce Plc | A cooling arrangement |
US7901191B1 (en) | 2005-04-07 | 2011-03-08 | Parker Hannifan Corporation | Enclosure with fluid inducement chamber |
US20070290702A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | System and method for thermal management and gradient reduction |
US20070291361A1 (en) * | 2006-06-19 | 2007-12-20 | Credence Systems Corporation | Lens housing with integrated thermal management |
US9347987B2 (en) * | 2009-11-06 | 2016-05-24 | Intel Corporation | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same |
JP5782741B2 (en) | 2010-07-15 | 2015-09-24 | 富士通株式会社 | Electronics |
US20120325436A1 (en) | 2011-06-27 | 2012-12-27 | Shedd Timothy A | High efficiency thermal management system |
WO2015178880A1 (en) * | 2014-05-19 | 2015-11-26 | Hewlett-Packard Development Company, L.P. | Substrate sprayer |
JP6160567B2 (en) * | 2014-06-17 | 2017-07-12 | 三菱電機株式会社 | Measuring device, measuring method |
EP3195711A4 (en) | 2014-09-15 | 2018-08-29 | D'Onofrio, Nicholas, Michael | Liquid cooled metal core printed circuit board |
US10597286B2 (en) * | 2017-08-01 | 2020-03-24 | Analog Devices Global | Monolithic phase change heat sink |
CN113994772B (en) | 2019-04-14 | 2023-05-16 | 捷控技术有限公司 | Cooling module based on direct contact fluid |
CA3140764A1 (en) * | 2019-06-27 | 2020-12-30 | Hypertechnologie Ciara Inc. | Microgap system for cooling electronics with direct contact |
DE112020003635T5 (en) * | 2019-07-31 | 2022-04-21 | Jetcool Technologies, Inc. | re-entry flow cold plate |
US11640930B2 (en) * | 2019-09-05 | 2023-05-02 | Mediatek Inc. | Semiconductor package having liquid-cooling lid |
US20220015262A1 (en) * | 2020-07-09 | 2022-01-13 | Intel Corporation | Technologies for dynamic cooling in a multi-chip package with programmable impingement valves |
US20230071588A1 (en) * | 2021-09-07 | 2023-03-09 | Inventec (Pudong) Technology Corporation | Heat dissipation system and electronic device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160150A (en) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | Cooling device for integrated circuit |
US4879632A (en) * | 1985-10-04 | 1989-11-07 | Fujitsu Limited | Cooling system for an electronic circuit device |
US4791983A (en) * | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
JP2786193B2 (en) * | 1987-10-26 | 1998-08-13 | 株式会社日立製作所 | Semiconductor cooling device |
JP2534749B2 (en) * | 1988-03-31 | 1996-09-18 | 株式会社東芝 | Semiconductor package |
EP0341950B1 (en) * | 1988-05-09 | 1994-09-14 | Nec Corporation | Flat cooling structure of integrated circuit |
JP2708495B2 (en) * | 1988-09-19 | 1998-02-04 | 株式会社日立製作所 | Semiconductor cooling device |
JP2658309B2 (en) * | 1988-12-07 | 1997-09-30 | 富士通株式会社 | Jet cooling semiconductor device |
US5097385A (en) * | 1990-04-18 | 1992-03-17 | International Business Machines Corporation | Super-position cooling |
JPH0451550A (en) * | 1990-06-20 | 1992-02-20 | Hitachi Ltd | Semiconductor integrated circuit device |
US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
-
1992
- 1992-05-29 EP EP92304961A patent/EP0516478A2/en not_active Withdrawn
- 1992-05-29 CA CA002070062A patent/CA2070062C/en not_active Expired - Fee Related
- 1992-06-01 US US07/891,257 patent/US5285351A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0516478A3 (en) | 1994-02-02 |
EP0516478A2 (en) | 1992-12-02 |
US5285351A (en) | 1994-02-08 |
CA2070062C (en) | 1997-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |